JP2002019118A - Electrical wiring substrate of ink jet recording head, ink jet recording head and ink jet recording apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent short-circuits at adjacent points by improving a reliability on connection between a recording element substrate and an electrical wiring substrate. SOLUTION: The electrical wiring substrate H1300 including a connecting terminal H1302 for supplying a driving power is connected with the use of a thermosetting adhesive to the recording element substrate H1100 including energy-generating elements for generating an energy to be utilized for discharging a recording solution from discharge openings in accordance with electrical signals, and bump electrodes H1105 made conductive to the energy-generating elements. A breadth of the connecting terminal H1302 of the electrical wiring substrate H1300 is made larger than a breadth of a contact face of the bump electrode H1105 at least at a point where the connecting terminal contacts the bump electrode H1105.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electric wiring board for an ink jet recording head, an ink jet recording head, and an ink jet recording apparatus.

[0002]

2. Description of the Related Art An ink jet recording apparatus is a so-called non-impact recording type recording apparatus. High-speed recording on various recording media is possible, and there is little noise during recording. For this reason, it has been widely adopted as a device having a recording mechanism such as a printer, a word processor, a facsimile, and a copying machine. This inkjet recording,
A method in which minute droplets are ejected from minute ejection ports to perform recording on recording paper, and a typical method is a method using an electrothermal transducer. An inkjet recording apparatus generally includes an inkjet recording head having nozzles for forming droplets, and a supply system that supplies ink to the inkjet recording head. In an ink jet recording head using an electrothermal conversion element, an electrothermal conversion element is provided in a recording liquid chamber, and thermal energy is given to the recording liquid by applying an electric pulse serving as a recording signal to the recording medium, and the phase of the recording liquid at that time is given. The bubble pressure at the time of bubbling (at the time of boiling) of the recording liquid caused by the change is used for discharging the recording liquid droplets.

In the case of an ink jet recording head using such an electrothermal conversion method, a method of discharging a recording liquid in parallel to a substrate on which electrothermal conversion elements are arranged (edge shooter) and an electrothermal conversion element Method for ejecting recording liquid perpendicularly to the substrate on which is arranged (side shooter)
There is. Hereinafter, the side shooter method will be described as an example.

FIG. 17 shows a recording element unit of an ink jet recording head. The printing element unit includes a printing element substrate 1100, a first plate 1200, a second plate (not shown in the drawing), and a flexible film electric wiring board 1300. Is fixed to the plate 1200 with high positional accuracy. A method for connecting the recording element substrate and the electric wiring substrate using a thermosetting adhesive is disclosed in Japanese Patent Application Laid-Open No. 10-444418 of the present applicant. As shown in FIG. 18, the printing element unit includes an electrode bump 1105 of a printing element substrate 1100 and an electric wiring board 1.
The connection terminals 1302 formed on the base film 1304 of the base plate 300 are brought into contact with each other, and are thermocompression-bonded using a thermosetting adhesive or the like, thereby being mechanically and electrically connected. In order to increase the thermal efficiency at the time of thermocompression bonding, it is preferable to prevent heat from escaping to the electric wiring board 1300, and for that purpose, the width dimension of the connection terminal 1302 is made as small as possible. As a result, as shown in FIG. 18 (b), the connection terminal 1302 comes into contact with only a part of the outer periphery of the electrode bump 1105, so that only a part of the bump 1105 is electrically conductive.

[0005]

However, there are the following problems in the ink jet recording head including the above-described recording element unit.

In other words, with the recent increase in the number of colors and high image quality represented by photo grades, it is necessary to increase the number of nozzles of an ink jet recording head and to reduce the pitch of the nozzle density. With the increase in the number of electrothermal transducers in the printing element substrate and the increase in the density of the printing element substrate and the electric wiring board due to higher functionality, the reliability of the electrical connection between the recording element substrate and the electric wiring board has become more reliable. It is one of the sexual issues.

Further, with the increase in the number of electrodes of the recording element substrate due to multicoloring, the pitch of the connection terminals is reduced, and the adjacent portions between the electrode bumps of the recording element substrate and the terminal portions of the electric wiring substrate are formed. Prevention of short-circuits is one new issue. An object of the present invention is to provide a recording element substrate, an electric wiring substrate of an ink jet recording head capable of reliably connecting the recording element substrate and the electric wiring substrate in increasing the density of the electric wiring substrate, and improving reliability. An object of the present invention is to provide an ink jet recording head and an ink jet recording apparatus.

Still another object of the present invention is to provide an electric wiring board for an ink jet recording head which can prevent a short circuit at a portion adjacent to an electrode bump of a recording element substrate and a connection terminal portion of the electric wiring board. It is to provide a recording head and an ink jet recording apparatus.

[0009]

In order to achieve the above object,
The present invention has the following configuration.

That is, an electric wiring board of an ink jet recording head according to one embodiment of the present invention is an energy generating element for generating energy used for discharging a recording liquid from a discharge port in accordance with an electric signal, and the energy generating element. An electrical wiring board having connection terminals that are pressurized and connected to the printing element substrate having the bump electrodes that are electrically connected to and supply drive power, wherein the width of the connection terminals of the electrical wiring board is at least In a portion that comes into contact with the bump electrode, the width is larger than a width of a contact surface of the bump electrode.

According to another aspect of the present invention, there is provided an ink jet recording head having an energy generating element for generating energy used for discharging a recording liquid from a discharge port in accordance with an electric signal, and being electrically connected to the energy generating element. A recording element substrate having bump electrodes, and an electric wiring board having connection terminals that are pressurized and connected to the recording element substrate to supply driving power, wherein the width dimension of the connection terminals is at least An electric wiring board formed wider than a width dimension of a contact surface of the bump electrode at a portion contacting the bump electrode.

Further, an ink jet recording apparatus according to another aspect of the present invention is an energy generating element for generating energy used for discharging a recording liquid from a discharge port in response to an electric signal, and is connected to the energy generating element. A recording element substrate having bump electrodes, and an electric wiring board having connection terminals that are pressurized and connected to the recording element substrate to supply driving power, wherein the width dimension of the connection terminals is at least An ink jet recording head including an electric wiring board formed wider than a width dimension of the contact surface of the bump electrode at a portion in contact with the bump electrode, and the ink jet recording head is mounted thereon, and can reciprocate in a scanning direction. And a carriage.

[0013] In the invention according to the above aspect, the bump electrodes of the recording element substrate are arranged in a staggered manner, and the width dimension of the connection terminal of the electric wiring board is limited to a portion corresponding to the bump electrode. May be formed wider than the width dimension of the contact surface.

The bump electrode is formed by a stud bump method in which a ball is formed on the electrode by ball bonding using a gold wire, the wire is cut just above the ball, and the ball is flattened to form a bump. The formed bump electrode may be formed such that a width dimension of a connection terminal of the electric wiring board is larger than a width dimension of a top contact surface of the flattened bump electrode.

It is preferable that the recording element substrate and the electric wiring substrate are connected by heating and pressing using a thermosetting adhesive.

Further, it is preferable that the connection terminal and the bump electrode are connected such that the connection terminal covers the bump electrode.

Further, the thermosetting adhesive may be an anisotropic conductive adhesive containing conductive particles.

Preferably, the energy generating element is an electrothermal converting element.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an ink jet recording apparatus having an electric wiring board and an ink jet recording head according to the present invention will be described with reference to the drawings.

In the embodiment described below, a printer will be described as an example of a recording apparatus using an ink jet recording method.

In this specification, "print"
(Sometimes referred to as "records") refers not only to the formation of significant information such as characters and figures,
In addition, regardless of whether or not they are visualized so that humans can perceive them visually, images, patterns,
This also refers to the case where a pattern or the like is formed or the medium is processed.

Here, the term "print medium" means not only paper used in a general printing apparatus but also a wide range of inks such as cloth, plastic films, metal plates, glass, ceramics, wood, leather, etc. Let's say what is possible.

Further, “ink” (sometimes referred to as “liquid”) is to be interpreted widely as in the definition of “print” described above. It refers to a liquid that can be used for forming a pattern or the like, processing a print medium, or processing ink (for example, solidifying or insolubilizing a color material in ink applied to a print medium).

[Apparatus Main Body] FIGS. 1 and 2 show a schematic configuration of a printer using an ink jet recording system. In FIG. 1, an apparatus main body M1 of the printer in this embodiment is shown.
000 are the lower case M1001 and the upper case M10.
02, access cover M1003 and discharge tray M10
04, and a chassis M3019 (see FIG. 2) housed in the exterior member.

The chassis M3019 is composed of a plurality of plate-like metal members having a predetermined rigidity, forms a skeleton of a recording apparatus, and holds each recording operation mechanism described later. Further, the lower case M1001 is connected to the apparatus main body M1.
000, and the upper case M1002 forms the upper half of the exterior of the apparatus main body M1000. A combination of the two cases has a hollow space having a storage space for storing each mechanism described below. It has a body structure. Openings are formed in the upper surface and the front surface of the apparatus main body M1000, respectively.

Further, one end of the discharge tray M1004 is rotatably held by the lower case M1001, and the opening formed in the front surface of the lower case M1001 can be opened and closed by the rotation. For this reason, when performing the recording operation, the discharge tray M100
By rotating the opening 4 to the front side to open the opening, the recording sheets can be discharged from here, and the discharged recording sheets P can be sequentially stacked.
Also, the paper discharge tray M1004 has two auxiliary trays M.
1004a and M1004b are accommodated, and the tray support area can be expanded or reduced in three stages by pulling out each tray as needed.

One end of the access cover M1003 is rotatably held by the upper case M1002 so that an opening formed on the upper surface can be opened and closed. When the access cover M1003 is opened, the inside of the main body is opened. The stored recording head cartridge H1000 or ink tank H1900 can be replaced. Although not particularly shown here, the access cover M10
When the cover 03 is opened and closed, a projection formed on the back surface rotates the cover opening / closing lever, and the open / closed state of the access cover can be detected by detecting the rotation position of the lever with a microswitch or the like. It has become.

On the rear upper surface of the upper case M1002, a power key E0018 and a resume key E0019 are provided.
Is provided so as to be pressed, and an LED E0020 is provided. When the power key E0018 is pressed, L
The ED E0020 lights up to notify the operator that recording is possible. LED E0
Reference numeral 020 has various display functions such as changing the blinking method and color, and notifying an operator of a printer trouble or the like. Further, the buzzer E0021 (FIG. 7) can be smoothed. When the trouble or the like is solved, the recording is restarted by pressing the resume key E0019.

[Printing Operation Mechanism] Next, the printing operation mechanism according to the present embodiment, which is housed and held in the apparatus main body M1000 of the printer, will be described.

The recording operation mechanism in the present embodiment includes an automatic feeding unit M3022 for automatically feeding the recording sheet P into the apparatus main body, and a recording sheet P sent one by one from the automatic feeding unit. A conveyance section M3029 for guiding the recording sheet P from the recording position to the discharge section M3030 while guiding the recording sheet P to a predetermined recording position; and a recording sheet P conveyed to the recording position.
And a recovery unit (M5000) for performing recovery processing on the recording unit and the like.

(Recording Unit) Here, the recording unit will be described. The recording unit includes a carriage M4001 movably supported by a carriage shaft M4021, and a recording head cartridge H1000 removably mounted on the carriage M4001. Consists of

Recording Head Cartridge First, the recording head cartridge used in the recording section will be described with reference to FIGS.

As shown in FIG. 3, the recording head cartridge H1000 in this embodiment includes an ink tank H1900 for storing ink and an ink tank H190 for storing the ink.
And a recording head H1001 that ejects ink supplied from nozzles from nozzles according to recording information. The recording head H1001 employs a so-called cartridge system which is removably mounted on a carriage M4001 described later.

The recording head cartridge H10 shown here
In FIG. 4, in order to enable photographic high-quality color recording, for example, ink tanks H1900 for each color of black, light cyan, light magenta, cyan, magenta and yellow are prepared as ink tanks. As shown in FIG.
1 is detachable.

As shown in the exploded perspective view of FIG. 5, the recording head H1001 includes a recording element substrate H1100, a first plate H1200, an electric wiring substrate H1300, a second plate H1400, a tank holder H1500,
It is composed of a flow path forming member H1600, a filter H1700, and a seal rubber H1800.

On the printing element substrate H1100, a plurality of printing elements for ejecting ink to one side of the Si substrate and electric wiring of Al or the like for supplying power to each printing element are formed by a film forming technique. A plurality of ink flow paths and a plurality of ejection ports H1100T corresponding to the recording elements are formed by photolithography, and an ink supply port for supplying ink to the plurality of ink flow paths is formed to open on the back surface. Have been. The printing element substrate H1100 is bonded and fixed to a first plate H1200, and an ink supply port H1201 for supplying ink to the printing element substrate H1100 is formed here. Further, a second plate H1400 having an opening is adhered and fixed to the first plate H1200, and the electric wiring board H13 is connected via the second plate H1400.
00 is held so as to be electrically connected to the printing element substrate H1100. This electric wiring board H1300
Is for applying an electric signal for discharging ink to the recording element substrate H1100.
1100, and an external signal input terminal H1301 at an end of the electric wiring for receiving an electric signal from the main body.
1301 is positioned and fixed on the back side of a tank holder H1500 described later.

On the other hand, a flow path forming member H1600 is fixed to the tank holder H1500 for detachably holding the ink tank H1900, for example, by ultrasonic welding, and an ink flow path H1501 extending from the ink tank H1900 to the first plate H1200. Is formed. Further, a filter H1700 is provided at an end portion of the ink flow path H1501 on the ink tank side which engages with the ink tank H1900, so that intrusion of dust from the outside can be prevented. In addition, a seal rubber H1800 is attached to an engagement portion with the ink tank H1900, so that evaporation of ink from the engagement portion can be prevented.

Further, as described above, the tank holder H1
500, flow path forming member H1600, filter H170
And a tank element comprising a recording element substrate H1100, a first plate H1200, an electric wiring substrate H1300, and a second plate H1400, which are joined together by bonding or the like. This constitutes the recording head H1001.

(Carriage) Next, referring to FIG. 2, a carriage M on which the recording head cartridge H1000 is mounted.
4001 will be described.

As shown in FIG. 2, the carriage M4001
Has a recording head H10 that engages with the carriage M4001.
01, a carriage cover M4002 for guiding the recording head H1001 to a predetermined mounting position on the carriage M4001, a head set lever M4007 that engages with the tank holder H1500 of the recording head H1001 and presses the recording head H1001 to the predetermined mounting position. Is provided. That is, the head set lever M4007 is provided above the carriage M4001 so as to be rotatable with respect to the head set lever shaft, and a spring-biased head set plate (not shown) is provided at an engagement portion with the recording head H1001. The recording head H1001 is mounted on the carriage M4001 while being pressed by the spring force.

A contact flexible print cable (refer to FIG. 7, hereinafter referred to as a contact FPC) is provided at another engagement portion of the carriage M4001 with the recording head H1001.
E0011 is provided, and the contact FPC E
0011 and a contact portion (external signal input terminal) H1301 provided on the print head H1001
Are electrically in contact with each other, so that various kinds of information for recording and reception and supply of electric power to the recording head H1001 can be performed.

Here, an elastic member such as rubber (not shown) is provided between the contact portion of the contact FPC E0011 and the carriage M4001, and the contact portion is formed by the elastic force of this elastic member and the pressing force of the headset lever spring. The secure contact with the carriage M4001 is enabled. Further, the contact FPC
E0011 is connected to a carriage substrate E0013 mounted on the back of the carriage M4001 (see FIG. 7).

[Scanner] The printer in this embodiment can be used as a reading device by mounting a scanner on the carriage M4001 instead of the recording head cartridge H1000 described above.

This scanner moves in the main scanning direction together with the carriage M4001 on the printer side, and reads a document image fed instead of a recording medium in the course of movement in the main scanning direction. By alternately performing the reading operation in the main scanning direction and the feeding operation of the document in the sub-scanning direction, one document image information can be read.

FIGS. 6A and 6B show a scanner M6 for explaining a schematic configuration of the scanner M6000.
000 are shown upside down.

As shown, the scanner holder M6001
Has a substantially box-like shape, and contains therein an optical system and a processing circuit necessary for reading. When the scanner M6000 is mounted on the carriage M4001, a reading unit lens M60 is provided at a portion facing the original surface.
The lens M6006 converges the reflected light from the document surface to an internal reading unit to read the document image. On the other hand, the illumination unit lens M6005 has a light source (not shown) inside, and light emitted from the light source is applied to the document via the lens M6005.

The scanner cover M6003 fixed to the bottom of the scanner holder M6001 is attached to the scanner holder M6.
The inside of 001 is fitted so as to shield light, and the operability of attaching and detaching to and from the carriage M4001 is improved by louver-shaped grips provided on the side surface. Scanner holder M60
01 has substantially the same outer shape as the recording head H1001, and can be attached to and detached from the carriage M4001 by the same operation as the recording head cartridge H1000.

The scanner holder M6001 houses a substrate having a read processing circuit, and a scanner contact PCB connected to the substrate is provided so as to be exposed to the outside. The scanner M6000 is mounted on the carriage M4001. Scanner contact PC when attached
B M6004 contacts the contact FPC E0011 on the carriage M4001 side, and the substrate is moved to the carriage M4.
001 is electrically connected to a control system on the main body side.

[Configuration of Electric Circuit of Printer] Next, an electric circuit configuration in the embodiment of the present invention will be described. FIG.
FIG. 1 is a diagram schematically showing an example of the overall configuration of an electric circuit according to this embodiment.

The electric circuit in this embodiment mainly includes a carriage board (CRPCB) E0013 and a main PC.
B (Printed Circuit Board) E0014, power supply unit E0015 and the like. Here, the power supply unit E0015 is connected to the main PCB E0014 and supplies various drive powers. In addition, the carriage substrate E0013 includes a carriage M400.
1 (FIG. 2).
In addition to functioning as an interface for transmitting and receiving signals to and from the recording head through the contact FPC E0011,
Based on a pulse signal output from the encoder sensor E0004 in accordance with the movement of the carriage M4001, the encoder scale E0005 and the encoder sensor E0004
And outputs the output signal to the main PCB E0014 through the flexible flat cable (CRFFC) E0012.

A main PCBE0014 is a printed circuit board unit for controlling the driving of each part of the ink jet recording apparatus in this embodiment. The main PCBE0014 is a paper end detection sensor (PE sensor) E0007, an ASF (automatic paper feeder) sensor E0009, a cover sensor. E0022, a parallel interface (parallel I / F) E0016, a serial interface (serial I / F) E0017, a resume key E0019, an LED E0020, a power key E0018, a buzzer E0021, and the like are provided on the board. Furthermore, the carriage M140
A motor (CR motor) E0001 serving as a drive source for main scanning of 0, a motor (LF motor) E0002 serving as a drive source for conveying a recording medium, and a rotating operation of a recording head and a paper feeding operation of the recording medium. In addition to being connected to a shared motor (PG motor) E0003 to control these drives, the ink empty sensor E0006, the GAP sensor E0008, the PG sensor E0010, the CRFFC E0
012, a connection interface with the power supply unit E0015.

FIG. 8 is a block diagram showing the internal configuration of the main PCB E0014. In the figure, E1001
Is a CPU, and the CPU E1001 has a clock generator (PC) internally connected to the oscillation circuit E1005.
G) E1002, and generates a system clock by the output signal E1019. The control bus E101
4 through ROM E1004 and ASIC (Applic
ation Specific Integrated Circuit) is connected to E1006, and according to a program stored in ROM, A
Control of SIC E1006, input signal E from power key
1017, and an input signal E101 from the resume key
6, cover detection signal E1042, head detection signal (HS
ENS) E1013 is detected, the buzzer E0021 is driven by a buzzer signal (BUZ) E1018, and an ink empty detection signal (INKS) E101 connected to the built-in A / D converter E1003.
1 and the temperature detection signal (TH) E101 by the thermistor
While detecting the state of No. 2, various other logical operations and condition judgments are performed to control the driving of the ink jet recording apparatus.

Here, the head detection signal E1013 is transmitted from the print head cartridge H1000 to the flexible flat cable E0012, the carriage board E0013, and the contact flexible print cable E0011.
, An ink empty detection signal E1011 is an analog signal output from the ink empty sensor E0006, and a temperature detection signal E1012 is output from a thermistor (not shown) provided on the carriage substrate E0013. Is an analog signal.

E1008 is a CR motor driver which uses a motor power supply (VM) E1040 as a drive source and
CR motor control signal E1036 from IC E1006
Generates a CR motor drive signal E1037 according to
The R motor E0001 is driven. E1009 is LF / P
A G motor driver that uses a motor power supply E1040 as a drive source, generates an LF motor drive signal E1035 according to a pulse motor control signal (PM control signal) E1033 from the ASIC E1006, and thereby drives the LF motor and the PG motor A drive signal E1034 is generated to drive the PG motor.

E1010 is a power supply control circuit,
In accordance with a power control signal E1024 from CE1006, power supply to each sensor having a light emitting element is controlled.
Parallel I / F E0016 is ASIC E1006
I / F signal E1030 is transmitted to an externally connected parallel I / F cable E1031, and the signal of the parallel I / F cable E1031 is transmitted to an ASIC.
It transmits to E1006. Serial I / F E0017
Is the serial I / F signal E from the ASIC E1006.
1028 is transmitted to the serial I / F cable E1029 connected to the outside, and the signal from the cable E1029 is transmitted to the ASIC E1006.

On the other hand, from the power supply unit E0015, a head power supply (VH) E1039 and a motor power supply (VM) E
1040, a logic power supply (VDD) E1041 is supplied. Also, the head power supply O from the ASIC E1006
An N signal (VHON) E1022 and a motor power supply ON signal (VMOM) E1023 are input to the power supply unit E0015, and control ON / OFF of the head power supply E1039 and the motor power supply E1040, respectively. Power supply unit E
Logic power supply (VDD) E10 supplied from 0015
41 is a main PC after voltage conversion as necessary.
It is supplied to each part inside and outside BE0014.

The head power signal E1039 is sent to the flexible flat cable E0011 after being smoothed on the main PCB E0014, and is used for driving the recording head cartridge H1000. E100
Reference numeral 7 denotes a reset circuit which detects a drop in the logic power supply voltage E1041 and detects the CPU E1001 and the ASIC E1.
A reset signal (RESET) E1015 is supplied to 006 to perform initialization.

The ASIC E1006 is a one-chip semiconductor integrated circuit.
It is controlled by the U E1001 and outputs the above-mentioned CR motor control signal E1036, PM control signal E1033, power control signal E1024, head power ON signal E1022, motor power ON signal E1023, etc., and outputs the parallel I / F E0016 and serial I / F. F E0017
, A PE detection signal (PES) E1025 from the PE sensor E0007, an ASF sensor E
ASF detection signal (ASFS) E102 from 0009
6. The state of the GAP detection signal (GAPS) E1027 from the sensor (GAP) sensor E0008 for detecting the gap between the recording head and the recording medium and the PG detection signal (PGS) E1032 from the PG sensor E0010 are detected. Data indicating the state is transmitted to the CPU E1001 via the control bus E1014, and based on the input data, the CPU E1001 controls the driving of the LED driving signal E1038 to blink the LEDE0020.

Further, an encoder signal (ENC) E10
20 is detected to generate a timing signal, and the printhead cartridge H100 is generated by the head control signal E1021.
The interface with 0 controls the recording operation. Here, the encoder signal (ENC) E1020 is an output signal of the CR encoder sensor E0004 input through the flexible flat cable E0012. The head control signal E1021 is transmitted to the flexible flat cable E0012 and the carriage board E001.
3 and a contact FPC E0011 to the print head H1000.

FIG. 9 is a block diagram showing an example of the internal configuration of the ASIC E1006.

In the figure, the connection between the blocks shows only the flow of data related to the control of the head and the mechanical components such as print data and motor control data, and the registers built in each block. Control signals and clocks related to reading and writing of the data, control signals related to DMA control, and the like are omitted to avoid complication in the drawings.

Referring to FIG. 9, reference numeral E2002 denotes a PLL controller. As shown in FIG. 9, the ASIC E1 is controlled by a clock signal (CLK) E2031 and a PLL control signal (PLLON) E2033 output from the CPU E1001.
Clock supplied to most of 006 (not shown)
Occurs.

E2001 is a CPU interface (CPU I / F), and a reset signal E1015,
Soft reset signal (PDWN) E2032 and clock signal (CLK) E2 output from CPU E1001
031 and a control signal from the control bus E1014,
Control of register read / write for each block as described below, supply of a clock to some blocks, acceptance of an interrupt signal, etc. (all not shown) are performed, and an interrupt signal (IN) is sent to the CPU E1001.
T) Output E2034 to notify the occurrence of an interrupt in ASIC E1006.

Reference numeral E2005 denotes a DRAM, which is a reception buffer E2010,
Work buffer E2011, print buffer E201
4. It has various areas such as a data buffer E2016 for development and a motor control buffer E for motor control.
2023, and as a buffer used in the scanner operation mode, a scanner capture buffer E2024, a scanner data buffer E2026, and a transmission buffer E20 used in place of the recording data buffers described above.
28.

The DRAM E2005 has a CP
It is also used as a work area necessary for the operation of the EU 1001. That is, E2004 is a DRAM control unit, which is provided from the CPU E1001 by the control bus to the DRAM control unit.
Access to E2005 and DMA control unit E described later
Switching from access to the DRAM E2005 from 2003 is performed to perform a read / write operation to the DRAM E2005.

The DMA controller E2003 receives a request (not shown) from each block, and receives an address signal and a control signal (not shown), and in the case of a write operation, write data E2038, E2041, E2044, and E2.
053, E2055, E2057 and the like are output to the DRAM control unit E2004 to perform DRAM access. In the case of reading, read data E2040, E2043, E2045,
E2051, E2054, E2056, E2058, E
2059 is passed to the requesting block.

Further, E2006 is IEEE 1284
I / F, CP via CPU I / F E2001
Under the control of U E1001, the parallel I / F E00
In addition to performing a two-way communication interface with an external host device (not shown) through
The received data (PIF received data E2036) from / FE0016 is subjected to DMA processing to receive control unit E200
8 and the DRAM E when reading the scanner.
The data (1284 transmission data (RDPIF) E2059) stored in the transmission buffer E2028 in 2005 is transmitted to the parallel I / F by DMA processing.

E2007 is a universal serial bus (USB) I / F. The serial I / F is controlled by the CPU E1001 via the CPU I / F E2001.
In addition to performing a two-way communication interface with an external host device (not shown) through the FE0017, the reception control unit E (USB reception data E2037) from the serial I / FE 0017 is subjected to DMA processing during printing during printing.
Delivered to 2008, DRAM when scanning
Data (USB transmission data (RDUSB) E2058) stored in the transmission buffer E2028 in E2005
Is transmitted to the serial I / F E0017 by the DMA processing. The reception control unit E2008 has a 1284 I / F E2
006 or received data (WDIF) E203 from the selected I / F of the USB I / F E2007
8) is written to the reception buffer write address managed by the reception buffer control unit E2039.

E2009 is a compression / expansion DMA controller, which is a CPU controller via CPU I / FE 2001.
Under the control of 1001, the reception data (raster data) stored in the reception buffer E2010 is read from the reception buffer read address managed by the reception buffer control unit E2039, and the data (RDWK) E2040 is read.
Is compressed / expanded in accordance with the designated mode, and written as a recording code string (WDWK) E2041 in the work buffer area.

Reference numeral E2013 denotes a recording buffer transfer DMA controller which controls the CPU via the CPU I / F E2001.
Work buffer E2011 under the control of E1007
The upper recording code (RDWP) E2043 is read out, and each recording code is stored in a print buffer E20 suitable for the data transfer order to the recording head cartridge H1000.
14 (WDWP E20)
44). Reference numeral E2012 denotes a work clear DMA controller, which controls the recording buffer transfer D under the control of the CPU E1001 via the CPU I / F E2001.
The designated work fill data (WDWF) E2042 is repeatedly written into the area on the work buffer to which the transfer by the MA controller E2013 has been completed.

E2015 is a print data development DMA controller, which is a CP controller via the CPU I / F E2001.
The head control unit E2018 is controlled by the control of U E1001.
Triggered by the data development timing signal E2050 from the CPU, the recording code rearranged and written on the print buffer and the development data written on the development data buffer E2016 are read, and the development record data (RDH) is read.
DG) E2045 is stored in column buffer write data (WD
HDG) Write to the column buffer E2017 as E2047. Here, the column buffer E2017 is an SRAM for temporarily storing transfer data (developed recording data) to the recording head cartridge H1000, and includes a recording data developing DMA controller E2015 and a head controller E2015.
Shared management is performed by both blocks by a handshake signal (not shown) with 2018.

E2018 denotes a head control unit, which is a CPU I /
Under the control of the CPU E1001 via the FE2001, the recording head cartridge H is controlled via a head control signal.
1000 or the interface with the scanner, and based on the head drive timing signal E2049 from the encoder signal processing unit E2019, the print data development D
Data expansion timing signal E to MA controller
2050 is output.

At the time of printing, in accordance with the head drive timing signal E2049, the developed print data (RDHD) E2048 is read from the column buffer, and the data is output to the print head cartridge H1000 as a head control signal E1021.

In the scanner reading mode, the fetched data (WDHD) E2053 input as the head control signal E1021 is transferred to the DRAM E2005.
The data is DMA-transferred to the upper scanner fetch buffer E2024. E2025 is a scanner data processing DMA controller, which is a CPU via a CPU I / F E2001.
The scanner capture buffer E2 is controlled by the control of E1001.
024 stored in the capture buffer (R
DAV) E2054 is read, and processed data (WDAV) E2055, which has been subjected to averaging and the like, is transferred to a DRAM.
Write to the scanner data buffer E2026 on E2005.

E2027 is a scanner data compression DMA controller, which is a CP via the CPU I / F E2001.
Under the control of UE1001, the processed data (RDYC) E2056 on the scanner data buffer E2026 is read out and data compression is performed, and the compressed data (WDY) is read out.
C) Write and transfer E2057 to the sending buffer E2028.

Reference numeral E2019 denotes an encoder signal processing unit which receives an encoder signal (ENC) and receives a signal from the CPU E1.
In addition to outputting the head drive timing signal E2049 in accordance with the mode determined by the control of 001, information relating to the position and speed of the carriage M4001 obtained from the encoder signal E1020 is stored in a register.
1001. The CPU E1001 determines various parameters in controlling the CR motor E0001 based on this information. E2020 denotes a CR motor control unit, which is a CPU via a CPU I / F E2001.
By the control of E1001, the CR motor control signal E103
6 is output.

Reference numeral E2022 denotes a sensor signal processing unit which detects signals E1033, E1025, E1026, E output from the PG sensor E0010, PE sensor E0007, ASF sensor E0009, GAP sensor E0008, and the like.
In response to 1027, the CPU E101 transmits these sensor information in accordance with the mode determined by the control of CPUE1001.
01 and a sensor detection signal E205 to the LF / PG motor control DMA controller E2021.
2 is output.

The LF / PG motor control DMA controller E2021 is controlled by the CPU I / F E2001
The DRAM E2005 is controlled by the PU E1001.
In addition to reading the pulse motor drive table (RDPM) E2051 from the upper motor control buffer E2023 and outputting the pulse motor control signal E1033, depending on the operation mode, the pulse motor control signal E1033 is output using the sensor detection signal as a control trigger.

E2030 is an LED control unit.
CPU E1001 via CPU I / F E2001
, An LED drive signal E1038 is output.
Further, E2029 is a port control unit, and CPUI /
Under the control of the CPU E1001 via the FE2001, a head power ON signal E1022, a motor power ON signal E1023, and a power control signal E1024 are output.

[Operation of Printer] Next, the operation of the ink jet recording apparatus according to the embodiment of the present invention configured as described above will be described with reference to the flowchart of FIG.

When the apparatus main body 1000 is connected to the AC power supply, first, in step S1, first initialization processing of the apparatus is performed. In this initialization process, the ROM and R
Check the electric circuit system such as AM check,
Electrically confirm that the device can operate normally.

Next, at step S2, the apparatus body M100
0 power key E001 provided on the upper case M1002.
8 is turned on, and the power key E00
If the button 18 has been pressed, the process moves to the next step S3, where a second initialization process is performed.

In the second initialization processing, various driving mechanisms and the recording head of the apparatus are checked. That is, when the various motors are initialized and the head information is read, it is confirmed whether the apparatus can operate normally.

Next, in step S4, an event is waited. That is, the apparatus monitors command events from the external I / F, panel key events due to user operations, internal control events, and the like, and executes a process corresponding to the event when these events occur.

For example, if a print command event is received from the external I / F in step S4, the process proceeds to step S5, and if a power key event is generated by a user operation in the same step, the process proceeds to step S10. The process proceeds to step S11 when another event occurs in the same step. Here, in step S5, a print command from the external I / F is analyzed, and the designated paper type,
The paper size, print quality, paper feeding method, and the like are determined, data representing the determination result is stored in the RAM E2005 in the apparatus, and the process proceeds to step S6. Next, in step S6, sheet feeding is started by the sheet feeding method designated in step S5, the sheet is fed to a recording start position, and the process proceeds to step S7. In step S7, a recording operation is performed. In this recording operation, the recording data sent from the external I / F is temporarily stored in the recording buffer, and then stored in the CR motor E0001.
To start the movement of the carriage M4001 in the main scanning direction, and supply the print data stored in the print buffer E2014 to the printhead H1001 to print one line, and print one line of print data. When the recording operation is completed, the LF motor E0002 is driven to rotate the LF roller M3001 to feed the paper in the sub-scanning direction. Thereafter, the above operation is repeatedly performed, and when the recording of one page of recording data from the external I / F is completed, the process proceeds to step S8.

At step S8, the LF motor E0002
Is driven to drive the paper discharge roller M2003, and the paper feeding is repeated until it is determined that the paper is completely fed out of the apparatus. When the paper is completely discharged, the paper is completely discharged onto the paper discharge tray M1004a. Becomes

Next, in step S9, it is determined whether or not the recording operation of all the pages to be recorded has been completed. If the pages to be recorded remain, the process returns to step S5. The operations from S5 to S9 are repeated,
When the recording operation of all pages to be recorded is completed, the recording operation ends, and thereafter, the process shifts to step S4 to wait for the next event.

On the other hand, in step S10, a printer termination process is performed, and the operation of this apparatus is stopped. That is, in order to turn off the power of various motors and heads, the state is shifted to a state where the power can be turned off, and then the power is turned off and step S4
Go to and wait for the next event.

In step S11, other event processing other than the above is performed. For example, a process corresponding to a recovery command from various panel keys or an external I / F of the apparatus or a recovery event generated internally is performed. After the process is completed, the process proceeds to step S4 and waits for the next event.

In one embodiment in which the present invention is effectively used, a film is formed in a liquid by using thermal energy generated by an electrothermal converter to form bubbles.

Here, the configuration of the recording element substrate according to the present invention will be described with reference to FIG. The recording element substrate H1100 is, for example, a Si substrate H1101 having a thickness of 0.5 to 1 mm, and a thin film is formed on one surface thereof. Then, six rows of ink supply ports H1102 formed of long groove-shaped through-holes are formed as ink flow paths for six colors, and the electrothermal conversion elements H1103 are arranged in a staggered pattern on both sides of each ink supply port H1102. The electric heat conversion element H1103 and electric wiring (not shown) such as Al for supplying electric power to each of the electric heat conversion elements H1103 are formed by a film forming technique.

The electrode portion H1104 for supplying power to the electric wiring is provided with an electrode bump H1125 (in some cases, H1105 and H1115 described later). The ink supply port H1102 is formed by performing anisotropic etching using the crystal orientation of the Si substrate H1101. For example, if the Si substrate has a crystal orientation of (1,0,0) on the wafer surface and (1,1,1) in the thickness direction, anisotropic etching of an alkaline system (KOH, TMAH, humanrazine, etc.) , The etching proceeds at an angle of about 54.7 degrees. Using this method, etching is performed to a desired depth.

Further, on the Si substrate H1101, an ink flow path wall H1106 for forming an ink flow path corresponding to the electrothermal conversion element H1103 and discharge ports H1107 are formed by photolithography, and the six colors are formed. Six ejection port arrays H1108 corresponding to the inks are formed.
Further, the electrothermal transducer H1103 is provided so as to face the discharge port H1107, and the ink flow path H11
02 for the ink supplied from the electrothermal conversion element H11.
A bubble is generated by applying thermal energy to the ink in the step 03, and the ink is ejected using the bubble pressure. FIG. 12 is an exploded perspective view for explaining the configuration of the recording element unit. As shown in FIG. 12, the printing element unit includes the printing element substrate H1100 described above and the first printing element substrate.
, A second plate H1400, and an electric wiring board H1310.

The first plate H1200 is made of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm. The material of the first plate is not limited to alumina, and has a linear expansion coefficient equal to the linear expansion coefficient of the material of the recording element substrate H1100, and is equal to the thermal conductivity of the material of the recording element substrate H1100. Alternatively, it may be made of a material having the same or higher thermal conductivity. The material of the first plate H1200 is, for example, silicon (Si), aluminum nitride (AlN), zirconia, silicon nitride (Si).
₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), and tungsten (W).

The first plate H1200 has six ink supply ports H1201 for supplying six colors of ink to the recording element substrate H1100, and the six ink supply ports H1102 of the recording element substrate H1100.
Are the six ink supply ports H1 of the first plate H1200.
201, and the printing element substrate H1100 is adhesively fixed to the first plate H1200 with high positional accuracy. The first adhesive H1202 used for the bonding is applied on the first plate H1200 so as to substantially conform to the shape of the recording element substrate H1100, and to prevent an air path from being generated between the adjacent ink supply ports H1201. . Such a first adhesive H1
For example, 202 preferably has a low viscosity, a thin adhesive layer formed on the contact surface, a relatively high hardness after curing, and an ink resistance. The first adhesive H1202 is, for example, a thermosetting adhesive mainly containing an epoxy resin, and the thickness of the adhesive layer is desirably 50 μm or less.

The electric wiring board H1310 is for applying an electric signal for discharging ink to the recording element substrate H1100, and has an opening H1315 for incorporating the recording element substrate H1100. A connection terminal H1302, which will be described later, corresponding to the electrode portion H1104 of the substrate H1100, and an external signal input terminal H located at the end of the wiring for receiving an electric signal from the main unit.
1301.

The electric wiring substrate H1310 and the printing element substrate H
1100 is mechanically and electrically connected using a thermosetting adhesive. As a material of the electric wiring board H1310, for example, a flexible wiring board having a two-layer wiring structure is used, and the surface layer is covered with a resist film H1304.

The second plate H1400 has, for example, a thickness
0.5-1 mm alumina (Al _TwoO_Three) Formed of material
Have been. The material of the second plate is alumina
Without being limited, the printing element substrate H1100 and the first
It has the same linear expansion coefficient as the plate H1200, and
Has thermal conductivity equal to or higher than these thermal conductivity
It may be made of a material that does. Then, the second plate H
1400 is bonded and fixed to the first plate H1200
Opening larger than the outer dimensions of the printed element substrate H1100
It has a shape having a portion H1401.

The recording element substrate H1100 and the electric wiring substrate H
The second plate H1400 is adhered to the first plate 200 with a second adhesive (not shown) so that the electric wiring 1313 can be electrically connected to the first plate 200 in a planar manner. Is bonded and fixed to the plate H1400 with a third adhesive (not shown). Further, the electric wiring board H1310 is provided with a second plate H14.
00 and simultaneously with the first plate H1200
And it is bent at the edge of the second plate H1400 and adhered to the side surface of the first play H1200 with a third adhesive. As the second adhesive, for example, an adhesive having a low viscosity, a thin adhesive layer formed on the contact surface, and ink resistance is used. As the third adhesive, for example, a thickness of 10 to 1 containing an epoxy resin as a main component is used.
A 00 μm thermosetting adhesive film is used.

The recording element unit H2000 formed as described above is replaced with the tank holder unit H1500.
To form an ink jet recording head H1001 as shown in FIG.

Embodiments relating to the electric wiring substrate and the recording element substrate of the present invention as components of the above-described ink jet recording head will be further described below with reference to FIGS.

(First Embodiment) FIG. 14 is a partially enlarged view showing a connection state between a printing element substrate H1100 and an electric wiring substrate H1300. As shown in FIG. 14, the electrode bumps H1105 of the recording element substrate H1100 and the connection terminals H1302 of the electric wiring substrate H1300 are in contact with each other and are electrically connected.

A substantially prismatic electrode bump H1105 is formed on the recording element substrate H1100 by, for example, a plating method.

As a material of the electric wiring board H1300,
For example, a flexible film wiring substrate having a two-layer wiring structure is used, and the surface layer is covered with a resist film H1304.

The connection terminal H13 of the electric wiring board H1300
02 is wider than the width of the contact surface of the electrode bump H1105, so that the connection terminal H1302 can be connected to the electrode bump H1105 as shown in FIGS. It touches the entire surface including the outer periphery of the top surface. That is, the connection terminal H1302 and the bump electrode H1105 are connected such that the connection terminal H1302 covers the bump electrode H1105. For this reason, the connection is more reliable and the open defect rate of the circuit is reduced as compared with the case where only a part of the conventional example contacts.

(Second Embodiment) Next, FIG. 15 shows a second embodiment. This embodiment reduces the open defect rate of the circuit similarly to the above-described first embodiment, and at the same time, reduces the arrangement pitch due to the increase in the number of electrodes of the recording element substrate for multicoloring and the like. This is also to prevent adjacent short-circuits between the electrode bumps of the recording element substrate and the connection terminals of the electric wiring substrate.

For this reason, the electric wiring board H of the present embodiment is
At 1310, as shown in FIG.
The electrode bumps H1115 formed in 100 are arranged in a staggered manner, and the width of the connection terminals H1312 is increased only in a portion corresponding to the electrode bumps H1115 arranged in a staggered manner in comparison with other portions. Is formed wider than the width of the contact surface.

As described above, the electrode bumps H1115 are arranged in a staggered arrangement, and the width of the connection terminal H1312 is changed to the width of the electrode bumps H1115.
By increasing only the portion corresponding to 1115, the distance between the adjacent connection terminals H1312 is widened, so that adjacent short-circuit can be prevented.

(Third Embodiment) In addition to the first and second embodiments in which electrode bumps are formed on a recording element substrate by the plating method described above, the third embodiment is an example to which the present invention is applied. Show. This embodiment is an example in which electrode bumps are formed on a recording element substrate by a stud bump method.

The stud bump method is a general bump forming method similar to the plating bump method, and can easily form bumps, ie, electrode bumps, on the electrodes of the recording element substrate as compared with the plating bump method. It is. First, a ball is formed on the electrode of the recording element substrate by ball bonding using a gold wire, and the wire is cut just above the ball. Then, the top of the ball is flattened to form an electrode bump. The electrode bump formed in this manner has a two-step upper surface shape, a bottom formed during ball bonding and a vertex formed during flat.

As shown in FIG. 16, in the present embodiment, the width of the connection terminals H1312 of the electric wiring board H1310 is different from that of the stud bumps H1125 in the staggered bumps H1125 arranged in a staggered manner on the recording element substrate H1100. Only the width is wider than the other portions, and is wider than the contact surface at the apex of the stud bump H1125. In this embodiment, the same effects as those of the above-described embodiment can be obtained.

In the embodiment described above, the connection between the printing element substrate H1100 and the electric wiring substrate H1310 is
The heat-compression bonding may be performed using a thermosetting adhesive mainly composed of an epoxy resin. However, when an anisotropic conductive adhesive containing conductive particles is used, more preferable connection is obtained.

For example, an anisotropic conductive adhesive containing nickel particles having a particle size of about 3 μm is used to form a stud bump having a top diameter of 85 μm in a staggered arrangement of 180 μm pitch. The open failure rate at the time of connection is determined by setting the width of the connection terminal of the electric wiring board to 75 μm
And 1% when the width of the connection terminal was 120 μm (the number of samples of the recording element unit: 163).

On the other hand, the short-circuit defect rate was 0% both when the width of the connection terminal of the electric wiring board was 75 μm and when the width of the connection terminal was 120 μm.

[0115]

As is apparent from the above description, according to the first, sixth or thirteenth aspect, the width of the connection terminal of the electric wiring board is formed wider than the width of the contact surface of the electrode bump. By doing so, it is possible to reduce the open defect rate.

Furthermore, according to the second, seventh or fourteenth aspects of the present invention, the electrode bumps of the recording element substrate are staggered, and only the portion where the width of the connection terminal of the electric wiring board corresponds to the electrode bump is set. By being formed wider than the width dimension of the contact surface of the electrode bump, it is possible to reduce the open defect rate and prevent adjacent short circuit.

According to the third, eighth, or fifteenth aspect of the present invention, similarly, when stud bumps are provided,
The effects of reducing the open defect rate and preventing adjacent short-circuits can be obtained. As a result, an ink jet recording head having excellent electrical reliability can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an external configuration of an inkjet recording apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state where an exterior member of the ink jet recording apparatus shown in FIG. 1 is removed.

FIG. 3 is a perspective view showing a state in which a recording head cartridge used in an ink jet recording apparatus according to one embodiment of the present invention is assembled.

FIG. 4 is an exploded perspective view showing the recording head cartridge shown in FIG.

FIG. 5 is an exploded perspective view of the recording head shown in FIG. 4 as viewed obliquely from below.

FIG. 6 shows the configuration of a scanner cartridge that can be mounted on an inkjet recording apparatus according to an embodiment of the present invention instead of the recording head cartridge of FIG. 3; FIG.

FIG. 7 is a block diagram schematically showing an overall configuration of an electric circuit in the inkjet recording apparatus according to one embodiment of the present invention.

8 is a block diagram showing an example of an internal configuration of a main PCB in the electric circuit shown in FIG. 7;

FIG. 9 is a block diagram showing an example of the internal configuration of an ASIC in the main PCB shown in FIG. 8;

FIG. 10 is a flowchart illustrating an operation example of the inkjet recording apparatus according to one embodiment of the present invention.

FIG. 11 is a partially exploded perspective view illustrating a configuration of a printing element substrate according to an embodiment of the present invention.

FIG. 12 is an exploded perspective view illustrating a configuration of a printing element unit according to one embodiment of the present invention.

FIG. 13 is a perspective view showing an ink jet recording head according to an embodiment of the present invention.

14A and 14B are views for explaining a connection state in the first embodiment relating to the electric wiring substrate and the recording element substrate of the present invention, wherein FIG. 14A is a plan view, FIG. (C) is a transverse sectional view similarly.

15A and 15B are diagrams for explaining a connection state in the second embodiment relating to the electric wiring board and the printing element substrate of the present invention, wherein FIG. 15A is a plan view, FIG. (C) is a transverse sectional view similarly.

16A and 16B are views for explaining a connection state in a third embodiment relating to the electric wiring board and the printing element substrate of the present invention, wherein FIG. 16A is a plan view, FIG. (C) is a transverse sectional view similarly.

FIG. 17 is a perspective view of the recording element unit in an assembled state.

FIG. 18 is an explanatory diagram of a connection state in a conventional mode;
(A) is a plan view, (b) is a longitudinal sectional view of a connection terminal,
(C) is a transverse sectional view similarly.

[Explanation of symbols]

 H1001 Inkjet recording head H1100 Recording element substrate H1101 Si substrate H1102 Ink supply port H1103 Electrothermal conversion element H1104 Electrode section H1105, H1115, H1125 Electrode bump H1106 Ink flow path wall H1107 Discharge port H1108 Discharge port array H1200 First plate H1201 Ink supply H1300, H1310 Electrical wiring board H1301 Input terminal H1302, H1312 Connection terminal H1304 Resist film H1400 Second plate H1500 Tank holder unit H2000 Recording element unit

Claims (17)

[Claims] 1. A printing element substrate having an energy generating element for generating energy used for discharging a recording liquid from a discharge port in response to an electric signal and a bump electrode electrically connected to the energy generating element. , Pressurized connection,
An electric wiring board having a connection terminal for supplying drive power, wherein a width dimension of the connection terminal of the electric wiring board is larger than a width dimension of a contact surface of the bump electrode at least at a portion in contact with the bump electrode. An electric wiring substrate of an ink jet recording head, wherein the electric wiring substrate is formed. 2. The method according to claim 2, wherein the bump electrodes of the recording element substrate are arranged in a staggered manner, and the width of the connection terminal of the electric wiring substrate is smaller than the width of the contact surface of the bump electrode only in a portion corresponding to the bump electrode. The electric wiring board according to claim 1, wherein the electric wiring board is formed widely. 3. The bump electrode is formed by a stud bump method in which a ball is formed on the electrode by ball bonding using a gold wire, the wire is cut just above the ball, and the ball is flattened to form a bump. 3. A bump electrode formed, wherein a width dimension of a connection terminal of the electric wiring board is formed wider than a width dimension of a top contact surface of the flattened bump electrode. An electric wiring board according to claim 1. 4. The electric wiring substrate according to claim 1, wherein the recording element substrate and the electric wiring substrate are connected under heat and pressure by using a thermosetting adhesive. . 5. The electric wiring board according to claim 1, wherein the connection terminal and the bump electrode are connected such that the connection terminal covers the bump electrode. 6. A recording element substrate having an energy generating element for generating energy used for discharging a recording liquid from a discharge port in response to an electric signal, and a printing element substrate including a bump electrode connected to the energy generating element. An electric wiring board having a connection terminal that is pressurized and connected to the recording element substrate and supplies drive power, wherein a width dimension of the connection terminal is at least a portion that comes into contact with the bump electrode. An electrical wiring board formed wider than the width dimension of the contact surface. 7. The bump electrodes of the recording element substrate are arranged in a staggered manner, and the width dimension of the connection terminal of the electric wiring board is smaller than the width dimension of the contact surface of the bump electrode only in a portion corresponding to the bump electrode. The inkjet recording head according to claim 6, wherein the inkjet recording head is formed widely. 8. The bump electrode is formed by a stud bump method in which a ball is formed on the electrode by ball bonding using a gold wire, the wire is cut just above the ball, and the ball is flattened to form a bump. 9. The formed bump electrode, wherein a width dimension of the connection terminal of the electric wiring board is formed wider than a width dimension of a top contact surface of the flattened bump electrode. 3. The ink jet recording head according to item 1. 9. The ink-jet recording according to claim 6, wherein the recording element substrate and the electric wiring substrate are connected by heating and pressure using a thermosetting adhesive. head. 10. The connection terminal and the bump electrode,
10. The ink jet recording head according to claim 6, wherein the connection terminals are connected so as to cover the bump electrodes. 11. An ink jet recording head according to claim 9, wherein said thermosetting adhesive is an anisotropic conductive adhesive containing conductive particles. 12. The ink jet recording head according to claim 5, wherein said energy generating element is an electrothermal converting element. 13. A recording element substrate comprising: an energy generating element for generating energy used for discharging a recording liquid from a discharge port in response to an electric signal; and a printing element substrate including a bump electrode connected to the energy generating element. An electric wiring board having a connection terminal that is connected under pressure to the printing element substrate and supplies drive power, wherein a width dimension of the connection terminal is
An ink jet recording head including an electric wiring board formed at least in a portion in contact with the bump electrode and having a width larger than a width dimension of a contact surface of the bump electrode; and reciprocating in a scanning direction by mounting the ink jet recording head. An ink jet recording apparatus, comprising: a carriage that can be used. 14. The bump electrodes of the recording element substrate are arranged in a staggered manner, and the width dimension of the connection terminal of the electric wiring board is smaller than the width dimension of the contact surface of the bump electrode only in a portion corresponding to the bump electrode. 14. The device according to claim 13, which is formed widely.
3. The ink jet recording apparatus according to claim 1. 15. The stud bump method in which a ball is formed on the electrode by ball bonding using a gold wire, the wire is cut just above the ball, and the ball is flattened to form a bump. 15. The bump electrode formed, wherein a width dimension of the connection terminal of the electric wiring board is formed wider than a width dimension of a top contact surface of the flattened bump electrode. 3. The ink jet recording apparatus according to claim 1. 16. The ink jet recording according to claim 13, wherein the recording element substrate and the electric wiring substrate are connected under heat and pressure by using a thermosetting adhesive. apparatus. 17. The semiconductor device according to claim 17, wherein the connection terminal and the bump electrode
17. The ink jet recording apparatus according to claim 13, wherein the connection terminals are connected so as to cover the bump electrodes.