JP2002129377A - Method for manufacturing sn-ni alloy plated stainless steel-sheet with low contact resistance and superior surface luster - Google Patents

Method for manufacturing sn-ni alloy plated stainless steel-sheet with low contact resistance and superior surface luster

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Publication number
JP2002129377A
JP2002129377A JP2000319860A JP2000319860A JP2002129377A JP 2002129377 A JP2002129377 A JP 2002129377A JP 2000319860 A JP2000319860 A JP 2000319860A JP 2000319860 A JP2000319860 A JP 2000319860A JP 2002129377 A JP2002129377 A JP 2002129377A
Authority
JP
Japan
Prior art keywords
stainless steel
plating
plating layer
contact resistance
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000319860A
Other languages
Japanese (ja)
Inventor
Keiji Izumi
圭二 和泉
Masayoshi Tadano
政義 多々納
Eiji Watanabe
栄次 渡辺
Masaru Sato
勝 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Nisshin Co Ltd
Original Assignee
Nisshin Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nisshin Steel Co Ltd filed Critical Nisshin Steel Co Ltd
Priority to JP2000319860A priority Critical patent/JP2002129377A/en
Publication of JP2002129377A publication Critical patent/JP2002129377A/en
Withdrawn legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a Sn-Ni alloy plated stainless steel-sheet which presents a preferable luster, and which shows a low contact resistance even after exposed in an atmosphere of high temperature and high humidity for a long time. SOLUTION: This method includes employing a ferritic stainless steel sheet or an austenitic stainless steel sheet with surface roughness of 0.050 μm or less by Ra (a unit of average surface roughness defined in JIS), as a base sheet to be plated, forming a Sn-Ni alloy plated layer with the film thickness of 0.1-0.5 μm including 60-90 mass% of Sn, on one side of the base sheet, and then bright finish rolling the surface with the elongation rate of 0.2-1%. The base sheet is preferably strike plated with Ni beforehand.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、電池缶用,接点用バネ
材等に使用され、接触抵抗が低く光沢度の高いSn−N
i合金めっきステンレス鋼板を製造する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for a battery can, a spring material for a contact, etc., and has a low contact resistance and a high glossiness.
The present invention relates to a method for producing an i-alloy-plated stainless steel sheet.

【0002】[0002]

【従来の技術】ステンレス鋼板は、表面に不動態皮膜が
形成されているため接触抵抗が高く、低接触抵抗が要求
される電池缶,接点バネ材等の用途には鋼板ままでは適
さない。そのため、Niめっきを施すことにより接触抵
抗を下げたステンレス鋼が電池缶,接点バネ材等の用途
に使用されており、見栄えを良くするために表面光沢の
あるNiめっき材が好まれている。
2. Description of the Related Art A stainless steel sheet has a high contact resistance due to the formation of a passivation film on its surface and is not suitable as it is for applications such as battery cans and contact spring materials which require a low contact resistance. For this reason, stainless steel whose contact resistance has been reduced by applying Ni plating is used for applications such as battery cans and contact spring materials, and Ni plated materials having a glossy surface are preferred in order to improve appearance.

【0003】ステンレス鋼板に表面光沢のある光沢Ni
めっき層を形成する方法としては、ストライクめっき後
に光沢Niめっきを施す方法が一般的である。ストライ
クめっきには、たとえば塩化ニッケル及び硫酸からなる
pH1以下のウッド浴が使用される。光沢Niめっきに
は、とえば硫酸ニッケル,塩化ニッケル,ホウ酸等を含
むpH3.5〜5.0のワット浴にケトン,アルデヒ
ド,スルホン酸塩等の有機化合物を光沢剤として添加し
ためっき浴が使用される。光沢Niめっき層は、たとえ
ば2〜4μmの厚みで形成される。
[0003] Shin Ni with a glossy surface on a stainless steel plate
As a method of forming a plating layer, a method of applying bright Ni plating after strike plating is generally used. For strike plating, for example, a wood bath having a pH of 1 or less made of nickel chloride and sulfuric acid is used. For bright Ni plating, for example, a plating bath in which an organic compound such as ketone, aldehyde, and sulfonate is added as a brightener to a Watt bath having a pH of 3.5 to 5.0 containing nickel sulfate, nickel chloride, boric acid, or the like. used. The bright Ni plating layer is formed with a thickness of, for example, 2 to 4 μm.

【0004】光沢Niめっき以外に、バフ研磨等によっ
てもNiめっき層に光沢を付与できる。この場合、光沢
剤を添加していないワット浴や全塩化物浴を用いた電気
めっきによりたとえば3〜5μmの無光沢Niめっき層
を形成した後、無光沢Niめっき層をバフ研磨する。ま
た、特開昭63−145793号公報では、表面光沢を
もつステンレス鋼板の表面に厚み0.01〜0.5μm
と薄膜の無光沢Niめっき層を形成することにより、加
工性及び表面光沢に優れ、しかも長期間にわたって低接
触抵抗を保持するステンレス鋼Niめっき材が製造でき
ることが紹介されている。
[0004] In addition to bright Ni plating, buffing or the like can also be used to impart gloss to the Ni plating layer. In this case, a matte Ni plating layer of, for example, 3 to 5 μm is formed by electroplating using a Watt bath or a total chloride bath to which no brightener is added, and then the matte Ni plating layer is buff-polished. In Japanese Patent Application Laid-Open No. 63-145793, a thickness of 0.01 to 0.5 μm is applied to the surface of a stainless steel plate having a surface gloss.
It is introduced that a stainless steel Ni-plated material having excellent workability and surface gloss and maintaining low contact resistance for a long period of time can be manufactured by forming a thin matte Ni plating layer with a thin film.

【0005】[0005]

【発明が解決しようとする課題】光沢剤を添加しためっ
き浴を用いる光沢Niめっきでは、一般的にNiめっき
層を厚膜にする必要がある。また、めっき浴中の光沢剤
成分が電解反応によって早期に消耗するので、広幅コイ
ルで工業的規模の連続めっきに光沢Niめっきを適用す
る場合、光沢剤を連続的に補給してめっき浴中に一定量
の光沢剤を確保することが必要となる。しかし、めっき
浴中の光沢剤の濃度管理は非常に難しく、光沢剤の濃度
変動に応じたNiめっき層の光沢変動が生じやすいこと
から品質が不安定になる。しかも、高価な光沢剤を消費
し、且つ厚膜のNiめっき層を必要とすることから製造
コストも高くなりがちである。
In bright Ni plating using a plating bath to which a brightener is added, it is generally necessary to make the Ni plating layer thick. Also, since brightener components in the plating bath are quickly consumed by the electrolytic reaction, when bright Ni plating is applied to continuous plating on an industrial scale with a wide coil, the brightener is continuously replenished in the plating bath. It is necessary to secure a certain amount of brightener. However, it is very difficult to control the concentration of the brightener in the plating bath, and the quality of the Ni plating layer becomes unstable because the gloss of the Ni plating layer easily changes in accordance with the concentration change of the brightener. In addition, since an expensive brightener is consumed and a thick Ni plating layer is required, the manufacturing cost tends to be high.

【0006】無光沢Niめっき層をバフ研磨して光沢を
付与する場合、バフ研磨でNiめっき層が削り取られる
ため、必要以上の厚みで無光沢Niめっき層を形成する
ことが必要となる。しかも、バフ研磨されたNiめっき
層の表面にバフ目の線状模様がつけられるため、美麗な
表面が得られがたい。
When buffing the matte Ni plating layer to impart gloss, the buffing removes the Ni plating layer, so that it is necessary to form the matte Ni plating layer with an excessive thickness. Moreover, a buffed linear pattern is formed on the surface of the buffed Ni plating layer, so that it is difficult to obtain a beautiful surface.

【0007】薄い無光沢Niめっき層で光沢性を確保す
る方法では、ステンレス鋼めっき材を電池缶等の形状に
成形すると、無光沢Niめっき層が金型に接触する加工
部では金型との摩擦によって無光沢Niめっき層表面が
高光沢面になる。その結果,電池缶頭部では無光沢Ni
めっき層の外観を呈するが、電池缶側壁部では高光沢の
外観になり、電池缶頭部と電池缶側壁部との光沢差が著
しく大きな電池缶となり、製品の見栄えが悪化する。し
かも、光沢Niめっき層に比較して軟質の無光沢Niめ
っき層が形成されたステンレス鋼板では、電池缶製造工
程での打抜き,プレス加工,組立て工程等で無数の擦り
疵が発生しやすく、全体的に疵の多い不良な外観をもつ
電池缶になりやすい。
[0007] In the method of ensuring glossiness with a thin matte Ni plating layer, when a stainless steel plating material is formed into a shape such as a battery can, the matte Ni plating layer contacts the mold at the processing portion where the matte portion contacts the mold. The surface of the matte Ni plating layer becomes a high gloss surface due to friction. As a result, the matte Ni
Although the appearance of the plating layer is exhibited, the appearance becomes high gloss on the side wall portion of the battery can, the difference in gloss between the battery can head and the side wall portion of the battery can becomes remarkably large, and the appearance of the product deteriorates. Moreover, the stainless steel sheet on which the soft matte Ni plating layer is formed as compared to the bright Ni plating layer is liable to generate an infinite number of scratches in the punching, pressing, assembling steps, etc. in the battery can manufacturing process. It tends to be a battery can with a defective appearance with many scratches.

【0008】電池缶,接点バネ材等の用途では、光沢度
が高いことに加え、めっき層の接触抵抗が性能を決定す
る重要な要因である。光沢剤添加めっき浴から得られる
光沢Niめっき層は、表面光沢に優れているものの、高
温高湿雰囲気に長時間曝されるとめっき層に含まれてい
る光沢剤(有機物)の分解によってNiめっき層表面の
酸化が加速される。この点、光沢Niめっき層は、表面
酸化により接触抵抗が非常に高くなる(具体的には、1
000mΩ以上)ので、電池缶,接点バネ材等の用途に
は適さない。他方、光沢剤無添加のめっき浴から得られ
る無光沢Niめっき層は、高温高湿雰囲気に長時間曝さ
れると接触抵抗が70mΩ程度に上昇し、時計等に組み
込まれるリチウムボタン電池としての要求値20mΩ以
下を大きく上回る。また、バフ研磨で光沢を付与しため
っき層では、バフ研磨中の加熱によってNiめっき層の
表面にNi酸化物等の皮膜が形成され易く、高温高湿雰
囲気に長時間曝されると接触抵抗が500mΩ程度まで
高くなる。
In applications such as battery cans and contact spring materials, in addition to high gloss, the contact resistance of the plating layer is an important factor in determining performance. The bright Ni plating layer obtained from the brightener-added plating bath has excellent surface gloss, but when exposed to a high-temperature and high-humidity atmosphere for a long time, the brightener (organic substance) contained in the plating layer is decomposed to produce Ni plating. Oxidation of the layer surface is accelerated. In this regard, the bright Ni plating layer has a very high contact resistance due to surface oxidation (specifically, 1
000 mΩ or more), which is not suitable for applications such as battery cans and contact spring materials. On the other hand, a matte Ni plating layer obtained from a plating bath without a brightener increases the contact resistance to about 70 mΩ when exposed to a high-temperature and high-humidity atmosphere for a long time, and is required as a lithium button battery incorporated in a watch or the like. It greatly exceeds the value of 20 mΩ or less. In addition, in the plating layer provided with gloss by buff polishing, a film of Ni oxide or the like is easily formed on the surface of the Ni plating layer by heating during the buff polishing, and the contact resistance is reduced when exposed to a high temperature and high humidity atmosphere for a long time. It increases to about 500 mΩ.

【0009】[0009]

【課題を解決するための手段】本発明は、このような問
題を解消すべく案出されたものであり、表面粗さを調整
したステンレス鋼をめっき原板とし、その上に特定条件
下でストライクめっき及び本めっきを施して得られたS
n−Ni合金めっきステンレス鋼板をブライト調質圧延
することにより、光沢剤の添加を必要とすることなく、
光沢度に優れ接触抵抗が低く電池缶,接点バネ剤等とし
て好適なSn−Niめっきステンレス鋼板を製造するこ
とを目的とする。
DISCLOSURE OF THE INVENTION The present invention has been devised in order to solve such a problem. A stainless steel plate whose surface roughness has been adjusted is used as a plating base plate, on which a strike is performed under specific conditions. S obtained by plating and main plating
Bright temper rolling of an n-Ni alloy-plated stainless steel sheet eliminates the need for a brightener,
An object of the present invention is to produce a Sn—Ni-plated stainless steel sheet which is excellent in glossiness, has low contact resistance, and is suitable as a battery can, a contact spring agent and the like.

【0010】本発明の製造方法は、その目的を達成する
ため、表面粗さがRa0.050μm以下のフェライト
系ステンレス鋼板又はオーステナイト系ステンレス鋼板
をめっき原板とし、めっき原板の片面にSn:60〜9
0質量%を含む膜厚0.1〜0.5μmのSn−Ni合
金めっき層を形成し、次いで伸び率0.2〜1%でブラ
イト調質圧延することを特徴とする。Sn−Ni合金め
っきされるステンレス鋼板は、予めNiストライクめっ
きをしておくことが好ましい。
In order to achieve the object, the production method of the present invention uses a ferritic stainless steel plate or an austenitic stainless steel plate having a surface roughness of Ra 0.050 μm or less as a plating base plate, and Sn: 60 to 9 on one surface of the plating base plate.
A Sn—Ni alloy plating layer having a thickness of 0.1 to 0.5 μm containing 0% by mass is formed, and then subjected to bright temper rolling at an elongation of 0.2 to 1%. It is preferable that the stainless steel plate to be subjected to the Sn-Ni alloy plating is subjected to Ni strike plating in advance.

【0011】[0011]

【作用】本発明者等は、電池缶,接点バネ材等の用途に
使用されているNiめっきステンレス鋼板に代えて、S
n−Ni合金めっきステンレス鋼板の使用を検討した。
Sn−Ni合金めっき層は、高温高湿の環境下でもめっ
き層表面に酸化皮膜や腐食生成物の形成が極めて少な
く、優れた耐食性を有していることから、めっきステン
レス鋼板の接触抵抗を長期間にわたって低位に維持す
る。また、表面粗さの非常に小さなステンレス鋼板をめ
っき原板として使用することにより、微細な電析粒の形
成に適した表面状態が活用され、良好な光沢を呈するめ
っき面が得られる。
The present inventors have replaced the Ni-plated stainless steel sheet used for applications such as battery cans and contact spring materials with S
The use of an n-Ni alloy plated stainless steel sheet was studied.
The Sn-Ni alloy plating layer has very little formation of oxide films and corrosion products on the plating layer surface even in a high-temperature and high-humidity environment, and has excellent corrosion resistance. Keep low over time. In addition, by using a stainless steel plate having a very small surface roughness as a plating base plate, a surface state suitable for forming fine electrodeposits is utilized, and a plated surface exhibiting good gloss can be obtained.

【0012】Sn−Ni合金めっきステンレス鋼板につ
いて、電池缶,接点バネ材等に要求される低接触抵抗及
び光沢性に及ぼす素材,Sn−Ni合金めっき層のSn
含有率,ブライト調質圧延等の影響を調査検討した。そ
の結果、めっき原板に使用されるステンレス鋼板の表面
粗さ,Sn−Ni合金めっき層のSn含有率及びブライ
ト調質圧延時の伸び率等でSn−Ni合金めっき層の接
触抵抗値,光沢度,プレス成形性及び耐疵付き性が変わ
ることが判った。そして、表面粗さ,Sn含有率及び伸
び率を本発明で規定した範囲に維持するとき、接触抵抗
値,光沢性,プレス成形性及び耐疵付き性の全てを満足
するSn−Ni合金めっきステンレス鋼板が得られるこ
とを見出した。
For a Sn—Ni alloy-plated stainless steel sheet, a material that affects low contact resistance and gloss required for a battery can, a contact spring material, etc., and a Sn—Ni alloy plating layer of Sn
The effects of content, bright temper rolling, etc. were investigated. As a result, the contact resistance value and the glossiness of the Sn—Ni alloy plating layer were determined based on the surface roughness of the stainless steel sheet used as the plating base sheet, the Sn content of the Sn—Ni alloy plating layer, and the elongation during bright pass rolling. It was found that the press formability and scratch resistance changed. When the surface roughness, Sn content and elongation are maintained within the ranges specified in the present invention, Sn—Ni alloy plated stainless steel that satisfies all of contact resistance, gloss, press formability and scratch resistance. It has been found that a steel sheet can be obtained.

【0013】[めっき原板の表面粗さ]Sn−Ni合金
めっき用原板として使用されるステンレス鋼板の表面粗
さが大きいと、Niストライクめっきを施しても十分に
平滑化されず、Niストライクめっき層の上に形成され
るSn−Ni合金めっき層の電析粒が大きくなる。大き
な電析粒からなるSn−Ni合金めっき層に光沢性を付
与するためには高伸び率のブライト調質圧延が必要とな
り、結果としてプレス成形性が著しく劣化する。Niス
トライクめっきによる平滑化作用は、フェライト系及び
オーステナイト系共に表面粗さをRa:0.05μm以
下にすることにより顕著となる。表面粗さがRa:0.
05μmを超えると、ブライト調質圧延でめっき層表面
に光沢を付与するために厚いNiストライクめっき及び
Sn−Ni合金めっきが必要となる。
[Surface Roughness of Original Plate for Plating] If the surface roughness of the stainless steel sheet used as the original plate for Sn—Ni alloy plating is large, even if Ni strike plating is applied, the surface is not sufficiently smoothed and the Ni strike plating layer The deposited particles of the Sn—Ni alloy plating layer formed thereon become large. Bright passivation with high elongation is required to impart gloss to the Sn-Ni alloy plating layer composed of large electrodeposits, and as a result, press formability is significantly deteriorated. The smoothing action by Ni strike plating becomes remarkable when the surface roughness of both the ferrite and austenite is set to Ra: 0.05 μm or less. The surface roughness is Ra: 0.
If the thickness exceeds 05 μm, thick Ni strike plating and Sn—Ni alloy plating are required to impart gloss to the plating layer surface by bright pass rolling.

【0014】[Sn−Ni合金めっき]めっき原板の表
面粗さが非常に小さい場合にはSn−Ni合金めっき層
をめっき原板表面に直接形成することもできるが、通常
はNiストライクめっきによってめっき原板の表面を平
滑化した後、Sn−Ni合金めっき層を形成する。Sn
−Ni合金めっきには、塩化スズ,塩化ニッケル,ピロ
リン酸カリウム,グリシン等からなるめっき浴が使用さ
れる。
[Sn-Ni alloy plating] When the surface roughness of the plating base plate is very small, the Sn-Ni alloy plating layer can be formed directly on the surface of the plating base plate. However, the plating base plate is usually formed by Ni strike plating. After smoothing the surface, a Sn—Ni alloy plating layer is formed. Sn
A plating bath made of tin chloride, nickel chloride, potassium pyrophosphate, glycine, or the like is used for the Ni alloy plating.

【0015】Sn−Ni合金めっき層は、良好なプレス
成形性を確保する上で60質量%以上のSnを含んでい
る。Sn含有率が60質量%を下回るとめっき層が硬質
化し、プレス加工等の際に加工部のめっき層に著しいク
ラックが発生し、製品の外観及び耐食性が低下する。逆
にSn含有率が90質量%を超えるSn−Ni合金めっ
き層は、高温高湿雰囲気に長時間曝されても低接触抵抗
を維持するが、非常に軟質であるため電池製造工程での
打抜き,プレス加工,組立て工程等でめっき層表面が疵
付きやすく、外観不良の製品となって製品歩留まりを低
下させる。
The Sn—Ni alloy plating layer contains 60% by mass or more of Sn in order to ensure good press formability. If the Sn content is less than 60% by mass, the plating layer becomes hard, and a marked crack occurs in the plating layer in a processed portion during press working or the like, and the appearance and corrosion resistance of the product are reduced. Conversely, a Sn—Ni alloy plating layer having a Sn content of more than 90% by mass maintains low contact resistance even when exposed to a high-temperature and high-humidity atmosphere for a long time, but is very soft and is punched in a battery manufacturing process. The surface of the plating layer is apt to be scratched in the press working, assembling process, etc., resulting in a product having poor appearance and lowering the product yield.

【0016】Sn−Ni合金めっき層は、低接触抵抗を
維持する上で0.1μm以上の膜厚で形成する。0.1
μmに達しない膜厚ではNiストライクめっきが露出し
た表面状態になり、苛酷な環境に曝される雰囲気で長時
間使用するとNiストライクめっきの露出部が酸化し、
接触抵抗が上昇する。しかし、0.5μmを超える厚め
っきでは、高価なSnやNiを多量に消費するため経済
的でない。
The Sn—Ni alloy plating layer is formed with a thickness of 0.1 μm or more in order to maintain a low contact resistance. 0.1
If the film thickness does not reach μm, the surface of the Ni strike plating will be exposed, and if used for a long time in an atmosphere exposed to a severe environment, the exposed portion of the Ni strike plating will be oxidized,
The contact resistance increases. However, thick plating exceeding 0.5 μm consumes a large amount of expensive Sn or Ni and is not economical.

【0017】[ブライト調質圧延]Sn−Ni合金めっ
き層を形成したステンレス鋼板を伸び率0.2〜1%で
ブライト調質圧延すると、有機質光沢剤を添加しためっ
き浴で得られる光沢Niめっきステンレス鋼板の表面光
沢度に匹敵する1000以上の光沢性に優れたSn−N
i合金めっきステンレス鋼板が製造される。ブライト調
質圧延の伸び率が0.2%未満ではブライト調質圧延に
よる平滑化作用が不充分で十分な光沢が得られない。逆
に1%を超える伸び率では、光沢Niめっき以上の光沢
度が得られるものの、0.2%耐力,伸び等の機械的性
質に悪影響が現れ、Sn−Ni合金めっきステンレス鋼
板のプレス成形性が低下する。ブライト調質圧延では、
320番手以上の表面仕上げロールを使用することが好
ましい。
[Bright temper rolling] Bright temper rolling of a stainless steel sheet on which an Sn-Ni alloy plating layer is formed at an elongation of 0.2 to 1% gives a bright Ni plating obtained in a plating bath containing an organic brightener. Sn-N with excellent glossiness of 1000 or more comparable to the surface glossiness of stainless steel sheet
An i-alloy plated stainless steel sheet is manufactured. If the elongation percentage of the bright skin pass rolling is less than 0.2%, the smoothening action by the bright skin pass rolling is insufficient and sufficient gloss cannot be obtained. Conversely, if the elongation exceeds 1%, glossiness higher than that of bright Ni plating can be obtained, but mechanical properties such as 0.2% proof stress and elongation are adversely affected, and the press formability of the Sn—Ni alloy-plated stainless steel sheet is increased. Decrease. In bright temper rolling,
It is preferable to use a surface finishing roll of 320 or more.

【0018】[0018]

【実施例1】めっき原板として、表面粗さRa:0.0
34〜0.072μm,板厚0.20mmのSUS43
0ステンレス鋼板を使用した。オルソケイ酸ソーダ50
g/l,液温55℃のアルカリ電解浴にめっき原板を浸
漬し、電流密度5A/dm2で10秒間陰極電解するこ
とにより電解脱脂した。電解脱脂されためっき原板を水
洗した後、硫酸10g/l,浴温25℃の硫酸浴に10
秒間浸漬することにより,めっき原板を酸洗した。酸洗
されためっき原板をNiストライクめっき浴に浸漬し、
次の条件で膜厚0.25μmのNiストライクめっき層
を形成した。
Example 1 As a plating base plate, surface roughness Ra: 0.0
SUS43 with a thickness of 34 to 0.072 μm and a thickness of 0.20 mm
0 stainless steel plate was used. Sodium orthosilicate 50
The plating base plate was immersed in an alkaline electrolytic bath having a liquid temperature of 55 ° C. and a g / l solution, and subjected to cathodic electrolysis at a current density of 5 A / dm 2 for 10 seconds to perform electrolytic degreasing. After the electrolytically degreased plating base plate is washed with water, 10 g / l of sulfuric acid is added to a sulfuric acid bath at a bath temperature of 25 ° C.
The plating plate was pickled by immersion for 2 seconds. The pickled plating base plate is immersed in a Ni strike plating bath,
A 0.25 μm-thick Ni strike plating layer was formed under the following conditions.

【0019】Niストライクめっきされたステンレス鋼
板を水洗した後、次の条件でSn−Ni合金めっき層を
形成した。Sn−Ni合金めっき層の膜厚は通電時間を
変えることにより0.05〜0.50μmの範囲で、S
n含有率はめっき浴組成を変えることにより42〜96
質量%の範囲で調整した。
After the Ni strike-plated stainless steel plate was washed with water, a Sn—Ni alloy plating layer was formed under the following conditions. The thickness of the Sn—Ni alloy plating layer is in the range of 0.05 to 0.50 μm by changing the energization time.
The n content can be varied from 42 to 96 by changing the plating bath composition.
It was adjusted in the range of mass%.

【0020】得られたSn−Ni合金めっきステンレス
鋼板に、320番手表面仕上げロールを用いて種々の伸
び率でブライト調質圧延を施した。ブライト調質圧延さ
れたSn−Ni合金めっきステンレス鋼板から試験片を
切り出し、光沢度を測定すると共に、プレス成形試験及
び促進劣化試験に供した。光沢度は、ポータブル表面光
沢度計(株式会社村上色彩研究所製)を用い測定角度2
0度で測定し、その数値で示した。
The obtained Sn—Ni alloy plated stainless steel plate was subjected to bright temper rolling at various elongations using a 320th surface finishing roll. A test piece was cut out from a bright temper-rolled Sn—Ni alloy-plated stainless steel sheet, and the gloss was measured, and the test piece was subjected to a press forming test and an accelerated deterioration test. The gloss was measured using a portable surface gloss meter (Murakami Color Research Laboratory Co., Ltd.) at a measurement angle of 2
It was measured at 0 degrees and indicated by the numerical value.

【0021】プレス成形試験では、試験片100個を外
径40mm,成形高さ30mmの形状にカップ絞りし、
成形品頭部の表面形状を観察し、不良発生の有無を非接
触高さ計で測定した。測定結果から、成形品100個
中、形状不良発生率が0%のものを○,1〜10%を
△,10%を超えるものを×としてプレス成形性を評価
した。また、プレス成形時に金型に擦られた側壁部を観
察して疵の有無を調べた。調査結果から、成形品100
個中、疵発生率が0%のものを○,1〜10%を△,1
0%を超えるものを×として耐疵付き性を評価した。促
進劣化試験では、温度60℃,相対湿度90%の高温高
湿槽に試験片を80日間放置した後、接触抵抗分布測定
器(株式会社 山崎精機研究所製)を用い、印加電流1
0mA,接触荷重100gfの条件で接触抵抗を測定し
た。
In the press forming test, 100 test pieces were cup-drawn into a shape having an outer diameter of 40 mm and a forming height of 30 mm.
The surface shape of the molded product head was observed, and the presence or absence of defects was measured with a non-contact height meter. From the measurement results, out of 100 molded products, the press formability was evaluated as 形状 when the occurrence rate of shape defects was 0%, Δ when 1 to 10%, and X when more than 10%. Further, the side walls rubbed by the mold during press molding were observed to check for flaws. According to the survey results, the molded article 100
Of the pieces, those having a flaw occurrence rate of 0% were evaluated as ○, 1 to 10% as Δ, 1
Those exceeding 0% were evaluated as x, and the scratch resistance was evaluated. In the accelerated aging test, the test piece was left in a high-temperature and high-humidity chamber at a temperature of 60 ° C. and a relative humidity of 90% for 80 days, and then an applied current of 1 was measured using a contact resistance distribution measuring device (manufactured by Yamazaki Seiki Laboratory Co., Ltd.).
The contact resistance was measured under the conditions of 0 mA and a contact load of 100 gf.

【0022】表1の調査結果にみられるように、試験番
号1〜10(本発明例)では、何れも光沢度が1000
以上であり、プレス成形性,耐疵付き性も良好で、促進
劣化試験後の接触抵抗値も20mΩ以下と良好な低接触
抵抗を示した。これに対し、めっき原板の表面粗さが大
きな試験番号11,12や薄膜のSn−Ni合金めっき
層を形成した試験番号13ではめっき面の光沢が100
未満であり、試験番号13では促進劣化試験後の接触抵
抗が20mΩ以上に上昇していた。伸び率が1%を超え
るブライト調質圧延を施した試験番号14ではプレス成
形性が劣っていた。Sn含有率が60質量%に達しない
Sn−Ni合金めっき層が形成された試験番号15で
は、光沢度が1000未満で、促進劣化試験後の接触抵
抗が20mΩを超えていた。90質量%を超えるSnを
含むSn−Ni合金めっき層が形成された試験番号16
では、耐疵付き性に著しく劣っていた。更に、無光沢N
iめっき層を形成した試験番号17では、めっき層表面
の光沢度が低く、耐疵付き性に劣っていた。また、光沢
Niめっき層を形成した試験番号18では、プレス成形
性に劣り、促進劣化試験後に1700mΩと非常に高い
接触抵抗を示した。
As can be seen from the survey results in Table 1, in Test Nos. 1 to 10 (Examples of the present invention), the gloss was 1000 in all cases.
As described above, the press formability and the scratch resistance were good, and the contact resistance value after the accelerated deterioration test was as low as 20 mΩ or less. On the other hand, in Test Nos. 11 and 12 in which the surface roughness of the original plating plate was large and in Test No. 13 in which a thin Sn—Ni alloy plating layer was formed, the gloss of the plated surface was 100%.
In Test No. 13, the contact resistance after the accelerated deterioration test was increased to 20 mΩ or more. In test No. 14 in which the elongation percentage was higher than 1% by bright pass rolling, the press formability was inferior. In Test No. 15, in which the Sn—Ni alloy plating layer in which the Sn content did not reach 60% by mass was formed, the glossiness was less than 1000, and the contact resistance after the accelerated deterioration test exceeded 20 mΩ. Test No. 16 in which a Sn—Ni alloy plating layer containing Sn exceeding 90% by mass was formed.
Was markedly inferior in scratch resistance. Furthermore, matte N
In Test No. 17 in which the i-plated layer was formed, the glossiness of the surface of the plated layer was low, and the scratch resistance was poor. In Test No. 18 in which a bright Ni plating layer was formed, the press formability was poor, and a very high contact resistance of 1700 mΩ was shown after the accelerated deterioration test.

【0023】 [0023]

【0024】[0024]

【実施例2】めっき原板として、表面粗さがRa:0.
037〜0.069μmに調整された板厚0.20mm
のSUS304ステンレス鋼板を使用した。実施例1と
同様に前処理,Niストライクめっき(膜厚0.15μ
m)及びSn−Ni合金めっきを施した。得られた各め
っき材について、実施例1と同様に光沢度,プレス成形
性,耐疵付き性及び促進劣化試験後の接触抵抗を調査し
た。表2の調査結果にみられるように,試験番号19〜
28(本発明例)では、何れも全ての試験で良好な結果
を示した。
Embodiment 2 As a plating base plate, the surface roughness was Ra: 0.
Plate thickness 0.20mm adjusted to 037-0.069μm
SUS304 stainless steel plate was used. Pretreatment, Ni strike plating (film thickness 0.15 μm) as in Example 1.
m) and Sn-Ni alloy plating. For each of the obtained plated materials, the glossiness, press formability, scratch resistance, and contact resistance after the accelerated deterioration test were examined in the same manner as in Example 1. As can be seen from the survey results in Table 2, test numbers 19 to
No. 28 (Example of the present invention) showed good results in all the tests.

【0025】これに対し、表面粗さが大きなめっき原板
を使用した試験番号29,30、薄膜のSn−Ni合金
めっき層を形成した試験番号31では、促進劣化試験後
の接触抵抗が高い値を示した。また、伸び率が1%を超
えるブライト調質圧延を施した試験番号32ではプレス
成形性が劣っていた。Sn:60質量%未満のSn−N
i合金めっき層を形成した試験番号33では、光沢度及
び接触抵抗が劣っていた。逆に90質量%を超えるSn
を含むSn−Ni合金めっき層を形成した試験番号34
では、耐疵付き性が劣っていた。更に、無光沢Niめっ
き層を形成した試験番号35では光沢度及び耐疵付き性
が劣り、光沢Niめっき層を形成した試験番号36では
プレス成形性に劣り促進劣化試験後の接触抵抗も高い値
を示した。
On the other hand, in Test Nos. 29 and 30 using a plating base plate having a large surface roughness and Test No. 31 in which a thin Sn—Ni alloy plating layer was formed, the contact resistance after the accelerated deterioration test was high. Indicated. Further, in Test No. 32 in which the bright skin pass rolling with an elongation of more than 1% was performed, press formability was inferior. Sn: less than 60% by mass of Sn-N
In Test No. 33 in which the i-alloy plating layer was formed, the glossiness and the contact resistance were inferior. Conversely, Sn exceeding 90% by mass
No. 34 in which a Sn—Ni alloy plating layer containing
Was inferior in scratch resistance. Further, in Test No. 35 in which a matte Ni plating layer was formed, the glossiness and scratch resistance were poor, and in Test No. 36 in which a bright Ni plating layer was formed, the press formability was poor and the contact resistance after the accelerated deterioration test was high. showed that.

【0026】 [0026]

【0027】[0027]

【発明の効果】以上に説明したように、本発明に従って
製造されたSn−Ni合金めっきステンレス鋼板は、高
温高湿雰囲気に長時間曝された後でも低い接触抵抗を示
し、且つめっき面の光沢も優れている。そのため、高光
沢及び低接触抵抗が要求される電池缶材料,接点用バネ
材を始めとして各種分野で使用される。
As described above, the Sn—Ni alloy-plated stainless steel sheet manufactured according to the present invention exhibits low contact resistance even after prolonged exposure to a high-temperature and high-humidity atmosphere, and has a glossy plated surface. Is also excellent. Therefore, it is used in various fields such as battery can materials and contact spring materials which require high gloss and low contact resistance.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 栄次 大阪府堺市石津西町5番地 日新製鋼株式 会社技術研究所内 (72)発明者 佐藤 勝 大阪府堺市石津西町5番地 日新製鋼株式 会社技術研究所内 Fターム(参考) 4E002 AD06 BC05 CB03 4K024 AA03 AA23 AB01 BA04 BB09 BB10 BC01 CA02 CA03 CA04 CA06 DA02 DA03 DA04 DA09 GA02 GA07  ──────────────────────────────────────────────────の Continuing on the front page (72) Eiji Watanabe, Inventor 5: Ishizu Nishimachi, Sakai City, Osaka Prefecture Nisshin Steel Co., Ltd. (72) Inventor Masaru Sato 5: Ishizu Nishimachi, Sakai City, Osaka Nissin Steel Co., Ltd. F-term in Technical Research Institute (reference) 4E002 AD06 BC05 CB03 4K024 AA03 AA23 AB01 BA04 BB09 BB10 BC01 CA02 CA03 CA04 CA06 DA02 DA03 DA04 DA09 GA02 GA07

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 表面粗さがRa0.050μm以下のフ
ェライト系ステンレス鋼板又はオーステナイト系ステン
レス鋼板をめっき原板とし、めっき原板の片面にSn:
60〜90質量%を含む膜厚0.1〜0.5μmのSn
−Ni合金めっき層を形成し、次いで伸び率0.2〜1
%でブライト調質圧延することを特徴とする接触抵抗が
低く光沢度に優れたSn−Ni合金めっきステンレス鋼
板の製造方法。
1. A ferrite stainless steel plate or an austenitic stainless steel plate having a surface roughness Ra of 0.050 μm or less is used as a plating base plate, and Sn:
0.1-0.5 μm thick Sn containing 60-90% by mass
-Forming a Ni alloy plating layer, and then elongating 0.2 to 1
%, Characterized in that it is subjected to bright temper rolling at a rate of 0.1%, and has a low contact resistance and is excellent in glossiness.
【請求項2】 Sn−Ni合金めっき層の形成に先立っ
て、めっき原板をNiストライクめっきする請求項1記
載の製造方法。
2. The manufacturing method according to claim 1, wherein the plating base plate is subjected to Ni strike plating before forming the Sn—Ni alloy plating layer.
JP2000319860A 2000-10-19 2000-10-19 Method for manufacturing sn-ni alloy plated stainless steel-sheet with low contact resistance and superior surface luster Withdrawn JP2002129377A (en)

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Publication Number Publication Date
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009263699A (en) * 2008-04-23 2009-11-12 Toyota Motor Corp METHOD OF MANUFACTURING PLATED BASE MATERIAL HAVING Sn PLATED LAYER
JP2012149314A (en) * 2011-01-20 2012-08-09 Jfe Steel Corp Metal plate for polymer electrolyte fuel cell separator and method for producing the same
JP2013118096A (en) * 2011-12-02 2013-06-13 Jfe Steel Corp Surface processing method for separator for fuel battery
JP5700183B1 (en) * 2013-10-22 2015-04-15 Jfeスチール株式会社 Stainless steel foil for separator of polymer electrolyte fuel cell
JP5796694B1 (en) * 2014-04-15 2015-10-21 Jfeスチール株式会社 Stainless steel foil for separator of polymer electrolyte fuel cell

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009263699A (en) * 2008-04-23 2009-11-12 Toyota Motor Corp METHOD OF MANUFACTURING PLATED BASE MATERIAL HAVING Sn PLATED LAYER
JP2012149314A (en) * 2011-01-20 2012-08-09 Jfe Steel Corp Metal plate for polymer electrolyte fuel cell separator and method for producing the same
JP2013118096A (en) * 2011-12-02 2013-06-13 Jfe Steel Corp Surface processing method for separator for fuel battery
JP5700183B1 (en) * 2013-10-22 2015-04-15 Jfeスチール株式会社 Stainless steel foil for separator of polymer electrolyte fuel cell
JP5796694B1 (en) * 2014-04-15 2015-10-21 Jfeスチール株式会社 Stainless steel foil for separator of polymer electrolyte fuel cell

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