JP2001148381A5 - - Google Patents

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Publication number
JP2001148381A5
JP2001148381A5 JP2000271569A JP2000271569A JP2001148381A5 JP 2001148381 A5 JP2001148381 A5 JP 2001148381A5 JP 2000271569 A JP2000271569 A JP 2000271569A JP 2000271569 A JP2000271569 A JP 2000271569A JP 2001148381 A5 JP2001148381 A5 JP 2001148381A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000271569A
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Japanese (ja)
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JP2001148381A (ja
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Publication date
Application filed filed Critical
Priority to JP2000271569A priority Critical patent/JP2001148381A/ja
Priority claimed from JP2000271569A external-priority patent/JP2001148381A/ja
Publication of JP2001148381A publication Critical patent/JP2001148381A/ja
Publication of JP2001148381A5 publication Critical patent/JP2001148381A5/ja
Pending legal-status Critical Current

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JP2000271569A 1999-09-07 2000-09-07 絶縁膜の形成方法及びその装置 Pending JP2001148381A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000271569A JP2001148381A (ja) 1999-09-07 2000-09-07 絶縁膜の形成方法及びその装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP25334899 1999-09-07
JP11-253348 1999-09-07
JP2000271569A JP2001148381A (ja) 1999-09-07 2000-09-07 絶縁膜の形成方法及びその装置

Publications (2)

Publication Number Publication Date
JP2001148381A JP2001148381A (ja) 2001-05-29
JP2001148381A5 true JP2001148381A5 (enrdf_load_html_response) 2007-12-20

Family

ID=26541154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000271569A Pending JP2001148381A (ja) 1999-09-07 2000-09-07 絶縁膜の形成方法及びその装置

Country Status (1)

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JP (1) JP2001148381A (enrdf_load_html_response)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7517751B2 (en) 2001-12-18 2009-04-14 Tokyo Electron Limited Substrate treating method
JP2005203730A (ja) * 2003-12-18 2005-07-28 Seiko Epson Corp 絶縁膜、半導体素子、電子デバイスおよび電子機器
JP4511307B2 (ja) 2004-02-10 2010-07-28 セイコーエプソン株式会社 ゲート絶縁膜、半導体素子、電子デバイスおよび電子機器
JP4992957B2 (ja) * 2004-02-10 2012-08-08 セイコーエプソン株式会社 絶縁膜、半導体素子、電子デバイスおよび電子機器
JP2015103551A (ja) * 2013-11-21 2015-06-04 旭化成エレクトロニクス株式会社 半導体装置及びその製造方法
JP6573578B2 (ja) 2016-05-31 2019-09-11 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置、およびプログラム
TWI764068B (zh) * 2019-01-11 2022-05-11 日商國際電氣股份有限公司 半導體裝置之製造方法、基板處理方法、基板處理裝置及程式
US11527407B2 (en) 2020-03-03 2022-12-13 Applied Materials, Inc. Vapor deposition of carbon-based films

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