JP2001270113A - Ink-jet recording head and ink-jet recorder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink-jet recording head and an ink-jet recorder which prevent crosstalks among pressure generation chambers and suppress a decrease of a quantity of displacement of a diaphragm. SOLUTION: This ink-jet recording head has a channel form substrate 10 in which pressure generation chambers 12 communicating with nozzle openings are defined by a plurality of partition walls 11, and piezoelectric elements 300 set to regions corresponding to the pressure generation chambers 12 via the diaphragm constituting part of the pressure generation chambers 12 for generating a pressure change in the pressure generation chambers 12. There are formed slit parts 15 and storage parts 16 to regions opposite to the partition walls 11 of the channel form substrate 10. The slits parts 15 defined to the diaphragm communicate with at least one end parts of a breadth direction of the pressure generation chambers 12. The storage parts 16 formed to regions corresponding to peripheral walls of the pressure generation chambers 12 communicate with the slit parts 15 via communication passages. The ink in the slit parts 15 is thus made fluid.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure generating chamber which communicates with a nozzle opening for discharging ink droplets, which is constituted by a vibrating plate. TECHNICAL FIELD The present invention relates to an ink jet recording head and an ink jet recording apparatus for ejecting ink droplets by means of a printer.

[0002]

2. Description of the Related Art A part of a pressure generating chamber communicating with a nozzle opening for discharging ink droplets is constituted by a vibrating plate, and the vibrating plate is deformed by a piezoelectric element to pressurize the ink in the pressure generating chamber to pass the nozzle opening. Two types of ink jet recording heads that eject ink droplets have been commercialized, one using a longitudinal vibration mode piezoelectric actuator that expands and contracts in the axial direction of the piezoelectric element, and the other using a flexural vibration mode piezoelectric actuator. ing.

In the former method, the volume of the pressure generating chamber can be changed by bringing the end face of the piezoelectric element into contact with the diaphragm, so that a head suitable for high-density printing can be manufactured. There is a problem in that a difficult process of cutting into a comb shape in accordance with the arrangement pitch of the openings and an operation of positioning and fixing the cut piezoelectric element in the pressure generating chamber are required, and the manufacturing process is complicated.

On the other hand, in the latter, a piezoelectric element can be formed on a diaphragm by a relatively simple process of sticking a green sheet of a piezoelectric material according to the shape of a pressure generating chamber and firing the green sheet. In addition, there is a problem that a certain area is required due to the use of flexural vibration, and that high-density arrangement is difficult.

On the other hand, in order to solve the latter disadvantage of the recording head, a uniform piezoelectric material layer is formed by a film forming technique over the entire surface of the diaphragm as disclosed in Japanese Patent Application Laid-Open No. 5-286131. A proposal has been made in which the piezoelectric material layer is cut into a shape corresponding to the pressure generating chambers by a lithography method, and a piezoelectric element is formed so as to be independent for each pressure generating chamber.

This eliminates the need for attaching the piezoelectric element to the vibration plate, which not only allows the piezoelectric element to be manufactured by a precise and simple method such as lithography, but also reduces the thickness of the piezoelectric element. There is an advantage that it can be made thin and can be driven at high speed.

[0007]

However, when the pressure generating chambers are arranged at a high density, the rigidity of the partition walls becomes insufficient due to the small thickness of the partition walls between the pressure generating chambers, and the pressure generating chambers between the pressure generating chambers are arranged at a high density. There is a problem that crosstalk occurs.

In order to solve such a problem, for example, in a piezoelectric actuator of a longitudinal vibration mode, a wide portion is provided on the diaphragm side of the pressure generating chamber, and the width of the pressure generating chamber in other portions is reduced. A structure in which the thickness of the partition wall is increased has been considered. However, in such a structure, there is a problem that since the ink in the wide portion has no fluidity, deformation of the diaphragm due to driving of the piezoelectric element is hindered, and sufficient displacement cannot be obtained.

The present invention has been made in view of the above circumstances, and provides an ink jet recording head and an ink jet recording apparatus which prevent crosstalk between pressure generating chambers and suppress a decrease in displacement of a diaphragm. Make it an issue.

[0010]

According to a first aspect of the present invention, there is provided a flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening is defined by a plurality of partition walls; A piezoelectric element provided in a region corresponding to the pressure generating chamber via a vibration plate constituting a part of the piezoelectric generating member to generate a pressure change in the pressure generating chamber. A slit portion defined between the diaphragm in a region facing the partition wall and communicating with at least one widthwise side of the pressure generating chamber; and a slit formed in a region corresponding to a peripheral wall of the pressure generating chamber. An ink jet type recording head having a storage portion communicating with the slit portion via a passage.

In the first aspect, since the thickness of the partition wall between the pressure generating chambers can be increased, the rigidity can be increased, and the ink in the slit portion is made to flow by the storage portion, so that the piezoelectricity can be increased. The displacement of the diaphragm due to the driving of the element is not hindered.

According to a second aspect of the present invention, there is provided the ink jet recording head according to the first aspect, wherein the slit portion extends to the outside in the width direction of the piezoelectric element.

In the second aspect, since the flow path forming substrate does not exist below the piezoelectric element, the displacement of the diaphragm by driving is facilitated.

According to a third aspect of the present invention, in the first or second aspect, a depth of the slit portion in a thickness direction of the flow path forming substrate is 0.5 to 10 μm. In the ink jet recording head.

[0015] In the third aspect, the rejected volume can be increased without increasing the volume of the pressure generating chamber.
The ink ejection efficiency is improved.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the slit portion communicates with a longitudinal end of the pressure generating chamber. In the recording head.

In the fourth aspect, the displacement of the diaphragm near the longitudinal end of the pressure generating chamber increases.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the storage section is provided commonly to at least two or more pressure generating chambers. In the recording head.

In the fifth aspect, even when the storage section is provided in common for a plurality of pressure generating chambers, the ink in each slit section surely has fluidity.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects, the storage section is provided on the nozzle opening side of the pressure generating chamber. In the head.

In the sixth aspect, the change in the pressure of the ink at the time of discharging the ink is more effectively absorbed.

According to a seventh aspect of the present invention, in any one of the first to fifth aspects, the storage section is provided in a region facing a partition partitioning the pressure generating chamber. In the ink jet recording head.

In the seventh aspect, an area for forming a storage section is newly provided on the flow path forming substrate, and there is no need to increase the size of the head.

According to an eighth aspect of the present invention, in any one of the fifth to seventh aspects, a reservoir for supplying ink to each of the pressure generating chambers is formed in the flow path forming substrate, and the reservoir is provided with the reservoir. The ink jet recording head is characterized in that it also serves as a part.

In the eighth aspect, the ink in the slit portion has fluidity, the ink can be easily supplied from the reservoir to the pressure generation chamber, and the shortage of the ink supply portion to the pressure generation chamber can be solved.

According to a ninth aspect of the present invention, in any one of the first to eighth aspects, at least a part of the storage section is sealed with a flexible member having flexibility. Ink-jet recording head.

In the ninth aspect, the fluidity of the ink can be further improved by the flexible member, and the displacement of the diaphragm can be more reliably increased.

According to a tenth aspect of the present invention, in any one of the first to ninth aspects, the pressure generating chamber is formed on a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed of a thin film and a lithography. An ink jet recording head characterized by being formed by a method.

According to the tenth aspect, an ink jet recording head having high-density nozzle openings can be manufactured in a large amount and relatively easily.

An eleventh aspect of the present invention is an ink jet recording apparatus comprising the ink jet recording head according to any one of the first to tenth aspects.

According to the eleventh aspect, it is possible to realize an ink jet recording apparatus having improved head characteristics.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on embodiments.

(Embodiment 1) FIG. 1 is an exploded perspective view showing an ink jet recording head according to Embodiment 1 of the present invention. FIG. 2 is a plan view of the ink jet recording head and one pressure generating chamber. It is a figure showing the section structure in the longitudinal direction.

As shown in the figure, the flow path forming substrate 10 is a single crystal silicon substrate having a plane orientation (110) in this embodiment. As the flow path forming substrate 10, usually 150 to 3
A thickness of about 00 μm is used.
Those having a thickness of about 0 to 280 μm, more preferably about 220 μm are suitable. This is because the arrangement density can be increased while maintaining the rigidity of the partition wall between the adjacent pressure generating chambers.

In this flow path forming substrate, pressure generating chambers 12 partitioned by a plurality of partition walls 11 are arranged side by side in the width direction by, for example, anisotropic etching. Also,
At one end in the longitudinal direction of each pressure generating chamber 12, a reservoir 13 serving as a common ink chamber for each pressure generating chamber 12 is formed,
Each of the pressure generating chambers 12 is communicated with one longitudinal end thereof via an ink supply path 14.

On one side of the flow path forming substrate 10,
For example, zirconium oxide (ZrO) _Two) Etc. from the insulating layer
The elastic film 50 having a thickness of 1 to 2 μm is provided.
One surface constitutes one wall surface of the pressure generating chamber 12. What
On the other surface side of the flow path forming substrate 10, the same as the elastic film 50
When forming the pressure generating chamber 12 and the like.
A protective film 55 serving as a mask is provided.

Further, the elastic film 5 of the flow path forming substrate 10
In the region corresponding to each partition 11 on the 0-side surface, for example, a slit portion 15 communicating with each pressure generating chamber 12 is provided by performing anisotropic etching similarly to the pressure generating chamber 12. Further, in a region corresponding to the peripheral wall of the pressure generating chamber 12 on the side opposite to the reservoir 13, each slit portion 15 is provided.
A storage section 16 for storing a fixed amount of ink or the like is formed for each time, and is connected to each slit section 15 via a communication path 17.

On the other hand, on the protective film 55 on the other surface side of the flow path forming substrate 10, the nozzle plate 20 having the nozzle opening 21 communicating with the pressure supply chamber 12 on the opposite side to the ink supply path 14 is formed. Are fixed via an adhesive or a heat-sealing film. The nozzle plate 20 has a thickness of, for example, 0.1 to 1 mm and a linear expansion coefficient of 300 ° C. or less.
For example, it is made of glass ceramics having a temperature of 2.5 to 4.5 [× 10 ⁻⁶ / ° C.] or non-rusting steel. The nozzle plate 20 entirely covers one surface of the flow path forming substrate 10 on one surface, and also serves as a reinforcing plate for protecting the silicon single crystal substrate from impact and external force. Further, the nozzle plate 20 may be formed of a material having substantially the same thermal expansion coefficient as that of the flow path forming substrate 10. In this case, since the deformation of the flow path forming substrate 10 and the nozzle plate 20 due to heat become substantially the same, it is possible to easily join them using a thermosetting adhesive or the like.

Here, the size of the pressure generating chamber 12 for applying the ink droplet ejection pressure to the ink and the size of the nozzle opening 21 for ejecting the ink droplet depend on the amount of the ejected ink droplet, the ejection speed, and the ejection frequency. Optimized. For example,
When recording 360 ink droplets per inch, the nozzle openings 21 need to be formed with a diameter of several tens of μm with high accuracy.

The lower electrode film 60 having a thickness of, for example, about 0.5 μm and the piezoelectric layer 70 having a thickness of, for example, about 1 μm are formed on the elastic film 50 provided on the flow path forming substrate 10. The upper electrode film 80 having a thickness of, for example, about 0.1 μm is formed by lamination in a process described later to form the piezoelectric element 300. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. In general, one of the electrodes of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each of the pressure generating chambers 12. Here, a portion which is constituted by one of the patterned electrodes and the piezoelectric layer 70 and in which a piezoelectric strain is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the lower electrode film 60 is used as a common electrode of the piezoelectric element 300, and the upper electrode film 80 is used as an individual electrode of the piezoelectric element 300. In any case, the piezoelectric active portion is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and the elastic film whose displacement is generated by driving the piezoelectric element 300 are collectively referred to as a piezoelectric actuator.

Here, the manufacturing process of the ink jet recording head of this embodiment, in particular, the process of forming the pressure generating chamber 12 and the like in the flow path forming substrate 10 and the piezoelectric element 300 in the region corresponding to the pressure generating chamber 12 The step of forming will be described. 3 to 5 are cross-sectional views of the pressure generating chamber 12 in the longitudinal direction.

First, as shown in FIG. 3A, anisotropic etching is performed from one side of a silicon single crystal plate serving as the flow path forming substrate 10 using a mask having a predetermined shape made of, for example, silicon oxide. By doing so, a slit portion 15, a storage portion 16, and a communication passage 17 that communicates these are formed in a region to be each pressure generating chamber 12.

Next, as shown in FIG. 3B, the sacrifice layer 100 is filled in the slit portion 15, the storage portion 16, and the communication passage 17 formed in the flow path forming substrate 10. For example, in the present embodiment, the sacrificial layer 10 is formed over the entire surface of the flow path forming substrate 10.
0 is formed with substantially the same thickness as the depth of the slit portion 15,
The sacrifice layer 100 other than the slit portion 15, the storage portion 16, and the communication passage 17 is formed by chemical mechanical polishing (CM).
P).

The material of the sacrificial layer 100 is not particularly limited. For example, polysilicon or phosphorus-doped silicon oxide (PSG) may be used. In this embodiment, PSG having a relatively high etching rate is used. .

The method of forming the sacrificial layer 100 is not particularly limited. For example, ultrafine particles of 1 μm or less
A method called a gas deposition method or a jet molding method in which a film is formed by colliding with a substrate at high speed by the pressure of a gas such as e) may be used. According to this method, the sacrifice layer 100 can be partially formed only in a region corresponding to the slit portion 15, the storage portion 16, and the communication path 17.

Next, as shown in FIG. 3C, an elastic film 50 and a protective film 55 are formed on both surfaces of the flow path forming substrate 10. For example, in this embodiment, after the zirconium layers are formed on both surfaces of the flow path forming substrate 10, the elastic film 50 and the protective film 55 made of zirconium oxide are thermally oxidized in a diffusion furnace at 500 to 1200 ° C.

Next, a piezoelectric element 300 is formed on the elastic film 50 corresponding to each pressure generating chamber 12.

The steps for forming the piezoelectric element 300 include:
First, as shown in FIG. 4A, a lower electrode film 60 is formed on the elastic film 50 by sputtering. This lower electrode film 60
Platinum, iridium, and the like are preferable as the material. This is because it is necessary to crystallize a piezoelectric layer 70 described later, which is formed by a sputtering method or a sol-gel method, by firing at a temperature of about 600 to 1000 ° C. in an air atmosphere or an oxygen atmosphere after the film formation. Because. That is, the lower electrode film 60
The material must be able to maintain conductivity under such high temperature and oxidizing atmosphere. In particular, when lead zirconate titanate (PZT) is used for the piezoelectric layer 70, the diffusion of lead oxide It is desirable that there is little change in conductivity due to Pt, and for these reasons, platinum and iridium are preferred.

Next, as shown in FIG. 4B, a piezoelectric layer 70 is formed. For example, in the present embodiment, a so-called sol in which a metal organic material is dissolved and dispersed in a catalyst is applied and dried to form a gel, and then fired at a high temperature to obtain a piezoelectric layer 70 made of a metal oxide. Formed by using As a material for the piezoelectric layer 70, a PZT-based material is suitable when used in an ink jet recording head. The method for forming the piezoelectric layer 70 is not particularly limited. For example, the piezoelectric layer 70 may be formed by a spin coating method such as a sputtering method or a MOD method (organic metal thermal coating decomposition method).

Further, a method of forming a precursor film of lead zirconate titanate by a sol-gel method, a sputtering method, a MOD method, or the like, and then growing the crystals at a low temperature by a high-pressure treatment method in an alkaline aqueous solution may be used. Good.

In any case, unlike the bulk piezoelectric material, the crystal is preferentially oriented in the piezoelectric layer 70 formed in this way, and in the present embodiment, the piezoelectric layer 70 is It is formed in a column shape. Note that the preferential orientation refers to a state in which a crystal orientation direction is not disordered and a specific crystal plane is oriented in a substantially constant direction. In addition, a crystal having a columnar thin film refers to a state in which substantially columnar crystals are gathered in a plane direction with their central axes substantially aligned in the thickness direction to form a thin film. Of course, it may be a thin film formed of preferentially oriented granular crystals. The thickness of the piezoelectric layer manufactured in the thin film process is generally 0.2 to 5 μm.

Next, as shown in FIG. 4C, an upper electrode film 80 is formed. The upper electrode film 80 only needs to be a material having high conductivity, and can use many metals such as aluminum, gold, nickel, and platinum, and a conductive oxide. In the present embodiment, platinum is formed by sputtering.

Next, as shown in FIG. 4D, the piezoelectric element 300 is patterned by etching only the piezoelectric layer 70 and the upper electrode film 80. In the present embodiment,
At the same time, the protective film 55 is patterned to
2. A through hole 55a is formed in a region corresponding to the reservoir 13 and the ink supply path 14.

Next, as shown in FIG. 5A, from the surface of the flow path forming substrate 10 opposite to the elastic film 50, the protective film 55 is formed.
Pressure generation chamber 12 and reservoir 13 by performing anisotropic etching, for example, wet etching using
And the ink supply path 14 is formed.

Here, in the anisotropic etching, when the silicon single crystal substrate is immersed in an alkaline solution such as KOH, the substrate is gradually eroded, and the first (111) plane perpendicular to the (110) plane and the first (111) plane are formed. A second (1) which forms an angle of about 70 degrees with the (111) plane and forms an angle of about 35 degrees with the (110) plane.
11) plane, and the etching rate of the (111) plane is about 1/1 compared to the etching rate of the (110) plane.
This is performed using the property of being 80.
By such anisotropic etching, two first (11
Precision processing can be performed based on depth processing of a parallelogram formed by the 1) plane and two oblique second (111) planes, and the pressure generating chambers 12 can be arranged at high density. it can.

In this embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane, and the short side is formed by the second (111) plane. The pressure generating chamber 12 is provided on the flow path forming substrate 1.
It is formed by etching until it reaches the elastic film 50 almost through 0. Here, the elastic film 50 is
The amount attacked by the alkaline solution for etching the silicon single crystal substrate is extremely small. Each of the ink supply passages 14 communicating with one end of each of the pressure generating chambers 12 is formed shallower than the pressure generating chambers 12 and maintains a constant flow resistance of the ink flowing into the pressure generating chambers 12. That is, the ink supply path 14 is formed by partially etching (half-etching) the silicon single crystal substrate in the thickness direction. Note that the half etching is performed by adjusting the etching time.

Thereafter, as shown in FIG. 5B, the sacrifice layer 100 in the slit portion 15, the storage portion 16 and the communication path 17 is removed by wet etching or vapor etching through the pressure generating chamber 12. In this embodiment,
Since PSG is used as the material of the sacrificial layer 100,
Etching was performed using a hydrofluoric acid aqueous solution. When polysilicon is used, etching can be performed with a mixed aqueous solution of hydrofluoric acid and nitric acid or an aqueous solution of potassium hydroxide.

Through the steps described above, the pressure generating chamber 12, the piezoelectric element 300, and the like are formed. In the above-described series of film formation and anisotropic etching, a large number of chips are simultaneously formed on one wafer, and after the process,
Is divided for each flow path forming substrate 10 of one chip size as shown in FIG. Further, the divided flow path forming substrate 10 is adhered and integrated with the nozzle plate 20 to form an ink jet recording head. Then, it is fixed to a holder or the like (not shown), mounted on a carriage, and incorporated in an ink jet recording apparatus.

The ink jet recording head of this embodiment manufactured as described above takes in ink from an external ink supply means (not shown) into the reservoir 13 and fills the interior from the reservoir 13 to the nozzle opening 21 with ink. Thereafter, in accordance with a recording signal output via an external drive circuit (not shown), each of the piezoelectric elements 300 corresponding to the pressure generating chamber 12, namely, the lower electrode film 60 and the upper electrode film 8
By applying a voltage between 0 and 0 to bend and deform the elastic film 50, the lower electrode film 60, and the piezoelectric layer 70, the pressure in each pressure generating chamber 12 increases, and ink droplets are ejected from the nozzle openings 21.

FIG. 6 is a plan view and a cross-sectional view showing a main part of the ink jet recording head of this embodiment manufactured as described above.

As shown in FIG. 6, in the present embodiment, a slit portion 15 communicating with both sides in the width direction of each pressure generating chamber 12 is provided in a region facing the partition 11 which partitions the pressure generating chamber 12.
Is, for example, at a depth of 0.5 to 10 μm,
2 are formed over the longitudinal direction. In the region corresponding to the peripheral wall in the longitudinal direction of the pressure generating chamber 12, in this embodiment, the region corresponding to the peripheral wall on the nozzle opening 21 side, a plurality of slits 15 are provided between the pressure generating chamber 12 and the elastic film 50. A storage section 16 is defined, and each storage section 16 is communicated with each slit section 15 via a communication path 17.

A piezoelectric element 300 including a lower electrode layer 60, a piezoelectric layer 70, and an upper electrode film 80 is provided in a region corresponding to the pressure generating chamber 12, and is provided in a region facing the slit portion 15 and on the peripheral wall. The piezoelectric layer 70
Further, a piezoelectric active portion 320 which is a substantial driving portion including the upper electrode film 80 is formed. That is, the slit portion 15 extends to the outside in the width direction of the piezoelectric element 300.

In such a configuration, since the width of the partition 11 between the pressure generating chambers 12 can be increased and the rigidity can be sufficiently increased, the crosstalk can be prevented and the ink discharge characteristics can be improved. Further, in the present embodiment, since the depth of the slit portion 15 is formed relatively small, the partition wall 11 is formed.
Crosstalk can be reliably prevented without lowering the rigidity of the device. In addition, by providing the slit portion 15, the volume of the ink generated by driving the piezoelectric element 300 can be increased without increasing the volume of the pressure generating chamber 12, that is, without increasing the ink compliance. The ink ejection efficiency can be improved.

Since the storage section 16 communicates with the slit section 15 through the communication path 17, the slit section 15
It is possible to cause fluidity in the ink inside, and it is possible to prevent stagnation of ink in the slit portion 15 when the diaphragm is deformed by driving the piezoelectric element 300. That is,
The ink in the slit portion 15 does not hinder the displacement of the diaphragm, so that the ink ejection characteristics can be favorably maintained.

The ink may be stored in the storage 16 communicating with the slit 15, but air may be left in the storage. In any case, fluidity can be generated in the ink in the slit portion 15.

In the present embodiment, each slit 15
Although the storage section 16 is provided for each, the present invention is not limited to this. For example, a storage section 16 common to two or more slit sections 15 may be provided.

In the present embodiment, the storage section 16 is sealed by the elastic film 50, but is not limited to this. For example, as shown in FIG. The film 50 may be provided with a through hole 51 and sealed with a flexible film 110 having flexibility. Accordingly, the ink in the slit portion 15 can be made to have greater fluidity, and the stagnation of the ink in the slit portion 15 is reliably prevented.

(Embodiment 2) FIG. 8 is a plan view and a sectional view of an ink jet recording head according to Embodiment 2.

The present embodiment is an example in which the reservoir 13 for supplying ink to each pressure generating chamber 12 also serves as the storage section 16, and as shown in FIG. 8, the end of the slit section 15 on the reservoir 13 side. Is provided with a communication passage 17A, and the slit 15 and the reservoir 13 are communicated with each other through the communication passage 17A.

In such a configuration, as in the above-described embodiment, crosstalk can be prevented and the slit 1
The fluid in the ink in the slit 5 can be prevented from disturbing the displacement of the diaphragm.

Further, in this embodiment, the slit 15
Is communicated with the reservoir 13 via the communication path 17A, so that the shortage of ink supply from the reservoir 13 to the pressure generating chamber 12 can be eliminated.

(Other Embodiments) The embodiments of the present invention have been described above, but the basic configuration of the ink jet recording head is not limited to the above.

For example, in each of the above embodiments, the slits 15 are provided on both sides in the width direction of the pressure generating chamber 12, but the present invention is not limited to this. For example, as shown in FIG.
The slit 15 may be provided continuously from the widthwise end of the pressure generating chamber 12 to the longitudinal end. Also,
For example, the slit portion 15 may be provided only on one side in the width direction of the pressure generating chamber 12. Of course, even in such a configuration, the same effect as in the above-described embodiment can be obtained.

The ink jet recording head of each of the embodiments constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on an ink jet recording apparatus. FIG.
FIG. 1 is a schematic view showing an example of the ink jet recording apparatus.

As shown in FIG. 10, recording head units 1A and 1B having an ink jet recording head are
Cartridges 2A and 2B constituting ink supply means are detachably provided. A carriage 3 on which the recording head units 1A and 1B are mounted is provided on a carriage shaft 5 attached to the apparatus main body 4 so as to be movable in the axial direction. I have. The recording head units 1A and 1B are, for example,
Each of them ejects a black ink composition and a color ink composition.

Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and a timing belt 7 (not shown), so that the carriage 3 on which the recording head units 1A and 1B are mounted moves along the carriage shaft 5. Moved. On the other hand, a platen 8 is provided on the apparatus main body 4 along the carriage shaft 5, and a recording sheet S, which is a recording medium such as paper fed by a paper feed roller (not shown), is wound around the platen 8. It is designed to be transported.

[0077]

As described above, in the present invention, the rigidity can be sufficiently increased by increasing the width of the partition wall, and crosstalk can be prevented. In addition, since the storage portion communicates with the slit portion through the communication passage, the ink in the slit portion has fluidity, and the ink stays in the slit portion when the diaphragm is deformed by driving the piezoelectric element. Can be prevented. That is, it is possible to prevent the ink in the slit portion from hindering the displacement of the vibration plate, and it is possible to obtain an advantageous effect that the ink ejection characteristics can be favorably maintained.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an ink jet recording head according to a first embodiment of the present invention.

FIG. 2 is a plan view and a cross-sectional view of the inkjet recording head according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a manufacturing process according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a manufacturing process according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a manufacturing process according to the first embodiment of the present invention.

FIG. 6 is a plan view and a cross-sectional view illustrating a main part of the inkjet recording head according to the first embodiment of the present invention.

FIGS. 7A and 7B are a plan view and a cross-sectional view showing a modification of the ink jet recording head according to the first embodiment of the present invention.

FIG. 8 is a plan view and a cross-sectional view illustrating a main part of an ink jet recording head according to a second embodiment of the present invention.

FIG. 9 is a plan view and a cross-sectional view illustrating a main part of an ink jet recording head according to another embodiment of the present invention.

FIG. 10 is a schematic diagram of an ink jet recording apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 10 flow path forming substrate 11 partition wall 12 pressure generation chamber 13 reservoir 14 ink supply path 15 slit section 16 storage section 17 communication path 20 nozzle plate 21 nozzle opening 50 elastic film 55 protective film 60 lower electrode film 70 piezoelectric layer 80 upper electrode film 300 piezoelectric element

Claims (11)

[Claims] 1. A pressure generating chamber communicating with a nozzle opening corresponds to the pressure generating chamber via a flow path forming substrate defined by a plurality of partition walls and a diaphragm constituting a part of the pressure generating chamber. A piezoelectric element provided in a region and causing a pressure change in the pressure generating chamber; and a piezoelectric element defined in the region of the flow path forming substrate facing the partition between the diaphragm and the diaphragm. A slit portion communicating with at least one widthwise side of the pressure generating chamber, and a storage portion formed in a region corresponding to a peripheral wall of the pressure generating chamber and communicating with the slit portion through a communication passage. Inkjet recording head. 2. The ink jet recording head according to claim 1, wherein the slit portion extends to the outside in the width direction of the piezoelectric element. 3. The flow path forming substrate according to claim 1, wherein the depth of the slit portion in the thickness direction of the flow path forming substrate is 0.5 to 1 mm.
An ink jet recording head having a thickness of 0 μm. 4. The ink jet recording head according to claim 1, wherein said slit portion communicates with a longitudinal end of said pressure generating chamber. 5. The ink jet recording head according to claim 1, wherein the storage section is provided in common to at least two or more pressure generating chambers. 6. An ink jet recording head according to claim 1, wherein said storage section is provided on said nozzle opening side of said pressure generating chamber. 7. The ink jet recording head according to claim 1, wherein the storage section is provided in a region facing a partition partitioning the pressure generating chamber. 8. The method according to claim 5, wherein a reservoir for supplying ink to each pressure generating chamber is formed in the flow path forming substrate, and the reservoir also serves as the storage section. Ink jet recording head. 9. The ink jet recording head according to claim 1, wherein at least a part of the storage section is sealed with a flexible member having flexibility. 10. The pressure generating chamber according to claim 1, wherein the pressure generating chamber is formed on a silicon single crystal substrate by anisotropic etching, and each layer of the piezoelectric element is formed by a thin film and a lithography method. An ink jet recording head, characterized in that: 11. An ink jet recording apparatus comprising the ink jet recording head according to claim 1.