JP2001183811A - Device for evaluation of mask pattern shape, method for evaluation of shape and recording medium in which program for evaluation of shape is recorded - Google Patents

Device for evaluation of mask pattern shape, method for evaluation of shape and recording medium in which program for evaluation of shape is recorded

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Publication number
JP2001183811A
JP2001183811A JP36474999A JP36474999A JP2001183811A JP 2001183811 A JP2001183811 A JP 2001183811A JP 36474999 A JP36474999 A JP 36474999A JP 36474999 A JP36474999 A JP 36474999A JP 2001183811 A JP2001183811 A JP 2001183811A
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Japan
Prior art keywords
pattern
shape
pattern shape
data
evaluation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP36474999A
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Japanese (ja)
Inventor
Yuichi Fukushima
祐一 福島
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Toppan Printing Co Ltd
凸版印刷株式会社
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Application filed by Toppan Printing Co Ltd, 凸版印刷株式会社 filed Critical Toppan Printing Co Ltd
Priority to JP36474999A priority Critical patent/JP2001183811A/en
Publication of JP2001183811A publication Critical patent/JP2001183811A/en
Application status is Pending legal-status Critical

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Abstract

(57) Abstract: A photomask pattern shape evaluation apparatus uses a new evaluation means for evaluating a pattern shape of a photomask including a fine pattern, thereby providing an accurate and highly accurate shape evaluation apparatus and shape evaluation. A method and a recording medium recording a shape evaluation program are provided. A mask pattern image is input and processed by a computer to extract and compare and evaluate pattern shape data, so that the in-plane distribution and inter-plane distribution of the mask pattern shape, and the pattern shape based on design data comparison and the like are obtained. Analysis and evaluation can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask pattern shape evaluation apparatus and a shape evaluation method for extracting a pattern shape of a photomask used in a lithography process of semiconductor manufacturing from a pattern image and comparing and evaluating a predetermined pattern shape. The present invention relates to a recording medium on which a shape evaluation program is recorded.

[0002]

2. Description of the Related Art With the recent miniaturization of semiconductor LSI patterns, photomasks as pattern masters are also required to respond to miniaturization, and at the same time, demands for high precision are extremely severe. Conventionally, three items of defects, dimensional accuracy, and alignment have been particularly emphasized as important items in photomask quality. At present, as semiconductor miniaturization advances, a high-precision dedicated photomask inspection apparatus for measuring each item. Has been developed and used. However, the demand for higher precision by making photomask patterns finer is the above 3
The same is true for all quality items other than the items (pattern shape, pattern data guarantee, durability, cleanliness, etc.). The accuracy of the pattern shape is particularly important because it directly affects the accuracy and performance of the LSI circuit. It has come to be.

As for the pattern shape of a photomask, it is naturally desirable that a pattern exactly as shown in the design drawing of the mask pattern designed in the mask layout design of the semiconductor circuit is accurately reproduced on the mask. However, in practice, a fine pattern is processed on a metal thin film on glass using lithography technology.Therefore, the mask pattern and the design pattern are not completely the same shape, and there are minute differences such as dimensional differences and round corners. There are significant differences. In most cases, this difference is about several tens to several hundreds of nanometers on the mask. However, with the recent progress in miniaturization of the VLSI, there is a concern that this may affect the characteristics of the semiconductor circuit. Has begun. In other words, the finer the pattern, the greater the difference in the pattern shape with respect to the pattern itself, which affects the characteristic value.

With the rapid miniaturization in recent years, attempts to solve the above-mentioned problem of the pattern shape by actively utilizing the optical principle in the projection exposure technique have been actively made. A typical example is an optical proximity effect correction mask (hereinafter, referred to as an OPC mask). Here, the OPC mask will be described. The OPC mask is designed to transfer the circuit pattern shape with high accuracy during wafer exposure transfer.
This is a mask to which a fine optical proximity effect correction pattern (hereinafter referred to as an OPC pattern) is added so as to be close to or in contact with the original circuit pattern. The OPC pattern can correct the shape of the transfer pattern caused by the optical proximity effect at the time of projection exposure transfer by using the optical interference effect between adjacent patterns, and the original design pattern can be transferred accurately. And is often disposed at the four corners of the original circuit pattern or at the part closest to the adjacent pattern. Recently, a type of OPC pattern that makes the entire circuit pattern complicatedly deformed has also been proposed. However, since it is unnecessary as an original circuit pattern, the OPC pattern itself must be fine enough not to be transferred. Therefore,
Since the OPC pattern is considerably finer than the conventional pattern, the dimensional rule of the mask pattern will be drastically finer than the conventional mask, and a very advanced fine processing technology is required in terms of the mask manufacturing technology. And Of course, in terms of miniaturization, it is certain that conventional photomasks will also evolve in the same way, and advanced microfabrication technology is also required. Therefore, the above-mentioned problem of the pattern shape accuracy has come to be emphasized as a problem of the photomask manufacturing and inspection technology.

As for the method of evaluating the mask pattern shape, the following evaluation is performed in the mask inspection process. First, the items of the mask shape will be described.
When evaluating a pattern shape as a mask quality item, there are various items. For example, each part of the pattern such as roundness of the pattern corner (= corner roundness), jaggedness of the straight pattern edge (= edge roughness), pattern misalignment (= batting error) at drawing, shape distortion, taper shape, etc. There are items to check. In addition,
Items in parentheses are item names usually used in the photomask inspection process.

Next, a description will be given of a shape evaluation method currently performed in a general mask inspection process. FIG. 3 shows a flow of pattern shape inspection in the current photomask manufacturing process. First, in a high magnification microscope inspection 21, the shape of a mask pattern is observed using an optical microscope which is an optical means. Generally, the pattern is visually observed at a magnification of about 600 to 1000 times, and abnormalities are found in items such as jagged pattern and tapered shape of the pattern edge (a shape in which the pattern edge is obliquely etched rather than perpendicularly), and roundness of the pattern corner. Determine if there is any. In the above cases,
The determination of the shape is all made only by the visual observation of the inspector.

Next, in the defect inspection 22, the presence or absence of a defect is inspected by using an automatic defect inspection machine. At this time, the defective portion can be observed with a monitor screen of the inspection machine and an attached optical microscope, and the abnormal shape can be observed. Can be determined. However, since only the defective parts detected by the automatic defect inspection machine are observed on the monitor screen, emphasis is placed on judging whether or not the defect is a pseudo defect. There is a problem that objective reliability is lacking due to the visual judgment of the user. Here, the pseudo defect is a defect that is recognized as a defect by the inspection machine, but is determined as not a true defect by visual observation using a monitor. The cause of a pseudo defect is often caused by a small deviation from an image, which is a pattern to be compared with a defective portion (a pattern is compared with a pattern on the same mask depending on a method of an inspection period, and a pattern is compared with pattern data). It is presumed that the deviation is caused by the detection sensitivity / alignment accuracy of the apparatus, the pattern position accuracy, or the pattern dimension difference.

In the evaluation method in the pattern shape inspection as described above, the determination of the shape by an optical microscope (including a pattern observing apparatus such as a laser microscope or a confocal microscope, also for high-magnification observation) is performed. Because of the subjectivity of the examiner, there is a possibility that a slight difference in judgment may occur between the examiners. Also, the shape determination of the defective portion by the defect inspection machine has the same problem because the final determination is based on the subjective determination of the inspector on the monitor screen. Further, when the shape is determined by the defect inspection machine, there is a problem that only a portion detected as a defect can be determined. Also, in order to detect a pattern shape abnormality compared to a defect, it is necessary to observe a portion smaller than the defect, and for that purpose, it is necessary to set the sensitivity of the device to a high sensitivity exceeding the defect specification and scan. However, there is a serious problem that an extremely small defect that is originally within the standard is excessively detected, and that the inspection time is further increased and the throughput is reduced. Furthermore, pseudo-defects may increase due to the increased sensitivity. As described above, in the inspection by the defect inspection machine, there is a serious problem in accurately evaluating the pattern shape.

In the above-described shape inspection process, the judgment is subject to the examiner's subjectivity, so that there is a possibility that the judgment may vary depending on the inspector. This is because the quantitative measurement of the pattern shape has not been established and it is difficult to express the numerical value, and because the pattern is not constant, the measurement method and measurement location cannot be the same, and the judgment criteria are ambiguous. Is probably the cause. In other words, in the case of other quality items, the measurement device is developed exclusively for defects such as the number and size of defects, the dimension is the dimension value, the alignment is the amount of displacement, and numerical measurement is possible, whereas the shape is In the case of (1), there is a problem that since a clear standard is not defined, a sensory inspection method based on visual observation by an inspector is used.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an accurate and highly accurate method for evaluating the pattern shape of a photomask including a fine pattern by using new evaluation means. It is an object to provide a shape evaluation device, a shape evaluation method, and a recording medium on which a shape evaluation program is recorded.

[0011]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. According to a first aspect of the present invention, in a mask pattern shape evaluation apparatus, a mask pattern image is inputted and processed by a computer to obtain a pattern. A mask pattern shape evaluation device characterized by extracting and comparing shape data to analyze and evaluate the pattern shape by comparing the in-plane distribution and inter-plane distribution of the mask pattern shape and the design data. It is.

According to a second aspect of the present invention, there is provided the mask pattern shape evaluation apparatus according to the first aspect, wherein the mask pattern observing means is capable of arbitrarily enlarging and observing a photomask pattern using an optical means. A pattern image input / conversion means for inputting a mask pattern image and converting it into pattern image data for image processing, and a pattern shape extraction for extracting pattern shape data by computer processing the converted pattern image data A mask pattern shape evaluation apparatus, comprising: a pattern shape comparison / evaluation unit configured to compare and evaluate shapes by overlapping pattern shapes with each other or the pattern image data using desired pattern shape data. It is what it was.

According to a third aspect of the present invention, in the method for evaluating the pattern shape of a photomask, arbitrary pattern shape data is extracted from the pattern image data, and a plurality of pattern data of the same kind are recorded. A mask pattern shape evaluation method is characterized by analyzing and evaluating a mask pattern shape by comparing shape data.

According to a fourth aspect of the present invention, the third aspect is provided.
In the method of evaluating a mask pattern shape described above, a plurality of pattern shape data are recorded, and reference shape data for a target pattern shape is extracted, and these shape data are superimposed by image processing for comparative evaluation. This is a method for evaluating a mask pattern shape.

[0015] The invention of claim 5 of the present invention is the above-mentioned claim 3.
In the mask pattern shape evaluation method of the above, the pattern image data is smoothed by computer processing,
This is a mask pattern shape evaluation method characterized by extracting shape data of an arbitrary pattern by using a combination of image processing algorithms such as a value conversion process, a contour extraction process, and a thinning process.

According to a sixth aspect of the present invention, there is provided a recording medium on which a shape evaluation program for evaluating a shape of a mask pattern is recorded by a program, wherein the shape evaluation program causes a computer to input a mask pattern image and process the mask pattern image. A mask pattern shape measurement and evaluation program characterized by extracting and comparing pattern shape data and analyzing and evaluating the pattern shape by comparing the in-plane distribution and the inter-plane distribution of the pattern shape and the design data. This is a recording medium on which recording is performed.

According to a seventh aspect of the present invention, there is provided a recording medium on which the mask pattern shape evaluation program according to the sixth aspect is recorded, wherein the shape measurement evaluation program causes a computer to input mask pattern image data and to execute image processing data. A pattern image input / conversion means for converting the mask pattern image obtained by the conversion, and a pattern shape extraction processing means for extracting the pattern shape data,
A mask pattern shape evaluation program characterized by comprising pattern shape comparison and evaluation means for comparing and evaluating shapes by overlapping pattern shapes with each other or the pattern image data using desired pattern shape data. It is a recording medium.

[0018]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a block diagram showing one embodiment of the configuration of the mask pattern shape evaluation apparatus of the present invention. In FIG. 1, a photomask of a target sample is loaded in a mask pattern observation means 1 and a mask pattern is observed. The pattern image observed by the mask pattern observation means is sent to the image input / conversion means 2 and converted into data in a predetermined digital image format.

Here, the mask pattern observing means 1 may have a high-magnification pattern observing function and a pattern image photographing function that can be magnified and observed as used in a normal mask inspection process. For example, the observation mechanism of the above-described device such as the optical microscope, the automatic defect inspection machine, or the length measuring SEM (electron microscope) satisfies these functions.

When an analog image such as a photograph is input, the image input / conversion means 2 converts the analog image into a digital image. Here, the image data is an image of the observed mask pattern, and the digital image data has a predetermined format (in most cases, a bitmap format, and a compression format may be used). It is recorded in pixel units.

The conversion of the image data from analog to digital can be technically and selectively performed by either hardware processing or software processing, and the conversion may be performed at any stage. Further, when a digital image output function is directly incorporated in the mask pattern observing means 1, digital image data is output from the beginning, so that this data conversion becomes unnecessary.

In the image input / conversion means 2, image data can be input by selecting a target image. That is, when there are a plurality of the observed image data, a desired processing order is selected from among them, or when the image range is wide, only a desired pattern area is cut out, or the image quality is inappropriate. In such a case, it is possible to select an image by appropriately considering the subsequent processing, such as performing appropriate image processing using various image conversion means.

Next, the pattern shape extracting means 3 extracts pattern shape data from the input pattern image data. The pattern shape data is obtained by extracting contour data of a pattern by using an image processing technique by a computer for the pattern image data. This data is realized by combining known various image processing algorithms or using shape extraction processing software based on an algorithm uniquely created. It should be noted that the pattern shape extraction data is only binary data of the outline portion of the shape and other portions. The data format may be a bitmap format in pixel units or a format similar thereto, or may be converted to a vector data format depending on the intended use.

Further, the extracted pattern shape data is recorded on an external recording medium by the information recording means 9. This data can be extracted and quoted at any time by the information extracting means 10. Therefore, the pattern image input / conversion processing and the pattern shape extraction processing are repeatedly performed on a plurality of pattern images, so that a plurality of pattern shape data are accumulated using the information recording unit 9.

The information extracting means 10 can appropriately extract the data from these data, and the pattern shape can be compared and evaluated using the pattern shape comparing means 4.
Further, systematic data can be arbitrarily extracted by the information extracting means 10, so that a single mask
Alternatively, it is also possible to extract a common element from among a plurality of masks and perform analysis and evaluation using a statistical method.

Here, an embodiment of comparison and evaluation of pattern shape data will be described with reference to FIG. FIG. 4A shows the shape data of an OPC pattern extracted from a part of the OPC mask described in the related art, and the pattern range is about 2 μm square. However, the mask pattern is 5
Double size. This pattern shape is determined to be good, and can be used as a reference as a good product shape. on the other hand,
FIG. 4B shows a pattern shape extracted from a part of another OPC mask. Further, FIG. 4C is a diagram in which the pattern shape data (a) and (b) are superimposed and displayed. In this diagram, (a) is indicated by a solid line, and (b) is indicated by a dotted line. Actually, since the pattern shape data is held as digital image information, it can be displayed on a computer monitor as it is or at the same time as being superimposed. The shape data may be distinguished by the color of the line instead of the dotted line. By superimposed and displayed as shown in FIG. 4C, the difference in the shape of the OPC pattern becomes clear at a glance. Thus, the same type of pattern shape can be comparatively evaluated. Further, when the dimensional scale of the pattern shown in the figure is known, dimensional measurement can be performed on a portion having an arbitrary difference in shape by scaling on the monitor screen.

Normally, when comparing such a pattern shape, the pattern to be evaluated has a size close to the state-of-the-art device rule in the fine processing technology, for example, around 0.8 μm (a five-fold mask) at present. Often. FIG.
In the pattern (b), the corners are slightly rounder than in the pattern (a). This phenomenon is called a corner roundness, and this phenomenon is a peculiar pattern deterioration phenomenon in the lithography technology, and each factor exists in each process such as electron beam drawing, development, and etching.

As an image processing procedure for extracting the shape, image processing is basically basically performed in the order of edge detection processing, binarization processing, and thinning processing. However, depending on the original image quality, the same processing procedure may have a large effect on the shape data extraction due to the large noise of the image. In this case, the processing procedure may be changed or another image processing algorithm may be used. What is necessary is just to change the combination of the image processing as appropriate and set a processing procedure for obtaining the optimal shape data.

Next, the description returns to FIG. In the above description of FIG. 1, all means and processing except the mask pattern observation means 1 are controlled by the control processor 5. The operator can confirm and judge these means and processing contents through the screen of the monitor 6. An instruction is sent to the contents of the processing using the input means 7, and the result of the processing can be output using the output means 8. The contents of these processes can be stored using the information recording means 9.

The information extracting means 10 can organize and store shape data, original image data, other related information, and the like, and can extract desired data whenever necessary. Has become information database software. The monitor 6 is a computer display, and the input means 7 can be a computer keyboard or a general computer input device such as a mouse alone or in combination.
The output means 8 may use an output device such as a printer, a magneto-optical disk, or a floppy disk.

The information recording means 9 is suitably a large-capacity recording medium for storing image data, and it is desirable to store the data on a hard disk, a network file server, or the like. With the above apparatus configuration, it is possible to extract pattern shape data from a mask pattern image and compare and evaluate the results.

FIG. 2 is a flowchart showing the procedure of the mask pattern shape comparison and evaluation method of the present invention. FIG.
In the pattern shape observation 11, the pattern is observed using an observation mechanism such as an optical microscope or a length-measuring SEM capable of observing a target photomask at a high magnification. At this time, a pattern whose shape is to be evaluated is determined, and a pattern image is photographed using an image photographing function attached to the observation mechanism. At this time, the image must be image data that can be captured by a computer. Depending on the case where the image photographing mechanism is a digital camera, a CCD camera, an optical camera, or the like, an image data conversion processing method is appropriately selected in image data conversion processing described later.

In the next pattern image input / conversion processing 12, if the image is an optical photograph, the photograph can be scanned using a scanner and converted into image data.
If the image is an analog image obtained by a CCD camera or a monitor camera, the analog image is captured using a scanner or the like and converted into digital image data. This is because image data needs to be converted into digital information for computer processing.

In the pattern shape extraction process 13, data is processed using a predetermined image processing algorithm to extract pattern shape data. Further, in the shape data information recording processing 14, the extracted pattern shape data and associated information are recorded on a recording medium.

Next, evaluation execution determination 15 is performed on the extracted and recorded pattern shape data. This is a process for determining whether or not to perform comparison and evaluation by extracting the data when shape data serving as a comparison reference for the shape data has already been recorded by the information recording process. If it is determined that the evaluation is to be performed, a comparison shape data extraction process 16 is performed. If the evaluation is not performed, the process returns to the pattern shape observation 11 which is the beginning of the procedure for processing the next pattern shape data, and the pattern shape data is extracted again.

In the next comparison shape data extraction processing 16,
Desired data is extracted from the shape data already recorded and stored, and is used as reference data for comparison. Then, in the comparative evaluation 17, the pattern difference is evaluated and determined by superimposing and comparing the pattern shape data as described above. As a result, if it is determined that the pattern data is within the standard, the pattern shape is determined to be acceptable, and if it is determined that the pattern data is not the standard, the pattern is determined to be unacceptable. The comparative evaluation of the pattern shape can be performed by the above procedure.

[0037]

As described above, by using the mask pattern shape comparison / evaluation apparatus and the shape comparison / evaluation method of the present invention in the mask pattern shape inspection process, the defect detection by the sensory inspection by microscopic observation or the defect inspection by the defect inspection apparatus is conventionally performed. The pattern shape evaluation, which was performed only by observation, can be accurately and accurately performed by direct comparison with the reference shape data.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of an embodiment of a mask pattern shape evaluation apparatus of the present invention.

FIG. 2 is a flowchart showing a procedure of an embodiment of a mask pattern shape evaluation method according to the present invention.

FIG. 3 is a flowchart illustrating a conventional pattern shape inspection process.

FIGS. 4A and 4B are explanatory diagrams of comparison evaluation of mask pattern shape data, FIG. 4A is an explanatory diagram of shape data, FIG. 4B is an explanatory diagram of other shape data, and FIG. is there.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Mask pattern observation means 2 ... Image input / conversion means 3 ... Pattern shape extraction means 4 ... Pattern shape comparison evaluation means 5 ... Control processor 6 ... Monitor 7 ... Input Means 8 ... Output means 9 ... Information recording means 10 ... Information extraction means 11 ... Pattern shape observation 12 ... Pattern image input / conversion operation 13 ... Pattern shape extraction processing 14 ... Shape data information recording process 15: Shape evaluation execution determination 16: Comparative shape data extraction process 17: Shape comparison evaluation 21: High-magnification optical microscope inspection 22: Defect inspection

Claims (7)

    [Claims]
  1. In a mask pattern shape evaluation apparatus,
    By inputting a mask pattern image and processing it by computer to extract and compare and evaluate the pattern shape data, it is possible to analyze and evaluate the pattern shape by comparing the in-plane distribution and inter-plane distribution of the mask pattern shape, design data comparison, etc. A mask pattern shape evaluation device, characterized in that:
  2. 2. The mask pattern shape evaluation apparatus according to claim 1, wherein a mask pattern observation means capable of arbitrarily enlarging and observing a photomask pattern using an optical means to obtain a mask pattern image, and inputting the mask pattern image. Pattern image input / conversion means for converting into pattern image data for image processing, pattern shape extraction means for extracting pattern shape data by computer processing of the converted pattern image data, and desired pattern shape data And a pattern shape comparison and evaluation means for comparing and evaluating the shapes by superimposing the pattern shapes with each other or with the pattern image data by using the mask pattern shape evaluation apparatus.
  3. 3. A method for evaluating a pattern shape of a photomask, comprising extracting arbitrary pattern shape data from pattern image data, recording shape data of a plurality of similar patterns, and comparing these pattern shape data. A mask pattern shape evaluation method characterized by analyzing and evaluating a pattern shape.
  4. 4. A mask pattern shape evaluation method according to claim 3, wherein a plurality of pattern shape data are recorded, shape data serving as a reference for a target pattern shape is extracted, and these shape data are converted into an image. A mask pattern shape evaluation method characterized by performing comparative evaluation by superimposing by processing.
  5. 5. The mask pattern shape evaluation method according to claim 3, wherein the pattern image data is combined with image processing algorithms such as smoothing processing, binarization processing, contour extraction processing, and thinning processing by computer processing. A mask pattern shape evaluation method characterized by extracting shape data of an arbitrary pattern by using the method.
  6. 6. A recording medium on which a shape evaluation program for evaluating a shape of a mask pattern by a program is recorded, wherein the shape evaluation program causes a computer to input a mask pattern image, process the image, and extract pattern shape data. A recording medium on which a mask pattern shape evaluation program is recorded, characterized in that the pattern shape is analyzed and evaluated by comparing and evaluating the in-plane distribution and the inter-plane distribution of the pattern shape and the design data comparison.
  7. 7. A recording medium on which the mask pattern shape evaluation program according to claim 6 is recorded, wherein said shape evaluation program causes a computer to input mask pattern image data and convert it into image processing data. And pattern shape extraction processing means for processing the mask pattern image obtained by the conversion to extract the pattern shape data, and by superimposing the pattern shapes or the pattern image data using desired pattern shape data. A recording medium storing a mask pattern shape evaluation program, comprising: a pattern shape comparison evaluation means for comparing and evaluating shapes.
JP36474999A 1999-12-22 1999-12-22 Device for evaluation of mask pattern shape, method for evaluation of shape and recording medium in which program for evaluation of shape is recorded Pending JP2001183811A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003043663A (en) * 2001-08-01 2003-02-13 Toppan Printing Co Ltd Automatic shape measuring method for photomask pattern, its measuring instrument and program, photomask manufacturing method as well as manufacturing method for semiconductor device
US7139998B2 (en) 2002-09-30 2006-11-21 Kabushiki Kaisha Toshiba Photomask designing method, pattern predicting method and computer program product
US7673281B2 (en) 2006-07-25 2010-03-02 Kabushiki Kaisha Toshiba Pattern evaluation method and evaluation apparatus and pattern evaluation program
JP2013218339A (en) * 2008-11-04 2013-10-24 Hoya Corp Method and device of inspecting photo mask

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003043663A (en) * 2001-08-01 2003-02-13 Toppan Printing Co Ltd Automatic shape measuring method for photomask pattern, its measuring instrument and program, photomask manufacturing method as well as manufacturing method for semiconductor device
JP4710191B2 (en) * 2001-08-01 2011-06-29 凸版印刷株式会社 Photomask pattern shape automatic measurement method and apparatus, program therefor, photomask manufacturing method and semiconductor device manufacturing method
US7139998B2 (en) 2002-09-30 2006-11-21 Kabushiki Kaisha Toshiba Photomask designing method, pattern predicting method and computer program product
US7673281B2 (en) 2006-07-25 2010-03-02 Kabushiki Kaisha Toshiba Pattern evaluation method and evaluation apparatus and pattern evaluation program
JP2013218339A (en) * 2008-11-04 2013-10-24 Hoya Corp Method and device of inspecting photo mask

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