JP2002031797A - Liquid crystal display device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display device capable of displaying in reflection mode having bright and excellent visibility and having high electrical reliability and to provide its manufacturing method. SOLUTION: In the liquid crystal display device having a reflection region for performing reflection mode display in respective plural pixel regions, a reflection electrode 32 is provided so as to form a superposing region including at least one of a first superposing region where the reflection electrode 32 is superposed on a region where a signal wiring 4 and a scanning wiring 2 intersect each other and a second superposing region where the reflection electrode 32 is superposed on a thin film transistor 26. The height of the recessed part of a recessed and projecting surface of an interlayer insulating film 30 positioned in the superposing region is higher than that of the recessed part of a recessed and projecting surface formed in a region other than the superposing region in the reflection area.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device and a method of manufacturing the same, and more particularly, to a liquid crystal display device that performs display in a reflection mode and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, liquid crystal display devices have been characterized by their thinness and low power consumption, and have been developed to use OA equipment such as word processors and personal computers, portable information equipment such as electronic notebooks, and cameras equipped with liquid crystal monitors. Widely used for body VTRs and the like. In particular, a liquid crystal display device (such as a reflection type or a transmission / reflection type) having a reflection layer for reflecting ambient light and capable of displaying in a reflection mode is not only advantageous for portability and low power consumption, but also advantageous Since it is advantageous for outdoor use, it has been actively developed recently.

[0003] In order to improve the display brightness of a liquid crystal display device capable of displaying in such a reflection mode, a liquid crystal display device having an improved aperture ratio is formed by forming a reflection layer on wirings and switching elements. Is being developed.

Further, in order to perform display with good visibility without reflection of surrounding images, it is necessary to appropriately scatter (diffuse reflection) incident light. However, when the incident light is uniformly scattered in all directions, the amount of reflected light per unit solid angle decreases, which causes a decrease in brightness.

[0005] In order to obtain a bright display with good visibility, various studies have been made on the production of a reflective layer having a scattering characteristic in which the intensity of scattered light in a specific angle range serving as the viewing direction is high and uniform. Have been. In order to realize such scattering characteristics, a reflective layer having a surface formed in an uneven shape has been developed.

Until now, for example, Japanese Patent Application Laid-Open No. 6-7523
No. 7, JP-A-6-75238, and the like have proposed the following reflective liquid crystal display devices.

First, JP-A-6-75237 discloses that
There is disclosed a reflective liquid crystal display device having an interlayer insulating film having an uneven surface and a reflective electrode formed on the interlayer insulating film and functioning as a light reflecting layer. The reflection electrode of this reflection type liquid crystal display device is also arranged on the interlayer insulating film above the switching element and the wiring, and the surface of the interlayer insulating film above the switching element and the wiring is formed in an uneven shape. I have.

Japanese Patent Application Laid-Open No. 6-75238 also discloses a reflective liquid crystal having an interlayer insulating film having an uneven surface and a reflective electrode formed on the interlayer insulating film and functioning as a light reflecting layer. A display device is disclosed. The reflection electrode of this reflection type liquid crystal display device is also arranged on the interlayer insulating film above the switching element and the wiring, but the surface of the interlayer insulating film above the switching element and the wiring is not formed unevenly. .

According to the structure of the reflection type liquid crystal display device disclosed in the above two publications, since the reflection electrode is also arranged on the interlayer insulating film on the switching element and the wiring, the area of the reflection electrode is reduced. The aperture ratio can be increased, and a bright display can be performed.

Further, in the reflection type liquid crystal display device disclosed in Japanese Patent Application Laid-Open No. 6-75237, the surface of the interlayer insulating film is formed in an uneven shape, and the surface of the interlayer insulating film above the switching elements and wirings is formed. Since the surface of the reflective electrode formed on the interlayer insulating film is also uneven, the surface of the reflective electrode has unevenness over the entire surface. Therefore, the reflective electrode has the above-described scattering characteristics over the entire surface, and has an advantage that a bright display can be performed with good visibility.

In the reflection type liquid crystal display device disclosed in JP-A-6-75238, since the surface of the interlayer insulating film on the switching element and the wiring is not formed in an uneven shape,
Compared to the case where the surface is formed in an uneven shape, the film thickness is less likely to be thinner than the thickness that can maintain insulation,
This has the advantage that the occurrence of an electrical short circuit between the reflective electrode and the switching element, the scanning wiring or the signal wiring can be suppressed.

[0012]

However, each of the reflection type liquid crystal display devices disclosed in the above publications has the following problems.

First, in the reflection type liquid crystal display device disclosed in Japanese Patent Application Laid-Open No. 6-75237, since the surface of the interlayer insulating film is formed unevenly over the entire surface, the thickness of wiring, switching elements, etc. is reduced. For example, in the region where the thickness of the interlayer insulating film is thin, for example, in the upper layer of the switching element or in the upper layer of the region where the scanning wiring and the signal wiring cross each other,
Due to an error in processing accuracy when the surface of the interlayer insulating film is formed in an uneven shape, the thickness of the interlayer insulating film may be smaller than a thickness that can maintain the insulating property, and the reflective electrode, the switching element, the scanning wiring, or There is a problem that an electric short circuit occurs with the signal wiring.

Next, in the reflection type liquid crystal display device disclosed in Japanese Patent Application Laid-Open No. 6-75238, the surface of the interlayer insulating film above the switching elements and wirings is not formed in an uneven shape, but is formed thereon. Since the surface of the reflective electrode has no irregularities,
Compared to the case where the surface of the reflective electrode is formed in an uneven shape over the entire surface, there is a problem that the area of the reflective electrode in which the unevenness is formed is small, and the visibility and brightness of the display are inferior. ing.

The present invention has been made in view of the above-mentioned problems, and has as its object to provide a liquid crystal display having excellent visibility, capable of displaying a bright reflection mode, and having high electrical reliability. An object of the present invention is to provide an apparatus and a method of manufacturing the same.

[0016]

A liquid crystal display device according to the present invention has a first substrate, a second substrate, and a liquid crystal layer provided between the first substrate and the second substrate. Each of the plurality of picture element areas has a reflection area for displaying in a reflection mode, and for each of the plurality of picture element areas, the first substrate is disposed so as to intersect the scanning wiring and the scanning wiring. A switching element electrically connected to the signal wiring, an insulating film covering the switching element and having an uneven surface, provided on the uneven surface of the insulating film, and electrically connected to the switching element; A reflective electrode, wherein the reflective electrode has at least one of a first overlap region overlapping a region where the signal line and the scan line intersect each other, and a second overlap region overlapping the switching element. Shape the overlapping area including And the height of the concave portion of the concave-convex surface of the insulating film located in the overlapping region is higher than that of the concave-convex surface formed in a region other than the overlapping region in the reflection region. It has a configuration that is higher than the height of the recess, thereby achieving the above object.

The reflection electrode is provided so as to further form a third overlap region that overlaps with at least one of the signal wiring and the scan wiring in a region other than the first overlap region. It is preferable that the surface of the insulating film located in the overlapping region is formed in an uneven shape.

Another liquid crystal display device according to the present invention includes a first substrate, a second substrate, and a liquid crystal layer provided between the first substrate and the second substrate. Each of the regions has a reflection region for performing display in a reflection mode, and for each of the plurality of pixel regions, the first substrate includes a scanning line and a signal line disposed so as to intersect the scanning line. A switching element that is electrically connected, an insulating film that covers the switching element and has an uneven surface, and a reflective electrode provided on the uneven surface of the insulating film and electrically connected to the switching element. The reflective electrode has a first overlapping region overlapping the region where the signal wiring and the scanning line intersect each other, a second overlapping region overlapping the switching element, and a region other than the first overlapping region. In the region, the signal A third overlapping region that overlaps with at least one of a line and the scanning line; and a surface of the insulating film located in the first overlapping region and the second overlapping region is formed flat. And the surface of the insulating film located in the third overlapping region is formed in an uneven shape, and the surface of the insulating film located in the first overlapping region and the second overlapping region is formed. Has a configuration that is higher than the average height of the uneven surface formed in a region excluding the first overlap region and the second overlap region in the reflection region, and Objective is achieved.

[0019] Each of the plurality of picture element regions may have a transmissive region for performing display in a transmissive mode.

The method for manufacturing a liquid crystal display device according to the present invention comprises:
A reflection region having a first substrate, a second substrate, and a liquid crystal layer provided between the first substrate and the second substrate, and performing display in a reflection mode on each of the plurality of pixel regions. Have,
A method of manufacturing a liquid crystal display device, comprising: (a) a plurality of scanning lines, a plurality of signal lines intersecting the plurality of scanning lines, and a plurality of signal lines electrically connected to the scanning lines and the signal lines. Preparing a first substrate on which a switching element is formed; and (b) forming an insulating film covering the switching element on the first substrate using a photosensitive resin, and forming the insulating film by a photolithography process. Forming a plurality of convex groups on the insulating film; and (c) a first overlapping region in which the reflective electrode overlaps a region where the signal wiring and the scanning wiring intersect with each other on the insulating film; and Providing the reflective electrode so as to form an overlap region including at least one of a second overlap region overlapping with the element, wherein the photomask used in the step (b) has a predetermined shape. Second generating a first region in which the first photo-mask pattern that generates a light intensity distribution is formed, the second light intensity distribution of the different predetermined from the first light intensity distribution
A second region on which a photomask pattern is formed,
By the photolithography process using the photomask, the plurality of convex groups formed on the insulating film are formed on the insulating film located in a first patterning region including a region to be an overlapping region. A first projection group formed by forming a plurality of projections corresponding to the mask pattern;
A second group of convex portions, in which a plurality of convex portions corresponding to the second photomask pattern are formed on the insulating film located in the second patterning region excluding the first patterning region in a region to be a reflection region. Wherein the center distance of the plurality of protrusions included in the first protrusion group is shorter than the center distance of the plurality of protrusions included in the second protrusion group, Thereby, the above object is achieved.

[0021] It is preferable that the method further includes a step of deforming the plurality of convex groups by performing a heat treatment to form the surface of the insulating film into a smooth irregular shape.

[0022] A further insulating film may be formed on the surface of the insulating film which is formed in a gentle uneven shape.

[0023] The photomask may have a configuration in which a transmissive portion and a light shielding portion are provided, one of the transmissive portion and the light shielding portion is formed in an island shape, and the other is formed in a sea shape. Good.

The one of the transmissive portion and the light-shielding portion, which is formed in an island shape, includes a plurality of first island portions included in the first region and a plurality of first island portions included in the second region. A plurality of first islands having a center distance of 6 μm or less, and a plurality of second islands having a center distance of 6 μm or more. Is preferred.

Another method of manufacturing a liquid crystal display device according to the present invention comprises a first substrate, a second substrate, the first substrate and the second substrate.
A liquid crystal layer provided between the first substrate and the liquid crystal layer, wherein the reflective layer has an uneven surface for scattering incident light. A method of manufacturing a device, comprising: a step of forming an insulating film on a first substrate; and a step of forming a plurality of projections on the insulating film.
By forming a first region in which the plurality of protrusions are formed at a first density and a second region in which the plurality of protrusions are formed at a second density, the average film thickness of the first region and the second region is reduced. Differentiating each other, and depositing a reflective film on the insulating film, thereby forming a reflective layer having an uneven surface corresponding to the plurality of convex portions of the insulating film. The above object is achieved by the above.

Hereinafter, the operation of the present invention will be described.

In the liquid crystal display device of the present invention, the reflection electrode is also formed on the upper layer where the signal wiring and the scanning wiring cross each other, and also on the switching element. Therefore,
The area of the reflective electrode can be increased, the aperture ratio can be improved, and bright display can be performed.

Further, since the surface of the insulating film in the reflection region is formed to be uneven over the entire surface, the surface of the reflective electrode formed on the insulating film has unevenness over the entire surface. Therefore,
The reflective electrode can have scattering characteristics over the entire surface such that the intensity of scattered light in a specific angle range serving as the observation direction is high and uniform. As a result, a bright display with good visibility can be performed.

Further, the height of the concave portion on the uneven surface of the insulating film located in the overlapping region is higher than the height of the concave portion on the uneven surface of the insulating film formed in the region other than the overlapping region in the reflective region. Since it is formed, the occurrence of an electrical short circuit between the switching element, the scanning wiring or the signal wiring, and the reflective electrode is suppressed.

In this specification, the term "height" of the surface of the insulating film is used. The “height” refers to the height from a certain reference plane (for example, the surface of the substrate flat over the entire surface of the liquid crystal panel) to the surface of the insulating film.

Further, the reflection electrode is provided so as to further form a third overlapping region which overlaps with at least one of the signal wiring and the scanning wiring in a region other than the first overlapping region. When the configuration in which the surface of the insulating film located in is formed in an uneven shape is adopted, the reflective electrode having the unevenness on the surface is also formed on the third overlapping region, so that the area of the reflective electrode having the unevenness on the surface is reduced. It is possible to further increase the aperture ratio, improve the aperture ratio, and perform brighter display with good visibility.

In another liquid crystal display device according to the present invention, since a reflective electrode is also formed on the switching element and the wiring, the area of the reflective electrode can be increased, the aperture ratio is improved, and a bright display is achieved. Can be performed.

Further, since the surface of the insulating film in the region other than the first overlapping region and the second overlapping region in the reflection region is formed over the entire surface including the third overlapping region, the insulating film is formed. The surface of the reflective electrode formed thereon has irregularities over almost the entire surface. Therefore, the reflective electrode can have a scattering characteristic over a substantially entire surface in which the intensity of scattered light in a specific angle range serving as the observation direction is high and uniform. As a result, a bright display with good visibility can be performed.

Further, the surfaces of the insulating films located in the first overlapping region and the second overlapping region are formed to be flat, and the height thereof is equal to that of the first overlapping region and the second overlapping region in the reflection region. Since the height is higher than the average height of the uneven surface formed in the region excluding the above, the occurrence of an electric short circuit between the switching element, the scanning wiring or the signal wiring, and the reflective electrode is suppressed.

In the method for manufacturing a liquid crystal display device according to the present invention, in the step of forming a plurality of convex portions on the insulating film,
By forming a plurality of protrusions at the first density and the second density in the first area and the second area, respectively, the average film thickness of the first area and the second area can be made different from each other. Usually, the step of forming a plurality of convex portions on the insulating film is performed for the purpose of making the reflective layer formed on the insulating film in a later step have an uneven surface. According to the method, the average film thicknesses of the first region and the second region can be made different from each other without providing an extra step. As a result, it is possible to efficiently manufacture a liquid crystal display device in which a reflective layer having an uneven surface is formed on the first region and the second region having different average film thicknesses.

In a production line of a liquid crystal display device on which a reflective layer having an uneven surface is formed, in order to easily and reproducibly control the shape of the uneven surface of the reflective layer,
A step of forming a plurality of convex portions by a photolithography process on an insulating film formed using a photosensitive resin and forming a reflective layer on the insulating film can be employed.
The manufacturing method according to the present invention is particularly effective in an existing production line that employs such a process, since the process is preferably performed by simply preparing a predetermined photomask without the need to provide new facilities and processes. .

[0037]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a liquid crystal display device according to an embodiment of the present invention and a method for manufacturing the same will be described with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 First, the structure of a liquid crystal display device 100 according to Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing a configuration of a picture element region portion of the liquid crystal display device 100 according to the first embodiment. FIGS. 2A and 2B are cross-sectional views illustrating a configuration of a picture element region of the liquid crystal display device 100 according to the first embodiment. FIG. 2A corresponds to a cross-sectional view taken along line AA ′ of FIG. 1, and FIG.
This corresponds to a cross-sectional view along the line B ′. In the specification of the present application, the minimum unit in display is “picture element”, and the area of the liquid crystal display device corresponding to “picture element” is called “picture element area”.

As shown in FIG. 2, the liquid crystal display device 100 has a first substrate 100a, a second substrate 100b, and a liquid crystal layer 40 provided between the first substrate 100a and the second substrate 100b. are doing.

The first substrate 100a comprises: an insulating substrate 10;
A thin film transistor 26 as a switching element formed on the insulating substrate 10; and an interlayer insulating film 30 formed so as to cover the thin film transistor 26 and having an uneven surface.
And a reflective electrode 32 formed on the uneven surface of the interlayer insulating film 30 and electrically connected to the thin film transistor 26.

The second substrate 100b has a transparent substrate 50 and a transparent electrode 52 formed on the transparent substrate 50. A retardation plate 54 and a polarizing plate 56 are arranged outside the second substrate 100b. The first substrate 100a and / or the second substrate 100b are provided with an alignment layer, a color filter layer (neither is shown), or the like, if necessary.

As the liquid crystal layer 40, a liquid crystal layer capable of displaying a polarization mode (for example, TN mode) is used.
However, the present invention is not limited to this, and conventional liquid crystal layers of various modes can be used. For example, if a liquid crystal layer of a guest-host mode is used, the phase difference plate 54 and the polarizing plate 56 are omitted. It becomes possible.

The reflective electrode 32 and the liquid crystal layer 4
The transparent electrode 54 that is opposed to the pixel via 0 defines a picture element region. The liquid crystal display device 100 according to the first embodiment is a reflective liquid crystal display device in which each of a plurality of picture element regions arranged in a matrix is formed of a reflection region that performs display in a reflection mode.

Next, the structure of the first substrate 100a will be described in more detail with reference to FIGS.

In the first substrate 100a, a thin film transistor 26 as a switching element is formed on an insulating substrate 10. For example, a scanning wiring (gate bus line) 2 made of a Ta layer and a gate electrode 1 branched from the scanning wiring 2 are formed on an insulating substrate 10 made of glass or the like.
2, a gate insulating layer 16 made of a SiNx layer, a semiconductor layer 18 made of an a-Si layer, an n-type semiconductor layer 20 made of an n-type a-Si layer, a signal wiring (data bus line) 4 made of a Ti layer, and the signal Source electrode 2 branched from wiring 4
2. The thin film transistor 26 functions as a switching element. The thin film transistor 26 is not limited to the above-described structure, and various thin film transistors having a known structure can be used.

In the first embodiment, the auxiliary capacitance wiring 14 is formed from the same Ta layer as the scanning wiring 2 and the gate electrode 12, and the gate insulating layer 16 formed thereon is formed.
And an auxiliary capacitance electrode formed thereon (not shown)
These functions constitute an auxiliary capacitor and serve to hold a voltage applied to the liquid crystal layer. Of course, the auxiliary capacitance line 14 and the auxiliary capacitance electrode may be omitted.

An interlayer insulating film 30 having an uneven surface is formed using, for example, a photosensitive resin so as to cover the entire surface of the insulating substrate 10 on which the above-described thin film transistor 26 is formed. On the uneven surface of the interlayer insulating film 30,
For example, a reflective electrode 32 formed of a laminated film of an Al layer and a Mo layer
The reflective electrode 32 is electrically connected to the drain electrode 24 forming the thin film transistor 26 via the contact hole 6.

In the first embodiment, as shown in FIGS. 1 and 2, the reflective electrode 32 is formed in the first overlapping area where the signal wiring 4 and the scanning wiring 2 or the auxiliary capacitance wiring 14 overlap with the area where they cross each other. The second overlapping with the thin film transistor 26
In the superimposition region and the region other than the first superimposition region,
It is provided so as to form a third overlapping region that overlaps with the signal wiring 4 or the scanning wiring 2. With such a configuration, the area of the reflective electrode 32 can be increased, and the aperture ratio can be improved to perform bright display.

Further, since the surface of the interlayer insulating film 30 in the reflection region is formed over the entire surface in an uneven shape, the surface of the reflective electrode 32 formed on the interlayer insulating film 30 is also uneven over the entire surface. Have. Therefore, the reflective electrode 32 has a scattering characteristic over the entire surface such that the intensity of scattered light in a specific angle range serving as the observation direction is high and uniform. As a result, it is possible to perform bright display with good visibility. Note that reference numerals 65a and 65b in FIG.
Schematically shows a protrusion formed on the interlayer insulating film 30, and the protrusions 65a and 65b typically have a circular shape when viewed from the normal direction of the display surface.

Further, the height of the concave portion on the uneven surface of the interlayer insulating film 30 located in the first overlapping region and the second overlapping region is set to a level other than the first overlapping region and the second overlapping region in the reflection region. The structure is higher than the height of the concave portion on the uneven surface of the formed interlayer insulating film 30. With such a configuration, occurrence of an electrical short circuit between the thin film transistor 26 or the signal wiring 4 and the reflective electrode 32 is suppressed.

In the first embodiment, FIGS. 1 and 2
As shown in (b), the semiconductor layer 18 and the n-type semiconductor layer 20 are formed on the gate insulating layer 16 located in a region where the scanning wiring 2 or the auxiliary capacitance wiring 14 and the signal wiring 4 cross each other. A semiconductor layer 18a and an n-type semiconductor layer 20a formed from the same layer are formed. This is to prepare for the disconnection of the signal wiring 4. That is, the scanning wiring 2
Alternatively, in a region where the auxiliary capacitance wiring 14 and the signal wiring 4 intersect each other, the signal wiring 4 formed so as to intersect with the scanning wiring 2 or the auxiliary capacitance wiring 14 due to the thickness thereof is disconnected. Signal wiring 4
By forming an n-type semiconductor layer 20a, which is a conductor, in the lower layer, it is possible to transmit a signal even if the signal wiring 4 is disconnected. The reason why the semiconductor layer 18a and the n-type semiconductor layer 20a are laminated is that the a-Si layer laminated on the insulating substrate 10 in the step of forming the thin film transistor 26 is formed.
This is because the semiconductor layer 18 and the n-type semiconductor layer 20 and the semiconductor layer 18a and the n-type semiconductor layer 20a are simultaneously formed by simultaneously patterning the n-type a-Si. Of course, the semiconductor layer 18a and the n-type semiconductor layer 20a may be omitted.

Subsequently, the method for manufacturing the liquid crystal display device 100 according to the present embodiment will be described with reference to FIGS. 1, 2 and 3. FIG. 3 is a process cross-sectional view showing a manufacturing process of the first substrate 100a in the liquid crystal display device 100 according to the first embodiment. In particular, the uneven surface is formed on the interlayer insulating film 30 and the uneven surface is reflected. This is for describing a step of forming the electrode 32.

The liquid crystal display device 100 according to the present embodiment is
For example, it is manufactured as follows.

First, as shown in FIG. 3A, on the surface of the insulating substrate 10 on which the thin film transistor 26 is formed, a positive photosensitive resin 30 (for example,
JAS100 manufactured by JSR) is applied. Photosensitive resin 30
Preferably has a thickness of about 1 μm to about 4 μm. In the first embodiment, the film is formed to have a thickness of about 2.1 μm.

Next, a first exposure is performed by disposing a photomask 60 as shown in FIG. 4A as shown in FIG. 3B. The exposure amount at the time of the first exposure is about 50 mJ / cm ²
Preferably in the range of about 250 mJ / cm ^2, performing exposure at about 75 mJ / cm ² in the present embodiment 1.

The pattern of the photomask 60 at this time has a structure in which the transmissive portions 62 are arranged in a sea shape as shown in FIG. 4A, and a plurality of circular light shielding portions 64a and 64b are arranged in an island shape. It has become. This photomask 60
Corresponds to the fact that the photosensitive resin 30 in the reflection region has a first patterning region including a region to be a first overlap region and a second overlap region, and a second pattern region excluding the first pattern region. In addition, it has a first region 66 corresponding to the first patterning region and a second region 68 corresponding to the second patterning region. Further, in the photomask 60, a plurality of circular light shielding portions 64 a are arranged in the first region 66, and a plurality of circular light shielding portions 64
b, and a plurality of circular light shielding portions 64a
Is shorter than the center distance of the plurality of circular light shielding portions 64b. In the specification of the present application, “center-to-center distance” indicates the distance between centers of adjacent circular light-shielding portions. The distance between the centers of the plurality of circular light-shielding portions 64a is preferably about 6 μm or less, and is preferably about 5 μm.
It is more preferred that: Plural circular light shielding parts 6
The center-to-center distance of 4b is preferably about 6 μm or more, and more preferably in the range of about 6 μm to about 12 μm. Exposure is performed after such a photomask 60 is aligned with the insulating substrate 10 having the photosensitive resin 30 applied to the entire surface.

In the first embodiment, the region corresponding to the contact hole 6 is a complete transmissive portion 67 and the circular light-shielding portion 64b is not disposed, but the photosensitive resin corresponding to the contact hole 6 will be described later. Since 30 is completely removed, a circular light shielding portion 64b may be arranged. Further, in the first embodiment, the light-shielding portion is circular, but is not limited thereto, and may be elliptical or polygonal.

Next, in the state where the exposure has been performed as described above, a photomask 70 as shown in FIG.
The second exposure is performed with the arrangement as shown in FIG. Second
Is about 270 mJ / cm ² to about 800 mJ / cm ^2.
It is preferably within the range of mJ / cm ² , and in the first embodiment, the exposure is performed at about 390 mJ / cm ² .

As shown in FIG. 4B, the pattern of the photomask 70 at this time has a structure in which a region corresponding to the contact hole 6 is a transmissive portion 72 and the other region is a light shielding portion 74. I have. Exposure is performed after the photomask 70 and the insulating substrate 10 are aligned.

Thereafter, the photosensitive resin 3 on the insulating substrate 10
0 is developed with, for example, TMAH (0.1%) manufactured by Hayashi Junyaku Co., Ltd., as shown in FIG.
Are formed on the surface of the substrate. The photosensitive resin 30 in a region where light is not irradiated by the second exposure (a region where unevenness is formed) has a relatively low first exposure intensity (about 75 mJ /
cm ² ), there are no areas completely removed during development. Note that such an exposure method is sometimes referred to as “half exposure”. On the other hand, the photosensitive resin 30 in a region irradiated with light through the first exposure and the second exposure (a region corresponding to the contact hole 6) is completely removed at the time of development.

Then, after performing the entire surface exposure (exposure amount: about 500 mJ / cm ² ) with a ghI line (high pressure mercury lamp), a heat treatment is performed at about 220 ° C. for about 75 minutes to obtain FIG. As shown in (2), the uneven surface of the photosensitive resin 30 is deformed by the heat dripping phenomenon, and the corners are removed to form a gentle uneven shape. At this time, the uneven surface is formed such that the height of the recess in the first patterning region is higher than the height of the recess in the second patterning region. The reason will be described later.

Further, an insulating resin may be deposited on the photosensitive resin 30 having the gentle uneven surface as described above to form a further insulating film. As the insulating resin, for example, the same material as the photosensitive resin 30 having a lower viscosity than the photosensitive resin 30 may be used. For example, the photosensitive resin 30 has a viscosity of about 9 c
P to about 30 cP (about 9 × 10 ⁻³ Ns / m ^{2 to} 3 × 10 ⁻²
Ns / m ² ) when using JAS100 manufactured by JSR,
As an insulating resin, the viscosity is about 3 cP (about 3 × 10 ⁻³ Ns
/ M ² ) The following JSR100 manufactured by JSR is used. In the case where an additional insulating film is formed, the first exposure performed in the step shown in FIG. 3B does not have to be half exposure. Since the conductive resin 30 may be completely removed at the time of development, the contact hole 6 can be simultaneously formed in the first exposure, and the second exposure shown in FIG. 3C can be omitted.

In the first embodiment, the positive photosensitive resin 30 is used. However, the present invention is not limited to this, and a negative photosensitive resin 30 may be used. When a negative type is used, in the process shown in FIGS. 3B and 3C, a photomask 80 as shown in FIGS. 5A and 5B is used instead of the photomasks 60 and 70. Exposure may be performed using the steps 90 and 90. The pattern of the photomask 80 shown in FIG. 5A has a configuration in which the transmissive portion 72 and the light-shielding portion 74 of the photomask 70 shown in FIG. ing. The pattern of the photomask 90 shown in FIG. 5B corresponds to the transmitting portion 6 of the photomask 60 shown in FIG.
2. Transmission part 67, circular light-shielding part 64a and circular light-shielding part 6
4b is replaced with a light-shielding portion 92, a light-shielding portion 97, a circular transmitting portion 94a, and a circular transmitting portion 94b, respectively.

Subsequently, as shown in FIG. 3 (f), a laminated film of an Al layer and a Mo layer as the reflective electrode 32 is formed on the photosensitive resin 30 on which the smooth uneven surface is formed, for example, by sputtering. Formed to a thickness of about 200 nm by one method, and one thin film transistor 2 in one picture element region.
Patterning is performed so that one reflective electrode 32 corresponds to 6. Here, as shown in FIG. 1, the reflective electrode 32 according to the first embodiment is configured to form a first overlap region, a second overlap region, and a third overlap region.

In the first embodiment, the photosensitive resin 30 in the region where the reflective electrode 32 is not formed has no uneven surface. However, it is needless to say that the uneven surface may be formed. If the photosensitive resin 30 in the region where the reflective electrode 32 is not formed is also formed with the uneven surface, the display quality in the region near the end of the reflective electrode and the region other than the end can be made more uniform. There is an advantage that you can.

The reflection electrode 32 is connected to the drain electrode 2 of the thin film transistor 26 through the contact hole 6.
4 and the photosensitive resin 30
Since the reflective electrode 32 is formed along the gentle uneven surface formed thereon, the surface of the reflective electrode 32 also has unevenness corresponding to the uneven surface of the photosensitive resin 30.

By the steps shown in FIGS. 3A to 3F, the reflection electrode 32 having the uneven surface can be formed over the entire surface, and the scattering in a specific angle range serving as the observation direction can be achieved. The first substrate 100a in which each of the plurality of picture element regions has the reflective electrode 32 having high scattering intensity and uniform scattering characteristics over the entire surface is completed.

Next, a transparent substrate (eg, a glass substrate) 5
A second substrate 100b having a transparent electrode (for example, an ITO layer) 52 formed thereon is prepared, and the first substrate 100a and the second substrate 100b are bonded to each other. Thereafter, a liquid crystal material is injected, and the retardation plate 54 and the polarizing plate 56 are arranged, whereby the liquid crystal display device 100 according to the first embodiment as shown in FIGS. 1 and 2 is completed.

The reason why the height of the recess in the first patterning region is higher than the height of the recess in the second patterning region in the step shown in FIG. 3E will be described below with reference to FIGS. Will be described. 6 and 7
Is a process cross-section schematically showing how the photosensitive resins 30a and 30b located in the first patterning region and the second patterning region on which the projections and depressions have been exposed and developed are deformed due to heat dripping by heat treatment. FIG.

First, when the exposure and development steps are performed, FIG.
(A) and FIG. 7 (a), the photosensitive resin 30
a and 30b respectively include a plurality of circular light-shielding portions 64a arranged in the first region 66 of the photomask 60.
And a plurality of circular light shielding portions 6 arranged in the second region 68
4b, a plurality of convex portions 65a and 65b are formed. The photomask 60 includes a plurality of circular light shielding portions 64.
Since the center distance of a is shorter than the center distance of the plurality of circular light-shielding portions 64b, the center distance of the plurality of protrusions 65a is shorter than the center distance of the plurality of protrusions 65b. . Note that, for simplicity of description, it is assumed that the plurality of formed convex portions 65a and 65b have the same diameter.

Next, when the photosensitive resins 30a and 30b are subjected to a heat treatment, the photosensitive resins 30a and 30b are softened by heating, and the corners of the convex portions are rounded and a part of the resin of the convex portions is reduced. This causes a deformation that flows into the recess. At this time, the distance between the centers of the plurality of protrusions 65a is formed shorter than the distance between the centers of the plurality of protrusions 65b, and the protrusions are formed more densely in the first patterning region than in the second patterning region. Therefore, the ratio of the convex portions of the photosensitive resin 30a is higher than that of the photosensitive resin 30b.
When the ratio of the convex portions is high, the amount of resin flowing per unit area of the concave portions when heat treatment is performed is increased.
The height of the concave portion on the uneven surface of the photosensitive resin 30a shown in FIG. 7B is higher than the height of the concave portion on the uneven surface of the photosensitive resin 30b shown in FIG. 7B. Note that the plurality of convex portions 65
Even when the diameter of a is smaller than the diameter of the plurality of protrusions 65b, the center-to-center distance of the plurality of protrusions 65a is appropriately shortened,
By increasing the proportion of the region where the convex portion is formed, the height of the concave portion of the photosensitive resin 30a can be reduced.
The height can be higher than the height of the concave portion b.

The plurality of circular light-shielding portions 64a in the first area
Are arranged so as to be shorter than a predetermined center-to-center distance (for example, the circular light-shielding portions 64a having a diameter of 4 μm to 7 μm are arranged so that the center-to-center distance is 6 μm or less), so that adjacent circular light-shielding portions 64a The transmission part 62 located at
Is close to the resolution line width of the exposure machine, the photosensitive resin 3
0a recessed area (area corresponding to transmission section 62)
The exposure amount is smaller than that in the region of the photosensitive resin 30b that becomes the concave portion. Therefore, at the time of development, as shown in FIG.
It is removed shallower than the region which becomes the concave portion of the photosensitive resin 30b shown in FIG. As a result, before the heat treatment, the concave portions of the photosensitive resin 30a are already formed higher than the concave portions of the photosensitive resin 30b. Therefore, when the heat treatment is subsequently performed to form the surface gently, FIG. As shown in b), it is easier to realize that the concave portion of the photosensitive resin 30a is formed higher than the concave portion of the photosensitive resin 30b.

(Embodiment 2) Referring to FIGS. 9 and 10, a liquid crystal display device 20 according to Embodiment 2 of the present invention will be described.
The structure of 0 will be described. FIG. 9 is a plan view showing a configuration of a picture element region portion of the liquid crystal display device 200 according to the second embodiment. FIGS. 10A and 10B show the second embodiment.
5 is a cross-sectional view showing a configuration of a picture element region portion of the liquid crystal display device 200 in FIG. FIG. 10A corresponds to a cross-sectional view taken along the line CC ′ of FIG. 9, and FIG.
This corresponds to a cross-sectional view along the line D '.

The liquid crystal display device 200 according to the second embodiment
As shown in FIGS. 9 and 10, the surface of the interlayer insulating film 30 located in the first overlap region and the second overlap region is formed flat, and the height thereof is set to the first height in the reflection region.
The difference from the liquid crystal display device 100 according to Embodiment 1 described above is that the height is higher than the average height of the uneven surface formed in the region excluding the overlap region and the second overlap region.
Other configurations are the same as those of the liquid crystal display device 100 described above. In the following description, for simplicity, components having substantially the same function are denoted by the same reference numerals.

In the second embodiment, as shown in FIGS. 9 and 10, the reflection electrode 32 is connected to the signal wiring 4 and the scanning wiring 2.
Alternatively, the signal wiring 4 or the scanning wiring 2 is overlapped in a first overlapping region overlapping with a region where the auxiliary capacitance line 14 intersects with each other, a second overlapping region overlapping with the thin film transistor 26, and a region other than the first overlapping region. It is provided so as to form a third overlapping region. With such a configuration, the area of the reflective electrode 32 can be increased, and the aperture ratio can be improved to perform bright display.

Further, since the surface of the interlayer insulating film 30 in the region other than the first and second overlapping regions in the reflection region is formed over the entire surface, including the third overlapping region, the surface is uneven.
The surface of the reflective electrode 32 formed on the interlayer insulating film 30 is
It has irregularities over almost the entire surface. Therefore, the reflection electrode 32
However, it is possible to make the scattering characteristics such that the scattered light intensity in a specific angle range serving as the observation direction is high and uniform over almost the entire surface. As a result, a bright display with good visibility can be performed. Note that reference numeral 125 in FIG. 9 schematically represents a concave portion formed on the interlayer insulating film 30 of the liquid crystal display device 200, and the concave portion 125 typically has a shape when viewed from the normal direction of the display surface. It has a circular shape.

Further, the surface of the interlayer insulating film 30 located in the first overlap region and the second overlap region is formed flat, and the height thereof is set to be equal to the height of the first overlap region and the second overlap region in the reflection region. The configuration is higher than the average height of the uneven surface formed in the region excluding the above. With such a configuration, the thin film transistor 26 or the signal wiring 4
And the occurrence of an electrical short circuit with the reflective electrode 32 is suppressed.

In the second embodiment, the semiconductor layer 18a as in the first embodiment is formed on the gate insulating layer 16 located in a region where the scanning wiring 2 or the auxiliary capacitance wiring 14 and the signal wiring 4 intersect each other. Although the n-type semiconductor layer 20a is not formed, it may be formed.

Next, a method of manufacturing the liquid crystal display device 200 according to the second embodiment will be described with reference to FIGS. 9, 10 and 11. FIG. 11 is a process cross-sectional view showing a manufacturing process of the first substrate 200a in the liquid crystal display device 200 according to the second embodiment. In particular, the uneven surface is formed on the interlayer insulating film 30, and the uneven surface is formed on the uneven surface. Reflective electrode 32
This is for explaining the step of forming.

The liquid crystal display device 200 according to the second embodiment
Is manufactured, for example, as follows.

First, as shown in FIG. 11A, the surface of the insulating substrate 10 on which the thin film transistor 26 is formed is
A negative photosensitive resin 30 to be an interlayer insulating film 30 is applied.

Next, a photomask 110 as shown in FIG. 12A is arranged as shown in FIG. 11B, and a first exposure is performed.

As shown in FIG. 12A, the pattern of the photomask 110 at this time has a structure in which a region corresponding to the contact hole 6 is a light shielding portion 112 and the other region is a transmission portion 114. I have. Exposure is performed after such a photomask 110 is aligned with the insulating substrate 10 having the photosensitive resin 30 applied to the entire surface.

Next, in the state where the exposure has been performed as described above, the photomask 120 as shown in FIG. 12B is arranged as shown in FIG. 11C, and the second exposure is performed.

As shown in FIG. 12B, the pattern of the photomask 120 at this time is such that the transmissive portions 122 are arranged in a sea shape, and the light shielding portions 127 and the plurality of circular light shielding portions 124 are arranged in an island shape. It has a configuration that has been. More specifically, the photomask 120 has a first region 126 corresponding to the first patterning region and a second region 128 corresponding to the second patterning region. In the second region, a plurality of circular light-shielding portions 124 are arranged, and the entire region corresponding to the contact hole is formed as a light-shielding portion 127. Such a photomask 120 and the insulating substrate 10
Exposure is performed after the alignment with the above.

Thereafter, the photosensitive resin 3 on the insulating substrate 10
When 0 is developed, irregularities are formed on the surface of the photosensitive resin 30 as shown in FIG. Since a negative photosensitive resin is used as the photosensitive resin 30, the photosensitive resin 30 in a region irradiated with light by the first exposure or the second exposure (a region where unevenness is formed) is completely removed during development. The photosensitive resin 30 in an area where no removed area exists and where light is not irradiated through the first exposure and the second exposure (an area corresponding to the contact hole 6) is completely removed during development. State.

Then, by performing a heat treatment, FIG.
As shown in FIG. 1 (f), the uneven surface of the photosensitive resin 30 is deformed by the heat dripping phenomenon, and its corners are removed to form a gentle uneven shape. At this time, the uneven surface is formed such that the surface of the first patterning region is flat and the height thereof is higher than the average height of the uneven surface formed in the second patterning region. The reason will be described later.

Note that an insulating resin may be deposited on the photosensitive resin 30 having the gentle uneven surface as described above to form a further insulating film. In the case where an additional insulating film is formed, the photosensitive resin 30 in a region which becomes a concave portion during development may be completely removed, so that the first exposure shown in FIG. 11B can be omitted. .

In the second embodiment, the negative photosensitive resin 30 is used. However, the present invention is not limited to this, and a positive photosensitive resin 30 may be used.

When a positive type is used, FIG.
And in the step shown in FIG.
13 (a) and FIG.
Exposure may be performed using photomasks 130 and 140 as shown in FIG. The pattern of the photomask 130 shown in FIG. 13A is obtained by replacing the transmission part 122, the light shielding part 127 and the circular light shielding part 124 of the photomask 120 shown in FIG.
7 and a circular transmitting portion 134. In the pattern of the photomask 140 shown in FIG. 13B, the light shielding portion 112 and the transmission portion 114 of the photomask 110 shown in FIG.
And a light shielding unit 144.

When a positive type is used, FIG.
Photomask 1 as shown in FIG. 14A and FIG.
Exposure may be performed using 50 and 160. FIG.
The photomask 150 shown in FIG.
52 are arranged, and the light shielding portion 153 and the plurality of circular light shielding portions 154 are arranged in an island shape. More specifically, the photomask 150 has a first region 156 corresponding to the first patterning region and a second region 158 corresponding to the second patterning region,
The first region 156 has a light-shielding portion 153 on the entire surface, a plurality of circular light-shielding portions 154 are arranged on the second region, and a region corresponding to the contact hole has a transparent portion 157 on the entire surface. Photomask 1 shown in FIG.
Reference numeral 60 designates a region corresponding to the contact hole 6 as the transparent portion 1.
62, and the other area is configured as a light shielding portion 164. Note that the uneven surface of the photosensitive resin 30 exposed and developed using the photomasks 150 and 160 is replaced by a reference numeral 125 schematically representing a concave portion in FIG. It was done.

Subsequently, as shown in FIG. 11 (f), a laminated film of an Al layer and a Mo layer as the reflective electrode 32 is formed on the photosensitive resin 30 having the gentle uneven surface by, for example, sputtering. Then, patterning is performed so that one reflective electrode 32 corresponds to one thin film transistor 26 in one picture element region. Here, as shown in FIG. 9, the reflective electrode 32 in the first embodiment has a configuration in which a first overlap region, a second overlap region, and a third overlap region are formed.

In the second embodiment, since the photosensitive resin 30 in the area where the reflective electrode 32 is not formed also has an uneven surface, the area near the edge of the reflective electrode and the area other than the area near the edge are different. Display quality can be made more uniform. Of course, the uneven surface may not be formed.

The reflection electrode 32 is connected to the drain electrode 2 of the thin film transistor 26 through the contact hole 6.
4 and the photosensitive resin 30
Since the reflective electrode 32 is formed along the gentle uneven surface formed thereon, the surface of the reflective electrode 32 also has unevenness corresponding to the uneven surface of the photosensitive resin 30.

By the steps shown in FIGS. 11A to 11F, the reflection electrode 32 having the uneven surface can be formed over almost the entire surface, and the reflection electrode 32 having a specific angle range which is the observation direction can be formed. A reflective electrode 32 having a high scattered light intensity and having a scattering characteristic to be uniform over almost the entire surface,
The first substrate 200a included in each of the plurality of picture element regions is completed.

Next, a transparent substrate (eg, a glass substrate) 5
A second substrate 200b having a transparent electrode (for example, an ITO layer) 52 formed on the substrate 0 is prepared, and the first substrate 200a and the second substrate 200b are bonded to each other. Thereafter, a liquid crystal material is injected, and the retardation plate 54 and the polarizing plate 56 are arranged, whereby the second embodiment as shown in FIGS.
Is completed.

In the step shown in FIG.
The surface of the patterning area remains flat and its height is
The reason why the uneven surface is formed so as to be higher than the average height of the uneven surface formed in the second patterning region will be described below.

First, the entire surface of the photosensitive resin 30a located in the first patterning region is irradiated with light through the first exposure and the second exposure. The surface is uniform and the surface after development is formed flat. On the other hand, the photosensitive resin 30b located in the second patterning region is irradiated with light on the entire surface at the time of the first exposure, but at the time of the second exposure, the region corresponding to the circular light shielding portion 124 of the photomask 120 is exposed. Is not illuminated. Therefore, the region is more easily dissolved in the developer than the other regions in the second patterning region and the first patterning region, and becomes a concave portion having a lower surface height than the other region after development. As a result, the height of the flat surface of the photosensitive resin 30a is higher than the average height of the uneven surface of the photosensitive resin 30b.

Next, when the photosensitive resins 30a and 30b are subjected to a heat treatment, the photosensitive resins 30a and 30b are softened by being heated. The photosensitive resin 30b is deformed such that the corners of the convex portion are rounded and a part of the resin of the convex portion flows into the concave portion, and the surface thereof is formed in a gentle uneven shape. Is formed flat, the above-mentioned deformation does not occur even if it is softened, its surface remains flat, and its height is higher than the average height of the uneven surface of the photosensitive resin 30b. Up to.

The first and second embodiments described above
In, the reflective liquid crystal display device in which each of the plurality of picture element regions is configured from a reflective region has been described, but the present invention has a reflective layer for reflecting ambient light,
It can be widely applied to a liquid crystal display device capable of displaying in a reflection mode. For example, the present invention can be suitably applied to a transflective liquid crystal display device in which each of a plurality of picture element regions is composed of a transmissive region and a reflective region (see, for example, JP-A-11-101992). .

[0101]

According to the present invention, the electric reliability is excellent, the display in the bright reflection mode is excellent, and the occurrence of the electric short circuit between the switching element or the wiring and the reflection electrode is suppressed. The liquid crystal display device with high performance is provided.
Further, according to the present invention, there is provided a method capable of efficiently manufacturing such a liquid crystal display device. INDUSTRIAL APPLICABILITY The present invention is suitably used for a liquid crystal display device capable of displaying in a reflection mode.

[Brief description of the drawings]

FIG. 1 is a top view schematically illustrating a liquid crystal display device 100 according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view schematically illustrating the liquid crystal display device 100 according to the embodiment of the present invention.

FIG. 3 is a sectional view schematically showing a manufacturing process of the liquid crystal display device 100 according to the embodiment of the present invention.

FIG. 4 is a view showing a photomask used in a manufacturing process of the liquid crystal display device 100 according to the embodiment of the present invention.

FIG. 5 is a view showing a photomask used in a manufacturing process of the liquid crystal display device 100 according to the embodiment of the present invention.

FIG. 6 is a cross-sectional view schematically showing deformation of an interlayer insulating film due to heat treatment.

FIG. 7 is a cross-sectional view schematically illustrating deformation of an interlayer insulating film due to heat treatment.

FIG. 8 is a cross-sectional view schematically illustrating deformation of an interlayer insulating film due to heat treatment.

FIG. 9 is a top view schematically illustrating the liquid crystal display device 200 according to the embodiment of the present invention.

FIG. 10 illustrates a liquid crystal display device 200 according to an embodiment of the present invention.
It is sectional drawing which shows typically.

FIG. 11 is a liquid crystal display device 200 according to an embodiment of the present invention.
It is sectional drawing which shows the manufacturing process of 1st.

FIG. 12 is a liquid crystal display device 200 according to an embodiment of the present invention.
FIG. 4 is a view showing a photomask used in the manufacturing process of FIG.

FIG. 13 illustrates a liquid crystal display device 200 according to an embodiment of the present invention.
FIG. 4 is a view showing a photomask used in the manufacturing process of FIG.

FIG. 14 is a liquid crystal display device 200 according to an embodiment of the present invention.
FIG. 4 is a view showing a photomask used in the manufacturing process of FIG.

[Explanation of symbols]

 Reference Signs List 2 scanning wiring 4 signal wiring 6 contact hole 10 insulating substrate 12 gate electrode 14 auxiliary capacitance wiring 16 gate insulating layer 18, 18a semiconductor layer 20, 20a n-type semiconductor layer 22 source electrode 24 drain electrode 26 thin film transistor 30 interlayer insulating film, photosensitive Resin 32 Reflective electrode 40 Liquid crystal layer 50 Transparent substrate 52 Transparent electrode 54 Retardation plate 56 Polarizer 60 Photomask 64a, 64b Circular light shield 65a, 65b Convex part 100 Liquid crystal display device 120 Photomask 124 Circular light shield 125 Concave part 200 Liquid crystal Display device

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G09F 9/30 330 G09F 9/30 338 338 G02F 1/136 500 F term (Reference) 2H042 BA04 BA12 BA15 BA20 DA01 DA02 DA12 DA14 DB08 DE00 2H090 HB07X JA03 JD01 KA05 KA06 LA04 2H091 FA16Y FB08 FC02 FC10 FC26 FC29 FD04 FD13 FD23 GA13 HA07 HA08 LA03 LA12 LA18 2H092 HA05 JA26 JA29 JA38 JA42 JA44 JA46 JB13 J53 JB23 JB23 JB23 JB23 JB23 JB23 JB23 JB23 JB23 JB23 JB23 JB23 JB23 JB23 JB33 MA37 NA25 PA06 PA09 QA07 QA08 5C094 AA21 AA31 AA43 BA03 BA43 CA19 EA05 EA06 EB02 ED14 ED20

Claims (10)

[Claims] 1. A display device comprising a first substrate, a second substrate, and a liquid crystal layer provided between the first substrate and the second substrate, and displaying a plurality of picture element regions in a reflection mode. And a switching element electrically connected to a scanning line and a signal line disposed to intersect the scanning line for each of the plurality of pixel regions. And an insulating film that covers the switching element and has an uneven surface, and a reflective electrode provided on the uneven surface of the insulating film and electrically connected to the switching element. A first overlapping region overlapping with a region where the signal line and the scanning line intersect with each other, and a second overlapping region including at least one of a second overlapping region overlapping with the switching element. In the superimposed area A height of a concave portion of the concave-convex surface of the insulating film located in the reflective region is higher than a concave portion of the concave-convex surface formed in a region other than the overlapping region in the reflection region. 2. The reflection electrode is provided so as to further form a third overlap region that overlaps with at least one of the signal wiring and the scan wiring in a region other than the first overlap region. The liquid crystal display device according to claim 1, wherein a surface of the insulating film located in the third overlapping region is formed in an uneven shape. 3. A display device comprising a first substrate, a second substrate, and a liquid crystal layer provided between the first substrate and the second substrate, and displaying in a reflection mode on each of a plurality of picture element regions. And a switching element electrically connected to a scanning line and a signal line disposed to intersect with the scanning line for each of the plurality of pixel regions. And an insulating film that covers the switching element and has an uneven surface, and a reflective electrode provided on the uneven surface of the insulating film and electrically connected to the switching element. A first overlapping region overlapping a region where the signal line and the scanning line intersect each other, a second overlapping region overlapping with the switching element, and a region other than the first overlapping region. Less scanning wiring Is also provided so as to form a third overlapping area overlapping with one, together with the surface of the insulating film located on the first overlapping region and the second superimposed region is flat,
The surface of the insulating film located in the third overlapping region is formed in an uneven shape, and the height of the surface of the insulating film located in the first overlapping region and the second overlapping region is: The liquid crystal display device, wherein the height is higher than the average height of the uneven surface formed in a region other than the first overlap region and the second overlap region in the reflection region. 4. The liquid crystal display device according to claim 1, wherein each of the plurality of picture element regions has a transmission region for performing display in a transmission mode. 5. A display device comprising a first substrate, a second substrate, and a liquid crystal layer provided between the first substrate and the second substrate, and displaying in a reflection mode on each of a plurality of picture element regions. (A) a plurality of scanning wirings, a plurality of signal wirings intersecting the plurality of scanning wirings, and an electrical connection between the scanning wirings and the signal wirings. Preparing a first substrate on which a plurality of switching elements connected in series are formed; and (b) forming an insulating film on the first substrate using a photosensitive resin to cover the switching elements; Forming a plurality of convex groups on the insulating film by a photolithography process; and (c) forming a first electrode on the insulating film where a reflective electrode overlaps a region where the signal wiring and the scanning wiring intersect each other. Superimposition area and the switching Providing the reflective electrode so as to form an overlap region including at least one of a second overlap region overlapping the element. The photomask used in the step (b) has a predetermined first light intensity. A first region in which a first photomask pattern for generating a distribution is formed, and a second region in which a second photomask pattern for generating a predetermined second light intensity distribution different from the first light intensity distribution is formed. A plurality of convex groups formed on the insulating film by a photolithography process using the photomask, the insulating film located in a first patterning region including a region to be an overlapping region; A first projection group formed by forming a plurality of projections corresponding to the first photomask pattern, and a second patterning excluding the first patterning region in a region to be a reflection region A second protrusion group formed by forming a plurality of protrusions corresponding to the second photomask pattern on the insulating film located in the region; and a plurality of protrusions included in the first protrusion group. The center distance of
A method for manufacturing a liquid crystal display device, wherein the distance between the centers of the plurality of protrusions included in the second protrusion group is shorter than the center distance. 6. The liquid crystal display device according to claim 5, further comprising a step of deforming the plurality of convex groups by performing a heat treatment to form the surface of the insulating film into a smooth uneven shape. Manufacturing method. 7. The method for manufacturing a liquid crystal display device according to claim 6, wherein an additional insulating film is formed on the surface of the insulating film which is formed in a gentle uneven shape. 8. The photomask has a transmission part and a light shielding part, one of the transmission part and the light shielding part is formed in an island shape, and the other is formed in a sea shape. A method for manufacturing a liquid crystal display device according to claim 5. 9. One of the transmissive portion and the light-shielding portion, which is formed in an island shape, includes a plurality of first island portions included in the first region and a plurality of first island portions included in the second region. The plurality of first islands are formed with a center distance of 6 μm or less, and the plurality of second islands are formed with a center distance of 6 μm or more. The method for manufacturing a liquid crystal display device according to claim 8, wherein the liquid crystal display device is formed. 10. A semiconductor device comprising: a first substrate; a second substrate; and a liquid crystal layer provided between the first substrate and the second substrate.
A method for manufacturing a liquid crystal display device, comprising: a reflective layer formed on the first substrate, wherein the reflective layer has an uneven surface for scattering incident light, wherein an insulating film is formed on the first substrate. Forming a plurality of protrusions on the insulating film, wherein the plurality of protrusions are formed at a first region formed at a first density and a second region formed at a second density. By forming a region with
A step of making the average film thickness of the first region and the average film thickness of the second region different from each other; and depositing a reflective film on the insulating film to have an uneven surface corresponding to the plurality of convex portions of the insulating film. Forming a reflective layer.