US7809642B1
(en)
|
1998-06-22 |
2010-10-05 |
Jpmorgan Chase Bank, N.A. |
Debit purchasing of stored value card for use by and/or delivery to others
|
US6615189B1
(en)
|
1998-06-22 |
2003-09-02 |
Bank One, Delaware, National Association |
Debit purchasing of stored value card for use by and/or delivery to others
|
US8793160B2
(en)
|
1999-12-07 |
2014-07-29 |
Steve Sorem |
System and method for processing transactions
|
AU2002327322A1
(en)
|
2001-07-24 |
2003-02-17 |
First Usa Bank, N.A. |
Multiple account card and transaction routing
|
US8020754B2
(en)
|
2001-08-13 |
2011-09-20 |
Jpmorgan Chase Bank, N.A. |
System and method for funding a collective account by use of an electronic tag
|
US7899753B1
(en)
|
2002-03-25 |
2011-03-01 |
Jpmorgan Chase Bank, N.A |
Systems and methods for time variable financial authentication
|
US8751391B2
(en)
|
2002-03-29 |
2014-06-10 |
Jpmorgan Chase Bank, N.A. |
System and process for performing purchase transactions using tokens
|
KR100467634B1
(ko)
*
|
2002-07-16 |
2005-01-24 |
삼성에스디에스 주식회사 |
스마트 카드 및 그의 제조방법
|
US6726099B2
(en)
*
|
2002-09-05 |
2004-04-27 |
Honeywell International Inc. |
RFID tag having multiple transceivers
|
US7809595B2
(en)
|
2002-09-17 |
2010-10-05 |
Jpmorgan Chase Bank, Na |
System and method for managing risks associated with outside service providers
|
US20040122736A1
(en)
|
2002-10-11 |
2004-06-24 |
Bank One, Delaware, N.A. |
System and method for granting promotional rewards to credit account holders
|
FI20022070A
(fi)
*
|
2002-11-20 |
2004-05-21 |
Rafsec Oy |
Transponderi
|
JP2004185208A
(ja)
*
|
2002-12-02 |
2004-07-02 |
Sony Corp |
Icカード
|
US7588184B2
(en)
|
2003-01-03 |
2009-09-15 |
American Express Travel Related Services Company, Inc. |
Metal-containing transaction card and method of making the same
|
WO2004063977A2
(en)
|
2003-01-03 |
2004-07-29 |
American Express Travel Related Services Company, Inc. |
Metal containing transaction card and method of making the same
|
US8033457B2
(en)
|
2003-01-03 |
2011-10-11 |
American Express Travel Related Services Company, Inc. |
Metal-containing transaction card and method of making the same
|
US7823777B2
(en)
*
|
2003-01-03 |
2010-11-02 |
American Express Travel Related Services Company, Inc. |
Metal-containing transaction card and method of making same
|
FR2853115B1
(fr)
*
|
2003-03-28 |
2005-05-06 |
A S K |
Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede
|
JP2004348590A
(ja)
*
|
2003-05-23 |
2004-12-09 |
Konica Minolta Photo Imaging Inc |
Icカード及びicカード製造方法
|
US8306907B2
(en)
|
2003-05-30 |
2012-11-06 |
Jpmorgan Chase Bank N.A. |
System and method for offering risk-based interest rates in a credit instrument
|
JP2005014302A
(ja)
*
|
2003-06-24 |
2005-01-20 |
Sony Corp |
合成樹脂カード及びその製造方法
|
US7237719B2
(en)
*
|
2003-09-03 |
2007-07-03 |
Stmicroelectronics, Inc. |
Method and apparatus for a USB and contactless smart card device
|
JP3803097B2
(ja)
|
2003-10-07 |
2006-08-02 |
株式会社日立製作所 |
無線通信媒体の製造方法
|
JP4504693B2
(ja)
*
|
2004-01-30 |
2010-07-14 |
トッパン・フォームズ株式会社 |
スレッド、icチップ入りシート及びその製造方法
|
JP2005234683A
(ja)
*
|
2004-02-17 |
2005-09-02 |
Matsushita Electric Ind Co Ltd |
Icカード
|
US7154170B2
(en)
*
|
2004-03-31 |
2006-12-26 |
Intel Corporation |
Semiconductor package security features using thermochromatic inks and three-dimensional identification coding
|
KR100602621B1
(ko)
*
|
2004-06-16 |
2006-07-19 |
한국조폐공사 |
조립식 콤비카드 및 이의 제조방법
|
JP2006024087A
(ja)
*
|
2004-07-09 |
2006-01-26 |
Nec Corp |
無線デバイス、その製造方法、その検査方法及び検査装置並びに無線装置及びその製造方法
|
CN100469591C
(zh)
*
|
2004-09-14 |
2009-03-18 |
株式会社理光 |
可逆型热敏记录介质、图像处理方法以及图像处理装置
|
US7401731B1
(en)
|
2005-05-27 |
2008-07-22 |
Jpmorgan Chase Bank, Na |
Method and system for implementing a card product with multiple customized relationships
|
JP4815891B2
(ja)
*
|
2005-06-22 |
2011-11-16 |
株式会社日立製作所 |
無線icタグ及びアンテナの製造方法
|
TWI339358B
(en)
*
|
2005-07-04 |
2011-03-21 |
Hitachi Ltd |
Rfid tag and manufacturing method thereof
|
EP1780662A1
(fr)
*
|
2005-10-27 |
2007-05-02 |
Axalto SA |
Module renforcé pour carte à puce et procédé de fabrication dudit module
|
US7595732B2
(en)
*
|
2006-03-31 |
2009-09-29 |
Broadcom Corporation |
Power generating circuit
|
JP2007261121A
(ja)
|
2006-03-29 |
2007-10-11 |
Ricoh Co Ltd |
可逆性感熱記録媒体用洗浄方法
|
US20070290048A1
(en)
*
|
2006-06-20 |
2007-12-20 |
Innovatier, Inc. |
Embedded electronic device and method for manufacturing an embedded electronic device
|
TWI506560B
(zh)
*
|
2006-08-07 |
2015-11-01 |
Kuo Ching Chiang |
Non - contact credit card and financial card trading device and its non - contact transaction method
|
TWI584199B
(zh)
*
|
2006-08-07 |
2017-05-21 |
江國慶 |
具有非接觸式儲值卡之手持通訊裝置及其方法
|
JP4382783B2
(ja)
*
|
2006-08-09 |
2009-12-16 |
富士通株式会社 |
Rfidタグ
|
JP2009178843A
(ja)
|
2006-08-22 |
2009-08-13 |
Rynne Group Llc |
識別カードおよびその識別カードを使用した識別カード取引システム
|
JP4860436B2
(ja)
*
|
2006-11-07 |
2012-01-25 |
トッパン・フォームズ株式会社 |
Icカードおよびその製造方法
|
WO2008056714A1
(fr)
*
|
2006-11-07 |
2008-05-15 |
Toppan Forms Co., Ltd. |
Matériau de base de fenêtre, et carte à module incorporé et son procédé de fabrication
|
JP2008210032A
(ja)
*
|
2007-02-23 |
2008-09-11 |
Fujitsu Ltd |
Rfidタグ
|
JP2008204139A
(ja)
*
|
2007-02-20 |
2008-09-04 |
Toppan Forms Co Ltd |
非接触型データ受送信体
|
JP5145881B2
(ja)
*
|
2007-11-07 |
2013-02-20 |
富士通株式会社 |
Rfidタグ
|
USD636021S1
(en)
|
2008-07-17 |
2011-04-12 |
Jpmorgan Chase Bank, N.A. |
Eco-friendly transaction device
|
USD617378S1
(en)
|
2009-02-12 |
2010-06-08 |
Jpmorgan Chase Bank, N.A. |
Transaction device with a gem-like surface appearance
|
USD620975S1
(en)
|
2009-02-12 |
2010-08-03 |
Jpmorgan Chase Bank, N.A. |
Transaction device
|
US8725589B1
(en)
|
2009-07-30 |
2014-05-13 |
Jpmorgan Chase Bank, N.A. |
Methods for personalizing multi-layer transaction cards
|
USD623690S1
(en)
|
2010-03-05 |
2010-09-14 |
Jpmorgan Chase Bank, N.A. |
Metal transaction device with gem-like surface
|
AU2011224861B2
(en)
*
|
2010-03-08 |
2015-11-26 |
Sensormatic Electronics Llc |
System and method for security tag deployment using reversible adhesives
|
USD643064S1
(en)
|
2010-07-29 |
2011-08-09 |
Jpmorgan Chase Bank, N.A. |
Metal transaction device with gem-like surface
|
KR101275983B1
(ko)
|
2010-09-01 |
2013-06-14 |
현대카드 주식회사 |
메탈 결제카드 및 그 제작 방법
|
US10032099B2
(en)
|
2012-07-20 |
2018-07-24 |
CPI Card Group—Colorado, Inc. |
Weighted transaction card
|
US8857722B2
(en)
|
2012-07-20 |
2014-10-14 |
CPI Card Group—Colorado, Inc. |
Weighted transaction card
|
CN103996351B
(zh)
*
|
2013-02-20 |
2020-01-21 |
泰科消防及安全有限公司 |
粘合剂结合的物品保护标签
|
USD854083S1
(en)
|
2013-03-27 |
2019-07-16 |
Jpmorgan Chase Bank, N.A. |
Hybrid transaction device
|
DE102013109976B4
(de)
*
|
2013-09-11 |
2017-06-22 |
Infineon Technologies Ag |
Chipkartenmodul-Anordnung, Chipkarte, Verfahren zum Herstellen einer Chipkartenmodul-Anordnung und Verfahren zum Herstellen einer Chipkarte
|
US9442662B2
(en)
*
|
2013-10-18 |
2016-09-13 |
Sandisk Technologies Llc |
Device and method for managing die groups
|
EP3061032A4
(en)
|
2013-10-25 |
2017-10-11 |
CPI Card Group -Colorado, Inc. |
Multi-metal layered card
|
JP6280014B2
(ja)
*
|
2014-09-30 |
2018-02-14 |
新光電気工業株式会社 |
半導体装置及びその製造方法
|
JP6353763B2
(ja)
*
|
2014-09-30 |
2018-07-04 |
新光電気工業株式会社 |
半導体装置及びその製造方法
|
US20160232438A1
(en)
|
2015-02-06 |
2016-08-11 |
American Express Travel Related Services Company, Inc. |
Ceramic-containing transaction cards
|
WO2017210305A1
(en)
|
2016-06-01 |
2017-12-07 |
Cpi Card Group - Colorado, Inc. |
Ic chip card with integrated biometric sensor pads
|
WO2018152218A1
(en)
|
2017-02-14 |
2018-08-23 |
Cpi Card Group - Colorado, Inc. |
Edge-to-edge metal card and production method
|
KR102242063B1
(ko)
|
2019-11-04 |
2021-05-12 |
(주)비티비엘 |
품질이 우수한 휴대용 카드
|