JP2001332530A5 - - Google Patents

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Publication number
JP2001332530A5
JP2001332530A5 JP2000196861A JP2000196861A JP2001332530A5 JP 2001332530 A5 JP2001332530 A5 JP 2001332530A5 JP 2000196861 A JP2000196861 A JP 2000196861A JP 2000196861 A JP2000196861 A JP 2000196861A JP 2001332530 A5 JP2001332530 A5 JP 2001332530A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2000196861A
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Japanese (ja)
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JP4305707B2 (ja
JP2001332530A (ja
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Priority to JP2000196861A priority Critical patent/JP4305707B2/ja
Priority claimed from JP2000196861A external-priority patent/JP4305707B2/ja
Publication of JP2001332530A publication Critical patent/JP2001332530A/ja
Publication of JP2001332530A5 publication Critical patent/JP2001332530A5/ja
Application granted granted Critical
Publication of JP4305707B2 publication Critical patent/JP4305707B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000196861A 2000-03-14 2000-06-29 基板の製造方法および半導体装置の製造方法 Expired - Fee Related JP4305707B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000196861A JP4305707B2 (ja) 2000-03-14 2000-06-29 基板の製造方法および半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-70521 2000-03-14
JP2000070521 2000-03-14
JP2000196861A JP4305707B2 (ja) 2000-03-14 2000-06-29 基板の製造方法および半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006308576A Division JP2007088503A (ja) 2000-03-14 2006-11-15 半導体発光素子

Publications (3)

Publication Number Publication Date
JP2001332530A JP2001332530A (ja) 2001-11-30
JP2001332530A5 true JP2001332530A5 (US20070244113A1-20071018-C00087.png) 2006-12-28
JP4305707B2 JP4305707B2 (ja) 2009-07-29

Family

ID=26587451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000196861A Expired - Fee Related JP4305707B2 (ja) 2000-03-14 2000-06-29 基板の製造方法および半導体装置の製造方法

Country Status (1)

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JP (1) JP4305707B2 (US20070244113A1-20071018-C00087.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8138002B2 (en) 2008-08-21 2012-03-20 Sony Corporation Semiconductor light-emitting element, fabrication method thereof, convex part formed on backing, and convex part formation method for backing

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