JP2002289568A - Substrate washing equipment and ultrasonic vibration element used therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide equipment wherein a vibration transfer plate of an ultrasonic vibration element has sufficient corrosion resistance to various chemicals, and impurities are prevented from eluting and contaminating a substrate a vibrator is cooled sufficiently via the vibration transfer plate, sufficiently large power can be applied to the vibrator, and cost can be restrained to be low. SOLUTION: This equipment is provided with a cleaning fluid supplying part 14 for supplying cleaning fluid to a substrate W; and an ultrasonic wave applying part 16 equipped with the ultrasonic vibration element 30 constituted of the vibrator 32 connected with an ultrasonic oscillator, and the vibration transfer plate 34 bonded to a single surface side of the vibrator. The vibration transfer plate is formed from silicon.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to cleaning various substrates such as a semiconductor substrate, a glass substrate for a flat panel display such as a liquid crystal display device, a glass substrate for a photomask, and a substrate for an optical disk. The present invention relates to a substrate cleaning device for cleaning and an ultrasonic vibration element used in the substrate cleaning device.

[0002]

2. Description of the Related Art Ultrasonic cleaning is widely known as a technique for removing contaminants such as particles attached to the surface of a substrate such as a semiconductor wafer. As an apparatus for performing the ultrasonic cleaning, an ultrasonic vibrator is attached to a cleaning tank in which a cleaning liquid is stored, and a batch-type cleaning apparatus that carries a plurality of substrates into the cleaning tank and simultaneously performs cleaning, and a cleaning that discharges the cleaning liquid. There is a single-wafer cleaning apparatus in which an ultrasonic vibration element is mounted on a nozzle, and the substrate is sequentially cleaned while relatively moving the substrates one by one.
Among them, in the single-wafer cleaning apparatus, an ultrasonic vibration element is formed by joining a vibration transmission plate to a vibrator connected to an ultrasonic oscillator.

[0003] Conventional ultrasonic vibration elements generally include:
It has a structure in which a vibration transmission plate made of a metal material such as tantalum or stainless steel is attached to one side of the vibrator that is on the liquid contact side. Further, for example, Japanese Patent Application Laid-Open No. 10-151422
As disclosed in Japanese Unexamined Patent Publication (Kokai) No. H10-209, there is a type in which a vibration transmission plate is formed of ceramic such as high-purity SiC or high-purity quartz.

[0004]

However, in cleaning the substrate, various chemicals other than pure water are used as the cleaning liquid. For this reason, in the ultrasonic vibration element in which the vibration transmission plate is formed of a metal material, the vibration transmission plate is corroded by the chemical solution, and the substrate is contaminated by the eluted metal.
There is such a problem.

An ultrasonic vibration element in which the vibration transmission plate is formed of ceramics such as SiC or quartz or the like has corrosion resistance to a general chemical solution, and there is no concern that the substrate is contaminated by eluting impurities. However, for example, for cleaning a semiconductor wafer, a hydrofluoric acid solution is often used as a cleaning liquid, and ceramics such as SiC and quartz are corroded by hydrofluoric acid. Therefore, when a hydrofluoric acid solution is used as the cleaning liquid, there is a problem that the ultrasonic vibration element in which the ultrasonic vibration plate is formed of ceramics or quartz cannot be used, and the application is limited.

In the case where the area of the vibrator is large, the vibration transmitting plate attached to the vibrator, including the role of reinforcing the vibrator, requires a half (λ) of the wavelength of the ultrasonic wave transmitted through the vibrating plate.
/ 2). For example, 1M
When the vibrator is operated at a frequency of Hz, the vibration transmission plate is designed to have a thickness corresponding to the wavelength λ of the ultrasonic wave from the viewpoint of strength. 6 mm. The vibration transmission plate formed of quartz having such a thickness has a low thermal conductivity, and therefore cannot sufficiently cool the vibrator through the vibration transmission plate. As a result, there is a problem that a sufficiently large electric power cannot be supplied to the vibrator, and the ability to peel off particles having a strong adhesive force from the substrate surface is restricted.

Although it is conceivable to use high-purity sapphire (crystalline alumina) as a material for forming the vibration transmitting plate of the ultrasonic vibrating element, it is difficult to adopt it because the cost is high.

The present invention has been made in view of the above circumstances, and the vibration transmission plate of the ultrasonic vibration element has sufficient corrosion resistance to various chemicals used as a cleaning liquid, There is no fear of elution and contaminating the substrate, the vibrator can be cooled sufficiently through the vibration transmission plate, and a sufficiently large power can be supplied to the vibrator, and the cost is also reduced. It is an object of the present invention to provide a substrate cleaning apparatus that can be kept low, and to provide an ultrasonic vibration element used in the substrate cleaning apparatus.

[0009]

According to the first aspect of the present invention,
A cleaning liquid supply means for supplying a cleaning liquid to the substrate, an ultrasonic oscillator, a vibrator connected to the ultrasonic oscillator, and a vibration transmission plate joined to one side of the vibrator; An ultrasonic wave applying means for applying ultrasonic waves to the cleaning liquid supplied onto the substrate by the means, wherein the vibration transmission plate is made of silicon.

According to a second aspect of the present invention, in the substrate cleaning apparatus according to the first aspect, the vibrator of the ultrasonic wave applying means has a long flat plate shape, and the vibration transmission plate is equal to or larger than the vibrator. The vibration transmitting plate is formed in a shape of a larger elongated flat plate, and the vibration surface of the vibration transmission plate is disposed so as to face the relatively moving substrate at a small interval, and the cleaning liquid supply unit is provided with a vibration surface of the vibration transmission plate. And has a slit-shaped liquid discharge port extending along the longitudinal direction of the vibrating surface and having a length equal to or longer than the length of the vibrating surface, and the liquid discharge port is spaced apart from a relatively moving substrate. And are disposed so as to face each other.

According to a third aspect of the present invention, in the substrate cleaning apparatus according to the first or second aspect, the vibrator is vacuum-adsorbed to the vibration transmitting plate.

According to a fourth aspect of the present invention, in the substrate cleaning apparatus of the third aspect, a resin film is laminated so as to completely cover the vibrator, and the vibrator is a resin film with respect to the vibration transmission plate. It is characterized by being hermetically sealed.

According to a fifth aspect of the present invention, there is provided an ultrasonic vibration element comprising: a vibrator connected to an ultrasonic oscillator; and a vibration transmission plate joined to one side of the vibrator.
The vibration transmission plate is formed of silicon.

According to a sixth aspect of the present invention, in the ultrasonic vibration element according to the fifth aspect, the vibrator has a long flat plate shape, and the vibration transmission plate is a long flat plate equal to or larger than the vibrator. And the vibration transmission plate is arranged so that the vibration surface of the vibration transmission plate faces the relatively moving substrate at a small interval.

According to a seventh aspect of the present invention, in the ultrasonic vibration element according to the fifth or sixth aspect, the vibrator is vacuum-adsorbed to the vibration transmitting plate.

According to an eighth aspect of the present invention, in the ultrasonic vibration element according to the seventh aspect, a resin film is laminated so as to completely cover the vibrator, and the vibrator is formed of a resin film with respect to the vibration transmission plate. It is characterized by being sealed with.

In the substrate cleaning apparatus according to the first aspect of the present invention, the vibration transmission plate of the ultrasonic wave applying means is formed of silicon, and silicon has corrosion resistance to various chemicals including hydrofluoric acid. Therefore, there is no possibility that the vibration transmitting plate is corroded by the cleaning liquid, and since the vibration transmitting plate is the material of the semiconductor wafer itself, there is no problem of elution of impurities. In addition, silicon has a considerably higher thermal conductivity than quartz, and when the vibrator is cooled through a vibration transmission plate formed of silicon, the vibrator can be sufficiently cooled. It is possible to supply a sufficiently large electric power to the vibrator. In addition, silicon
Since it is a material that is often produced in the semiconductor industry, it can be obtained relatively inexpensively.

In the substrate cleaning apparatus according to the second aspect of the present invention,
While the cleaning liquid is supplied to the substrate from the slit-shaped liquid discharge port, ultrasonic waves are applied to the cleaning liquid on the substrate from the long vibration surface adjacent to the liquid discharge port, and the substrate is cleaned. The above operation is achieved in the substrate cleaning apparatus having such a configuration.

In the substrate cleaning apparatus according to the third aspect of the present invention,
Since the vibrator is vacuum-adsorbed to the vibration transmission plate and no adhesive layer is interposed between the vibration transmission plate and the vibrator, the transmission efficiency of ultrasonic waves is good.

In the substrate cleaning apparatus of the invention according to claim 4,
Since the vibrator is hermetically sealed with the resin film with respect to the vibration transmission plate, there is no need to continuously perform a vacuum suction operation to keep the vibrator vacuum-adsorbed to the vibration transmission plate.

In the ultrasonic vibration element according to the fifth aspect of the present invention, the vibration transmission plate is formed of silicon, and silicon has corrosion resistance to various chemicals including hydrofluoric acid. There is no risk that the plate will be corroded by the cleaning liquid, and since it is the material of the semiconductor wafer itself, there is no problem of elution of impurities. In addition, silicon has a considerably higher thermal conductivity than quartz, and when the vibrator is cooled through a vibration transmission plate formed of silicon, the vibrator can be sufficiently cooled. It is possible to supply a sufficiently large electric power to the vibrator. In addition, silicon is a material that is often produced in the semiconductor industry and can be obtained relatively inexpensively.

In the ultrasonic vibration element according to the sixth aspect of the present invention, ultrasonic waves are applied to the cleaning liquid on the substrate from the long vibration surface to clean the substrate.

In the ultrasonic vibration element according to the seventh aspect of the present invention, the vibrator is vacuum-adsorbed to the vibration transmitting plate, and no adhesive layer is interposed between the vibration transmitting plate and the vibrator. Is good.

In the ultrasonic vibration element according to the present invention, the vibrator is hermetically sealed with the resin film with respect to the vibration transmitting plate. There is no need to continuously perform a vacuum suction operation.

[0025]

Preferred embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show an example of an embodiment of the present invention. FIG. 1 is a diagram showing a schematic configuration of an ultrasonic cleaning head which is a main part of a substrate cleaning apparatus, and FIG. Is a cross-sectional view as viewed from the front side, (b) is a view as viewed from the lower side,
FIG. 2 is an enlarged cross-sectional view of the ultrasonic cleaning head viewed from the side.

The ultrasonic cleaning head 10 of this substrate cleaning apparatus
Although not shown, the mounting portion 12 is connected to one end of the swing arm, and is held by the swing arm in a suspended state. Although the detailed description is omitted here, the other end of the swing arm is fixed to the upper end of a vertically arranged arm shaft, and the arm shaft is rotated around the axis by a swing drive mechanism. As well as up and down by a lifting drive mechanism. Therefore, the swing arm is swung in a horizontal plane and vertically moved up and down. By the swing and the vertical movement, the ultrasonic cleaning head 10 held by the swing arm is moved by the substrate supporting and rotating mechanism. Is moved between a cleaning position close to the upper surface of the substrate, which is supported in a horizontal posture and rotated around a vertical axis, and a standby position deviated from a position above the substrate.

The ultrasonic cleaning head 10 includes a cleaning liquid supply unit 14 for supplying a cleaning liquid to a substrate W which moves relatively to the cleaning liquid, and an ultrasonic cleaning head supplied to the cleaning liquid supplied onto the substrate W by the cleaning liquid supply unit 14. Ultrasonic applying section 1 for applying
6 having a structure in which they are integrally connected.

The cleaning liquid supply section 14 is formed by forming a liquid inlet 20, a liquid reservoir 22, and a liquid outlet 24 on a long plate-like body 18 whose longitudinal direction is horizontal and whose short side is vertical. Then, the lower end surface of the liquid outlet hole 24 is opened to open the liquid discharge port 2.
It becomes 6. Although not shown, a liquid supply pipe connected to a cleaning liquid supply source is connected to and connected to the liquid inlet 20. The liquid reservoir 22 communicating with the liquid inlet 20 is formed over substantially the entire length of the cleaning liquid supply unit 14. The liquid outflow hole 24 communicating with the liquid reservoir 22 is formed substantially over the entire length of the cleaning liquid supply unit 14 similarly to the liquid reservoir 22, and the liquid discharge port 26 at the lower end thereof is arranged as shown in FIG. As shown, it has a slit shape. The area of the cross section of the liquid outflow hole 24 is smaller than that of the liquid reservoir 22, so that the cleaning liquid that has flowed into the liquid reservoir 22 through the liquid inlet 20 spreads in the longitudinal direction, and is After filling the entirety of the liquid crystal 22, it flows down to the liquid outflow hole 24, and is supplied onto the substrate W from the slit-shaped liquid discharge port 26 without bias.
The long plate-shaped body 18 forming the cleaning liquid supply unit 14 is formed of a material that transmits corrosion resistance to a chemical solution, for example, a fluororesin such as an ethylene tetrafluoride resin.

The ultrasonic wave applying section 16 is constructed by mounting an ultrasonic vibration element 30 on the inner bottom of a long casing 28 having an open bottom so as to close the bottom opening in a liquid-tight manner.
The long casing 28 is formed of a material that transmits corrosion resistance to a chemical solution, for example, a fluororesin such as an ethylene tetrafluoride resin. The ultrasonic vibration element 30 has a structure in which a vibration transmission plate 34 is bonded to one side of a vibrator 32 with an adhesive or the like. The vibrator 32 is formed in a long flat plate shape from a piezoelectric material such as PZT. The vibration transmission plate 34 is formed in a long flat plate shape equal to or larger than the vibrator 32, and the lower surface exposed from the bottom surface of the long housing 28 becomes a long rectangular vibration surface 36. This long rectangular vibration surface 3
Numeral 6 is arranged adjacent to and parallel to the slit-shaped liquid discharge port 26 of the cleaning liquid supply unit 14, and is equal to or slightly shorter than the liquid discharge port 26. Although not shown, the vibrator 3
Numeral 2 is connected to an ultrasonic oscillator, and power is supplied to the vibrator 32 from the ultrasonic oscillator.

The ultrasonic vibration element 30
The vibration transmission plate 34 is made of silicon. Here, silicon has a sound wave propagation velocity of 8433 m / sec.
The thermal conductivity is 0.309 cal / cm · sec · ° C. and the coefficient of linear expansion is 0.42 × 10 ⁻⁵ / ° C. In contrast, quartz conventionally used as a material for the vibration transmission plate has a sound wave propagation velocity of 5970 m / sec, a thermal conductivity of 0.033 cal / cm · sec · ° C., and a linear expansion coefficient of 0.055 m / sec. a × ^{10 -5} / ° C., the piezoelectric material forming the vibrator 32, for example, the linear expansion coefficient of PZT is 0.055 × ^{10 -5} / ℃.

Therefore, silicon can be used as a material of the vibration transmitting plate 34 for transmitting the ultrasonic vibration of the vibrator 32. Further, for example, at a frequency of 1 MHz, the oscillator 3
2, the thickness of the vibration transmission plate 34 is about 3 mm (λ / 2) or about 6 mm when using quartz.
(Λ), which is about 4.2 m when using silicon.
m (λ / 2) or about 8.4 mm (λ),
Since the thermal conductivity of silicon is about 10 times larger than that of quartz, the ultrasonic vibration element 30 has a vibration transmission plate 3
The vibrator 32 can be sufficiently cooled via the fourth member 4.
Therefore, it is possible to supply a sufficiently large electric power to the vibrator 32. When the vibrator 32 made of a piezoelectric material and the vibration transmitting plate 34 are bonded with an adhesive, they are heated and bonded to a temperature of 150 ° C. to 200 ° C. However, the linear expansion coefficient of silicon is Compared to P
Since it is very close to the linear expansion coefficient of ZT, the adhesion between the vibrator 32 and the vibration transmission plate 34 after bonding is excellent. Further, silicon is a material that is widely produced in the semiconductor industry, so it can be obtained relatively inexpensively, and the surface polishing technique is well established. In addition, silicon has a good track record in terms of corrosion resistance to hydrofluoric acid, and since it is a raw material for semiconductor wafers, elution of impurities does not pose any problem.

The ultrasonic cleaning head 10 having the above configuration
Supplies the cleaning liquid to the substrate W from the slit-shaped liquid discharge port 26 in a state where the lower surface is close to the upper surface of the substrate W relatively moved by a rotation operation or the like, for example, about 1 mm to 3 mm. Meanwhile, ultrasonic waves are applied from the ultrasonic cleaning head 10 to the cleaning liquid filled between the upper surface of the substrate W and the lower surface of the ultrasonic cleaning head 10, and the substrate W is cleaned.

Next, FIG. 3 is an enlarged sectional view similar to FIG. 2, showing another example of the configuration of the ultrasonic cleaning head. The ultrasonic cleaning head 38 has a liquid introduction port 44 to which a liquid supply pipe 42 connected to a cleaning liquid supply source is connected and connected, and a liquid reservoir 4.
Cleaning liquid supply unit 40 composed of the liquid 6 and the liquid outlet hole 48
Are provided on both sides of the ultrasonic wave applying section 52 in the direction of relative movement of the substrate W. Ultrasonic vibrating element 54 attached to the inner bottom of ultrasonic applying section 52
Has a structure in which a vibration transmission plate 58 made of silicon is adhered to one surface of a vibrator 56 in the same manner as described above. In the ultrasonic cleaning head 38, a pair of slit-shaped liquid discharge ports 50 and a long rectangular vibration surface 60 are formed flush.

The present invention is not limited to the ultrasonic cleaning heads of the type shown in FIGS. 1 to 3, and can be applied to various types of ultrasonic cleaning heads.

Next, an example of a method of joining the vibrator and the vibration transmission plate which is different from the above-described method will be described with reference to FIGS.

FIG. 4 is a sectional view showing a schematic configuration of the ultrasonic vibration element. This ultrasonic vibration element 62
Is provided with a vibrator 64 and a vibration transmission plate 66 made of silicon, and a holding cover 68 for holding the vibrator 64 with respect to the vibration transmission plate 66.

The holding cover 68 is formed of a sheet of fluororesin or the like between a pair of flexible fixed frames 70 and 71 formed of a material having corrosion resistance to chemicals, for example, fluororesin such as tetrafluoroethylene resin. And a pair of fixing frames 70 and 71 and the flexible sheet 72 are fixed in an airtight state by a plurality of fixing bolts 74 and nuts (not shown). A seal member 76 made of silicon rubber or the like is attached to an end surface of the fixed frame 70. The fixed frame 70 of the holding cover 68 is brought into contact with the vibration transmission plate 66, and the fixed frame 70 is air-tightly joined to the vibration transmission plate 66 by the seal member 76. The space surrounded by the fixed frame 70, the flexible sheet 72, and the vibration transmission plate 66 becomes a storage section 78 for storing the vibrator 64.

The flexible sheet 72 has a storage section 78.
A vacuum exhaust port 80 for exhausting the air inside, and an electrode extracting port 84 for extracting the electrode wire 82 of the vibrator 64 to the outside are provided. The vacuum exhaust port 80 is provided with an exhaust pipe 90 in which a pressure sensor 86 and a check valve 88 are inserted.
Through to a vacuum pump 92. The pressure signal detected by the pressure sensor 86 is transmitted to the control device 9.
The vacuum pump 92 is driven and controlled by the control device 94 based on the pressure signal from the pressure sensor 86,
The inside space of the holding cover 68 is maintained at a predetermined degree of vacuum. The electrode wire 82 of the vibrator 64 is taken out of the electrode outlet 84 to the outside, and
6 is connected. A sealing cap 98 is attached to the outer end of the electrode outlet 84, and the electrode outlet 84 is
Thus, the outside air does not enter the space inside the holding cover 68 through the space, and the degree of vacuum in the space inside the holding cover 68 does not decrease.

The ultrasonic vibration element 62 having the above configuration
In order to make the vibrator 64 adhere to the vibration transmitting plate 66, the vibrator 64 is placed on the vibration transmitting plate 66, and the holding cover 68 is passed through the electrode wire 82 of the vibrator 64 through the electrode outlet 84. In this state, it is placed on the vibration transmitting plate 66 so as to cover the vibrator 64, and the fixed frame 70 of the holding cover 68 is
Is brought into close contact with the upper surface of the vibration transmission plate 66. And
After attaching the sealing cap 98 to the electrode outlet 84, the vacuum pump 92 is started. As a result, the air pressure in the storage section 78 surrounded by the holding cover 68 and the vibration transmission plate 66 gradually decreases, and accordingly, the flexible sheet 7
2 gradually deforms and approaches the vibrator 64 and the vibration transmission plate 66. Eventually, when the pressure in the storage unit 78 approaches vacuum,
As shown in FIG. 5, the flexible sheet 72 is
6, the vibrator 66 is pressed against the vibration transmission plate 66 by the flexible sheet 72,
The vibrator 66 comes into close contact with the vibration transmission plate 66 in vacuum. And
When the pressure detected by the pressure sensor 86 reaches a predetermined degree of vacuum, the vacuum pump 92 is stopped by a control signal from the control device 94. Even if the vacuum pump 92 is stopped, the check valve 88, the sealing member 76, and the sealing cap 98 allow the flexible sheet 72 and the vibrator 66 to move.
The degree of vacuum between the vibration transmitting plate 66 and the vibration transmitting plate 66 is maintained, and the vibrator 66 remains in vacuum contact with the vibration transmitting plate 66.
It should be noted that the vacuum pump 92 may be kept driven without being stopped, or the vacuum pump 92 may be driven intermittently.

In the ultrasonic vibrating element 62 shown in FIGS. 4 and 5, the vibrator 64 and the vibration transmitting plate 66 are joined without using an adhesive, so that there is a gap between the vibrator 64 and the vibration transmitting plate. No adhesive layer is interposed. For this reason, the transmission efficiency of the ultrasonic waves is improved.

FIG. 6A is a plan view, and FIG. 6B is a cross-sectional view as viewed from the front side. In the ultrasonic vibration element 100, a vibrator 102 is mounted on a vibration transmitting plate 104 made of silicon. In a state of being in close contact with the vacuum, a resin film 106 is laminated so as to completely cover the vibrator 102,
The vibrator 102 is hermetically sealed with a resin film 106 with respect to the vibration transmission plate 104. In the ultrasonic vibration element 100, the vibrator 1
This eliminates the need to continuously perform a vacuum suction operation in order to keep 02 in vacuum.

[0043]

When the substrate cleaning apparatus according to the first aspect of the present invention is used, the vibration transmission plate of the ultrasonic wave applying means is corroded by a chemical solution used as a cleaning liquid, or impurities elute from the vibration transmission plate to cause the substrate to be cleaned. There is no need to worry about contamination. Further, since the vibrator can be sufficiently cooled through the vibration transmission plate, a sufficiently large electric power can be supplied to the vibrator. Therefore, the substrate cleaning apparatus has a high cleaning capability. Become. And the cost of the apparatus can be kept low.

According to a second aspect of the present invention, an ultrasonic wave is applied to the cleaning liquid on the substrate from a long vibration surface adjacent to the liquid discharging port while supplying the cleaning liquid to the substrate from the slit-shaped liquid discharging port. The above effects can be obtained in a substrate cleaning apparatus of a type in which the substrate is cleaned by the method.

In the substrate cleaning apparatus according to the third aspect of the present invention,
The transmission efficiency of ultrasonic waves is improved.

In the substrate cleaning apparatus according to the fourth aspect of the present invention,
It is not necessary to continuously perform a vacuum suction operation to hold the vibrator in vacuum on the vibration transmission plate.

When the ultrasonic vibration element of the invention according to claim 5 is used, the vibration transmission plate is corroded by a chemical solution used as a cleaning liquid, or impurities are eluted from the vibration transmission plate to contaminate the substrate. There is no need to worry.
Therefore, this ultrasonic vibration element is not restricted by the application. Further, since the vibrator can be sufficiently cooled through the vibration transmission plate, a sufficiently large electric power can be supplied to the vibrator. Therefore,
The substrate cleaning device using this ultrasonic vibration element,
It will have high cleaning ability. And the manufacturing cost can be suppressed low.

The ultrasonic vibration element of the invention according to claim 6 is used in a substrate cleaning apparatus of a type in which ultrasonic waves are applied to a cleaning liquid on a substrate from a long vibration surface to clean the substrate, and the above-described effect is obtained. Is obtained.

According to the ultrasonic vibration element of the present invention, the transmission efficiency of ultrasonic waves is improved.

In the ultrasonic vibration element according to the eighth aspect of the present invention, it is not necessary to continuously perform a vacuum suction operation in order to hold the vibrator on the vibration transmitting plate by vacuum suction.

[Brief description of the drawings]

FIG. 1 shows an example of an embodiment of the present invention, and is a view showing a schematic configuration of an ultrasonic cleaning head which is a main part of a substrate cleaning apparatus, wherein FIG. (b) is a view as seen from the lower surface side.

FIG. 2 is an enlarged sectional view of the ultrasonic cleaning head shown in FIG. 1 as viewed from a side.

FIG. 3 is an enlarged cross-sectional view showing another configuration example of the ultrasonic cleaning head as viewed from the side.

FIG. 4 is a sectional view showing a schematic configuration of an ultrasonic vibration element different from that of the substrate cleaning apparatus shown in FIGS. 1 to 3;

FIG. 5 shows the ultrasonic vibration element shown in FIG.
It is sectional drawing which shows the state which the vibrator was vacuum-adhered to the vibration transmission plate.

6 shows a schematic configuration of an ultrasonic vibration element different from that shown in FIG. 4, (a) is a plan view, and (b) is a cross-sectional view as viewed from the front side.

[Explanation of symbols]

 10, 38 Ultrasonic cleaning head 14 Cleaning liquid supply section 16, 52 Ultrasonic application section 18 Long plate-shaped body 20, 44 Liquid introduction port 22, 46 Liquid storage section 24, 48 Liquid outflow hole 26, 50 Liquid discharge port 28 Length Scale housing 30, 54, 62, 100 Ultrasonic vibration element 32, 56, 64, 102 Vibrator 34, 58, 66, 104 Vibration transmission plate 36, 60 Vibration surface 42 Liquid supply pipe 68 Holding cover 70, 71 Fixed frame 72 Flexible sheet 76 Sealing member 80 Vacuum exhaust port 82 Electrode wire 84 Electrode outlet 86 Pressure sensor 88 Check valve 90 Exhaust pipe 92 Vacuum pump 94 Controller 96 Ultrasonic oscillator 98 Sealing cap 106 Resin film W Substrate

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Takamasa Sakai 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto F-term (reference) in Dainippon Screen Mfg. Co., Ltd. 5D107 AA02 AA10 BB11 CC02 CC10 FF08

Claims (8)

[Claims] A cleaning liquid supply means for supplying a cleaning liquid to a substrate; an ultrasonic oscillator; a vibrator connected to the ultrasonic oscillator;
And an ultrasonic wave applying unit configured of a vibration transmission plate joined to one side of the vibrator and applying ultrasonic waves to the cleaning liquid supplied onto the substrate by the cleaning liquid supplying unit. A substrate cleaning apparatus, wherein the vibration transmission plate is formed of silicon. 2. The vibrator of the ultrasonic wave applying means has a long flat plate shape, and the vibration transmission plate has a long flat plate shape equal to or larger than the vibrator. The cleaning liquid supply means extends along the longitudinal direction of the vibration surface adjacent to the vibration surface of the vibration transmission plate, and has a length corresponding to the length of the vibration surface. It has a slit-shaped liquid discharge port that is equal to or longer than the length dimension,
2. The substrate cleaning apparatus according to claim 1, wherein the liquid discharge port is disposed so as to face the relatively moving substrate at a slight interval. 3. The substrate cleaning apparatus according to claim 1, wherein the vibrator is vacuum-adsorbed to the vibration transmission plate. 4. The substrate cleaning apparatus according to claim 3, wherein a resin film is laminated so as to completely cover the vibrator, and the vibrator is hermetically sealed with the resin film with respect to the vibration transmission plate. 5. An ultrasonic vibration element comprising: a vibrator connected to an ultrasonic oscillator; and a vibration transmission plate joined to one side of the vibrator; wherein the vibration transmission plate is formed of silicon. An ultrasonic vibration element characterized by the above. 6. The vibrator has a long flat plate shape, the vibration transmission plate has a long flat plate shape equal to or larger than the vibrator, and the vibration surface of the vibration transmission plate relatively moves. The ultrasonic vibration element according to claim 5, wherein the ultrasonic vibration element is disposed so as to face the substrate at a slight distance. 7. The ultrasonic vibration element according to claim 5, wherein the vibrator is vacuum-adsorbed to the vibration transmission plate. 8. The ultrasonic vibration element according to claim 7, wherein a resin film is laminated so as to completely cover the vibrator, and the vibrator is sealed with the resin film with respect to the vibration transmission plate.