JP2001320153A - Method of controlling current value, and method of manufacturing circuit board, and current value control apparatus - Google Patents

Method of controlling current value, and method of manufacturing circuit board, and current value control apparatus

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Publication number
JP2001320153A
JP2001320153A JP2000135447A JP2000135447A JP2001320153A JP 2001320153 A JP2001320153 A JP 2001320153A JP 2000135447 A JP2000135447 A JP 2000135447A JP 2000135447 A JP2000135447 A JP 2000135447A JP 2001320153 A JP2001320153 A JP 2001320153A
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JP
Japan
Prior art keywords
current value
conductive fluid
conductive
circuit
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000135447A
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Japanese (ja)
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JP3724328B2 (en
Inventor
Seigo Mizutani
誠吾 水谷
Original Assignee
Seiko Epson Corp
セイコーエプソン株式会社
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Publication date
Application filed by Seiko Epson Corp, セイコーエプソン株式会社 filed Critical Seiko Epson Corp
Priority to JP2000135447A priority Critical patent/JP3724328B2/en
Publication of JP2001320153A publication Critical patent/JP2001320153A/en
Application granted granted Critical
Publication of JP3724328B2 publication Critical patent/JP3724328B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a simpler current value control method and enables higher control with smaller space without affecting other parts, etc., than a conventional method of cutting a circuit pattern. SOLUTION: This is a control method for a current value which sets a current flowing to circuits to a specified value, by spraying and applying conductive fluid between the circuits 11a and 11b (the section of 11d) required to let a given value of current flow by ink jet method, and adjusting the sectional area (sections of 11c and 11d) of those circuits so as to lower the resistance value of the circuits.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for jetting a conductive fluid onto or between wirings constituting a circuit by using an ink jet method, and adjusting the cross-sectional area of the wiring or the circuit between the wirings. The present invention relates to a method of changing a resistance value and controlling a value of a current flowing therethrough, and particularly relates to a current value control of a drive circuit for a clock circuit or a semiconductor element which needs to set the current value with high accuracy. I do.

[0002]

2. Description of the Related Art For example, in an electronic timepiece, it is necessary to supply a minute predetermined current to an internal IC and a driving circuit of a transmission circuit in order to adjust the accuracy of time. For this reason, conventionally, Japanese Unexamined Patent Application Publication No.
As disclosed in Japanese Patent No. 2993 or the like, while measuring a current value in a drive circuit, some of a plurality of current adjustment circuit patterns in the circuit are cut with a laser beam to increase a resistance value in the circuit. Thus, the method of adjusting the value of the current flowing there was adopted.

[0003]

However, in the above-described method of cutting the current adjustment circuit pattern, only the stepwise current value control for each circuit pattern can be performed, and the current value can be precisely controlled. If it is desired to control the size of the circuit, it is necessary to provide as many circuit patterns as possible, which increases the space for the circuit pattern, and poses a problem in reducing the size and weight of the device. Further, if the circuit pattern is divided too finely, there is a possibility that the circuit pattern itself may be broken. In addition, when laser light is used for cutting, it is necessary to make the circuit board heat-resistant, and there is also a restriction that a circuit cannot be formed on the back surface of the portion irradiated with the laser light. Furthermore, the cut circuit pieces may be scattered as dust, causing short circuits in other parts of the circuit or entering mechanical components, possibly causing malfunction.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is simpler than conventional methods for cutting a circuit pattern, can save space, and has a bad influence on other parts. It is another object of the present invention to provide a method and apparatus capable of controlling a current value with high accuracy.

[0005]

A current value control method according to the present invention is a method for controlling a current value for setting a current value between circuits to a predetermined value, wherein the current value between the circuits is measured in advance. And a step of forming a conductor by injecting a conductive fluid by an ink jet method so that a current value between the circuits becomes a predetermined value.
Further, the application amount of the conductive fluid is adjusted based on a measurement result obtained by measuring a current value between the circuits. In addition, the number of times of spraying the conductive fluid is controlled based on a measurement result obtained by measuring a current value between the circuits.

In controlling the current value by forming a conductor by the ink-jet method, there is no need to prepare an extra circuit pattern in advance, and the amount of the conductor can be finely adjusted. Thus, more accurate current value control is possible in a small space. In addition, since the ink jet method does not remove an existing circuit, a short circuit of the circuit or an adverse effect on other components due to the removed circuit piece does not occur. Further, in an ink jet system using a piezoelectric element, a single injection amount of the conductive fluid is set to several steps (for example, 6 ng, 10 ng, 13 ng) by a signal given to the piezoelectric element.
Therefore, the current value can be finely adjusted by changing the application amount of the conductive fluid based on the difference between the predetermined current value and the measured current value.

Further, the conductive fluid contains a conductive material, and a current value between the circuits is adjusted by a plurality of conductive fluids having different contents of the conductive material. . Thus, for example, by changing the content of the conductive material per unit volume in the conductive fluid, the fluid having a small amount of the conductive material per unit volume has a small current value due to a small change in the resistance value. On the other hand, in fluids with a large amount of conductive material per unit volume, it is possible to significantly change the current value by changing the large resistance value, and if multiple types of conductive fluids are used properly according to the purpose ,
Control efficiency can be increased. In particular, if the inkjet head is provided with injection ports for each of multiple types of conductive fluids, the resistance of the circuit can be reduced efficiently while changing the injection ports according to the amount of adjustment of the current value. The value of the flowing current can be set to a predetermined value with high accuracy.

If the conductive fluid contains a substance that dissolves an oxide film on the surface of the circuit, the electric characteristics (conductive property) at the connection between the current circuit to be adjusted and the conductive fluid can be adjusted. ) Can be prevented, and a phenomenon such as partial heat generation due to partial variation in resistance value in the wiring can be suppressed. In particular, in the case where the ink jet head has a plurality of ejection ports, at least one of the ejection ports is used as the ejection port of the liquid containing the substance that dissolves the oxide film on the surface of the circuit, so that the liquid that dissolves the oxide film is used. Since the amount of application can be controlled separately from the conductive fluid, the amount can be independently adjusted according to the degree of melting of the oxide film.

[0009] The current value control method of the present invention further comprises forming the conductive material by solidifying the applied conductive fluid by controlling the temperature. Further, a protective film is formed on the formed conductor. Thus, the fixability of the conductive fluid to the circuit board can be improved, and the electrical connection between the existing circuit and the conductor formed by the inkjet method can be kept good.

Further, the method of manufacturing a circuit board according to the present invention is a method of manufacturing a circuit board having wiring formed thereon, wherein the step of measuring the current value between the wirings in advance includes the step of measuring the current value between the wirings. A step of injecting a conductive fluid by an ink jet method to form a conductor so as to have a predetermined value. According to this method, in addition to the effects already described, it is not necessary to pay attention to the heat resistance of the circuit board as in the case of the circuit cutting method using laser light,
In addition, an effect is obtained that a circuit can be formed on the back side of the substrate surface on which the conductive fluid is applied.

[0011] Further, according to the present invention, there is provided an apparatus for manufacturing a circuit board, comprising: an ink jet head for jetting a conductive fluid;
A current value control device having at least a measurement device for measuring a current value, and a control unit that determines an injection amount of the conductive fluid based on a current value measured by the measurement device. And ejecting the conductive fluid from the inkjet head based on information from the control unit. Further, the conductive fluid contains a substance that dissolves an oxide film. Further, an ejection port for ejecting a conductive fluid containing a substance that dissolves an oxide film is formed in the inkjet head. Further, the conductive fluid contains a photo-curing material. When the photocurable material is included in the conductive fluid, in addition to the effect that the conductive fluid can be solidified by light irradiation, by creating a state in which the conductive fluid does not dry naturally, the conductive fluid When the current value control by the application fails, the applied conductive fluid is wiped off, the current value control can be performed again, and an effect that the product is not wasted can be obtained. Further, the conductive fluid contains a conductive material, and has a plurality of types of conductive fluids having different contents of the conductive material, in order to inject the plurality of types of conductive fluids. Are formed in the ink jet head for each type. Further, a means for forming a protective film on the conductor is provided. By implementing the method of the present invention using each of these devices, it is possible to achieve the above-described respective effects.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory diagram showing a method for controlling a current value of a circuit wiring on a circuit board by an ink jet system used in each of the embodiments of the present invention described below. Here, the condition input from the condition setting unit 2, that is, the current value of the circuit wiring (not shown) to be controlled is measured using the inkjet head 1 having the plurality of ejection ports N1 to N5, and the value is measured. Is fed back to the condition setting unit 2 and an appropriate amount of application is sent to the inkjet head control unit 3 based on a difference between the value and a predetermined current value to be set, so that the inkjet head control unit 3 Driving, the circuit wiring part,
An appropriate amount of the conductive fluid is jetted to form a conductor there. In addition, you may make it provide an appropriate number of injection ports as needed.

[0013] The conductive fluid ejected by the ink-jet method may be used for adding silver powder, gold powder, lead powder, or the like to a liquid such as ink.
The conductive material having relatively small electric resistance such as solder powder is dissolved or mixed as fine particles. In addition, a fluid containing a conductive material as described in JP-A-11-274671 can also be used as the conductive fluid.

Next, the structure and operation of the ink jet head 1 will be described with reference to FIG. 2 showing an example of the ink jet head. The ink jet head 1 has a middle silicon substrate 62 sandwiched therebetween, a nozzle plate 63 also made of silicon on the upper side, and a borosilicate glass substrate 64 having a thermal expansion coefficient close to that of silicon on the lower side. The silicon substrate 62 is etched from its surface to form independent ink chambers (pressure generating chambers) 65 and 1.
Two common ink chambers (reservoirs) 66 and grooves functioning as ink supply passages (orifices) 67 connecting the common ink chambers 66 to the respective ink chambers 65 are formed. When these grooves are closed by the nozzle plate 63, the ink chamber 65 and the common ink chamber 66 are formed.
And an ink supply path 67 are formed.

Each ink chamber 65 is provided in the nozzle plate 63.
Ink nozzles 71 are formed at positions corresponding to the front end portions of the ink chambers 65 and communicate with the ink chambers 65. In addition, a portion of the glass substrate 64 where the common ink chamber 66 is located has an ink supply port 72 communicating therewith.
Are formed. Ink is supplied from an external ink tank (not shown) through an ink supply port 72 to the common ink chamber 6.
6. The ink supplied to the common ink chamber 66 is supplied to each independent ink chamber 65 through each ink supply path 67. Each of the ink chambers 65 has a thin bottom wall 73 and is configured to function as an elastically displaceable diaphragm.

In the glass substrate 64 located below the silicon substrate 62, the ink chamber 6 of the silicon substrate 62
A shallowly etched recess 69 is formed at a position corresponding to 5. Therefore, the bottom wall 73 of each ink chamber 65 faces the surface 74 of the glass substrate 64 in which the recess 69 is formed with a very small gap G. Each segment electrode is formed on the surface 74 of the glass substrate 64 so as to face the bottom wall 73 of each ink chamber 65.

Here, the bottom wall (vibration plate) of each ink chamber 65
73 functions as a common electrode on each ink chamber side. The surface of the bottom wall 73 of each ink chamber 65 facing the glass substrate 64 is covered with an insulating layer made of a silicon oxide film. As described above, the bottom wall 73 of each ink chamber, that is, the diaphragm (common electrode), and each segment electrode 70 are opposed to each other with the gap G and the insulating layer formed on the surface of the bottom wall 73 of the ink chamber 65 interposed therebetween. are doing.

In the ink jet head 1 configured as described above, when the driving voltage from the voltage applying means 76 is applied between the opposing electrodes, Coulomb force is generated by the electric charge charged between the opposing electrodes, and the bottom plate The (vibrating plate) 73 is bent toward the segment electrode 70, and the volume of the ink chamber 65 is increased. Next, when the drive voltage from the voltage applying means 76 is released and the electric charge between the opposing electrodes is discharged, the diaphragm 73 is restored by its elastic restoring force, and the volume of the ink chamber 65 is rapidly reduced. Due to the ink pressure generated at this time, a part of the ink filling the ink chamber 65 becomes
Ink 5 is discharged from the ink nozzle 71 communicating with No. 5 as an ink column. After ejection, the ink becomes ink droplets due to its own surface tension and lands on the printing surface. By using the ink jet head having such a configuration in each of the following embodiments, it is possible to apply the conductive fluid to a predetermined location with low noise and low power consumption.

Embodiment 1 FIG. 3 is a plan view of circuit wiring showing an example of current value control according to the first embodiment of the present invention. Here, a predetermined current value I
a of the circuit wiring 11 where a is required
a and 11b have a width (that is, a cross-sectional area) sufficient to allow a current larger than the current value Ia to flow, and a width (that is, a cross-sectional area) where only a current smaller than the current value Ia flows in the intermediate portion 11c. And keep it.

Next, the circuit in which each element having the circuit wiring 11 is incorporated is actually operated, and the circuit wiring 1
1 until the circuit performs a desired operation while measuring the current value of the intermediate unit 11c.
A conductive fluid is applied to the substrate to form a conductor, and while the width of the circuit wiring is increased, the value of the current flowing therethrough is adjusted.
The portion additionally formed in this way is the conductor extension 1
1d.

Embodiment 2 FIG. FIG. 4 is a side sectional view of a circuit wiring showing an example of current value control according to the second embodiment of the present invention. Here, a portion of the circuit wiring 12 requiring a predetermined current value Ib is previously placed on both sides of the circuit board 12 on the circuit board.
2a and 12b have a thickness (that is, a cross-sectional area) sufficient to flow a current equal to or more than the current value Ib, and a thickness (that is, a cross-sectional area) where only a current smaller than the current value Ib flows in the intermediate portion 12c. ).

Next, the circuit in which each element having the circuit wiring 12 is incorporated is actually operated, and the circuit wiring 1
While measuring the current value of No. 2, the intermediate portion 12c is moved from the inkjet head until the circuit performs a desired operation.
A conductive fluid is applied to the substrate to form a conductor, and the current flowing therethrough is adjusted while increasing the thickness of the circuit wiring. The portion additionally formed in this manner is the conductor extension 12d.

Embodiment 3 FIG. FIG. 5 is a plan view of circuit wiring showing an example of current value control according to the third embodiment of the present invention. Here, a predetermined current value I
The circuit wiring 13 of the portion where c is required
The intermediate portion 13c has a width (that is, a circuit cross-sectional area) sufficient to allow a current equal to or greater than the current value Ic to flow through the intermediate portion 13c.
To face each other.

Next, by the ink jet head system,
By applying a conductive fluid to the intermediate portion 13c and forming a conductive material thereon, the wirings 13a and 13b on both sides are connected, and a circuit in which each element having the circuit wiring 13 is incorporated is actually operated. While measuring the current value of the circuit wiring 13, a conductive fluid is sequentially applied to the intermediate portion 13c from the inkjet head until the circuit performs a desired operation, and the connection portion (that is, the connection cross-sectional area) is applied. ) While adjusting the value of the current flowing therethrough. The portions additionally formed in this manner are the conductor connection portions 13d, 13e, 1
3f.

As described above, if the current value is controlled by the method as in the above-described first to third embodiments, the circuit wiring 1 can be formed using a narrow space without generating extra dust or the like.
The current values of 1, 12, and 13 can be controlled with high accuracy. In these cases, by dividing the jet of the conductive fluid from the ink jet head into a plurality of times, the resistance value of the portion can be finely reduced, and the current value can be controlled with higher accuracy.

Embodiment 4 Here, an example in which the content of the conductive material per unit volume in the conductive fluid is changed will be described. For example, by reducing the content of the conductive material in the conductive fluid, a conductive fluid having a reduced conductivity can be produced, and the adjustment range of the current value by one application can be reduced to increase the Accurate current value control becomes possible. Conversely, by increasing the content ratio of the conductive material in the conductive fluid, a conductive fluid having an increased conductivity can be produced, and the adjustment range of the current value by one application can be increased. Thus, the efficiency of the current value control can be improved.

Therefore, in the first to third embodiments,
If the content of the conductive material per unit volume in the conductive fluid ejected from the inkjet head is changed according to the adjustment amount of the current value, the resistance value of the circuit wiring to be controlled can be adjusted to an appropriate ratio. Thus, the current value of the current flowing through the circuit can be efficiently controlled.

In this case, it is also possible to use one ejection port of the ink jet head and sequentially eject the conductive fluid from which the content of the conductive material per unit volume is changed. By jetting a plurality of conductive fluids having different contents of the conductive material per unit volume from each of the injection ports N1 to N5 of the ink jet head 1 as shown in FIG. , And the control efficiency is greatly improved.

Embodiment 5 Generally, an oxide film is often formed on a wiring surface in a circuit due to a heating process for joining elements in the circuit, and particularly, a wiring material such as solder tends to easily form an oxide film on the surface. It is in.
If this oxide film is present, even if a conductive fluid is applied on the wiring surface later, the adhesion will be insufficient, and the electrical connection at that portion may not be sufficiently achieved. Therefore, in the first to third embodiments, it is preferable to take a measure to remove the oxide film of the corresponding wiring before or simultaneously with the ejection of the conductive fluid from the inkjet head.

The oxide film can be removed by mechanical treatment such as polishing. However, if the conductive fluid contains a substance that dissolves the oxide film, for example, a reducing agent such as sulfurous acid or an alkali metal, the conductive fluid is sprayed. Occasionally, the oxide film is chemically removed, so that the adhesion between the existing circuit and the circuit additionally formed with the conductive fluid can be increased, and good electrical connection can be obtained. If one of the ejection ports N1 to N5 of the ink jet head 1 as shown in FIG. 1 is used as an ejection port dedicated to a liquid containing a substance that dissolves an oxide film, the control of the conductive fluid is performed. Injection control can be performed independently.

Embodiment 6 FIG. The conductive fluid applied by the ink jet method to form the conductor is evaporated or solidified to maintain the fluidity, and the conductive material (fine particles or the like) in the conductive fluid is applied to the circuit wiring or It is necessary to perform a process for surely fixing the toner on the circuit board and maintaining good electrical connection.

Therefore, for example, when the conductive fluid contains fine particles of the conductive material, the applied conductive fluid is heated to a temperature equal to or higher than the melting point of the conductive material to dissolve the conductive material. By vaporizing the fluid component, the conductive material is connected and solidified and fixed on the circuit wiring or the like.On the other hand, when the conductive fluid contains a conductive material heated to a melting point or higher, The applied conductive fluid is adjusted to a temperature lower than the melting point of the conductive material, and by vaporizing the fluid component, the conductive material is connected and solidified and fixed on circuit wiring or the like.

Also, a photo-curable resin that is solidified by, for example, ultraviolet light or the like is contained in the conductive fluid, and after applying the conductive fluid, the coating is irradiated with ultraviolet light or the like.
By curing and solidifying the applied conductive fluid,
The conductive material may be connected and solidified and fixed on the circuit wiring or the like. If this is used, for example, when the application of the conductive fluid by the inkjet method is not successful,
Before solidification by light irradiation, there is an advantage that the conductive fluid can be wiped off and the conductive fluid can be applied many times.

Further, in order to stably fix the applied conductive fluid on the circuit board for a long period of time, it is desirable to coat the surface of the conductive fluid with a resin or the like. In this case, if one of the injection ports N1 to N5 of the ink jet head 1 of FIG. 1 is used to jet a liquid resin for coating, thereby covering the conductive fluid applied earlier, The current value control can be efficiently performed as a whole.

Embodiment 7 FIG. Here, an example is shown in which the current value control method described in each of the above embodiments is applied to an actual device. FIG. 6 is a timepiece circuit diagram in which a hand drive motor 21 for driving a hand of a timepiece is controlled by an IC 22 driven by a battery 23. Here, the battery 23 and the IC 22 are connected by circuit wiring of a fixed width, while the pointer driving motor 21 and the IC
The intermediate portions 22 are connected by circuit wiring narrowed in advance so that the intermediate portion 24c flows a current smaller than a current to flow therethrough. Then, in the timepiece manufacturing process, after the timepiece circuit as described above is assembled, the circuit 2
A conductive fluid is applied to the intermediate portion 24c of the fourth portion by an ink-jet method, the resistance value of the portion is lowered while forming the conductive extension portion 24d, and the current required to accurately move the pointer in time is adjusted. Is adjusted until it is supplied to the pointer driving motor 21.

By doing so, it is not necessary to form an extra circuit pattern on the circuit board in the timepiece, and the size of the timepiece can be reduced. Further, since the current value control can be performed in a state close to the analog control, the timepiece can be manufactured with higher accuracy. Further, since the circuit cut pieces are not scattered inside the timepiece which is a high precision product, a highly reliable timepiece can be obtained.

FIG. 7 is a circuit diagram of a planar heating element 31 used for a heating mat or the like. Here, a large number of heating conductors each composed of a linear portion and an S-shaped curved portion are arranged between the electrodes 32 and 33 provided in parallel in the horizontal direction. And the circuit 35 cut off in the middle are alternately combined. Then, in the manufacturing process of the sheet heating element 31, after the circuit as described above was assembled, the circuit in the middle was cut off as necessary while checking the actual heating state of the sheet heating element 31. A conductive fluid is applied to the cut portion 35c of the heat-generating conductor by an ink-jet method, the resistance value is reduced while connecting the portion, and the connection circuit width is adjusted so that a current of a predetermined value flows. Averages the heat generation state.

By doing so, the temperature distribution of the planar heating element can be made uniform by a relatively simple method. Further, compared with the conventional circuit cutting method, the circuit cutting pieces are not scattered, so that the cause of short-circuiting of other circuits or the like is eliminated, and a highly reliable planar heating element can be obtained.

It should be noted that the current value control method of the present invention can be widely used not only in the clock circuit and the heating element circuit described above but also in a circuit incorporating a semiconductor element sensitive to a change in current value.

[0040]

According to the present invention having the above-described structure, the resistance value of a circuit in which a minute predetermined current needs to flow can be reduced finely without taking extra space. The value of the flowing current can be adjusted with high accuracy. Further, in the present invention, since the circuit pattern is not cut and removed, the cut circuit portion becomes dust and scatters, which causes a short circuit of other portions in the circuit or a malfunction of mechanical parts. Without fear, so
From this aspect, highly reliable current value control is possible.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a method for controlling a current value of a circuit wiring on a circuit board by an ink jet method used in an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of an inkjet head illustrating an example of an inkjet head used in each embodiment.

FIG. 3 is a plan view of circuit wiring showing an example of current value control according to the first embodiment of the present invention.

FIG. 4 is a side sectional view of a circuit wiring showing an example of current value control according to a second embodiment of the present invention.

FIG. 5 is a plan view of circuit wiring showing an example of current value control according to a third embodiment of the present invention.

FIG. 6 is a clock circuit diagram showing an application example of the present invention to an actual device.

FIG. 7 is a circuit diagram of a sheet heating element showing an application example of the present invention to an actual device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ink-jet head 2 Condition setting part N1-N5 Injection port of an ink-jet head 3 Ink-jet head control part 4 Circuit board 11 Circuit wiring 11a, 11b Both sides of circuit wiring 11c Intermediate part 11d of circuit wiring 11d, conductor extension part 12 Circuit wiring 12a, 12b Both sides of the circuit wiring 12c Middle part of the circuit wiring 12d, conductor extension part 13 Circuit wiring 13a, 13b Both sides of the circuit wiring 13c Middle parts of the circuit wiring 13d, 13e, 13f Conductor connection part 21 Pointer drive motor 22 IC 23 Battery Reference numeral 24: Circuit wiring 24c Intermediate part 24d of circuit wiring 24d, conductor extension part 25 Circuit wiring 31 Planar heating element 32, 33 Electrode 34 Heating conductor conducting between electrodes 35 Heating conductor not conducting between electrodes 35 35c Cutting part of heating conductor

Claims (13)

[Claims]
1. A current value control method for setting a current value between circuits to a predetermined value, comprising: a step of measuring a current value between the circuits in advance; A method of forming a conductor by injecting a conductive fluid by an inkjet method so as to obtain a value.
2. The method of controlling a current value according to claim 1, wherein the application amount of the conductive fluid is adjusted based on a measurement result obtained by measuring a current value between the circuits.
3. The current value control method according to claim 1, wherein the number of times of injection of the conductive fluid is controlled based on a measurement result obtained by measuring a current value between the circuits.
4. The method according to claim 1, wherein the conductive fluid contains a conductive material, and a current value between the circuits is adjusted by a plurality of conductive fluids having different contents of the conductive material. The method for controlling a current value according to claim 1, wherein
5. The method of controlling a current value according to claim 1, wherein the applied conductive fluid is solidified by temperature control to form the conductive material.
6. The method for controlling a current value according to claim 1, wherein a protective film is formed on the conductor.
7. A method of manufacturing a circuit board on which wiring is formed, comprising: a step of measuring a current value between the wirings in advance; and an ink jet method so that the current value between the wirings becomes a predetermined value. Forming a conductor by injecting a conductive fluid by the method according to claim 1. A method for manufacturing a circuit board, comprising:
8. A current value control device having at least an ink jet head for ejecting a conductive fluid and a measuring device for measuring a current value, wherein the current measured by the measuring device is Current value control, comprising: a control unit that determines an injection amount of the conductive fluid based on a value, and injects the conductive fluid from the inkjet head based on information from the control unit. apparatus.
9. The current value control device according to claim 8, wherein the conductive fluid contains a substance that dissolves an oxide film.
10. The current value control device according to claim 9, wherein an ejection port for ejecting a conductive fluid containing a substance that dissolves an oxide film is formed in the ink jet head.
11. The current value control device according to claim 8, wherein the conductive fluid contains a photo-curing material.
12. The conductive fluid contains a conductive material, and includes a plurality of types of conductive fluids having different contents of the conductive material. 9. An ejection port for ejection is formed in the ink jet head for each type.
The current value control device as described in the above.
13. The current value control device according to claim 8, further comprising means for forming a protective film on said conductor.
JP2000135447A 2000-05-09 2000-05-09 Circuit current value control method, circuit formation method, timepiece, and semiconductor element Expired - Fee Related JP3724328B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000135447A JP3724328B2 (en) 2000-05-09 2000-05-09 Circuit current value control method, circuit formation method, timepiece, and semiconductor element

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072319A (en) * 2003-08-26 2005-03-17 Mitsubishi Electric Corp Method and device for evaluating and preparing microwave integrated circuit
WO2013027781A1 (en) * 2011-08-19 2013-02-28 Fujifilm Corporation Conductive pattern, method for forming the same, printed wiring board, and manufacturing method of the same
JP2013042098A (en) * 2011-08-19 2013-02-28 Fujifilm Corp Conductive pattern, method for forming the same, printed board and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072319A (en) * 2003-08-26 2005-03-17 Mitsubishi Electric Corp Method and device for evaluating and preparing microwave integrated circuit
WO2013027781A1 (en) * 2011-08-19 2013-02-28 Fujifilm Corporation Conductive pattern, method for forming the same, printed wiring board, and manufacturing method of the same
JP2013042098A (en) * 2011-08-19 2013-02-28 Fujifilm Corp Conductive pattern, method for forming the same, printed board and method for manufacturing the same

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