JP2001302046A - Film carrier tape and its recognition device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To reduce the thickness of a film carrier tape in recent years, a warp occurs in a peripheral portion of the film carrier tape in a suction state during conveyance, and the film carrier tape is used for recognizing a position of an alignment mark of the film carrier tape. There has been a problem that the angle of reflection of the light from the lighting device changes, and the light from the lighting device reflects on the recognition device, making it impossible to recognize the position of the film carrier tape with high accuracy. SOLUTION: By forming a cross-shaped alignment mark 14 on the surface of a metal coating 12 on both sides of a film carrier tape 10, the width of the metal coating 12 is increased and the warpage of the film carrier tape 10 is reduced. Stabilizes the direction of the reflected light.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier tape for stably recognizing the position of a film carrier tape and a device for recognizing the same.

[0002]

2. Description of the Related Art Conventionally, a film carrier tape has been transported by inserting a transport sprocket pin into a sprocket transport hole of the film carrier tape to perform a feed operation for each pitch. In sprocket transport, a gap is provided by making the diameter of the sprocket transport hole larger than the diameter of the transport sprocket pin, so that the positioning accuracy in transport is limited. For this reason, in order to accurately align the position of the film carrier tape conveyed by the sprocket, the recognition device recognizes the position of the film carrier tape,
On the basis of the displacement data obtained by the recognition, the position of the film carrier tape or the suction device of the recognition device is corrected to perform accurate positioning.

Next, a conventional carry tape and its recognition device will be described with reference to FIGS. 4, 5 and 6. FIG.

FIG. 4 is a plan view showing a conventional film carrier tape. FIG. 5 is a perspective view showing a conventional suction machine for sucking and fixing a film carrier tape.
FIG. 6 is a diagram showing a recognition device that recognizes the position of the film carrier tape by sucking the film carrier tape by the suction machine.

[0005] As shown in FIG. 4, a plurality of semiconductor elements 2 are provided on a film carrier tape 1, and a metal layer other than each alignment mark 3 and metal coating 4 is
It has been removed by etching. The alignment marks 3 are located in the vicinity of each semiconductor element 2 and have the same positional relationship with each semiconductor element 2 and the corresponding alignment mark 3. The metal coatings 4 are provided at both ends of the film carrier tape 1 along the feeding direction, and the alignment marks 3 are formed at positions closer to the semiconductor element 2 than the metal coatings 4.

[0006] Next, as shown in FIGS. 4 and 5, the suction machine 5 has a suction hole 6 at a position facing the semiconductor element 2.
Is provided.

As shown in FIGS. 4 and 6, only the portion of the semiconductor element 2 mounted on the film carrier tape 7 is suctioned by the suction device 5, and the surface of the film carrier tape 7 is cleaned by the illumination device 8. While keeping the brightness constant, the position of the alignment mark is recognized using the recognition camera 9 and the alignment of the film carrier tape 7 is performed.

[0008]

However, due to recent changes in mounting methods, film carrier tapes are becoming thinner, and the flexibility of the film carrier tape itself is greater than that of conventional film carrier tapes. ing.

As shown in FIG. 6, in an inspection handler for performing a characteristic test of a semiconductor device (not shown) mounted on the film carrier tape 7, the film carrier tape 7 is disposed on the bottom side of the transport section and transported. However, warping of the film carrier tape 7 occurs due to the weight of the film carrier tape 7. If warpage occurs in the film carrier tape 7 when recognizing the position of the film carrier tape 7, the light of the illumination device used for recognizing the position of the film carrier tape 7 is located at the alignment mark of the film carrier tape 7. The angle of reflection of the film carrier tape changes, and depending on the size of the warp of the film carrier tape 7, the light of the illumination device is almost totally reflected and enters the recognition camera 9, making it difficult to recognize the position of the film carrier tape with high accuracy. There was a problem of becoming.

An object of the present invention is to provide a film carrier tape for recognizing an accurate position of a film carrier tape by suppressing a warp of the film carrier tape which is a factor of reducing recognition accuracy, and a recognition device therefor. Aim.

[0011]

In order to solve the above-mentioned conventional problems, a film carrier tape of the present invention is a film carrier tape for carrying semiconductor elements, wherein a metal coating is formed on a part of the surface of the film carrier tape. Is formed, and a part of the metal film is removed as an alignment mark.

By using such a film carrier tape, a fine alignment mark is formed on the metal film as compared with a conventional film carrier tape having the same width. As a result, the area of the metal film is reduced. Since it is possible to increase the rigidity of the film carrier tape, it is possible to reduce the warpage of the film carrier tape near the alignment mark. Therefore, the direction of the reflected light of the illumination used for recognizing the position of the alignment mark of the film carrier tape is stable, and the recognition of the position of the film carrier tape can be performed stably.

The film carrier tape recognizing device of the present invention is a recognizing device for positioning a film carrier tape, and has a suction hole for sucking a portion of an alignment mark formed on the film carrier tape.

By using such an apparatus for recognizing a film carrier tape, when the position of the film carrier tape is recognized, the alignment mark portion of the film carrier tape is sucked with a vacuum. Since the warp can be reduced and the direction of the reflected light of the optical system for recognizing the position of the alignment mark is stabilized, the position of the film carrier tape can be recognized stably.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the film carrier tape of the present invention and an apparatus for recognizing the same will be described below with reference to the drawings.

First, the film carrier tape of this embodiment will be described with reference to FIG.

FIG. 1 is a plan view showing a film carrier tape of the present embodiment.

As shown in FIG. 1, a semiconductor element 11 is provided on a film carrier tape 10, and a metal film 12 on the surface of the film carrier tape 10 has
A sprocket carrying hole 13 and a cross-shaped alignment mark 14 are formed. Cross-shaped alignment mark 14
Is formed by removing the cross shape from the metal coating 12 by etching from a state where the entire surface of the film carrier tape 10 before processing is coated with copper or the like.

Therefore, the width of the metal film 12 shown in FIG. 1 is smaller than that of the conventional metal film 4 formed only on the portion near the both ends of the film carrier tape 1 as shown in FIG. Is increased, and the rigidity of the film carrier tape 10 is increased, so that warpage is less likely to occur at the position of the cross-shaped alignment mark 14 for positioning the film carrier tape 10,
The direction of the reflected light of the recognition optical system on the surface of the film carrier tape 10 is stabilized, so that the film carrier tape 10 can be reliably recognized. The shape of the alignment mark 14 is not particularly limited as long as it can be recognized by a recognition device. In addition to the cross shape, a shape obtained by combining a circle, a polygon, and a straight line may be used. Size is 100-150μ
m. Further, in the present embodiment, the metal coating 12 is plated with tin in copper, but is not particularly limited as long as the conductivity and durability are equal to or higher than those of the present embodiment.

Next, an apparatus for recognizing a film carrier tape according to this embodiment will be described with reference to FIGS.

FIG. 2 shows a film carrier tape 15,
FIG. 2 is a diagram illustrating an attraction device 16 that absorbs a film carrier tape 15. FIG. 3 is a diagram illustrating a recognition device that performs recognition while transporting the film carrier tape 15.

As shown in FIG. 2, a suction device 16 for sucking the film carrier tape 15 has a first suction hole 18 at a position facing the semiconductor element 17 and a suction hole 16 formed on the surface of the film carrier tape 15. A second suction hole 20 is provided at a position facing the alignment mark 19 that is located. The suction of the film carrier tape 15 by the suction device 16 allows the portion of the alignment mark 19 to be reliably sucked, so that the warpage of the film carrier tape 15 can be prevented and the recognition of the alignment mark 19 can be prevented. The direction of the reflected light of the optical system is stabilized, and the position of the film carrier tape 15 can be stably recognized.

Next, as shown in FIGS. 2 and 3, a sprocket 21 having a sprocket pin inserted into a sprocket carrying hole formed in the film carrier tape 15 is mounted on the film carrier tape 15. In a state where a rotational movement for sending the element 17 at every pitch is possible, a step of performing recognition and inspection is interposed.
Two are fixed to the recognition device. Further, the alignment mark 19 formed on the film carrier tape 15 is used.
An illumination device 22 for maintaining a constant brightness of the image and a recognition camera 23 for recognizing the alignment mark 19 are provided to face the alignment mark 19. Then, a probe pin 24 that contacts the electrode of each semiconductor element 17 corresponding to each alignment mark 19 whose recognition has been completed, and a measurement prober 25 that determines an electric signal input from the probe pin 24 faces the film carrier tape 15. It is arranged. With such a configuration of the film carrier tape recognizing device, while the semiconductor elements 17 are sent at every pitch, the recognition of the alignment marks 19 and the position correction of the film carrier tape 15 are sequentially performed, and the probe pins for the electrodes of the semiconductor elements 17 It is possible to perform a continuous inspection of the semiconductor element by performing the inspection by the contact of 24.

Also, as a feature of this embodiment, the recognition device is provided with a suction machine having a suction hole for sucking the alignment mark 19 at a position facing the recognition camera 23 with the film carrier tape 15 interposed therebetween. So
It is possible to achieve a highly accurate and stable inspection without warping of the film carrier tape 15.

Next, as shown in FIGS. 2 and 3, the operation of each unit of the recognition device will be described. After the film carrier tape 15 is pitch-fed by the rotational movement of the sprocket 21, the portion of the semiconductor element 17 is sucked in the first suction hole 18 by using a vacuum force, and at the same time, the alignment of the film carrier tape 15 is performed. The mark 19 is also vacuum-sucked in the second suction hole 20 facing the alignment mark 19 to reduce the warpage of the film carrier tape 15. Thereafter, the illumination device 22 keeps the surface of the film carrier tape 15 at a constant brightness, and uses the recognition camera 22 to recognize the alignment mark 19 and
Recognize the position of. As described above, the position of the film carrier tape 15 is corrected based on the position shift measurement result obtained by the position recognition by the recognition device that also performs the inspection and the transport of the semiconductor element 17 at the same time, and then the semiconductor device 17 is mounted on the film carrier tape 15. The probe pins 24 are pressed against the electrode portions of the semiconductor element 17 thus performed, and an electrical characteristic test of the semiconductor element 17 is executed. When the electrical characteristics inspection of the semiconductor element 17 is completed, the vacuum suction of the first suction hole 18 and the second suction hole 20 is released, and the film carrier tape 15 is retracted from a position facing the measurement prober 25. 21 is rotated to perform pitch feed, and the process proceeds to the next measurement cycle. As described above, the recognition of the film carrier tape 15 is performed using the recognition device including the suction device 16, so that the film carrier tape 15 can be accurately recognized.

[0026]

As described above, according to the film carrier tape of the present invention and the apparatus for recognizing the same, even if the film carrier tape itself has high flexibility, a film carrier tape having a structure in which a large amount of the metal coating near the alignment mark remains is used. Therefore, it is possible to suppress a decrease in the rigidity of the film carrier tape, so that it is possible to reduce the warpage of the film carrier tape, and since the direction of the reflected light of the recognition optical system in the recognition of the position of the film carrier tape is stabilized, Can be recognized stably.

Also, by using a recognition device having a suction device provided with a suction hole for vacuum suction of the alignment mark portion of the film carrier tape, even if the flexibility of the film carrier tape is high, the recognition of the film carrier tape can be improved. By vacuum-sucking the vicinity of the alignment mark to the suction machine, it is possible to reduce the warpage of the film carrier tape, and the direction of the reflected light of the recognition optical system at the recognition position of the film carrier tape is stabilized. Can be stably recognized.

[Brief description of the drawings]

FIG. 1 is a plan view showing a film carrier tape according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a suction machine and a film carrier tape according to an embodiment of the present invention.

FIG. 3 is a schematic diagram showing a film carrier tape recognition device of the present invention.

FIG. 4 is a plan view showing a conventional film carrier tape.

FIG. 5 is a perspective view showing a conventional film carrier tape suction machine.

FIG. 6 is a schematic view showing a conventional suction machine and a film carrier tape.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Film carrier tape 2 Semiconductor element 3 Alignment mark 4 Metal film 5 Suction machine 6 Suction hole 7 Film carrier tape 8 Illumination device 9 Recognition camera 10 Film carrier tape 11 Semiconductor element 12 Metal film 13 Sprocket carrying hole 14 Cross alignment mark 15 Film carrier tape 16 Suction machine 17 Semiconductor element 18 First suction hole 19 Alignment mark 20 Second suction hole 21 Sprocket 22 Illumination device 23 Recognition camera 24 Probe pin 25 Measurement prober

Claims (2)

[Claims] 1. A film carrier tape for transporting semiconductor elements, wherein a metal film is formed on a part of the surface of the film carrier tape, and a part of the metal film is removed as an alignment mark. A film carrier tape characterized by the following. 2. A recognition device for positioning a film carrier tape, comprising: a suction machine having a suction hole for sucking a portion of an alignment mark formed on the film carrier tape. Recognition device.