JP2002194578A - Surface treatment method for metallic material containing copper - Google Patents

Surface treatment method for metallic material containing copper

Info

Publication number
JP2002194578A
JP2002194578A JP2000396488A JP2000396488A JP2002194578A JP 2002194578 A JP2002194578 A JP 2002194578A JP 2000396488 A JP2000396488 A JP 2000396488A JP 2000396488 A JP2000396488 A JP 2000396488A JP 2002194578 A JP2002194578 A JP 2002194578A
Authority
JP
Japan
Prior art keywords
surface treatment
copper
material containing
metallic material
treatment method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000396488A
Other languages
Japanese (ja)
Inventor
Hiroyuki Haraga
博行 原賀
Soichi Saito
荘一 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Asahi Denka Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Kogyo KK filed Critical Asahi Denka Kogyo KK
Priority to JP2000396488A priority Critical patent/JP2002194578A/en
Publication of JP2002194578A publication Critical patent/JP2002194578A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a surface treatment method for a metallic material containing highly versatile copper, which shortens a treatment time, besides keeping a same treatment quality as a conventional one, and easily treats even difficult scale to handle. SOLUTION: The surface treatment method for the metallic material containing copper comprises immersing the metallic material containing copper into a surface treatment agent which contains sulfuric acid of 70 g/liter or more and hydrogen peroxide of 10 g/liter or more as essential components, and applying an ultrasonic vibration to the surface treatment agent.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は銅を含有する金属材
料の表面処理方法に関するものであり、特に、ケイ素を
含有する銅合金の表面に形成される酸化ケイ素のような
除去の困難なスケールであっても容易に除去可能な、汎
用性の高い銅を含有する金属材料の表面処理方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating a surface of a metal material containing copper, and more particularly to a method for removing silicon oxide formed on the surface of a copper alloy containing silicon. The present invention relates to a surface treatment method for a highly versatile copper-containing metal material that can be easily removed even if it is present.

【0002】[0002]

【従来の技術】従来から、銅を含有する金属材料は、銅
単体もしくは銅合金としてプリント配線板製造工程など
において広く使用されている。プリント配線板における
銅(もしくは銅合金)張積層板においては、銅(もしく
は銅合金)箔表面に残存している防錆剤や酸化皮膜の除
去などのため表面処理剤による処理が行われており、例
えば、特願平2−236289号公報には、硫酸、過酸
化水素、リン酸、及びピペリジンを有効成分とする表面
処理剤が開示されている。これらのプリント配線板製造
工程に用いる表面処理剤は、近年の高精細化及び生産性
向上の観点から、処理品質を保ちながら一層の処理時間
の短縮化が求められている。また、銅合金として1〜6
重量%程度の鉛を含有する青銅系合金や黄銅系合金は工
業的に満足しうる被削性をもつことから水道配管の水栓
金具、給排水金具、バルブなどに用いられているが、近
年、人体や環境に与える悪影響のため鉛の使用が敬遠さ
れてきており、鉛に変えてケイ素を1〜5重量%程度含
有する黄銅などの銅合金が利用されるようになってい
る。しかし、ケイ素を含有する黄銅などは、焼鈍加工を
施すとその表面に酸化ケイ素に由来するスケールが付着
することがあり、このようなスケールは非常に除去し難
く、化学的な表面処理(例えば上記のような表面処理剤
による処理)では不十分か、非常に時間のかかるもので
あった。
2. Description of the Related Art Conventionally, a metal material containing copper has been widely used as a simple copper or a copper alloy in a printed wiring board manufacturing process and the like. Copper (or copper alloy) -clad laminates in printed wiring boards are treated with surface treatment agents to remove rust inhibitors and oxide films remaining on the copper (or copper alloy) foil surface. For example, Japanese Patent Application No. 2-236289 discloses a surface treating agent containing sulfuric acid, hydrogen peroxide, phosphoric acid, and piperidine as active ingredients. With respect to the surface treatment agents used in these printed wiring board manufacturing processes, further reduction in the processing time while maintaining the processing quality is demanded from the viewpoint of higher definition and higher productivity in recent years. Moreover, 1-6 as a copper alloy
Bronze-based alloys and brass-based alloys containing about 5% by weight of lead are used in faucet fittings, plumbing fittings, plumbing fittings, and valves for water pipes because of their industrially satisfactory machinability. The use of lead has been shunned due to its adverse effects on the human body and the environment, and copper alloys such as brass containing about 1 to 5% by weight of silicon instead of lead have been used. However, brass or the like containing silicon may have scales derived from silicon oxide attached to its surface when subjected to annealing, and such scales are very difficult to remove, and a chemical surface treatment (for example, Treatment with a surface treating agent such as) is insufficient or very time-consuming.

【0003】[0003]

【発明が解決しようとする課題】従って、本発明の目的
は、上記の問題を解決し処理品質を従来同様に保持し、
且つ処理時間を短縮でき、また、処理の困難なスケール
であっても容易に処理することのできる、汎用性の高い
銅を含有する金属材料の表面処理方法を提供することに
ある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems and to maintain the processing quality as before,
It is another object of the present invention to provide a highly versatile surface treatment method for a copper-containing metal material that can shorten the treatment time and can easily treat even a scale that is difficult to treat.

【0004】[0004]

【課題を解決するための手段】本発明者らは上記に鑑み
鋭意研究の結果本発明に到達した。即ち、本発明は第1
に、70g/リットル以上の硫酸及び10g/リットル
以上の過酸化水素を必須成分として含有する表面処理剤
中に銅を含有する金属材料を浸漬し、該表面処理剤に超
音波振動を加えることを特徴とする銅を含有する金属材
料の表面処理方法であり、第2に、銅を含有する金属材
料がケイ素を含有する銅合金である上記の表面処理方法
である。
Means for Solving the Problems The present inventors have arrived at the present invention as a result of intensive studies in view of the above. That is, the present invention relates to the first
Immersing a metal material containing copper in a surface treatment agent containing sulfuric acid of 70 g / L or more and hydrogen peroxide of 10 g / L or more as essential components, and applying ultrasonic vibration to the surface treatment agent. A second feature is the surface treatment method for a metal material containing copper, which is a characteristic feature, wherein the copper-containing metal material is a copper alloy containing silicon.

【0005】本発明に使用する表面処理剤は、必須成分
として硫酸及び過酸化水素を含有するものであるが、こ
のような硫酸−過酸化水素系の表面処理剤は公知であ
る。硫酸−過酸化水素系の表面処理剤は例えば特開平2
−236289号公報にも記載されているが、本発明に
使用する超音波振動との相乗効果を充分に得るために、
本発明においては表面処理剤中の硫酸濃度を70g/リ
ットル以上、好ましくは90〜280g/リットル、及
び過酸化水素濃度を10g/リットル以上、好ましくは
50g/リットル以上とすることが必要である。
[0005] The surface treating agent used in the present invention contains sulfuric acid and hydrogen peroxide as essential components, and such a sulfuric acid-hydrogen peroxide based surface treating agent is known. Sulfuric acid-hydrogen peroxide-based surface treatment agents are described in, for example,
-236289, but in order to obtain a sufficient synergistic effect with the ultrasonic vibration used in the present invention,
In the present invention, it is necessary that the concentration of sulfuric acid in the surface treatment agent is 70 g / L or more, preferably 90 to 280 g / L, and the concentration of hydrogen peroxide is 10 g / L or more, preferably 50 g / L or more.

【0006】硫酸濃度が70g/リットル未満である
と、スケール除去性、特に酸化ケイ素に由来するスケー
ルの除去性、が不十分となり、汎用性にかけるものとな
る。硫酸濃度の上限はスケールの除去性の観点からはと
くに無く、多いほど効果は高いが、概ね280g/リッ
トルを超えて使用しても効果の上昇は軽微であり、かえ
って廃水処理の問題、経済性の悪化などの問題が浮上し
てくるので、実用的には280g/リットル以下とする
ことが好ましい。また、過酸化水素濃度が10g/リッ
トル未満であっても、同様にスケールの除去性が不十分
となり、汎用性にかけるものとなる。過酸化水素濃度の
上限はスケールの除去性の観点からはとくに無く、多い
ほど効果は高いが、概ね200g/リットルを超えて使
用しても効果の上昇は軽微であり、かえって廃水処理問
題が浮上してくるので、実用的には200g/リットル
以下とすることが好ましい。
[0006] If the sulfuric acid concentration is less than 70 g / liter, the removability of the scale, particularly the removability of the scale derived from silicon oxide, becomes insufficient, and the product becomes versatile. The upper limit of the sulfuric acid concentration is not particularly limited from the viewpoint of the removability of the scale. The more the concentration is, the higher the effect is. Practically, it is preferable to be 280 g / liter or less, since problems such as deterioration of the surface appear. Further, even if the hydrogen peroxide concentration is less than 10 g / liter, similarly, the removability of the scale becomes insufficient, and the versatility is increased. The upper limit of the concentration of hydrogen peroxide is not particularly limited from the viewpoint of the removability of scale. The larger the amount, the higher the effect. Therefore, practically, it is preferably 200 g / liter or less.

【0007】本発明に使用する表面処理剤には、本発明
の効果を阻害しない範囲で公知の添加剤を通常の使用量
の範囲で使用することができる。例えば特開平2−23
6289号公報に記載されているような添加剤を配合す
ることができる。具体例としては、リン酸(0.5g/
リットル以上、好ましくは2〜5g/リットル)及び/
又はピベリジン(その誘導体を包含し、0.1g/リッ
トル以上、好ましくは0.1〜5g/リットル)を含有
することができる。
As the surface treating agent used in the present invention, known additives can be used in a range of a usual amount as long as the effects of the present invention are not impaired. For example, JP-A-2-23
Additives as described in JP-A-6289 can be blended. As a specific example, phosphoric acid (0.5 g /
Liter or more, preferably 2 to 5 g / liter) and / or
Alternatively, it may contain piberidine (including its derivative, at least 0.1 g / l, preferably 0.1 to 5 g / l).

【0008】本発明は、上記表面処理剤中に銅を含有す
る金属材料を浸漬する工程を有するものである。ここ
で、銅を含有する金属材料とは、銅単体もしくは銅合金
であり、銅合金としては、青銅、黄銅、丹銅、洋白など
を挙げることができる。これらのうち、ケイ素を(例え
ば1〜5重量%)含有する黄銅は、水道管や水道用バル
ブなどの用途に使用されるものであるが、焼鈍加工する
ことによりその表面に酸化ケイ素由来のスケールが付着
することがあり、このような銅合金をメッキ加工等する
ためにはこのようなスケールを除去する必要がある。し
かし、このような酸化ケイ素に由来するスケールは除去
が困難であり、従来の方法に比較して最も効果が顕著で
あるという点で、本発明はケイ素を含有する黄銅に対し
て使用することが特に好ましい。
The present invention has a step of immersing a metal material containing copper in the above-mentioned surface treating agent. Here, the metal material containing copper is a simple substance of copper or a copper alloy, and examples of the copper alloy include bronze, brass, red copper, nickel silver, and the like. Of these, brass containing silicon (for example, 1 to 5% by weight) is used for applications such as water pipes and water valves, and scales derived from silicon oxide are formed on the surface by annealing. May be attached, and it is necessary to remove such scales in order to plate such a copper alloy. However, such a scale derived from silicon oxide is difficult to remove, and the effect is most remarkable as compared with the conventional method.In this respect, the present invention can be used for brass containing silicon. Particularly preferred.

【0009】本発明では、銅を含有する金属材料を浸漬
した上記の表面処理剤に超音波振動を加える。超音波振
動としては、例えば周波数20kHz〜200kHz程
度であればよく、出力は表面処理剤液の量に略比例し、
例えば20〜200W/リットル程度であればよい。周
波数が上記範囲外の場合、及び出力が上記未満の場合
は、超音波振動を加える効果が十分でない場合がある。
また、出力が上記を超えることは一般に工業化適正の点
で好ましくない。また、特に、ケイ素を含有する黄銅の
表面の酸化ケイ素に由来するスケールを除去せんとする
場合は、周波数30kHz〜50kHz、出力30〜1
00W/リットルであることが効果及び工業化適正の点
で最も好ましい。本発明において表面処理液の温度は特
に限定されず、通常表面処理が行われる温度であれば何
ら差し支えなく、通常10℃〜40℃、好ましくは15
℃〜35℃の温度が用いられる。
In the present invention, ultrasonic vibration is applied to the above-mentioned surface treatment agent in which a metal material containing copper is immersed. As the ultrasonic vibration, for example, the frequency may be about 20 kHz to 200 kHz, and the output is substantially proportional to the amount of the surface treatment agent liquid,
For example, it may be about 20 to 200 W / liter. If the frequency is outside the above range or if the output is less than the above, the effect of applying ultrasonic vibration may not be sufficient.
Further, it is generally not preferable that the output exceeds the above from the viewpoint of industrialization suitability. In particular, when removing the scale derived from silicon oxide on the surface of brass containing silicon, the frequency is 30 kHz to 50 kHz, and the output is 30 to 1.
It is most preferable that it is 00 W / liter in terms of effect and industrial suitability. In the present invention, the temperature of the surface treatment liquid is not particularly limited, and may be any temperature at which the surface treatment is usually performed, and is usually 10 ° C to 40 ° C, preferably 15 ° C.
Temperatures between 0 ° C and 35 ° C are used.

【0010】[0010]

【実施例】以下実施例を挙げて本発明を更に説明する
が、本発明はこれらに限定されるものではない。 〔実施例1〜21、比較例1〜5〕表1の組成の水溶液
を表面処理剤として用意した。焼鈍加工を施し、その表
面に酸化ケイ素に由来するスケールを付着させた直径2
0mm、長さ10cmのケイ素含有黄銅(Si含量3重
量%)棒を試験片とした。表面処理剤1リットルを、超
音波加振器を配置した処理槽にとり、39kHz、10
0Wまたは30Wの超音波振動を加えた。ここに試験片
を表1に示した条件で浸漬して表面処理し、処理後直ち
に水洗・乾燥させ、試験片表面のスケール除去状態を、
処理時間10分以内は1分毎に、それ以上は10分毎に
観察した。表1に実用上合格といえるスケール除去率9
0%以上となるに要する処理時間を記す。
The present invention will be further described with reference to the following examples, but the present invention is not limited to these examples. Examples 1 to 21 and Comparative Examples 1 to 5 An aqueous solution having the composition shown in Table 1 was prepared as a surface treatment agent. Annealed, with a diameter of 2 with a scale derived from silicon oxide attached to the surface
A test piece was a silicon-containing brass (Si content: 3% by weight) rod having a length of 0 mm and a length of 10 cm. One liter of the surface treatment agent is placed in a treatment tank in which an ultrasonic vibrator is arranged, and is supplied at 39 kHz and 10 kHz.
Ultrasonic vibration of 0 W or 30 W was applied. Here, the test piece was immersed under the conditions shown in Table 1 to perform a surface treatment. Immediately after the treatment, the test piece was washed with water and dried.
Observation was performed every 1 minute within a treatment time of 10 minutes, and every 10 minutes after that. Table 1 shows the scale removal rate 9 which can be regarded as a practical pass.
The processing time required to reach 0% or more is described.

【0011】[0011]

【表1】 [Table 1]

【0012】〔比較例6〜8〕処理液組成を表2の通り
に替えた他は実施例5と同一の処理条件(但し、比較例
8のみ60℃)で同様に行った。結果を表2に示す。
[Comparative Examples 6 to 8] The same processing conditions as in Example 5 were used (except for Comparative Example 8 at 60 ° C.) except that the composition of the processing solution was changed as shown in Table 2. Table 2 shows the results.

【0013】[0013]

【表2】 [Table 2]

【0014】[0014]

【発明の効果】本発明により、銅を含有する金属材料の
表面処理における処理品質を従来同様に保持し、且つ処
理時間を短縮でき、また、処理の困難なスケールであっ
ても容易に処理することが可能となる。
According to the present invention, the treatment quality in the surface treatment of a metal material containing copper can be maintained as before, the treatment time can be shortened, and the treatment can be easily performed even on a scale where treatment is difficult. It becomes possible.

フロントページの続き Fターム(参考) 4K053 PA06 PA12 PA13 QA01 RA13 RA15 SA06 SA18 YA03 5E343 AA01 AA11 BB24 CC33 CC34 CC50 CC52 CC54 EE05 EE06 EE12 GG20 Continued on the front page F term (reference) 4K053 PA06 PA12 PA13 QA01 RA13 RA15 SA06 SA18 YA03 5E343 AA01 AA11 BB24 CC33 CC34 CC50 CC52 CC54 EE05 EE06 EE12 GG20

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 70g/リットル以上の硫酸及び10g
/リットル以上の過酸化水素を必須成分として含有する
表面処理剤中に銅を含有する金属材料を浸漬し、該表面
処理剤に超音波振動を加えることを特徴とする銅を含有
する金属材料の表面処理方法。
1. Sulfuric acid of 70 g / l or more and 10 g
Of a copper-containing metal material characterized by immersing a copper-containing metal material in a surface treatment agent containing hydrogen peroxide as an essential component in a volume of not less than / liter and applying ultrasonic vibration to the surface treatment agent. Surface treatment method.
【請求項2】 銅を含有する金属材料がケイ素を含有す
る銅合金である請求項1記載の表面処理方法。
2. The surface treatment method according to claim 1, wherein the metal material containing copper is a copper alloy containing silicon.
JP2000396488A 2000-12-27 2000-12-27 Surface treatment method for metallic material containing copper Pending JP2002194578A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000396488A JP2002194578A (en) 2000-12-27 2000-12-27 Surface treatment method for metallic material containing copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000396488A JP2002194578A (en) 2000-12-27 2000-12-27 Surface treatment method for metallic material containing copper

Publications (1)

Publication Number Publication Date
JP2002194578A true JP2002194578A (en) 2002-07-10

Family

ID=18861767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000396488A Pending JP2002194578A (en) 2000-12-27 2000-12-27 Surface treatment method for metallic material containing copper

Country Status (1)

Country Link
JP (1) JP2002194578A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101148000B1 (en) 2012-03-15 2012-05-24 (유)유달조선 Electrochemical method to improve cavitation resistivity of copper alloy
CN103114284A (en) * 2013-02-26 2013-05-22 浙江荣亿精密机械有限公司 Copper sleeve surface treatment process
JP2014203880A (en) * 2013-04-02 2014-10-27 三菱マテリアル株式会社 Method for manufacturing substrate for power module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101148000B1 (en) 2012-03-15 2012-05-24 (유)유달조선 Electrochemical method to improve cavitation resistivity of copper alloy
CN103114284A (en) * 2013-02-26 2013-05-22 浙江荣亿精密机械有限公司 Copper sleeve surface treatment process
JP2014203880A (en) * 2013-04-02 2014-10-27 三菱マテリアル株式会社 Method for manufacturing substrate for power module

Similar Documents

Publication Publication Date Title
CA2004796C (en) Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
US7384901B2 (en) Process for cleaning aluminum and aluminum alloy surfaces with nitric acid and chromic acid-free compositions
JP2001247986A (en) Composition for removing aluminum smut
JP6505498B2 (en) Method of passivating stainless steel
US4510018A (en) Solution and process for treating copper and copper alloys
US20110045673A1 (en) Method for manufacturing a silicon surface with pyramidal texture
US4373656A (en) Method of preserving the solderability of copper
JPS6354077B2 (en)
JP2002194578A (en) Surface treatment method for metallic material containing copper
US5100500A (en) Milling solution and method
JP4535232B2 (en) Titanium or titanium alloy etchant
US20030056807A1 (en) Method for cleaning and passivating a metal surface
JP4090951B2 (en) Mirror finish etchant for copper and copper alloys
JPH08253880A (en) Chemical treating solution for dissolving iron-nickel alloy
JP3361680B2 (en) Surface treatment solution for copper or copper alloy
EP0265578A1 (en) A non-abrasive polish or cleaning composition and process for its preparation
RU2177053C2 (en) Composition for cleansing article made of nonferrous and precious metal alloy, precious stone and crystal glass surface and method of cleansing with composition
JPH044397B2 (en)
JP3829189B2 (en) Grain boundary measurement method for steel with prior austenite grain boundaries.
JPS6320489A (en) Stripping method for plating
JPS6148583A (en) Scale remover
JP2021195572A (en) Etching agent and etching method
EP4424794A1 (en) A solution for polishing of copper and its alloys and a method for polishing
KR20210113636A (en) How to form copper oxide on a copper surface
JP2002097587A (en) Method for removing complex film on surface of copper and copper alloy