JP2001356147A - Semiconductor device and its inspecting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To directly confirm whether a power supply and a burn-in mode set signal for a burn-in test are fed to a semiconductor device at the burn-in test. SOLUTION: This semiconductor device is provided with a detecting means 10 detecting the presence or absence of the power supply for the burn-in test and the input of the burn-in mode set signal and a detection result storage region 11 storing the detection result by the detecting means 10, thereby whether a load is applied or not to the semiconductor device at the burn-in test can be judged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a burn-in target circuit for performing a burn-in test, and a method for inspecting a semiconductor device using a burn-in test apparatus.

In general, a burn-in test of a semiconductor device is performed by
This is performed by mounting a semiconductor device having a burn-in test target circuit on a burn-in test board and supplying a power supply voltage for the burn-in test and a burn-in mode setting signal to the semiconductor device from the burn-in test board.

[0003]

2. Description of the Related Art Conventionally, when the manufacture of a semiconductor device is completed,
A burn-in test is performed. The burn-in test is a process in which the semiconductor device is left for a predetermined period of time in an energized state. In this process, an initially defective semiconductor device is identified and is not shipped.

First, a burn-in test using a burn-in test board will be described with reference to FIG. The burn-in test board 1 has a configuration in which a large number of sockets 3 for mounting the semiconductor devices 20 are arranged. Further, the burn-in test board 1 is provided with a power supply terminal 4 to which each socket 3 is connected, a check terminal 5 for checking the energized state on the burn-in test board 1, and the like. The burn-in test board 1 is configured as described above.

In the burn-in test, a power supply voltage for a burn-in test and a burn-in mode setting signal are supplied to the semiconductor device 20 from a power supply terminal 4 on a burn-in test board 1 in which a large number of semiconductor devices 20 are mounted on a large number of sockets 3. Supplied. In this case, the power supply voltage also serves as a signal for setting the burn-in mode by the connection on the burn-in test board. Then, the power supply voltage and the waveform of the burn-in mode setting signal are checked from the check terminal 5 of the burn-in test board 1, and the semiconductor device 20 is checked.
It is determined whether or not a load during the burn-in test is applied.

Next, a semiconductor device in which a burn-in test is performed using the conventional burn-in test board shown in FIG. 3 will be described with reference to FIG. In FIG. 4, 2
Reference numeral 0 denotes a semiconductor device on which a burn-in test is performed, 6 denotes a burn-in target circuit to be subjected to a burn-in test, 7 denotes a power supply pad to which a power supply voltage is supplied from a burn-in test board, 8 denotes a ground pad to which a ground potential is applied, and 9 denotes a burn-in test. A burn-in mode setting pad to which a burn-in mode setting signal is supplied from the board for use.

When the burn-in target circuit 6 grounds the ground pad 8 and supplies a power supply voltage to the power supply pad 7 and sets the burn-in mode setting pad 9 to a high potential (burn-in mode setting signal), the burn-in mode operation (burn-in mode operation) is performed. (An operation of applying an electrical stress to the target circuit) to perform a burn-in test.

FIG. 5 shows a flow in a conventional semiconductor device inspection method. In FIG. 5, 1-1 is a burn-in test process, and 1-2 is a test process of a circuit to be burn-in. In step 1-2, an inspection of the circuit 6 to be burned-in of the semiconductor device 20 is performed. That is, it is checked whether the burn-in target circuit can perform an operation satisfying the standard.

[0009]

However, in the above-described conventional configuration, it is checked whether the power supply voltage for the burn-in test and the burn-in mode setting signal are supplied using the check terminal of the burn-in test board. However, there is a problem that it is not directly confirmed whether or not the power supply voltage and the burn-in mode setting signal are supplied to the semiconductor device having the burn-in target circuit to be subjected to the burn-in test.

Therefore, there is a possibility that a load at the time of the burn-in test is not applied to a plurality of sockets existing on the burn-in test board or the semiconductor devices mounted on the sockets. There is also a problem that a semiconductor device is accidentally shipped.

The present invention solves the above-mentioned conventional problems. It is possible to determine whether or not a load at the time of a burn-in test is applied to a semiconductor device having a burn-in target circuit. It is an object of the present invention to provide a semiconductor device capable of performing a burn-in test and screening an initial failure of the semiconductor device, and a method of inspecting the semiconductor device.

[0012]

According to a first aspect of the present invention, there is provided a semiconductor device including a burn-in test target circuit, a power supply voltage for a burn-in test, and a burn-in mode setting signal. And a detection result storage area for storing a detection result of the detection means.

According to this configuration, by reading and determining the contents of the detection result storage area, it is possible to determine whether or not a load during the burn-in test is applied to the semiconductor device. As a result, when no load is applied, the burn-in test can be performed again, the initial failure of the semiconductor device can be screened, the semiconductor device having the initial failure can be reliably selected, and the workability of the burn-in test can be further improved. Can be.

According to a second aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein the detection result storage area comprises an electrically writable nonvolatile storage device, and the detection result of the detection means is stored in the nonvolatile storage device. Write to the storage device.

According to this configuration, it is possible to determine whether or not a load during the burn-in test is applied to the semiconductor device by reading and determining the storage content of the nonvolatile storage device. As a result, when no load is applied,
By performing the burn-in test again, the initial failure of the semiconductor device can be screened, the semiconductor device having the initial failure can be reliably selected, and the workability of the burn-in test can be improved.

According to a third aspect of the present invention, in the semiconductor device according to the first aspect, the detection result storage area has a fuse circuit, and based on a detection result of the detection means, a power supply voltage to the burn-in target circuit. And the fuse circuit is cut off when the burn-in mode setting signal is input.

According to this configuration, it is possible to determine whether or not a load during the burn-in test is applied to the semiconductor device by determining whether or not the fuse circuit in the detection result storage area is disconnected. As a result, when no load is applied, the burn-in test can be performed again, the initial failure of the semiconductor device can be screened, the semiconductor device having the initial failure can be reliably selected, and the workability of the burn-in test can be further improved. Can be.

According to a fourth aspect of the present invention, there is provided a method of inspecting a semiconductor device, comprising:
Inspection of a semiconductor device for inspecting a semiconductor device provided with a detection means for detecting the presence or absence of input of a power supply voltage for a burn-in test and a burn-in mode setting signal, and a detection result storage area for storing a detection result of the detection means The method
By reading the content of the detection result storage area, it is determined whether or not a load for a burn test is applied to the semiconductor device.

According to this method, when no load is applied, a burn-in test can be performed again to screen the initial failure of the semiconductor device, and the semiconductor device having the initial failure can be reliably selected. Workability can be improved.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
FIG. 10 is a block diagram of a semiconductor device in which a burn-in test is performed using a burn-in test board in the embodiment. In FIG. 1, reference numeral 2 denotes a semiconductor device on which a burn-in test is performed, 6 denotes a burn-in test target circuit, 7 denotes a power supply pad to which a power supply voltage is supplied from a burn-in test board, 8 denotes a ground pad to which a ground potential is applied, 9 is a burn-in mode setting pad to which a burn-in mode setting signal is supplied from a burn-in test board.
Reference numeral 10 denotes a detection unit, and 11 denotes a detection result storage area.

The circuit 6 to be burned in is a ground pad 8
When the power supply voltage is supplied to the power supply pad 7 and the burn-in mode setting pad 9 is set to a high potential (burn-in mode setting signal), the burn-in target circuit 6 performs the burn-in mode operation to perform a burn-in test. it can.

At the same time, the input signal supplied to the ground pad 8, the power supply pad 7, and the burn-in mode setting pad 9 is supplied to the detecting means 10, and when the detecting means 10 checks the burn-in mode operation, for example, from the register, A flag is set in the detection result storage area 11.

The detection result storage area 11 of the above embodiment may be an electrically writable nonvolatile semiconductor device (for example, a flash memory). In this case, the result of applying the load during the burn-in test to the semiconductor device 2 is written using a writing unit instead of setting a flag in the detection result storage area 11 to determine whether the load during the burn-in test has been applied to the semiconductor device. Can be distinguished.

Further, a fuse circuit may be provided in the detection result storage area 11 of the above-described embodiment instead of the electrically writable nonvolatile semiconductor device. In this case, instead of setting a flag in the detection result storage area 11, the result of the load applied during the burn-in test to the semiconductor device 2 is
This is stored in a process of cutting the fuse circuit by the fuse cutting means. Also in this case, similar to the above,
It is possible to determine whether a load during a burn-in test has been applied to the semiconductor device.

As described above, according to the present embodiment, the detecting means for detecting whether a load during the burn-in test is applied to the semiconductor device and the detection result storage area for storing the detection result of the detecting means are provided. Therefore, by reading and determining the contents of the detection result storage area, it is possible to determine whether or not a load during the burn-in test is applied to the semiconductor device. As a result, when no load is applied, a burn-in test can be performed again to screen for an initial failure of the semiconductor device. In this case, since the semiconductor device is particularly improved, it can be implemented without using the burn-in device.

(Second Embodiment) FIG. 2 shows a flowchart of a semiconductor device inspection method according to the present invention. In the figure, the method for inspecting a semiconductor device according to the second embodiment of the present invention adds a new step for inspecting the detection result storage area in step 1-3 after the burn-in test in step 1-1. ,
The semiconductor device is configured so that it can be determined whether or not a load during the burn-in test is applied to the semiconductor device. Only the semiconductor device to which the load during the burn-in test is applied is subjected to the step of inspecting the burn-in target circuit in Step 1-2. It is composed.

If it is found that the load of the burn-in test is not applied to the semiconductor device by the inspection result storage area inspection step of step 1-3, the burn-in target circuit inspection step of step 1-2 is performed. Step 1-1 again without
Of the burn-in test.

As described above, according to the present embodiment, before testing the circuit to be burned-in of the semiconductor device,
By adding the step of inspecting the presence or absence of a load at the time of the burn-in test of the semiconductor device, it is possible to realize a semiconductor device inspection method that prevents a semiconductor device that has not been subjected to the burn-in test.

[0030]

As described above, according to the semiconductor device of the present invention, the contents of the detection result storage area are read and determined to determine whether or not a load is applied to the semiconductor device during the burn-in test. Can be. As a result, if no load is applied, conduct the burn-in test again,
An initial failure of a semiconductor device can be screened, a semiconductor device having an initial failure can be reliably selected, and workability of a burn-in test can be improved.

Further, according to the semiconductor device inspection method of the present invention, when no load is applied, a burn-in test can be performed again to screen the initial failure of the semiconductor device, and the semiconductor device having the initial failure can be reliably selected. Operability of the burn-in test can be further improved.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating a semiconductor device inspection method according to a second embodiment of the present invention;

FIG. 3 is a schematic diagram showing a configuration of a conventional burn-in test board.

FIG. 4 is a block diagram illustrating a configuration of a conventional semiconductor device.

FIG. 5 is a flowchart showing a conventional inspection method after a burn-in test of a semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Burn-in test board 2 Semiconductor device 3 Socket 4 Power supply terminal 5 Check terminal 6 Burn-in target circuit 7 Power supply pad 8 Ground pad 9 Burn-in mode setting pad 10 Detecting means 11 Detection result storage area

Claims (4)

[Claims] 1. A burn-in target circuit to be burn-in tested, detection means for detecting the presence or absence of input of a power supply voltage for a burn-in test and a burn-in mode setting signal, and a detection result storage for storing a detection result of the detection means Semiconductor device comprising a region. 2. The semiconductor device according to claim 1, wherein the detection result storage area comprises an electrically writable non-volatile storage device, and the detection result of the detection means is written to the non-volatile storage device. apparatus. 3. A detection result storage area having a fuse circuit, wherein the fuse circuit is cut off when a power supply voltage and a burn-in mode setting signal are input to a burn-in target circuit based on a detection result of a detection means. The semiconductor device according to claim 1, wherein: 4. A burn-in target circuit to be burn-in tested, detection means for detecting the presence or absence of input of a power supply voltage for the burn-in test and a burn-in mode setting signal, and a detection result storage for storing a detection result of the detection means. A semiconductor device inspection method for inspecting a semiconductor device having an area, comprising: determining whether a load for a burn test has been applied to the semiconductor device by reading the content of the detection result storage area. A method for inspecting a semiconductor device, comprising: