JP2001179820A - System and method for producing laminated base material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a practical method for producing a laminated base material by operating apparatuses arranged in sequence. SOLUTION: In the production of the laminated base material C in which resin sheets S11, S21 are laminated/bonded on/to both surfaces of a base material B, the first thermoforming apparatus 20 for laminating/bonding the sheet S11 on/to the upper surface B4 of the base material B and the second thermoforming apparatus 30 for laminating/bonding the sheet S21 on/to the surface B5 of the lower surface B5 of the base material B are installed, and the apparatuses 20, 30 are connected by the second base material supply apparatus 50 for supplying the base material B so that the laminated base material C can be produced by operating the apparatuses arranged in sequence.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated base material manufacturing system and a laminated base material manufacturing method, and more particularly to a laminated base material manufacturing system for manufacturing a laminated base material by laminating and bonding a resin sheet to both sides of a base material. And a method for producing a laminated base material.

[0002]

2. Description of the Related Art Conventionally, a method disclosed in Japanese Patent Publication No. 57-55061 is known as a method for producing this kind of laminated base material. This publication discloses a method for producing a laminated base material composed of an outer layer formed of plastic, an intermediate layer of molded paper, and an inner layer formed of plastic. A method for producing such a laminated base material includes a step of thermoforming a transparent plastic sheet of an outer layer container into a predetermined shape, and a step of providing a plug or an acute projection on the bottom of a basic mold at the time of the thermoforming. Forming an appropriate number of small holes for vacuum holes in the outer layer container, and inserting and filling in the outer layer container a molded paper for an intermediate layer punched in a shape substantially similar to a state where the flange portion of the outer layer container is removed. A step of producing an auxiliary mold comprising an intermediate layer and a plastic sheet for an inner layer container preheated on a separate line, using an auxiliary mold placed in a basic mold, vacuum forming, pressure forming or Performing vacuum pressure forming to form an inner container and fitting it to the flange of the outer container. Further, according to the present technology, a small hole is provided at the bottom of the outer layer container to provide a passage for vacuum or compressed air when molding a plastic sheet to be an inner layer container.

[0003]

In the above-mentioned conventional method for manufacturing a laminated base material, the forming paper as an intermediate layer is placed on a plastic sheet which has already been formed as an outer layer container by a basic forming die. Become. Therefore, the outer layer container and the intermediate layer cannot be bonded by thermoforming. That is, by laminating and bonding plastic sheets to both surfaces of the intermediate layer by thermoforming, a laminated base material in which the intermediate layer is substantially sealed cannot be produced. Further, in this conventional method of manufacturing a laminated base material, no specific method has been proposed for a technique for generating a laminated base material by continuous operation of an apparatus.

The present invention has been made in view of the above-mentioned problems, and a resin sheet is bonded to both surfaces of a base material corresponding to an intermediate layer by laminating and bonding the resin sheets to both surfaces of the base material. It is an object of the present invention to provide a laminated base material manufacturing system and a laminated base material manufacturing method capable of laminating and bonding the both surfaces of the base material by an operation between interlocking devices.

[0005]

In order to achieve the above-mentioned object, the invention according to claim 1 is to produce a laminated substrate in which both surfaces of a substantially bowl-shaped concave substrate are laminated and adhered with a resin sheet. A first thermoforming apparatus for performing lamination of the resin sheet on one side of the base material by thermoforming with a molding mechanism having a predetermined mold, and a predetermined mold. A second thermoforming device for laminating the resin sheet on the other side to form a laminated base material by thermoforming with a molding mechanism comprising a, and connecting the first thermoforming device and the second thermoforming device. And a carry-in device for carrying the base material, one side of which is supplied from the first thermoforming device, laminated to the second thermoforming device.

In the invention according to claim 1, the resin sheet is laminated and adhered to both sides of the substantially bowl-shaped concave base material so that the resin sheet is laminated and adhered. Provided is a laminated base material manufacturing system for manufacturing a material. This laminated base material manufacturing system includes a first thermoforming device, a second thermoforming device, and a loading device. The first thermoforming device is formed by thermoforming with a forming mechanism having a predetermined mold. Laminating the resin sheet on one side of the material, the second thermoforming device laminates the resin sheet on the other side by thermoforming with a molding mechanism equipped with a predetermined mold, Molding.

The carrying-in device connects the first thermoforming device and the second thermoforming device, and carries in the second thermoforming device the one-side laminated substrate supplied from the first thermoforming device. . That is, since the base material and the resin sheet are bonded by lamination, no gap is generated between the respective layers, and the base material can be substantially sealed. Further, even in thermoforming, since no small holes are formed in the resin sheet, the base material is laminated and bonded to the resin sheet with airtightness, so that the airtightness of the laminated base material can be maintained. .

According to a second aspect of the present invention, as a mode for carrying a base material into the first thermoforming apparatus, the first thermoforming apparatus includes a first thermoforming apparatus. In addition to having a base material loading device for loading the base material into the forming mechanism of the forming device, the mold of the forming mechanism of the first thermoforming device is capable of forming a plurality of base materials into each base material that can be thermoformed in one shot. A corresponding mold arrangement is provided, and the substrate carrying-in device is configured to include a plate jig corresponding to the mold arrangement.

In the invention according to claim 2 configured as described above, the first thermoforming device is provided with a substrate loading device for loading the substrate into the molding mechanism. In addition, the mold of the molding mechanism is provided with a mold arrangement corresponding to each substrate so that a plurality of substrates can be thermoformed in one shot. Then, the substrate loading device is provided with a plate jig corresponding to the die arrangement.
That is, when carrying the base material into the forming mechanism, the base material is placed on a plate jig corresponding to the mold arrangement, and the plate jig is conveyed toward the forming mechanism. Then, the substrate loading device carries the substrate into the molding mechanism while maintaining the positional relationship of the substrate placed on the plate jig.

In the case where a plurality of base materials having a resin sheet laminated and bonded by the first thermoforming apparatus are produced, each base material is trimmed from the resin sheet when the base material is carried into the next second thermoforming apparatus. If it is performed, it is suitable for thermoforming with the second thermoforming device. Therefore, according to a third aspect of the present invention, in the laminated base material manufacturing system according to any one of the first and second aspects, the first thermoforming device maintains the thermoformed positional relationship while maintaining the thermoformed positional relationship. Is provided with a first trimming device for trimming the laminated base material, and the carrying-in device carries the one-side laminated base material trimmed by the first trimming device into the second thermoforming device. There is a configuration.

In the invention according to claim 3 configured as described above, the first trimming device for trimming the base material having one side laminated while maintaining the positional relationship thermoformed by the first thermoforming device is provided. Prepare. Then, the carrying-in device carries in the second thermoforming device the base material having one side trimmed by the first trimming device and laminated on one side.

In the case where a plurality of laminated base materials on which the resin sheets are laminated and bonded by the second thermoforming apparatus are formed, when each of the laminated base materials is collected as a product, the respective laminated base materials may be trimmed from the resin sheet. Suitable for recovery. Therefore, according to a fourth aspect of the present invention, in the laminated base material manufacturing system according to any one of the first and second aspects, the second thermoforming device is configured to hold the thermoformed positional relationship while maintaining the thermoformed positional relationship. It is configured to include a second trimming device for trimming the base material.

[0013] In the invention according to claim 4 configured as described above, the second thermoforming device is provided with a second trimming device for trimming the laminated base material while maintaining the thermoformed positional relationship. Trims the laminated base material laminated and adhered with the resin sheet so that it can be collected as a product.

As a specific mode for recovering the trimmed base material and the resin sheet from which the base material has been removed, the invention according to claim 5 is directed to the laminated base manufacturing system according to claim 3, wherein The first thermoforming device includes a first base material recovery device that recovers the laminated base material on one side trimmed by the first trimming device. The first adsorption and desorption means which adsorbs the laminated base material and separates from the resin sheet, and collects the laminated base material on one side while maintaining the positional relationship at the time of separation, to the loading device. It is configured to include a first base material collecting means to be supplied, and a first resin sheet collecting means to collect the resin sheet from which the base material laminated on one side by the base material collecting means has been removed.

[0015] In the invention according to claim 5 configured as described above, the first base material recovery device for recovering the base material having one side trimmed by the first trimming device in the first thermoforming device is laminated. Is provided. Then, the first base material recovery device, when one side trimmed by the first suction / separation means adsorbs the laminated base material and separates from the resin sheet, and is separated by the first base material recovery means The substrate laminated on one side is recovered while maintaining the positional relationship described above, and is supplied to the above-mentioned loading device. On the other hand, the first resin sheet collecting means collects the resin sheet from which the base material laminated on one side has been separated by the base material collecting means.

Of course, the above-described apparatus for collecting a substrate can also be used for a second thermoforming apparatus. Therefore,
According to a sixth aspect of the present invention, in the laminated base material manufacturing system according to the fourth aspect, the second thermoforming device collects a second base material recovered by the second trimming device. Device, the second substrate recovery device, the second adsorption and desorption means to adsorb the trimmed laminated base material and release from the resin sheet, the laminated base material while maintaining the positional relationship when separated It is configured to include a second base material collecting means for collecting and a second resin sheet collecting means for collecting the resin sheet from which the laminated base material has been separated by the same base material collecting means.

In the invention according to claim 6 configured as described above, the second thermoforming device is provided with a second base material collecting device for collecting the laminated base material trimmed by the second trimming device. The second base material recovery device absorbs the laminated base material trimmed by the second suction / separation means and separates from the resin sheet, while maintaining the positional relationship at the time of separation by the second base material recovery means. Collect the laminated substrate. The second resin sheet collecting means collects the resin sheet from which the laminated base material has been separated by the base material collecting means.

According to a seventh aspect of the present invention, as a specific mode in which the substrate is carried into the second thermoforming device by the carrying-in device, the laminated substrate manufacturing system according to any one of the fourth to sixth aspects is provided. In the above, the mold of the molding mechanism of the second thermoforming apparatus has the same mold arrangement as the mold of the molding mechanism of the first thermoforming apparatus, and the carry-in apparatus has a plate jig corresponding to the mold arrangement. The second thermoforming device is configured to carry the base material having one side laminated while maintaining the positional relationship trimmed by the plate jig.

In the invention according to claim 7 configured as described above, the mold of the molding mechanism of the second thermoforming apparatus has the same mold arrangement as the mold of the molding mechanism of the first thermoforming apparatus. I do. Further, the carry-in device is provided with a plate jig corresponding to the die arrangement, and holds the positional relationship of the base material trimmed by the plate jig. Then, the base material is placed on the plate jig, and the base material having one side laminated is carried into the second thermoforming device.

[0020] As an example of the function of the above-mentioned trimming device, the invention according to claim 8 relates to the laminated substrate manufacturing system according to any one of claims 3 to 7,
The first and second trimming devices include a predetermined upper and lower table that can be driven up and down, and one of the upper and lower tables buffers shock generated during a trimming operation performed by driving the upper and lower tables. A predetermined buffer mechanism is provided. In the invention according to claim 8 configured as described above, the first and second trimming devices are provided with predetermined vertical tables that can be vertically driven. Then, the shock generated during the trimming operation performed by driving the upper and lower tables is buffered by the buffer mechanism.

According to a ninth aspect of the present invention, as a specific example of the structure of the buffer mechanism, in the laminated base material manufacturing system according to the eighth aspect, the buffer mechanism comprises a predetermined hydraulic cylinder. The shock generated at the time of the trimming operation is buffered by leaking oil from the cylinder. According to the ninth aspect of the present invention, the shock absorbing mechanism is constituted by a predetermined hydraulic cylinder, and the hydraulic cylinder absorbs an oil injected therein to absorb an impact generated during the trimming operation. I do.

[0022] As an example of the mode of the loading device, claim 10
According to the present invention, in the laminated substrate manufacturing system according to any one of claims 1 to 9, the molding mechanisms of the first thermoforming device and the second thermoforming device are heated above a predetermined mold. The softened resin sheet is arranged and thermoformed, and the carry-in device includes a reversing device for reversing the base material having one side laminated by the first thermoforming device.

In the invention according to claim 10 having the above-described structure, the heat-softened resin sheet is arranged above a predetermined mold by the molding mechanisms of the first thermoforming device and the second thermoforming device. Thermoforming. In such a case, since the resin sheet is always disposed on the upper surface of the base material, the carry-in device needs to be inverted when the base material having one side laminated by the first thermoforming device is carried into the second thermoforming device. Occurs. Therefore, a reversing device is installed in the loading device, and the substrate formed by laminating one side formed by the first thermoforming device is reversed by the reversing device and is loaded into the second thermoforming device.

When the carry-in device can control the position of the carry-in position with respect to a predetermined position at which the carry-in device can carry the substrate into the second thermoforming device, the shape of the plate jig used at the time of carry-in changes. Even if it is done, it can respond flexibly. Therefore, the invention according to claim 11 is based on claims 7 to 10
In the laminated base material manufacturing system according to any one of the above, the carry-in device, when carrying the base material into the molding mechanism of the second thermoforming device with a plate jig of the carry-in device, the second thermoforming device In this configuration, the plate jig is positioned at a position where the mold arrangement of the mold of the molding mechanism substantially coincides with the mold arrangement of the plate jig. In the invention according to claim 11 configured as described above, the loading device includes:
When the base material is carried into the molding mechanism of the second thermoforming device by the plate jig of the carrying device, the mold arrangement of the mold of the molding mechanism of the second thermoforming device and the mold of the plate jig The plate jig is positioned at a position where the arrangement substantially matches.

As described above, the method of manufacturing a laminated base material in which both surfaces of the base material are laminated and bonded with a predetermined heat-softened resin sheet is not necessarily limited to a substantial apparatus. It is easy to understand that it works. For this reason, the invention according to claim 12 is a method for manufacturing a laminated base material in which both surfaces of the base material are laminated with a predetermined heat-softened resin sheet, and has a predetermined mold. A first thermoforming step of laminating the resin sheet on one side of the substrate by thermoforming with a molding mechanism, and an unloading step of unloading the substrate having one side laminated from the first thermoforming step And the other side of the base material, one side of which is laminated in the first thermoforming step by thermoforming with a molding mechanism provided with a predetermined mold, while the base material having one of the conveyed sides is carried in. And a second thermoforming step of laminating the resin sheet to form a laminated base material. In other words, there is no difference in that the present invention is not necessarily limited to a substantial device and is also effective as a method.

[0026]

As described above, according to the present invention, the substrate and the resin sheet are substantially sealed by laminating and bonding a resin sheet to both surfaces of the substrate as the intermediate layer. It is possible to provide a laminated base material manufacturing system capable of laminating and bonding by operation between linked devices. Further, according to the invention of claim 2, since the base material can be stored in the plate jig at the time of carrying in, the base material can be sequentially carried in according to the thermoforming cycle of the forming mechanism. Further, according to the third aspect of the invention, it is possible to easily trim the base material from the resin sheet. Further, according to the invention of claim 4, it is possible to easily trim the laminated base material from the resin sheet. Further, according to the invention of claim 5, it is possible to easily collect the base material. Further, according to the invention of claim 6, it is possible to easily collect the laminated base material.

Further, according to the invention of claim 7,
Since the base material can be accommodated in the plate jig at the time of carrying in, the laminated base material can be sequentially carried in according to the thermoforming cycle of the forming mechanism. Further, according to the invention according to claim 8, it is possible to buffer the impact during the trimming operation. Further, according to the ninth aspect, it is possible to show a specific configuration of the buffer mechanism. Further, according to the tenth aspect, by providing the reversing device, the structure of each forming mechanism can be made the same.
Further, according to the invention of claim 11, it is possible to flexibly cope with a change of the molding mechanism or the like. Furthermore, according to the twelfth aspect of the present invention, the base material and the resin sheet are substantially sealed by laminating and bonding the resin sheet to both surfaces of the base material corresponding to the intermediate layer, and both surfaces of the base material are interlocked. It is possible to provide a method of manufacturing a laminated base material capable of performing lamination bonding by operation between apparatuses.

[0028]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic external view of a laminated base material manufacturing system according to an embodiment of the present invention.
In FIG. 1, a laminated base material manufacturing system 10 includes a first thermoforming device 20, a second thermoforming device 30, a first base material supply device 40, and a second base material supply device 50. . In such a configuration, the laminated substrate manufacturing system 10
A resin sheet is laminated and bonded by thermoforming on both sides of a paper base material having a substantially bowl concave shape and an uneven shape, and the base material is substantially sealed by laminating both sides of the base material. A laminated substrate is manufactured. Here, the first thermoforming device 20 laminates and adheres a resin sheet to one side of the base material supplied by the first base material supply device 40.

Then, the second thermoforming device 30 is configured such that the first thermoforming device 20 supplied by the second substrate supply device 50 has one side laminated and bonded with a resin sheet to the other side. Laminate the resin sheet on the side.
Further, as described above, the first base material supply device 40 supplies the base material to the first thermoforming device 20, and the second base material supply device 50 supplies the base material to the first thermoforming device 20. Is supplied to the second thermoforming device 30 on the side of which is bonded by a resin sheet.

Next, the structure of the first thermoforming device 20 will be described with reference to FIG. The first thermoforming device 20 is generally
A roll sheet unwinding device 21, a sheet conveying device (not shown), a heating device 22, a forming device 23, a trimming device 24, a scrap pulling device 25, and a scrap winding device 26 are provided. And a base material take-out device 27 for taking out the base material laminated and adhered with the resin sheet.

In the above configuration, the roll sheet unwinding device 21 has a resin sheet roll S used for lamination bonding.
1, a required amount of the resin sheet S11 can be sequentially unwound while the edge portion is bitten by a spike chain in the sheet conveying device. And the resin sheet S11 unwound by the sheet conveying device is
It is carried into the heating device 22, is radiantly heated by a heater or the like installed in the heating device 22, and is softened by heating so as to be laminated and adhered to the substrate.

The heat-softened resin sheet S11 is carried into the molding device 23. In addition, the above-described first substrate supply device 40 is connected to the molding device 23,
The substrate on which the resin sheet S11 is laminated and adhered is carried into the molding device 23 by the first substrate supply device 40. Here, the molding device 23 generally has a pressurized empty box for molding at the top,
A molding die provided with a concave portion capable of accommodating the convex portion while the concave portion of the substrate is on the upper surface, and the convex portion of the substrate is engaged with the concave portion of the molding die, Is set in a molding die.
Then, the resin sheet S11 is carried into the upper surface of the base material, and the resin sheet S11 is drawn in from the molding die side by vacuum while moving the molding press box and the molding die up and down toward the resin sheet S11. The resin sheet S11 is laminated and bonded to the concave portion of the base material. Needless to say, the present invention is not limited to the mode in which the resin sheet is drawn into the concave portion of the base material by blowing compressed air from the compressed air box side.
11 may be laminated.

Thus, the resin sheet S11 is laminated and bonded to the concave side of the base material. And the resin sheet S
11 forms the molded sheet S12 in a shape to which the base material is added. The trimming device 2
4 and the trimming device 24
From the substrate part. And the formed sheet S
Scrap sheet S1 from which substrate is trimmed from 12
While being pulled by the scrap pulling device 25, 3 is rewound by the scrap winding device 26 and collected. On the other hand, the base material trimmed from the formed sheet S12 by the trimming device 24
Is taken out of the trimming device 24 and transferred to the second base material supply device 50.

Next, the structure of the second thermoforming device 30 will be described with reference to FIG. The second thermoforming device 30 includes a roll sheet unwinding device 31, a sheet conveying device (not shown), and a heating device 3, similarly to the first thermoforming device 20 described above.
2, a molding device 33, a trimming device 34, a scrap pulling device 35, and a scrap take-up device 36, and a base material take-out device 37 for taking out a laminated base material having both surfaces laminated and bonded from the trimming device 34; It is composed of

In the above configuration, the roll sheet unwinding device 31 has a resin sheet roll S used for lamination bonding.
2 is provided, and a required amount of the resin sheet S21 can be unwound by the sheet conveying device. Then, the resin sheet S21 unwound by the sheet conveying device
Is carried into the heating device 32, is radiantly heated by a heater or the like installed in the heating device 32, and is softened by heating so as to be laminated and adhered to the base material.

The heat-softened resin sheet S21 is carried into the molding device 33. In addition, the above-described second base material supply device 50 is connected to the molding device 33,
The base material in which the resin sheet S11 is laminated and bonded to the concave side by the first thermoforming device 20 is carried into the forming device 33 by the second base material supply device 50. Here, the molding device 33
Generally has a molding press box at the top, and a molding die at the bottom with a projection capable of accommodating a recess while the projection of the base material is on the top, and the projection of the molding die is provided. And the concave portion of the base material is engaged, and the base material is set on the molding die. Then, the resin sheet S21 is carried into the upper surface of the base material, and the molding press box and the molding die are moved up and down toward the resin sheet S21.
The resin sheet S21 is drawn in from the molding die side by vacuum, and the resin sheet S21 is laminated and adhered to the convex portion of the base material. Needless to say, the present invention is not limited to a mode in which the resin sheet S21 is drawn in from the molding die side by vacuum, and the resin sheet S21 may be laminated and adhered to the convex portion of the base material by blowing air from the molding pressurized box side.

When the resin sheet S21 is laminated and adhered to the convex portion side of the base material in this manner, a laminated base material is formed, and the molded sheet S22 is formed in a shape to which the laminated base material is added. Will be. This molded sheet S
22 is carried into a trimming device 34, and the trimming device 34 trims the laminated base material portion from the formed sheet S22. Then, the scrap sheet S23 obtained by trimming the laminated base material from the formed sheet S22 is rewound by the scrap winding device 36 and collected while being pulled by the scrap pulling device 35. On the other hand, the laminated base material trimmed from the molded sheet S22 by the trimming device 34 is taken out of the trimming device 34 by the base material take-out device 37 and collected as a product.

Here, the base material used in the present embodiment will be described. FIG. 2 is an external view showing the external appearance of the base material. In the figure, a base material B is formed in a bowl shape having a recessed wall by forming a vertical wall B2 by folding the periphery of a bottom surface B1 upward. In addition, standing wall B2
Is bent horizontally toward the outside of the base material B to form a flange portion B3. In the present embodiment, the upper side in the drawing of the base material B is defined as an upper surface B4, and the lower side in the drawing is defined as a lower surface B5.

FIG. 3A is a cross-sectional view of the molded sheet S12 when the resin sheet S11 is laminated and bonded to the upper surface B4 side of the base material B by the first thermoforming apparatus 20, and FIG. b) is a cross-sectional view of the base material B obtained by trimming the formed sheet S12 by the trimming device 24. As described above, in the first thermoforming apparatus 20, the resin sheet S11 is placed on one side of the base material B, that is, the upper surface B4.
Is subjected to thermoforming to form a molded sheet S12 by laminating and bonding. Then, trimming is performed by the trimming device 24 from the molded sheet S12 while slightly leaving the resin sheet portion from the flange portion B3, and the second trimming is performed.
The above-described one side to be carried into the thermoforming apparatus 30 is formed with the base material B laminated and bonded with the resin sheet S11.

The substrate B is carried into the second thermoforming device 30 and a resin sheet S21 is laminated on the other side to form a laminated substrate. FIG. 4A shows the second thermoforming device 3.
0 shows a cross-sectional view of the molded sheet S22 when the resin sheet S21 is laminated and bonded to the lower surface B5 side of the base material B, and FIG. 1 shows a cross-sectional view of a laminated base material C. As described above, in the second thermoforming device 30, the resin sheet S <b> 21 is thermoformed on one side of the base material B, that is, the lower surface B <b> 5, thereby performing the lamination bonding to generate the laminated base material C. I do. In the present embodiment, when trimming the laminated base material C from the molded sheet S22, the trimming is performed so that the ends C1a and C1a of the base material C1 are exposed.

Next, the first substrate supply device 40 will be described. FIG. 5 is a schematic external view showing an external appearance of a schematic configuration of the first base material supply device 40. In the figure, the first base material supply device 40 includes a pallet 41, a pallet index motor 42, a pallet transport conveyor 43, a lower flange conveyor 44, a pallet slider 45, a pallet stopper 46, and a transport loader 47. It is configured. The transport loader 47 includes a supply arm 47d and a base material suction unit 47c.
Is formed with at least one or more substrate mounting portions 41a on which the substrate B is mounted. In the present embodiment, 16 base materials B can be placed on the pallet 41.

In the above configuration, the pallet 41 is positioned at a predetermined mounting position by the pallet index motor 42. Then, the operator places the first thermoforming device 2 on the base material placing portion 41a of the pallet 41 which is positioned and stopped.
The substrate B to be transported to 0 is placed. When the placement of the base material B on the pallet 41 is completed, the pallet 41 is moved to the pallet transport conveyor 43 and the lower flange conveyor 44.
Is transported in the direction of arrow A in FIG. The transported pallet 41 is used as the first thermoforming device 2 of the first substrate supply device 40.
The pallet slider 45 moves to a predetermined stop position at this end, and the stopper 46
Fixed by

When the pallet 41 is fixed by the stopper 46, the transport loader 47 operates, and the transport loader 4
Substrate B placed on substrate placing portion 41a by the operation of 7
Will be carried into the molding device 23. The carrying-in operation into the molding device 23 is performed by the transfer
a Moves in the descending direction and approaches the pallet 41. Then, when the pallet 41 approaches the pallet 41 at a predetermined distance, the base material suction portion 47c operates to suck and hold the base material B placed on the base material placement portion 41a. When the base material B is held by the base material suction portion 47c, the transport loader 47 moves in the upward direction of the arrow 47a and also moves in the direction of the arrow 47b. As a result, when the supply arm 47d enters the inside of the molding device 23 and releases the suction of the base material B at a predetermined position, the base material B is released from the base material suction portion 47c, and the base material B is Will be carried in and set up.

FIG. 6A is a sectional view of the pallet 41 described above. In the same drawing, the pallet 41 has at least one or more substrate mounting portions 41a having a concave cross section,
Are mounted so as to be fitted in this concave shape. On the other hand, FIG. 6B is a schematic sectional view showing a section of the schematic configuration of the molding device 23. In FIG.
3 includes a pressurized empty box 23a having a predetermined plug, and a mold 23b capable of placing the base material B in the mold. The pressurized empty box 23a and the mold 23b Predetermined thermoforming is performed on the resin sheet S11 conveyed therebetween, and the base material B in which the resin sheet S11 is laminated and bonded to the upper surface B4 of the base material B placed in the mold can be generated. .

Here, in this embodiment, FIG.
As shown in (c), the pallet 41 has a substrate mounting portion 41a.
1 to 41a16 are formed.
a1 to 41a16 are each mold 2 of the molding die 23b.
3b1 to 23b16 are formed so as to correspond to each other. The structure in which the base material suction part 47c of the transport loader 47 sucks the base material B also has a structure in which the base material placement parts 41a1 to 41a are mounted.
16 are formed. Thereby, the base material B mounted on the base material mounting portions 41a1 to 41a16 is
While maintaining the positional relationship, the material is carried into the molding device 23 via the base material suction part 47c, and the molding die 23b
Are placed on each of the molds 23b1 to 23b16. Therefore, since the operator only has to place the base material B on the base material placing portions 41a1 to 41a16, the operation is simplified, and the position of the base material B is not disturbed during the transportation to the molding device 23. Therefore, it is possible to reliably carry the base material B into the molding device 23.

As will be described later, the second substrate supply device 5
Also at 0, the base material B is carried into the molding device 33 of the second thermoforming device 30 using the predetermined pallet 51. FIG.
(A) is a sectional view of the pallet 51. In the figure, a pallet 51 has at least one or more substrate mounting portions 51a having a convex cross section.
It is placed so as to fit into the convex shape of a.

On the other hand, FIG. 7B is a schematic cross-sectional view showing a cross section of a schematic configuration of the molding device 33. In the figure, a molding apparatus 33 comprises a pressurized empty box 33a and a molding die 3 having at least one or more dies for placing a base material B in the dies.
3b, and the base material B mounted on the base material mounting portion 51a described above is carried into the molding die 33b and installed therein. Then, predetermined thermoforming is performed on the resin sheet S21 conveyed between the pressurized empty box for molding 33a and the molding die 33b, and the resin sheet S is formed on the lower surface B5 of the base material B.
21 makes it possible to produce a laminated base material C laminated.

In this embodiment, as shown in FIG. 7 (c), the substrate placing portions 51a1 to 51a16 of the pallet 51
Are the dies 33b1 to 33b1 of the molding die 33b.
6 are formed so as to correspond to each other. The structure in which the base material suction portion 57c of the transport loader 57 described later sucks the base material B is also formed so as to correspond to the base material placement portions 51a1 to 51a16. Thereby, the base material B placed on the base material placing portions 51a1 to 51a16 is sucked by the base material sucking portion 57c and carried into the molding device 33 while maintaining its positional relationship, and the suction is released. Then, the base material B is placed on each of the molds 33b1 to 33b16 of the molding die 33b.

As described above, in the molding device 23 of the first thermoforming device 20, the upper surface B4 of the base material B is directed upward, and the resin sheet S11 is laminated and adhered thereon by thermoforming to form one side with the resin sheet S11. In step S12, the base material B laminated and bonded is generated, and in the second thermoforming apparatus 30, the lower surface B5 of the base material B is directed upward, and the resin sheet S21 is laminated and bonded by thermoforming from above. A substrate C is generated. Therefore, the upper surface B4 is connected to the resin sheet S1.
After the base material B laminated and bonded in 2 is generated,
When carrying the base material B into the forming device 33 of the second thermoforming device 30, the base material B must be inverted so that the lower surface B5 faces upward. Therefore, the second substrate supply device 5
No. 0 has a predetermined reversing device for reversing the substrate B.

Next, the second substrate supply device 50 will be described. FIG. 8 is a schematic external view showing an external appearance of a schematic configuration of the second base material supply device 50. In the figure, a second base material supply device 50 includes a pre-reversing transport device 50a, a post-reversing transport device 50b, and a post-reversing transport device 5a.
Reversing device 50c for reversing and moving substrate B to 0b
It is composed of In the above configuration, the transporting device 50a before reversing uses the transport loader 27 constituting the base material unloading device 27 to form the formed sheet S1 by the trimming device 24.
2 is supplied to the pallet 50a1.

Here, a base material suction portion 27a corresponding to the base material B to be trimmed is provided on the transport loader 27, and the trimming device 24 trims the base material by the operation of the supply arm 27b in the direction of the arrow. The supplied base material B is supplied to the pallet 50a1. When the supply of the base material B to the pallet 50a1 is completed, the feed motor 50a2 rotates. The ball screw 50a3 rotates with the rotation of the feed motor 50a2. The pallet 50a1 is placed on the pallet base 50a11 and the pallet base 51a11 is connected to the ball screw 50a3.
In accordance with the rotation operation of No. 3, it moves to the reversing device 50c side.

The pallet 50a moved to the reversing device 50c
1 is inverted by the inverting device 50c. Such reversal is
This is performed by the reversing motor 50c1. Pallet 50a
One side is fitted to the spline shaft 50c2, and the rotation axis of the reversing motor 50c1 coincides with the spline shaft 50c2. Therefore, the reversing motor 50
When c1 rotates in a direction to rotate the pallet 50c1 to the conveying device 50b side after reversing, the spline shaft 50c2 is rotated.
Rotates, and the pallet 50a1 is inverted to the side of the transport device 50b after being inverted by engagement with the spline shaft 50c2.

Here, in order to prevent the base material B placed on the pallet 50a1 from falling due to the reversal,
The suction fan 50a12 is provided on the pallet 50a1. The wind pressure generated by the operation of the suction fan 50a12 can pass in the direction in which the base material B is sucked to the pallet 50a1, and the base material B is held on the pallet 50a1 by the operation of the suction fan 50a12. The pallet pedestal 51a11 has a suction fan housing hole 51a13 for housing the suction fan 50a12.

Therefore, when the pallet pedestal 51a11 on which the pallet 50a1 is placed moves to the reversing device 50c, the suction motor 50c12 is operated while the reversing motor 50c is operated.
The c1 is rotated to invert the pallet 50a1. Thus, the base material B moves to the post-reversing transfer device 50b while being held on the pallet 50a1 by the suction fan 50c12.

The pallet 51 is arranged at a position where the pallet 50a1 is inverted in the post-reversal transfer device 50b.
When 1 is inverted, the operation stops. Then, pallet 5
The base material B placed on 0a1 is inverted and transferred to the pallet 51 while maintaining the placement positional relationship. The pallet 51 on which the base material B has been transferred moves the post-reversal transfer device 50b in the direction of arrow D in the drawing. Then, the base material B is placed on each mold of the molding die 33b of the molding device 33 based on the same operation as the above-described transport loader 47 by the transport loader 57.

Further, the second base material supply device 50 is provided with an inner surface forming defective carry-out shooter 52, and an operator monitors the base material B generated by the first thermoforming device 20 and detects a defect. When the pallet 50a1 is found, the pallet 50a1 is stopped at the position of the inner surface forming defective carry-out shooter 52, and the reversing motor 50c1 is rotated. Then, the base material B having the inner surface defect is taken into the inner surface forming defect discharge shooter 52 and collected. Needless to say, even in such a case, the suction fan 50a12 is appropriately operated.

The molding die 23b arranged in the molding device 23 of the first thermoforming device 20 can be appropriately changed according to the shape of the substrate B to be carried in.
As a result, the pressurized empty box for molding 23a is also changed. Further, when the molding die 23b is changed, the pallets 41, 50a1, and 51 arranged in the first substrate supply device 40 and the second substrate supply device 50 are placed on the molding die 23b. Will be changed to one having a shape corresponding to the shape and the number of base materials B. Of course, the molding device 33
The shape of the molding die 33b is also changed.

Here, in this embodiment, as shown in FIG. 9, the first base material supply device 40 carries the base material B into the forming device 23 with the pallet 41 based on the front end of the forming device 23. I do. Similarly, the second substrate supply device 50 includes:
The base material B is carried into the molding device 33 by the pallet 51 based on the front end of the molding device 33. On the other hand, the trimming device 24 arranges a receiving mold 23a and a Thomson mold 23b with a predetermined central axis X as a target axis, and the substrate extracting device 27 pallets the substrate B with respect to the central axis X. Take out to 50a1.

Therefore, when the molding die 23b is changed, the second base material supply device 50 moves the pallet 51a1 and the pallet pedestal 51a11 to the reversing device 50c by the pre-reversing transfer device 50a, and the predetermined positioning is performed. It is necessary to execute control. That is, when the molding dies 23b1 and 23b2 of different sizes are installed, the pallet 50a1 of the pre-reversing transfer device 50a becomes the pallet 50a1a when the molding die 23b1 is used and the pallet 50a1 when the molding die 23b2 is used. 50a1b.

In such a case, in the case of the pallet 50a1a,
The moving distance for the reversing device 50c is the moving distance Y1, and in the case of the pallet 50a1b, the moving distance for the reversing device 50c is the moving distance Y2. This moving distance Y1,
Since Y2 moves the base material B from the pallet 50a1 to the pallet 51 by the reversing device 50c, the Y2 needs to be positioned with high precision. In the present embodiment, a configuration is employed in which the ball screw 50a3 is connected to the feed motor 50a2 to control the movement of the pallet 50a1 and the pallet pedestal 50a11.

Next, FIG. 10 is a flow chart showing the contents of the substrate removing process realized by the operations of the transport loader 27, the scrap pulling device 25, and the scrap winding device 26. In addition, since the substrate removing process is the same in the substrate removing device 37 of the second thermoforming device 30, the transport loader 37 constituting the substrate supplying device 37 will also be described. In this case, the substrate pickup device 37 and the supply arm 37
b. In the figure, a formed sheet S1
Reference numerals 2 and 22 denote trimming devices 2 in a predetermined sheet conveying device.
4 and 34 (step S100), and stops at a position where the substrate B or the laminated substrate C can be trimmed (step S105).

Then, the supply arms 27b and 37b enter the trimming devices 24 and 34, and the base material suction unit 2
7a and 37a move toward the trimmed substrates B and C. Then, when the supply arm 27 moves to a predetermined position, the base material suction portions 27a and 37a operate, and the base materials B and C
Is absorbed (step S110). In this state, when the formed sheets S12 and S22 are pulled by the sheet pulling devices 25 and 35 (step S15), the base materials B and C are sucked and held by the base material suction portions 27a and 37a. , S22 (step S120).

As described above, the substrates B and C are formed on the molded sheet S1.
2, when it is separated from S22, the supply arms 27b, 37b
Moves and escapes from the trimming devices 24 and 34. Thereby, the base materials B and C are taken out from the trimming devices 24 and 34 (Step S125). On the other hand, this base material B,
In parallel with the unloading operation of C, the scrap winding device 2
6 and 36 are rotated, and the scrap sheets S13 and S23 generated by removing the base materials B and C from the formed sheets S12 and S22 are wound up and collected (Step S130).

In the present embodiment, the trimming device 24 arranged in the first thermoforming device 20 or the trimming device 34 arranged in the second thermoforming device 30 uses a predetermined Thomson mold, and this Thomson mold is used. Formed sheet S1
2, the base material B and the laminated base material C are trimmed from the molded sheets 12 and 22 by acting on S22. In such a case, the trimming press section needs a cushion function on the receiving side of the trimming blade on the receiving side of the trimming blade to absorb the shock when the trimming blade operates due to the nature of the die press and the crank drive.

Therefore, in this embodiment, a hydraulic cushion cylinder is used to realize this cushion function. Then, an air-hydro booster is connected to this hydraulic cushion cylinder, and when an overload of a predetermined value or more occurs in the hydraulic cushion cylinder during trimming, the air-hydro booster buffers the overload impact. That is, the function of the air-hydro booster complements the cushion function of the hydraulic cushion cylinder.

FIG. 11 is a schematic external view of the trimming devices 24 and 34 using such a hydraulic cushion cylinder. In the figure, the trimming devices 24 and 34 generally include an upper table 100, a lower table 101, a receiving mold 102, a Thomson mold 103, and a lower table 104.
, Drive device 105, hydraulic cushion cylinder 107
It is composed of The drive unit 105 is provided with a drive source (not shown), and the crankshaft 105b having one end fixed to the drive shaft 105a is rotated by the rotation of the drive shaft 105a of the drive source. With the rotation of the crankshaft 105b, the connecting shaft 105c movably connected to the other end of the crankshaft 105b rotates. This connecting shaft 105
The other end of c is connected to the lower table 104, and the lower table 104 moves up and down by the rotation of the connection shaft 105c.

A Thomson mold 103 is disposed on the upper surface of the lower table 104. When the lower table 104 is lifted, the Thomson mold 103 is substantially in contact with the receiving mold 102 disposed on the upper table 100. At this time, the formed sheets S12 and 22 are trimmed by the transport mechanism 107 into the trimming devices 23 and 3
Thomson mold 103 and receiving mold 1
The base material B or the laminated base material C is trimmed from the molded sheets S12 and S22 by the operation of substantially abutting with the base material 02.

In this embodiment, as described above, the upper table 100 is mounted on the hydraulic cushion cylinder 1 so that the pressing force applied to the upper table 100 due to the pressing force generated during trimming does not exceed a predetermined value.
When the Thomson mold 103 is substantially contacted with the receiving mold 102 by the vertical movement of the lower table 104, the impact of the substantial contact is buffered and absorbed. This hydraulic cushion cylinder 106 is used for the oil chamber 106 during the trimming operation.
b is supplied with oil from outside, and the oil supplied to the oil chamber 106b absorbs the impact of the cylinder 106a being pushed up by the upper table 100 from below in the figure. Further, when changing the shape of the receiving mold 102 disposed on the upper table 100, the oil in the oil chamber 106b is drawn in to the outside, and the cylinder 106a is moved upward in the figure. Then
Since the upper table 100 rises, the upper table 100
Then, the receiving mold 102 can be exchanged between the transfer mechanism 107 and the transfer mechanism 107.

The above-described cushion function of the hydraulic cushion cylinder 106
It becomes possible by connecting an air-hydro booster to the FIG. 12 shows a schematic configuration when an air-hydro booster is connected to the hydraulic cushion cylinder 106. In the figure, an air-hydro booster 200
Is a schematic diagram of the air-hydro cylinder 201 and the outer cylinder 20.
1a, and the vertical movement of the cylinder 106a of the hydraulic cushion cylinder 106 is controlled by the vertical movement of the air-hydro cylinder 201 inside the outer cylinder 201a. At this time, the vertical movement of the air-hydro cylinder 106a is executed by an air supply path 202 and an air supply path 203 serving as a supply path of a predetermined air pressure, and a supply path 204 serving as a supply path of oil from a predetermined converter.

That is, at the time of pressurization (when the cylinder 106a of the hydraulic cushion cylinder 106 is lowered), a predetermined air pressure is supplied from the air supply passage 202, and the air-hydro cylinder 201 is moved upward in the drawing. The oil supplied to the cylinder 200 is supplied to the cylinder 2
01 is supplied to the hydraulic cushion cylinder 106 with the rise of 01. The hydraulic cushion cylinder 106 absorbs the shock received from the upper table 100 during trimming by the supplied oil.

On the other hand, when the mold is changed (when the cylinder 106a of the hydraulic cushion cylinder 106 is raised), the air supply path 2
03, a predetermined air pressure is supplied, the air-hydro cylinder 201 is moved downward in FIG.
The oil supplied to 06 is drawn in. As a result, the cylinder 106a rises, and the mold receiving die 102 can be changed. Further, when an overload of a predetermined value or more is applied to the hydraulic cushion cylinder 106, the air-hydro cylinder 201 operates so as to be pushed down, so that the impact at the hydraulic cushion cylinder 106 is kept constant. That is, the air-hydro booster 200 has a complementary function of absorbing the impact applied to the hydraulic cushion cylinder 106.

As described above, when manufacturing the laminated base material C whose both surfaces are laminated and bonded by the resin sheets S11 and S21, the resin sheet S1 is placed on the upper surface B4 of the base material B.
A first thermoforming device 20 for performing lamination bonding of 1;
A second thermoforming device 30 for laminating and bonding the resin sheet S21 to the lower surface B5 of the base material B, and a second base material feeding device for feeding the base material B between the devices 20 and 30; The connection at 50 makes it possible to manufacture the laminated base material C by continuous operation of the apparatus.

The first and second base material supply devices 40 and 50 are connected to the molding dies 2 of the respective forming devices 23 and 33.
By disposing the pallets 41 and 51 corresponding to the pallets 3b and 33b, the base material B can be simply and accurately formed into the respective molding devices 23 and 3b.
3 can be supplied. Further, the first substrate supply device 40 and the second substrate supply device 50 to the respective molding devices 23,
33, a structure for supplying the base material B to the
By using the structure of 37 as a supply arm and a base material suction portion, the supply and supply of the base material can be performed while maintaining the positional relationship between the base material placed on the pallet or the base material and the laminated base material added to the molded sheet. It is possible to realize the removal of the base material and the laminated base material.

[Brief description of the drawings]

FIG. 1 is a schematic external view of a laminated base material manufacturing system according to an embodiment of the present invention.

FIG. 2 is an external view showing the external appearance of a base material.

FIG. 3 is a sectional view of a molded sheet S12 and a base material B.

FIG. 4 is a sectional view of a formed sheet S22 and a laminated base material C.

FIG. 5 is a schematic external view showing an external appearance of a schematic configuration of a first base material supply device 40.

FIG. 6 is a sectional view of a pallet 41 and the like.

FIG. 7 is a sectional view of a pallet 51 and the like.

FIG. 8 is a schematic external view showing an external appearance of a schematic configuration of a second base material supply device 50.

FIG. 9 is a schematic block diagram illustrating a mode of positioning control in the second base material supply device 50.

FIG. 10 is a flowchart showing processing contents of a base material removal processing.

FIG. 11 is a schematic external view of the trimming devices 24 and 34.

FIG. 12 is a schematic configuration diagram of a hydraulic cushion cylinder 106 and an air-hydro booster 200.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Laminated base material manufacturing system 20 ... 1st thermoforming apparatus 21 ... Roll sheet unwinding apparatus 22 ... Heating apparatus 23 ... Forming apparatus 24 ... Trimming apparatus 25 ... Scrap tensioning apparatus 26 ... Scrap winding apparatus 27 ... Substrate unwinding apparatus DESCRIPTION OF SYMBOLS 30 ... 1st thermoforming apparatus 31 ... Roll sheet unwinding apparatus 32 ... Heating apparatus 33 ... Forming apparatus 34 ... Trimming apparatus 35 ... Scrap tension apparatus 36 ... Scrap winding apparatus 37 ... Substrate unloading apparatus 40 ... 1st base material supply Apparatus 50: second substrate supply device S1: resin roll sheet S2: resin roll sheet S11: resin sheet S21: resin sheet S12: molded sheet S22: molded sheet S13: scrap sheet S23: scrap sheet

Continued on the front page (72) Inventor: Toshihiro Takai 158, Morakan, Kitayama, Ogo, Togo-cho, Aichi-gun, Aichi Prefecture Inside of 247 Asano Research Laboratories Co., Ltd. 247 of the ground F term in Asano Laboratory Co., Ltd. (reference) 4F208 AG01 AG03 MA08 MB02 MB19 MB22 MD10 MH06 MJ15 MW21 MW45

Claims (12)

[Claims] 1. A laminated base material manufacturing system for manufacturing a laminated base material in which a resin sheet is laminated and bonded to both surfaces of a base material formed in a substantially bowl-shaped concave shape, wherein a molding mechanism provided with a predetermined mold is used. A first thermoforming device for performing lamination of the resin sheet on one side of the base material by thermoforming, and a thermoforming process using a molding mechanism provided with a predetermined mold, thereby forming the resin on the other side of the base material. A second thermoforming device for performing sheet lamination and forming a laminated base material, connecting the first thermoforming device and the second thermoforming device, and one side supplied from the first thermoforming device is laminated. And a carry-in device for carrying the base material into the second thermoforming device. 2. The laminated base material manufacturing system according to claim 1, wherein the first thermoforming device includes a base material loading device that loads a substrate into a forming mechanism of the first thermoforming device. The mold of the molding mechanism of the first thermoforming device has a mold arrangement corresponding to each substrate capable of thermoforming a plurality of substrates in one shot, and the substrate loading device corresponds to this mold arrangement. A laminated substrate manufacturing system, comprising: a set plate jig. 3. The laminated base material manufacturing system according to claim 1, wherein the first thermoforming device is laminated on one side while maintaining a thermoformed positional relationship. A first trimming device for trimming the base material, the loading device is characterized in that one side trimmed by the first trimming device is loaded into the second thermoforming device the laminated base material. Laminated substrate manufacturing system. 4. The laminated base material manufacturing system according to claim 1, wherein the second thermoforming device trims the laminated base material while maintaining a thermoformed positional relationship. A laminated substrate manufacturing system, comprising: 5. The laminated base material manufacturing system according to claim 3, wherein the first thermoforming device recovers a base material having one side trimmed by the first trimming device and laminated on one side. The first substrate recovery device is provided with a substrate recovery device,
The first adsorption and desorption means that the trimmed one side adsorbs the laminated base material and separates from the resin sheet, and recovers the laminated base material on one side while maintaining the positional relationship when the separation is performed, It is provided with a first base material collecting means for supplying to the loading device, and a first resin sheet collecting means for collecting a resin sheet from which the base material one side of which has been laminated by the base material collecting means has been separated. Laminated substrate manufacturing system. 6. The laminated base material manufacturing system according to claim 4, wherein the second thermoforming device includes a second base material collecting device that collects the laminated base material trimmed by the second trimming device. The second base material recovery apparatus includes a second suction / separation unit that suctions the trimmed stacked base material and separates from the resin sheet, and recovers the stacked base material while maintaining the positional relationship when the separated base material is separated. A laminated base material manufacturing system, comprising: a second base material collecting means; and a second resin sheet collecting means for collecting a resin sheet from which the laminated base material has been separated by the base material collecting means. 7. The laminated base material manufacturing system according to claim 4, wherein the mold of the forming mechanism of the second thermoforming device is a mold of the forming mechanism of the first thermoforming device. In addition to having the same mold arrangement as the mold, the carry-in device has a plate jig corresponding to this mold arrangement, and while holding the positional relationship trimmed by the plate jig, the second thermoforming device is one-sided. A laminated substrate manufacturing system, characterized in that a substrate on which a side is laminated is carried in. 8. The laminated base material manufacturing system according to any one of claims 3 to 7, wherein the first and second trimming devices include a predetermined upper and lower table that can be driven up and down. A laminated base material manufacturing system, wherein a predetermined buffer mechanism for buffering an impact generated at the time of a trimming operation performed by driving the upper and lower tables is provided on one of the tables. 9. The laminated base material manufacturing system according to claim 8, wherein the buffer mechanism includes a predetermined hydraulic cylinder, and absorbs an impact generated during a trimming operation by leaking oil from the hydraulic cylinder. A laminated substrate manufacturing system, characterized in that: 10. The laminated base material manufacturing system according to claim 1, wherein the forming mechanisms of the first thermoforming device and the second thermoforming device are arranged above a predetermined mold. The heat-softened resin sheet is arranged and thermoformed, and the carry-in device is provided with a reversing device for reversing the base material having one side laminated in the first thermoforming device. Material production system. 11. The laminated base material manufacturing system according to any one of claims 7 to 10, wherein the carry-in device uses a plate jig of the carry-in device to form a base material of the second thermoforming device. When loading into the molding mechanism,
Mold arrangement of the mold that the molding mechanism of the second thermoforming device has,
A laminated base material manufacturing system, wherein the plate jig is positioned at a position where the mold arrangement of the plate jig substantially matches. 12. A method for producing a laminated base material in which both surfaces of a base material are laminated with a predetermined heat-softened resin sheet, the method comprising thermoforming with a molding mechanism having a predetermined mold. A first thermoforming step of laminating the resin sheet on one side of the base material, and an unloading step of unloading the base material having one side laminated from the first thermoforming step; One side is loaded with the laminated base material, and the resin sheet is placed on the other side of the base material with one side laminated in the first thermoforming step by thermoforming with a molding mechanism having a predetermined mold. And a second thermoforming step of forming a laminated base material by laminating the laminated base material.