JP2001118674A - Organic electroluminescent display device - Google Patents

Organic electroluminescent display device

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Publication number
JP2001118674A
JP2001118674A JP29658599A JP29658599A JP2001118674A JP 2001118674 A JP2001118674 A JP 2001118674A JP 29658599 A JP29658599 A JP 29658599A JP 29658599 A JP29658599 A JP 29658599A JP 2001118674 A JP2001118674 A JP 2001118674A
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JP
Japan
Prior art keywords
film
organic el
sealing
display device
substrate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP29658599A
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Japanese (ja)
Inventor
Tatsuo Tamagawa
達男 玉川
Original Assignee
Auto Network Gijutsu Kenkyusho:Kk
Sumitomo Electric Ind Ltd
Sumitomo Wiring Syst Ltd
住友電気工業株式会社
住友電装株式会社
株式会社オートネットワーク技術研究所
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Application filed by Auto Network Gijutsu Kenkyusho:Kk, Sumitomo Electric Ind Ltd, Sumitomo Wiring Syst Ltd, 住友電気工業株式会社, 住友電装株式会社, 株式会社オートネットワーク技術研究所 filed Critical Auto Network Gijutsu Kenkyusho:Kk
Priority to JP29658599A priority Critical patent/JP2001118674A/en
Publication of JP2001118674A publication Critical patent/JP2001118674A/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • H01L51/5243Sealing arrangements having a self-supporting structure, e.g. containers the sealing arrangements being made of metallic material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5253Protective coatings
    • H01L51/5256Protective coatings having repetitive multilayer structures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5259Passivation; Containers; Encapsulation, e.g. against humidity including getter material or desiccant

Abstract

PROBLEM TO BE SOLVED: To obtain a flexible film organic electroluminescent(EL) display device with a sealed EL element. SOLUTION: The organic EL display device 4 has an EL element 6 deposited on a flexible film transparent substrate 5 and a flexible film sealant 7 is adhered to the transparent substrate 5 so as to cover and seal the EL element 6.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、各種表示に用いられる有機EL表示装置に関し、特に可撓性を有するフィルム状に形成された有機EL表示装置に関する。 The present invention relates to relates to an organic EL display device used in various displays, an organic EL display device formed into a film having a particularly flexible.

【0002】 [0002]

【従来の技術】従来の有機EL表示装置は、透明基板上に有機EL素子が形成され、この有機EL素子を密封するようにしてガラスカバー(封止部)が透明基板上に固定されており、これにより、有機EL素子が外部の空気や水蒸気と接触しないように保護されていた。 Conventional organic EL display device, organic EL elements are formed on a transparent substrate, a glass cover so as to seal the organic EL element (the sealing portion) is fixed on a transparent substrate , Thus, the organic EL element is protected so as not to contact with the outside air and water vapor.

【0003】 [0003]

【発明が解決しようとする課題】しかしながら、かかる有機EL表示装置では、封止部材としてガラスカバーを用いているため、有機EL表示装置自体の可撓性が損なわれるという問題を有していた。 [SUMMARY OF THE INVENTION However, in such an organic EL display device, due to the use of glass cover as a sealing member, has a problem that flexibility of the organic EL display device itself is impaired.

【0004】そこで、この発明の課題は、有機EL素子を密封して保護する際の気密性および水密性を損なうことなく可撓性のあるフィルム状に形成された有機EL表示装置を提供することにある。 [0004] An object of the present invention is to provide a flexible organic EL display device formed into a film with without sacrificing airtightness and watertightness in protecting and sealing the organic EL device It is in.

【0005】 [0005]

【課題を解決するための手段】上記課題を解決するためには、この発明は、その一面側に有機EL素子が成膜された可撓性フィルム状の透明基板と、前記有機EL素子を密閉するように前記透明基板上に固定された可撓性フィルム状の封止部とを備えるものである。 To solve the above object, according to an aspect of the present invention is sealed with a flexible film-like transparent substrate of the organic EL element is formed on one surface thereof, said organic EL device wherein those comprising a flexible film-like sealing portion which is fixed on a transparent substrate so as to.

【0006】この場合、前記封止部は、金属箔、若しくは、ポリマーフィルムと金属膜とを少なくとも2層以上交互に積層したもの、又は、気密性及び水密性を有するように表面処理したポリマーフィルムにより形成されることが望ましい。 [0006] In this case, the sealing portion is a metal foil, or which the polymer film and the metal film are laminated alternately at least two layers, or polymeric films surface treated to have airtightness and watertightness it is desirable to be formed by.

【0007】また、前記透明基板と前記封止部とがシート状に一体的に形成されて、前記封止部が前記有機EL Further, the transparent substrate and the sealing portion are integrally formed into a sheet, the sealing portion of the organic EL
素子上に折り返されるようにして前記透明基板上に固定されるようにしてもよい。 So as to be folded back on the device may be secured on the transparent substrate.

【0008】その際、前記透明基板と前記封止部とで密閉される空間内に、乾燥剤が封入されることが望ましい。 [0008] At this time, in a space sealed between the transparent substrate and the sealing unit, the drying agent are desirably sealed.

【0009】 [0009]

【発明の実施の形態】以下、本発明の第1実施形態を図1及び図2に基づいて説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, will be explained based on the first embodiment of the present invention in FIGS. 図1は、本発明の第1 Figure 1 is a first aspect of the present invention
実施形態に係る有機EL表示装置の断面図であり、図2 Is a cross-sectional view of an organic EL display device according to the embodiment, FIG. 2
は、その有機EL表示装置に用いられる封止部の断面図である。 Is a cross-sectional view of the sealing part to be used in the organic EL display device.

【0010】この実施形態に係る有機EL表示装置4 [0010] The organic EL display device 4 according to this embodiment
は、図1に示すように、透明で可撓性を有するフィルム基板(透明基板)5と、フィルム基板5上に成膜された有機EL素子6と、この有機EL素子6を覆い隠すように密閉(密封)してフィルム基板5上に固定された可撓性を有する封止フィルム(封止部)7とを備えて主構成される。 As shown in FIG. 1, a film substrate (transparent substrate) 5 having a transparent flexible, the organic EL device 6 which is formed on the film substrate 5, so as to cover the organic EL device 6 closed (sealed) mainly constituted by a sealing film (sealing portion) 7 having a fixed flexible on the film substrate 5.

【0011】フィルム基板5は、フィルム基板本体を形成する第1のポリマーフィルム10の表面に、気密性及び水密性を有する第2のポリマーフィルム11を塗付あるいは貼着するか又は気密性及び水密性を有するようにフッ素、シリカ、アルミナなどの表面処理がなされて構成される。 [0011] film substrate 5, the surface of the first polymeric film 10 to form the film substrate body, or coated with or bonded to a second polymeric film 11 having air tightness and water-tightness or airtightness and watertightness fluorine to have sex, silica, and is made a surface treatment such as alumina.

【0012】第1のポリマーフィルム10には、例えば、ポリエステル、ポリビニルアルコール、ポリアリレート、ポリエーテルスルホン、ポリカーボネート、ポリエチレンテレフタレート、ポリプロピレンなどの部材により透明で可撓性のあるフィルム状に形成されたものが使用され、第2のポリマーフィルム11には、各種ガスバリアポリマー、例えばポリエチレンナフタレート(P [0012] The first polymeric film 10, for example, polyester, polyvinyl alcohol, polyarylate, polyether sulfone, polycarbonate, polyethylene terephthalate, those formed into a film with a transparent flexible by members such as polypropylene There are used, the second polymer film 11, various gases barrier polymers, such as polyethylene naphthalate (P
EN)などの部材により透明で可撓性のあるフィルム状に形成されたものが使用される。 EN) those formed into a film with a transparent flexible by members such as are used. この実施形態では、第2のポリマーフィルム11は、第1のポリマーフィルム10の例えば上面12に塗付あるいは接着されていたり、第1のポリマーフィルム10中に含有されており、 In this embodiment, the second polymer film 11 is, for example or is Nurizuke or bonded to the upper surface 12 of the first polymer film 10, which is contained in the first polymer film 10,
この第2のポリマーフィルム11によりフィルム基板5 Film substrate 5 by the second polymeric film 11
の気密性及び水密性の向上が図られている。 Improvement in airtightness and watertightness of is achieved. また、第2 In addition, the second
のポリマーフィルム11の代わりに、第1のポリマーフィルム10へフッ素、シリカ、アルミナを蒸着させガスバリア性を高めることも考えられる。 Instead of the polymer film 11, the first polymer film 10 fluorine, silica, it is conceivable to increase the gas barrier properties by depositing alumina.

【0013】有機EL素子6は、例えば、フィルム基板5の上面(図1では、第2のポリマーフィルム11の上面)に、陽極として例えばインジウム錫酸化物(IT [0013] The organic EL device 6 is, for example, (in FIG. 1, the upper surface of the second polymer film 11) the upper surface of the film substrate 5, for example indium tin oxide as the anode (IT
O)によって透明電極層15を形成した上に、バッファ層16(ホール輸送層)、発光層17及び陰極層18が順に積層されて全体として膜状に形成される。 On the formation of the transparent electrode layer 15 by O), the buffer layer 16 (hole transporting layer), the light emitting layer 17 and cathode layer 18 is formed like a film as a whole are stacked in this order.

【0014】封止フィルム7は、例えばアルミ、銅又はチタンのいずれかによって金属箔21に形成されており(図2(a))、この封止フィルム7の内側面30の例えば全面に絶縁膜22が形成され、この絶縁膜22の下面31に局所的に乾燥剤層23が形成される。 [0014] sealing film 7, for example aluminum, by any of the copper or titanium are formed on the metal foil 21 (FIG. 2 (a)), an insulating film, for example, the entire surface of the inner side surface 30 of the sealing film 7 22 is formed, locally desiccant layer 23 on the lower surface 31 of the insulating film 22 is formed.

【0015】そして、かかる封止フィルム7は、乾燥剤層23を内側に向けて、有機EL素子6を覆い隠すように、絶縁膜22の下面31の周縁部分がフィルム基板5 [0015] Then, according sealing film 7, the desiccant layer 23 inwardly, so as to cover the organic EL device 6, the peripheral portion is a film substrate 5 of the lower surface 31 of the insulating film 22
の上面(第2のポリマーフィルム11の上面)の有機E Organic E of the upper surface of the (top surface of the second polymer film 11)
L素子6の周辺部分(接着部分)14に接着剤により固定される。 Peripheral portion of the L element 6 is secured by adhesive (adhesive portion) 14. かかる封止フィルム7とフィルム基板5とにより密閉された密閉空間13に、有機EL素子6及び乾燥剤層23が封入されることとなる。 In such sealing film 7 and the film sealed space 13 which is sealed by the substrate 5, the organic EL device 6 and the drying agent layer 23 is to be sealed. その際、密閉空間13から後述するようにして空気及び水(湿気)が取り除かれて、この密閉空間13は真空状態にして密閉される。 At that time, it has been removed air and water (moisture) is as described below from the enclosed space 13, enclosed space 13 is sealed in the vacuum state.

【0016】この状態で、絶縁膜22は、金属箔21として形成された封止フィルム7を介して陰極18と陽極15とが電気的に接触することを防止しており、乾燥剤層23は、フィルム基板5や封止フィルム7を通して密閉空間13に入り込む水(湿気)およびフィルム基板5 [0016] In this state, the insulating film 22, a cathode 18 and anode 15 through the sealing film 7 formed as a metal foil 21 is prevented from being in electrical contact, the desiccant layer 23 is water entering the enclosed space 13 through the film substrate 5 and the sealing film 7 (moisture) and the film substrate 5
と封止フィルム7との接着部分14から密閉空間13に入り込む水(湿気)を吸着し、密閉空間13内から湿気を効果的に除去するものである。 And adsorbs water (moisture) entering from the bonded portion 14 into the sealed space 13 between the sealing film 7, in which effectively removes moisture from the enclosed space inside 13.

【0017】また、このような真空状態に密閉する方法として、フィルム基板5と封止フィルム7との接着部分14の一部を接着せずに、小さな隙間を開けておき、その隙間から図示しない吸引パイプを介して、密閉空間1 Further, as a method for sealing such a vacuum, without the adhesive part of the adhesive portion 14 of the film substrate 5 and the sealing film 7, leave open a small gap, not shown, from the gap via a suction pipe, sealed space 1
3に残留している空気および水(湿気)を吸い出した後、吸引パイプを取ってその隙間を貼着すればよい。 After sucked out air and water (moisture) remaining on the 3, it may be attached to the gap taking the suction pipe.

【0018】以上のように構成された有機EL表示装置4によれば、有機EL素子6が成膜されたフィルム基板5および封止フィルム7が共に可撓性のあるフィルム状に形成されているため、装置4全体としてフィルム状に薄く構成でき、可撓性を持たせることができる。 According to the organic EL display device 4 configured as described above, the film substrate 5 and the sealing film 7 in which the organic EL device 6 is formed is formed on both flexible film-like Therefore, device 4 can be thin in the overall film form, can have flexibility.

【0019】さらに、フィルム基板5には、第1のポリマーフィルム10の表面に気密性及び水密性がある第2 Furthermore, the film substrate 5, first the surface of the first polymeric film 10 is airtight and watertight 2
のポリマーフィルム11を設けると共に、封止フィルム7には気密性及び水密性がある金属箔21が用いられているため、空気や水(湿気)に対する透過性が強力に押さえられ、陰極18及び発光層17が空気(酸素)や水(湿気)により劣化することを防止できる。 With the provision of the polymer film 11, the metal foil 21 that is airtight and watertight to the sealing film 7 is used, permeability strongly pressed against an air or water (moisture), a cathode 18 and emission possible to prevent the layer 17 deteriorated by the air (oxygen) or water (moisture).

【0020】さらに、封止フィルム7とフィルム基板5 Furthermore, the sealing film 7 and the film substrate 5
とで密閉される密閉空間13は、空気および水(湿気) Closed space 13 which is sealed in a can, air and water (moisture)
が取り除かれ真空状態にして密閉されるため、有機EL Since is sealed in a vacuum state is removed, the organic EL
素子6が空気や水(湿気)と接触しないように保護でき、陰極18が劣化することを防止できる。 Element 6 can be protected from contact with air or water (moisture), it is possible to prevent the cathode 18 is deteriorated.

【0021】さらに、封止フィルム7の内側面30に乾燥剤層23が設けられているため、水(湿気)が、フィルム基板5や封止フィルム7を通して密閉空間13に入り込んだり、フィルム基板5と封止フィルム7との接着部分14から密閉空間13に入り込んだとしても、乾燥剤層23によって吸着されるため、陰極18を効果的に水蒸気から保護できる。 Furthermore, since the desiccant layer 23 is provided on the inner surface 30 of the sealing film 7, water (moisture) is intrude into the sealed space 13 through the film substrate 5 and the sealing film 7, the film substrate 5 and even it entered from the adhesive portion 14 of the sealing film 7 on the closed space 13, to be adsorbed by the desiccant layer 23, to protect the cathode 18 from effectively steam.

【0022】なお、この実施形態では、封止フィルム7 [0022] Incidentally, in this embodiment, the sealing film 7
として金属箔21を用いた場合で説明したが、金属箔2 The metal foil 21 has been described in the case of using as the metal foil 2
1を用いる場合に限るものではなく、例えば、図2 Not limited to the case of using 1, for example, FIG. 2
(b)に示すように、フィルム基板5と同じ部材である第1のポリマーフィルム10に第2のポリマーフィルム11を接着したポリマーフィルム26を使用しても良く、或いは、図2(c)に示すように、フィルム基板5 (B), the may be used a polymer film 26 adhered to the second polymeric film 11 to the first polymer film 10 is the same member as the film substrate 5, or in FIG. 2 (c) as shown, the film substrate 5
に使用した第1のポリマーフィルム10の表面に、例えばアルミ、銅又はチタンなどの金属膜24を蒸着した金属膜付きポリマーフィルム27や、図2(d)に示すように、金属膜24の両面側に第1のポリマーフィルム1 The first surface of the polymer film 10 used for, for example, aluminum, a metal film with a polymer film 27 and the metal film 24 was deposited, such as copper or titanium, as shown in FIG. 2 (d), both surfaces of the metal film 24 first polymer film to the side 1
0を積層した金属膜サンドイッチフィルム28を用いても良く、図示しないが、ポリマーフィルム10と金属膜24とを少なくとも3層以上交互に積層して形成したものを用いても良い。 0 may be used a metal film sandwich film 28 formed by laminating, although not shown, may be used after forming the polymer film 10 and the metal film 24 by alternately laminating at least three layers or more. これらを用いることによっても空気や水(湿気)の透過性を充分に押さえることができる。 These can be suppressed sufficiently permeable air and water (moisture) by using.
なお、ポリマーフィルム26においては、第2のポリマーフィルム11の代わりに、第2のポリマーフィルム1 In the polymer film 26, in place of the second polymer film 11, a second polymeric film 1
1と同じ部材(ポリエチレンテレフタレート、テフロン)から成るポリマー溶液を塗布しても良い。 1 and the same member (polyethylene terephthalate, Teflon) polymer solution consisting of may be applied.

【0023】また、この実施形態では、絶縁膜22を封止フィルム7の内側面30に設けた場合で説明したが、 Further, in this embodiment, it has been described in the case in which the insulating film 22 on the inner surface 30 of the sealing film 7,
必ずしも封止フィルム7の内側面30に限定するものではなく、陰極18と陽極15が封止フィルム7により電気的に接触することを防止できればどこに配置しても良く、例えば、有機EL素子6を覆うように有機EL素子6側に配置させてもよい。 Is not necessarily limited to the inner surface 30 of the sealing film 7 may be the cathode 18 and the anode 15 is placed anywhere as long prevent electrical contact by the sealing film 7, for example, an organic EL element 6 it may be disposed in the organic EL device 6 side to cover.

【0024】また、この実施形態では、封止フィルム7 Further, in this embodiment, the sealing film 7
として金属箔21を用いた場合で説明したので、金属箔21により陰極18と陽極15とが電気的に接触しないように絶縁膜22を設けたが、封止フィルム7として、 When using a metal foil 21 so described as, but the cathode 18 and the anode 15 is provided with an insulating film 22 so as not to electrically contact the metal foil 21, as a sealing film 7,
図2(b)又は(d)に示したポリマーフィルム26や金属膜サンドイッチフィルム28等のように、封止フィルム7の内側面が非導伝部材で形成される場合は、絶縁膜22は必ずしも必要としない。 As the polymer film 26 and a metal film sandwiched films 28 or the like shown in FIG. 2 (b) or (d), if the inner surface of the sealing film 7 is formed by Hishirubeden member, the insulating film 22 is not always do not need.

【0025】また、この実施形態では、乾燥剤層23を封止フィルム7側(絶縁膜22の下面31)に設けたが、必ずしも封止フィルム7側に設けるものに限定するものではなく、フィルム基板5と封止フィルム7とで密閉された密閉空間13内に配置されれば、どのように配置しても構わない。 Further, in this embodiment, is provided with the drying agent layer 23 to the sealing film 7 side (the lower surface 31 of the insulating film 22), it is not necessarily limited to those provided in the sealing film 7 side, the film if the substrate 5 and the sealing film 7 and sealed disposed in the sealed space 13, the may be disposed how.

【0026】また、この実施形態では、第2のポリマーフィルム11を第1のポリマーフィルム10の上面12 Further, in this embodiment, the upper surface 12 of the second polymer film 11 first polymer film 10
に設けるようにしたが、その下面12aに設けても良く、或いは、上面12および下面12aの両方に設けても良い。 Was so provided, it may be provided on a lower surface 12a, or may be provided on both the upper surface 12 and lower surface 12a.

【0027】また、この実施形態では、フィルム基板5 Further, in this embodiment, the film substrate 5
は、空気、水(湿気)の透過性を押さえるために、第1 In order to suppress the permeability of air, water (moisture), first
のポリマーフィルム10の表面に、気密性及び水密性をを有した第2のポリマーフィルム11を接着したが、同じ部材(ポリエチレンテレフタレート、テフロン)から成るポリマー溶液を第2のポリマーフィルム11の代わりに塗布して形成しても良い。 Of the surface of the polymer film 10 has been bonded to second polymeric film 11 having a airtightness and water-tightness, the same member (polyethylene terephthalate, Teflon) polymer solution consisting in place of the second polymer film 11 coated may be formed.

【0028】また、この実施形態では、封止フィルム7 Further, in this embodiment, the sealing film 7
が接着材によりフィルム基板5に接着される場合で説明したが、接着材の代わりに、加熱により融化又は硬化して接着機能を発揮するポリマー層を絶縁膜22の内側面31上の全面に形成しておき、加熱・圧着することにより、そのポリマー層を有機EL素子6の表面(上面及び周側面)及びフィルム基板5上の有機EL素子6の周囲部分14にかけて密着させて、封止フィルム7をフィルム基板5に隙間無く密閉接着するようにしてもよい。 Formed but There has been described the case to be bonded to the film substrate 5 by an adhesive, instead of the adhesive, the polymer layer exhibits an adhesive function infusible or cured to the heating over the whole surface of the inner surface 31 of the insulating film 22 ; then, by heating and pressure bonding, it makes good contact with the polymer layer over the peripheral portion 14 of the surface (upper surface and the peripheral side surface) and the film substrate 5 on the organic EL device 6 of the organic EL device 6, the sealing film 7 to the film substrate 5 may be no gap sealing adhesive.

【0029】次に、この発明の第2実施形態について説明する。 Next, a description of a second embodiment of the present invention.

【0030】この実施形態に係る有機EL表示装置4a The organic EL display device 4a according to this embodiment
は、図3に示すように、密閉フィルム30と、密閉フィルム30により密閉された有機EL素子6とから主構成される。 As shown in FIG. 3, the sealing film 30, the main consists of a sealed organic EL device 6 which the sealing film 30. なお、図3において第1実施形態と同一部分については同一符号を付して説明を省略する。 Incidentally, the description thereof is omitted same symbols are first embodiment the same parts in FIG.

【0031】密閉フィルム30は、フィルム状で可撓性及び透明性を有するもので、第1実施形態における第1 The sealing film 30 is one having the flexibility and transparency in the film-like, first in the first embodiment
のポリマーフィルム10の表面40に第2のポリマーフィルム11を接着することにより表面処理して構成される。 On the surface 40 of the polymer film 10 constituted by a second polymer film 11 to a surface treatment by adhering. 第2のポリマーフィルム11を第1のポリマーフィルム10に貼り付けることにより、密閉フィルム30の気密性及び水密性の向上が図られる。 By pasting the second polymeric film 11 to the first polymer film 10, improving the air tightness and water tightness of the sealing film 30 is achieved.

【0032】かかる密閉フィルム30は、第1実施形態におけるフィルム基板5および封止フィルム7をシート状に一体的に形成したものに相当し、フィルム基板5に相当する基板部5a及び封止フィルム7に相当する封止部7aとに区分される。 [0032] Such sealing film 30, the film substrate 5 and the sealing film 7 in the first embodiment corresponds to that formed integrally with the sheet-like substrate portions 5a and the sealing film 7 corresponds to a film substrate 5 It is divided into a sealing section 7a, corresponding to the.

【0033】そして、基板部5aの例えば表面32(図3では、第2のポリマーフィルムの表面)に有機EL素子6が成膜されると共に、封止部7aの表面32aには乾燥剤層23が形成されており、その封止部7aを有機EL素子6上に折り返して、有機EL素子6を覆い隠すようにして、封止部7aの周縁部分が基板部5a上の有機EL素子6の周辺部分33に気密状及び水密状に例えば接着材により固定される。 [0033] Then, (in FIG. 3, the surface of the second polymer film) For example the surface 32 of the substrate portion 5a with an organic EL device 6 is deposited, on the surface 32a of the sealing portion 7a desiccant layer 23 There are formed, the sealing part 7a is folded on the organic EL device 6, so as to cover the organic EL device 6, the peripheral portion of the sealing portion 7a of the organic EL device 6 on the substrate portion 5a is fixed by airtight and watertight form, for example, adhesive to the peripheral portion 33. そして、第1実施形態と同様の方法により、基板部7aと封止部aとで密閉された密閉空間13aから空気および水(湿気)が取り除かれ真空状態にして密閉される。 Then, in the same manner as in the first embodiment, the substrate portion 7a and the air from the sealing portion enclosed space 13a which is sealed by the a and water (moisture) is sealed in a vacuum state is removed.

【0034】なお、基板部5aと封止部7aの固定は、 [0034] Incidentally, the substrate portions 5a and the sealing portion 7a fixed,
接着材により固定する代わりに、第1実施形態の変形例で述べた場合と同様に、加熱により融化又は硬化するポリマー層を封止部7aの表面32a全面に形成しておき、加熱・圧着することにより、そのポリマー層を有機EL素子6の表面(上面及び周側面)及び基板部5a上の有機EL素子6の周囲部分にかけて密着させて、封止部7aを基板部5aに隙間無く密閉接着するようにしてもよい。 Instead of fixing with an adhesive, as in the case described in the modification of the first embodiment, the polymeric layer to infusible or cured by heating previously formed on the surface 32a entire surface of the sealing portion 7a, heated and pressure bonded it allows the polymer layer in close contact over the peripheral portion of the organic EL device 6 on the surface (upper surface and the peripheral side surface) and a substrate portion 5a of the organic EL device 6, without any gap sealing adhesive sealing portion 7a to the substrate portion 5a it may be.

【0035】以上のように構成された有機EL表示装置4aによれば、第1実施形態と同様の効果を奏する他に、部品数が減り、その分、製造に係る手間を省くことができる。 [0035] According to the organic EL display device 4a configured as described above, in addition to the same advantages as the first embodiment, reduces the number of components, correspondingly, it is possible to save the trouble of the manufacturing.

【0036】なお、この実施形態では、第2のポリマーフィルム11は、有機EL素子6を密閉した状態で、内側に配置するように第1のポリマーフィルム10の面4 [0036] In this embodiment, the second polymer film 11, the surface 4 of the first polymer film 10 as in a state of sealing the organic EL device 6 is arranged inside
0に設けられたが、有機EL素子6を密閉した状態で、 0 provided, but in a state of sealing the organic EL device 6,
外側に配置するように第1のポリマーフィルム10の面40aに設けても良く、若しくはその両方の面40,4 It may be provided on the surface 40a of the first polymer film 10 so placed outside or surface of both 40,4
0aに設けても良い。 It may be provided to 0a.

【0037】また、この実施形態では、密閉フィルム3 Further, in this embodiment, sealing film 3
0が第1のポリマーフィルム10の表面に第2のポリマーフィルム11を接着する場合で説明したが、第1実施形態のフィルム基板5の場合と同様に、第2のポリマーフィルム11の代わりに、第2のポリマーフィルム11 0 Although described in the case of bonding the second polymer film 11 on the surface of the first polymer film 10, as in the case of the film substrate 5 of the first embodiment, in place of the second polymer film 11, the second polymer film 11
と同じ部材から成るポリマー溶液を塗布して形成しても構わない。 It may be formed by coating a polymer solution consisting of the same members as.

【0038】 [0038]

【発明の効果】請求項1の記載の発明によれば、透明基板および封止部が共に可撓性を有したフィルム状に形成されると共に有機EL素子も膜状に形成されているため、装置全体としてフィルム状に薄く構成でき、可撓性を持たせることができる。 According to the invention described in claim 1 according to the present invention, since the transparent substrate and the sealing portion are formed the organic EL element in film shape is formed in a both-shaped having a flexible film, device as a whole can be made thin structure in the form of a film, can have flexibility.

【0039】請求項2の記載の発明によれば、前記封止部は、金属箔、若しくは、ポリマーフィルムと金属膜とを少なくとも2層以上交互に積層したもの、又は、気密性及び水密性を有するように表面処理したポリマーフィルムにより形成されているため、空気や水(湿気)に対する透過性を強力に押さえることができる。 [0039] According to the invention described in claim 2, wherein the sealing portion, a metal foil, or which the polymer film and the metal film are laminated alternately at least two layers, or, airtightness and watertightness because it is formed by the surface-treated polymer film so as to have, it can be pressed strongly the permeability to air and water (moisture).

【0040】請求項3の記載の発明によれば、透明基板と封止部とがシート状に一体的に形成されて、前記封止部が有機EL素子上に折り返されるようにして透明基板上に固定されるため、部品数が減りその分手間が省けてコストを抑えることができる。 [0040] wherein, according to the invention described in claim 3, a transparent substrate and a sealing portion is formed integrally with the sheet, the sealing portion on the transparent substrate manner are folded back on the organic EL device to be fixed, it is possible to suppress the cost eliminates the correspondingly troublesome reduce the number of parts.

【0041】請求項4の記載の発明によれば、透明基板と封止部とで密閉される空間内に、乾燥剤が封入されるため、水(湿気)が、透明基板や封止部を通して前記空間内に入り込んだり、透明基板と封止部との接着部分から前記空間内に入り込んだとしても、乾燥剤によって吸着されるため、有機EL素子が効果的に水(湿気)から保護される。 [0041] According to the invention described in claim 4, in a space which is sealed with a transparent substrate and a sealing portion, because the drying agent is enclosed, water (moisture) is, through a transparent substrate and a sealing portion intrude into the space, even entering the bonding portion between the transparent substrate and the sealing portion into the space, because it is adsorbed by the desiccant, the organic EL element is protected from the effects of water (moisture) .

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】この発明の第1実施形態に係る有機EL表示装置の断面図である。 1 is a cross-sectional view of an organic EL display device according to a first embodiment of the present invention.

【図2】この発明の第1実施形態に係る有機EL表示装置における封止部の断面図である。 2 is a cross-sectional view of the sealing portion of the organic EL display device according to a first embodiment of the present invention.

【図3】この発明の第2実施形態に係る有機EL表示装置の断面図である。 3 is a cross-sectional view of an organic EL display device according to a second embodiment of the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

4 有機EL表示装置 4a 有機EL表示装置 5 フィルム基板 6 有機EL素子 7 封止フィルム 13 密閉空間 21 金属箔 22 絶縁膜 23 乾燥剤層 24 金属膜 26 ポリマーフィルム 27 金属膜付きポリマーフィルム 28 金属膜サンドイッチフィルム 4 an organic EL display device 4a organic EL display device 5 film substrate 6 organic EL element 7 sealing film 13 sealed space 21 metal foil 22 insulating film 23 desiccant layer 24 metal film 26 a polymeric film 27 a metal film-polymer film 28 metal film sandwich the film

───────────────────────────────────────────────────── フロントページの続き (72)発明者 玉川 達男 愛知県名古屋市南区菊住1丁目7番10号 株式会社ハーネス総合技術研究所内 Fターム(参考) 3K007 AB13 AB18 BA07 BB01 BB05 CA06 CB01 DA00 DB03 EB00 FA01 FA02 ────────────────────────────────────────────────── ─── front page of the continuation (72) inventor Tatsuo Tamagawa Nagoya, Aichi Prefecture, Minami-ku, Kikusumi 1-chome, No. 7, No. 10, Ltd. harness technical Research Institute in the F-term (reference) 3K007 AB13 AB18 BA07 BB01 BB05 CA06 CB01 DA00 DB03 EB00 FA01 FA02

Claims (4)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 その一面側に有機EL素子が成膜された可撓性フィルム状の透明基板と、 前記有機EL素子を密封するように前記透明基板上に固定された可撓性フィルム状の封止部とを備えることを特徴とする有機EL表示装置。 1. A transparent substrate of the one side the organic EL element is formed on a flexible film-like, the organic EL element is fixed on the transparent substrate to seal a flexible film-like the organic EL display device, characterized in that it comprises a sealing portion.
  2. 【請求項2】 前記封止部は、金属箔、若しくは、ポリマーフィルムと金属膜とを少なくとも2層以上交互に積層したもの、又は、気密性及び水密性を有するように表面処理したポリマーフィルムにより形成されることを特徴とする請求項1に記載の有機EL表示装置。 Wherein said sealing portion is a metal foil, or which the polymer film and the metal film are laminated alternately at least two layers, or by a polymer film surface-treated to have airtightness and watertightness the organic EL display device according to claim 1, characterized in that it is formed.
  3. 【請求項3】 前記透明基板と前記封止部とがシート状に一体的に形成されて、前記封止部が前記有機EL素子上に折り返されるようにして前記透明基板上に固定されることを特徴とする請求項1に記載の有機EL表示装置。 Wherein the transparent substrate and the sealing portion are integrally formed into a sheet, said the seal portion is fixed to the way the transparent substrate is folded on the organic EL device the organic EL display device according to claim 1, wherein the.
  4. 【請求項4】 前記透明基板と前記封止部とで密閉される空間内に、乾燥剤が封入されることを特徴とする請求項1乃至請求項3のいずれかに記載の有機EL表示装置。 4. A space is sealed by the transparent substrate and the sealing unit, the organic EL display device according to any one of claims 1 to 3 desiccant, characterized in that it is enclosed .
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