JP2001135917A - Method for forming circuit pattern at curved body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance reliability and productivity. SOLUTION: A pattern seal 25 comprising a plastic sheet 22 with a circuit pattern 2 is formed, and then the pattern seal 25 is so laminated as to be wound around the outer perimeter of a pillar-like body 1a comprising prepreg. Then the pillar-like body 1a and the pattern seal 25 are bonded by applying pressure and heat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a circuit pattern on a curved body suitable for use in forming an electric circuit on an outer peripheral surface of a cylindrical body, for example.

[0002]

2. Description of the Related Art In recent years, circuit patterns have become more complicated as electronic devices become smaller, thinner and more sophisticated. As such an electronic device, a device in which a circuit pattern having a desired shape is formed on a curved surface as well as a flat surface in the device so as to have a function as a circuit board is known.

Heretofore, as a method of forming a circuit pattern of this type, a method in which a flexible substrate is attached to an outer peripheral surface of a columnar body with an adhesive or a double-sided adhesive tape has been adopted. Further, as a conventional method of forming a circuit pattern, a method of forming a metal layer by plating the outer peripheral surface of a columnar body and then performing an etching process on the metal layer is also employed.

[0004]

However, in the former case, since an adhesive or the like is interposed between the columnar body and the flexible substrate, the adhesive or the like does not function due to a change with time, and the flexible substrate is not used. Peels off from the columnar body,
There has been a problem that reliability is reduced. On the other hand, in the latter case, since a circuit pattern is formed by etching a metal layer on a curved surface, a large amount of time is required for work to improve the positional accuracy of the pattern, and productivity is reduced. There was a problem of lowering.

Japanese Patent Application Laid-Open No. 9-31460 discloses a prior art as "a method for locking a circuit transfer product and an electric circuit". Thus, the circuit pattern is transferred to the front surface of the transferred object by applying pressure and heat from the back surface of the base portion, and the above-mentioned problem has not been solved.

The present invention has been made in view of such circumstances, and a pattern seal having a plastic sheet with a circuit pattern is laminated on a curved body, and these are laminated by applying pressure and heat, thereby improving reliability. It is another object of the present invention to provide a method for forming a circuit pattern on a curved body that can increase productivity.

[0007]

According to a first aspect of the present invention, there is provided a method of forming a circuit pattern on a curved body, the method comprising forming a pattern seal having a plastic sheet with a circuit pattern. Then, after laminating this pattern seal so as to be wound around the curved surface of a curved body made of prepreg, the curved body and the pattern seal are bonded by applying pressure and heat. Therefore, the formation of the circuit pattern on the curved body is performed by laminating the pattern seal on the curved body, and pressing and heating these to adhere.

According to a second aspect of the present invention, in the method for forming a circuit pattern on a curved body according to the first aspect, the circuit pattern is formed by attaching a metal foil on a plastic sheet before winding the seal and etching the metal foil. The method is formed by applying Therefore, a circuit pattern is formed on the plastic sheet by performing an etching process on the metal foil on the flat plastic sheet before winding the seal.

According to a third aspect of the present invention, in the method for forming a circuit pattern on a curved body according to the second aspect, a metal foil is attached to a plastic sheet via an adhesive and a release agent. Therefore, the attachment of the metal foil is performed on the plastic sheet via the adhesive and the release agent.

The invention according to claim 4 is the invention according to claim 2 or 3.
In the method for forming a circuit pattern on a curved body described above, the pattern seal is a method in which a metal foil is brought into contact with the curved body and laminated. Therefore, the formation of the circuit pattern on the curved body is performed by bringing the metal foil of the pattern seal into contact with the curved body.

According to a fifth aspect of the present invention, in the method for forming a circuit pattern on a curved body according to the fourth aspect, the plastic sheet is removed from the curved body after pressing and heating. Therefore, when the plastic sheet is removed after pressurizing and heating the curved body and the pattern seal, the circuit pattern is exposed to the outside.

According to a sixth aspect of the present invention, there is provided a method of forming a circuit pattern on a curved body according to any one of the first to fifth aspects, wherein the base for forming the prepreg of the curved body is removed after laminating the pattern seal. There is. Therefore, if the base body for forming a prepreg having a curved surface is removed after the lamination of the pattern seal, the weight of the pattern formed product is reduced.

The invention according to claim 7 is the second or third invention.
In the method for forming a circuit pattern on a curved body described above, the pattern seal is a method in which a plastic sheet is brought into contact with the curved body and laminated. Therefore, the formation of the circuit pattern on the curved body is performed by bringing the plastic sheet of the pattern seal into contact with the curved body.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described.
This will be described with reference to the drawings. FIG. 1 is a perspective view showing a patterned columnar body obtained by the method for forming a circuit pattern on a curved body according to the first embodiment of the present invention. In FIG. 1, a patterned columnar member denoted by reference numeral 1 is formed by arranging a circuit pattern 2 on the outer peripheral surface of a columnar member 1a.

The columnar body 1a is formed by winding, for example, a glass yarn 4 around a cylindrical base 3, impregnating the glass yarn 4 with, for example, an epoxy resin, and curing the glass yarn 4 to such an extent that the epoxy resin has no fluidity. It is formed by a prepreg. The circuit pattern 2 is formed of a metal foil such as copper.

The circuit pattern 2 for the columnar body 1a
If it is necessary to consider the weight reduction of the circuit board after the formation, the base 3 is removed from the columnar body 1a. in this case,
The base 3 is preferably formed of, for example, a copper cylinder having a surface coated with a fluororesin. By doing so, the base 3 is not deformed in the pressurizing / heating step and is removed without adhering to the epoxy resin (impregnated resin) at the time of peeling after pressurizing / heating.

When it is necessary to consider the mechanical strength of the circuit board, the base 3 is not removed, and the circuit board functions as a reinforcing member for the columnar body 1a. In this case, the base 3 is preferably formed of, for example, an aluminum cylindrical body whose surface has been subjected to chromic acid treatment. By doing so, the base 3 is not deformed in the pressurizing / heating step, and good adhesion of the base 3 to the epoxy resin is obtained.

Next, a method of forming a circuit pattern on a curved body according to the first embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. FIG.
(D) and FIG. 3 are a cross-sectional view and a flow chart illustrating a method for forming a circuit pattern on a curved body according to the first embodiment of the present invention. The circuit pattern in the curved body shown in the present embodiment includes “formation of columnar body and pasting of metal foil”, “formation of pattern seal”, “wrapping of pattern seal and removal of release paper”, and “columnar body with circuit pattern”. Is formed sequentially.

[Formation of Column and Sticking of Metal Foil] First, the column 1a is formed by forming a glass yarn 4 on the outer peripheral surface of the base 3.
After winding (step SA1 in FIG. 3), the glass yarn 4 is impregnated with, for example, an epoxy resin (step SA2 in FIG. 3), and then cured until the epoxy resin no longer has fluidity (step SA1 in FIG. 3). SA3) Perform.

As shown in FIG. 2 (a), the adhesive 21 was previously glued (step S in FIG. 3).
B1) A release agent 23 is applied on a planar plastic sheet 22 made of PET or the like (Step SC1 in the figure), and a metal foil 24 such as copper is attached to the surface to which the release agent 23 is applied (Step SB2 in the figure). ).

In this case, the release agent 23 is a metal foil 2
4, the metal foil 24 does not peel off from the plastic sheet 22 (adhesive 21) at the time of the etching process in the next step, and the metal foil 24 does not peel off during the labeling (at the time of winding the pattern seal) after the etching process. For example, an acrylic release agent having an adhesive force that allows the sheet 22 to be peeled from the metal foil 24 is used.

"Formation of Pattern Seal" As shown in FIG. 2B, a metal foil 24 on the plastic sheet 22 is etched to form a pattern seal 25 having the circuit pattern 2 (FIG. 3 step). SB
3).

"Wrapping of Pattern Seal and Removal of Release Paper" First, the columnar body 1a and the pattern seal 25 are arranged in the labeling apparatus A with rollers a1 to a4 shown in FIG. 4 (step SD1 in FIG. 3). In this case, in FIG. 4, the columnar body 1a is mounted on a rotating shaft (not shown), and the pattern seal 25 is wound around the outer peripheral surface of the drum D1 together with the transport tape T by exposing the metal foil 24 to the outside.

Next, the labeling device A is driven, that is, the drum D2, the roller a1 and the columnar body 1a are rotated in the directions indicated by arrows in FIG. 4, respectively, so that the plastic sheet 22 is exposed to the outside of the columnar body 1a. The plastic sheet 22 is peeled off from the metal foil 24 and the release agent 23 while the pattern seal 25 is wound (step SD2 in FIG. 3) so that the plastic sheet 22 is removed as shown in FIG. The columnar body 11 with a seal is formed.

In this case, if the final product (circuit board) does not require mechanical strength and weight reduction needs to be considered, the columnar member 11 with a pattern seal shown in FIG.
By applying a pressing force to the base 3 in the axial direction, a column 51 with a pattern seal is formed as shown in FIG. 5 in which the base 3 is removed from the column 11 with a pattern seal.

In order to wind the pattern seal 25 in the state shown in FIG. 2 (b) around the columnar body 1a, the pattern seal 25 is set so that the longitudinal direction of the circuit pattern 2 is parallel to the axial direction of the columnar body 1a. This is performed by repositioning by 90 °.

"Formation of Columnar Body with Circuit Pattern"
The columnar body 11 with the pattern seal is housed in a pressurized chamber (not shown) and is pressurized and heated (step SD in FIG. 3).
3) By doing so, the metal foil 24 (circuit pattern 2) is bonded to the columnar body 1a. In this case, the pressure and temperature in the pressurized chamber are determined by disposing a heating device in the pressurized chamber. Next, by releasing the release agent 23 from the circuit pattern 2, the patterned columnar body 1 as a final product is formed as shown in FIG. 2D.

Therefore, in this embodiment, the pattern seal 25 having the plastic sheet 22 with the circuit pattern 2 is laminated on the prepreg columnar member 1a.
Since these are bonded by pressurizing and heating, the adhesiveness is not lost due to aging as in the conventional case, and the occurrence of peeling of the circuit pattern portion from the columnar body 1a can be prevented.

In this embodiment, since the circuit pattern 2 is formed by etching the metal foil 24 on the flat surface (plastic sheet 22), the work time for improving the positional accuracy of the pattern is reduced. Can be shortened.

Next, a second embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. FIG. 6 is a perspective view showing a patterned columnar body obtained by the method for forming a circuit pattern on a curved body according to the second embodiment of the present invention. In the figure, a pattern columnar member denoted by reference numeral 61 is formed by disposing a pattern seal 62 having a circuit pattern 62a on the outer peripheral surface of the columnar member 61a.

The columnar body 61a is formed by winding a glass yarn 64 around a cylindrical base 63, for example.
After being impregnated with, for example, an epoxy resin, the epoxy resin is cured by a prepreg formed so as to have no fluidity.

The pattern seal 62 is formed, for example, by attaching a metal foil such as copper to a fluororesin plastic sheet with an adhesive and a release agent, and then performing an etching process on the metal foil.

Next, a method of forming a circuit pattern on a curved body according to a second embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. FIGS. 7A to 7C are cross-sectional views illustrating a method for forming a circuit pattern on a curved body according to the second embodiment of the present invention. As in the first embodiment, the circuit pattern in the curved body shown in the present embodiment includes “formation of a columnar body and attachment of a metal foil”, “formation of a pattern seal”, and “ It is formed through the steps of “forming” sequentially.

[Formation of Columns and Sticking of Metal Foil] The columns 61a are formed by first winding a glass yarn 64 around the outer periphery of a base 63, and then impregnating the glass yarn 64 with, for example, an epoxy resin. After that, the epoxy resin is cured to the extent that fluidity is lost.

As shown in FIG. 7A, the metal foil is applied by applying a release agent 73 on a fluororesin-based plastic sheet 72 on which an adhesive 71 has been pasted. This is performed by attaching a metal foil 74 such as copper to the application surface of 73.

[Formation of Pattern Seal] As shown in FIG. 7B, a metal foil 74 on a plastic sheet 72 is subjected to an etching process to form a pattern seal 62 having a circuit pattern 62a.

"Wrapping of Pattern Seal and Formation of Patterned Pillar" After winding the pattern seal 62 around the outer peripheral surface of the pillar 61a so that the circuit pattern 62a is exposed to the outside, these are wound in the same manner as in the first embodiment. A pattern seal 62 is adhered to the columnar body 61a by being housed in a pressure chamber (not shown) and pressurized and heated.
As shown in (c), a columnar body 61 with a pattern is formed.

In order to wind the pattern seal 62 in the state shown in FIG. 7 (b) around the column 61a, the pattern seal 62 is set so that the longitudinal direction of the circuit pattern 62a is parallel to the axial direction of the column 61a. This is performed by repositioning by 90 °.

Therefore, in the present embodiment, the pattern seal 62 having the plastic sheet 72 with the circuit pattern 61a is laminated on the prepreg columnar body 61a, and these are adhered by applying pressure and heat. As in the case of the embodiment, the occurrence of peeling of the circuit pattern portion from the columnar body 61a can be prevented, and the operation time for improving the positional accuracy of the pattern can be shortened.

In each embodiment, the case where the circuit pattern is formed on the curved surface of the columnar body has been described.
The present invention is not limited to this, and other curved bodies can be formed in the same manner as in each embodiment. In this case, the pattern seal is wound around the curved surface of the curved body by using a labeling device and rotating the curved body as in the case of winding the pattern seal around the curved surface of the columnar body.

[0041]

As described above, according to the present invention, the formation of a circuit pattern on a curved body is performed by laminating a pattern seal on the curved body and applying pressure and heat to bond them. As in the conventional case, the adhesiveness is not lost due to a change over time, the occurrence of peeling of the circuit pattern portion from the curved body can be prevented, and the reliability can be improved.

Further, since the circuit pattern is formed on the plastic sheet before the pattern seal is wound around the curved surface of the curved body, the work time for improving the positional accuracy of the circuit pattern can be reduced, and the production time can be reduced. It can also enhance the character.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a patterned columnar body obtained by a method for forming a circuit pattern on a curved body according to a first embodiment of the present invention.

FIGS. 2A to 2D are cross-sectional views illustrating a method for forming a circuit pattern on a curved body according to the first embodiment of the present invention.

FIG. 3 is a flowchart illustrating a method for forming a circuit pattern on a curved body according to the first embodiment of the present invention.

FIG. 4 is a plan view showing a labeling apparatus used for performing a method of forming a circuit pattern on a curved body according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view showing another columnar body obtained by a method of forming a circuit pattern on a curved body according to the first embodiment of the present invention.

FIG. 6 is a perspective view showing a patterned columnar body obtained by a method of forming a circuit pattern on a curved body according to a second embodiment of the present invention.

FIGS. 7A to 7C are cross-sectional views illustrating a method for forming a circuit pattern on a curved body according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pillar with pattern 1a Pillar 2 Circuit pattern 3 Base 4 Glass yarn 11 Pillar with pattern seal 21 Adhesive 22 Plastic sheet 23 Release agent 24 Metal foil 25 Pattern seal

Claims (7)

[Claims] 1. A pattern seal having a plastic sheet with a circuit pattern is formed, and then the pattern seal is laminated so as to be wound around a curved surface of a prepreg. A method for forming a circuit pattern on a curved body, wherein the circuit pattern is adhered by applying pressure and heat. 2. The circuit pattern according to claim 1, wherein the circuit pattern is formed by attaching a metal foil on the plastic sheet and performing an etching process on the metal foil. Forming method. 3. The method for forming a circuit pattern on a curved body according to claim 2, wherein the metal foil is pasted on the plastic sheet via an adhesive and a release agent before the seal is wound. 4. The method for forming a circuit pattern on a curved body according to claim 2, wherein the pattern seal is laminated by bringing the metal foil into contact with the curved body. 5. The method for forming a circuit pattern on a curved body according to claim 4, wherein the plastic sheet is removed from the circuit pattern after pressing and heating. 6. The method for forming a circuit pattern on a curved body according to claim 1, wherein the base for forming the prepreg of the curved body is removed after laminating the pattern seal. 7. The method for forming a circuit pattern on a curved body according to claim 2, wherein the pattern seal is laminated by bringing the plastic sheet into contact with the curved body.