JP2001111296A - Clamping mechanism of board underside supporting pin, and method for placing the board underside supporting pin in electronic components mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a clamping mechanism of a board's underside support pin in a system for mounting electronic components, which can be clamped in a correct position and a method for mounting the board's underside support pin, by which the board's underside supporting pin can be easily detached/ attached in the system for mounting electronic components. SOLUTION: With respect to this clamping mechanism for clamping a board's underside support pin, the pin 13 in the perimeter of which a groove is formed is sandwiched by a clamp claw 26a provided with an end part 26b and a clamp claw 27a having a V-shaped section, the shaft center of the pin 13 is positioned by the end part 26b and a V-shaped inside, it is positioned vertically by the end part 26b, and further the direction of the pin 13 is determined by a straight part 27b provided on the clamp claw 27a. Accordingly, the pin 13 can be clamped in the correct position, and the operation of detaching/attaching the board's underside supporting pin can be automated.

Description

DETAILED DESCRIPTION OF THE INVENTION

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for clamping a board supporting pin for receiving a board in an electronic component mounting apparatus. The present invention relates to a method of mounting a board support pin in an electronic component mounting apparatus.

2. Description of the Related Art As a substrate on which electronic components are mounted, there is a so-called double-sided mounting substrate on which electronic components are mounted not only on one side but also on both sides. In the mounting process of this double-sided mounting board,
First, after mounting on the first surface, the substrate is turned over and the second
Mounting on the surface is performed. When mounting on this second side,
Since the first surface, that is, the mounting surface on which the electronic components have already been mounted faces downward, the electronic components hinder the direct mounting of the board surface when positioning and holding the board at the mounting position. Can not do. For this reason, a method is used in which an undercapable portion other than the electronic component mounting point on the already mounted surface is appropriately selected, and this position is supported by the board underpin. In this method, a plurality of pin holes are provided on the lower receiving jig to select positions corresponding to the above-mentioned lower receiving possible portions, and by mounting the substrate lower receiving pins in the pin holes at these positions,
A lower receiving jig corresponding to each substrate type is prepared. For this reason, at the time of switching the type of the board, the work of attaching and detaching the board supporting pin to the supporting jig is performed to match the arrangement of the board supporting pin with the target board.

Heretofore, the work of attaching and detaching the board support pins has been performed mainly by a manual operation of an operator. However, this work is a complicated work to insert a thin pin accurately at a predetermined position, and the number of the board supporting pins is large. The load is large, and it has been desired to automate and easily and accurately perform the work of attaching and detaching the support pins under the board. And for that,
There has been a demand for a clamp mechanism capable of holding the board supporting pins in a correct posture and position and a pin mounting method capable of easily attaching and detaching the board supporting pins. Accordingly, the present invention provides a clamp mechanism for a board support pin in an electronic component mounting apparatus capable of clamping the board support pin in a correct posture and position, and a board support for an electronic component mounting apparatus capable of easily attaching and detaching the board support pin. It is an object of the present invention to provide a pin mounting method.

According to a first aspect of the present invention, there is provided a clamp mechanism for a board support pin in an electronic component mounting apparatus, wherein the board support pin for receiving a board in an electronic component mounting apparatus is detached and attached. A clamping mechanism of a board supporting pin in an electronic component mounting apparatus that clamps a plurality of claw members that clamp by pinching the board supporting pin from the side, and opening and closing driving means for opening and closing these claw members; Shaft positioning means for positioning the axis position of the substrate support pin during clamping, vertical positioning means for restricting the vertical position of the substrate support pin during clamping, and holding direction of the substrate support pin during clamping And a direction determining means for regulating the direction. Claim 2
The clamp mechanism of the board support pin in the electronic component mounting apparatus according to claim 1, wherein the clamp mechanism of the board support pin in the electronic component mounting apparatus according to claim 1, wherein the clamp mechanism is configured to release the clamp by the claw member. Pushing means for pushing the receiving pin into the pin hole is provided. The clamp mechanism of the board support pin in the electronic component mounting apparatus according to claim 3 is the clamp mechanism of the board support pin in the electronic component mounting apparatus according to claim 1, wherein the shaft positioning means is provided with the board support. These are a plurality of claw members that abut on and pinch the pin at at least three points. The clamp mechanism of the board supporting pin in the electronic component mounting apparatus according to claim 4 is the clamp mechanism of the board supporting pin in the electronic component mounting apparatus according to claim 1, wherein the vertical positioning means includes At least one of them is a fitting end that fits into a groove that is provided circumferentially on the side surface of the board support pin. The clamp mechanism for the board support pin in the electronic component mounting apparatus according to claim 5 is the clamp mechanism for the board support pin in the electronic component mounting apparatus according to claim 1, wherein the direction determining means includes the one claw. A contact portion formed linearly on the side surface of the claw member other than the member and abutting on the side surface of the board supporting pin along the vertical direction. The mounting method of the board support pins in the electronic component mounting apparatus according to claim 6, wherein the board support pins for receiving the board in the electronic component mounting apparatus are mounted in the pin holes of the support receiving jig. A method of mounting a lower support pin, wherein the step of clamping the lower support pin of the substrate and positioning the lower support pin in a pin hole, the step of temporarily inserting the lower support pin into the pin hole, The method includes a step of releasing the clamp of the pin and a step of pushing in the temporarily inserted board support pin. According to the invention described in claims 1 to 5,
A clamping mechanism for clamping the board support pin; a shaft positioning means for positioning the axis position of the board support pin at the time of clamping; a vertical positioning means for regulating the vertical position of the board support pin; and a board support pin. And a direction determining means for restricting the holding direction of the substrate, the substrate support pins can be clamped in a correct posture and position, and the work of attaching and detaching the support pins can be automated. According to the sixth aspect of the present invention, in the automatic attachment and detachment of the board support pins, the board support pins are clamped and aligned with the pin holes, and the board support pins are temporarily inserted into the pin holes by a predetermined length. In this state, the temporary insertion of the board support pins after the clamp of the board support pins is released can prevent the mounting error of the board support pins.

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2A is a partial cross-sectional view of a board positioning portion of the electronic component mounting apparatus, and FIG. FIG. 3 is a cross-sectional view of a clamp mechanism of the board support pin of the electronic component mounting apparatus, FIG. 4A is a partial side view of the clamp mechanism of the board support pin, and FIG.
FIG. 5 is a partial cross-sectional view of a clamp mechanism of the substrate support pin, and FIG.
FIG. 4 is a process explanatory view of a mounting method of a board support pin in the electronic component mounting apparatus. First, an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is provided in the center of a base 1 in the X direction. The transport path 2 transports a substrate (not shown) and positions the substrate in the substrate positioning section 3. In the substrate positioning section 3, a lower receiving jig 3a is provided between the transport paths 2. The substrate positioning unit 3 will be described later. Electronic component supply units 4 are arranged on both sides of the transport path 2, and a large number of tape feeders 5 are arranged in the supply unit 4. The tape feeder 5 stores the electronic components held on the tape, and feeds the electronic components to a pickup position by a mounting head by feeding the tape at a pitch. A mounting head 7 for electronic components is mounted on the X-axis table 6. The X-axis table 6 includes two
Both ends are supported by a base Y-axis table 9 and are erected. Therefore, by driving the X-axis table 6 and the Y-axis table 9, the mounting head 7 moves horizontally, and the electronic components are picked up from the pickup position of the tape feeder 5 by each pickup head 8 and mounted on the board on the board positioning section 3. . A camera 10 for recognizing electronic components is provided between the supply unit 4 on the near side and the transport path 2. The camera 10 captures an image of the electronic component held by the mounting head 7 from below. On the side of the camera 10, a pin stocker 11 and a nozzle stocker 12 are provided. Hereinafter, the board positioning unit 3, the pin stocker 11, and the nozzle stocker 12 will be described. FIG. 2 (a)
2 shows a cross section of the transport path 2, the pin stocker 11, and the nozzle stocker 12 in the substrate positioning unit 3. A lower receiving jig 3a is vertically movably arranged between the rails of the transport path 2. A large number of pin holes 14 are provided on the upper surface of the lower receiving jig 3a, and substrate lower receiving pins 13 (hereinafter simply referred to as "pins 13") are mounted in the pin holes 14. The pins 13 are used for a double-sided mounting board on which electronic components are mounted on both front and back surfaces. That is, when the mounted surface on which the electronic components are mounted is the lower surface, the mounted surface cannot be supported flatly like a normal board. For this reason, it is necessary to select a part which can be supported under the lower surface of the substrate and which does not interfere with the already mounted electronic components, and to receive the part by the pins 13 in a dotted manner. Since the undercapable portion generally differs depending on the type of the board, the pin arrangement is changed each time the mounting target is changed. This arrangement change is performed by selecting pin holes 14 corresponding to the lower supportable portions of the target substrate from among a large number of pin holes 14 provided in a lattice on the lower receiving jig 3a, and mounting the pins 13 in these pin holes 14. It is done by doing. A pin stocker 11 is provided outside the transport path 2.
Are arranged. The pin stocker 11 has a pin storage hole 1
Many pins 1a are provided, and pins 13 are stored in the pin storage holes 11a in a vertical posture. As shown in FIG.
The pin 13 is obtained by cutting a small-diameter pin into a predetermined length, and a lower end portion of the pin 13 is chamfered 13a to facilitate insertion into the pin hole 11a. Further, a groove 13b is formed at a position below the head by a predetermined dimension and is provided on the side surface of the pin 13 in a circumferential shape. As will be described later, the groove 13b is used for positioning when clamping the pin 13, and has a function of preventing the pin 13 from dropping in the clamped state. Pin stocker 1
The nozzle stocker 12 is disposed adjacent to the nozzle stocker 1. The nozzle stocker 12 is provided with a large number of nozzle storage holes 12a, and suction nozzles 15 corresponding to respective electronic component types are stored in the nozzle storage holes 12a. Each time the type of electronic component is switched, the mounting head 7 moves the nozzle stocker 1
2 and the automatic replacement of the suction nozzle 15 is performed. In addition, the nozzle stocker 12 also accommodates a dedicated clamping tool 16 for clamping the support pin in addition to the normal suction nozzle 15. FIG. 2A shows the mounting head 7 on which the clamp tool 16 is mounted. If it is necessary to change the arrangement of the pins 13 when switching the board type, the mounting head 7 accesses the nozzle stocker 12 to perform a tool change. That is, the mounted suction nozzle 15 is returned to the nozzle stocker 12, and the clamp tool 16 for pin clamping is mounted on the mounting head 7. Thus, the work of attaching and detaching the pins 13 to and from the lower receiving jig 3a using the mounting head 7 for mounting electronic components can be automatically performed without manual intervention. Next, a clamp mechanism used for the clamp tool 16 for pin clamping will be described with reference to FIG. 3, the clamp tool 16 includes a taper shank 20 and a clamp mechanism 21. The tapered surface 20a of the tapered shank portion 20 fits into a mounting hole provided in the mounting block 7a of the mounting head 7. The tapered shank portion 20 is provided with a suction hole 20b, and communicates with the suction hole 7b provided in the mounting block 7a when mounted on the mounting head 7. A flange 20c is provided below the tapered shank 20 in the same manner as the general suction nozzle 15, and is held by the flange 20c when stored in the nozzle stocker 12. The lower portion of the suction hole 20b is connected to an inner hole 20d provided in the tapered shank portion 20, and the inner hole 20d forms an operation chamber for the piston 23 together with the inner hole 22a provided in the block 22 of the clamp mechanism 21. are doing. A rod 23a is connected to a lower portion of the piston 23, and the rod 23a is pin-connected to the first clamp member 26 and the second clamp member 27 by a pin 24. The first clamp member 26 and the second clamp member 27 have clamp claws 26a and 27a, respectively, which are claw members having different shapes. Clamp claw 26a
Is shaped so as to have an end 26b whose lower end protrudes in the lateral direction (inward direction). When the pin 13 is clamped, the end 26b is formed in the groove 13 provided in the pin 13.
b. The clamp claw 27a has a vertical linear portion 27b formed on the inner surface thereof. When the pin 13 is clamped, the linear portion 27b comes into contact with the side surface of the pin 13. The cross-sectional shape of the clamp claw 27a will be described later. By vacuum suction through the suction hole 7b, the piston 23 moves upward due to the negative pressure, whereby the first clamp member 2 supported by the pin fulcrum 25 is moved.
The sixth and second clamp members 27 perform a closing operation in which the respective clamp claws 26a, 27a move in directions approaching each other. Also, by releasing the vacuum suction, the piston 23 descends, whereby the first clamp member 26 and the second clamp member 27 perform an opening operation in which the respective clamp claws 26a, 27a move in directions away from each other. . Therefore, by vacuum-suctioning from the suction hole 7b with the pin 13 positioned between the clamp claws 26a and 27a, the pin 13 is mechanically clamped by the vacuum suction force. An unillustrated vacuum suction source and the piston 23 constitute opening / closing drive means for opening and closing the clamp claws 26a and 27a by a vacuum suction force. Block 22
Is formed with a convex portion 22b projecting downward. The pin 13 is pushed into the pin hole 14 by lowering the mounting head 7 with the convex portion 22b abutting on the head of the pin 13. be able to. That is, the convex portion 22b of the block 22 serves as a pushing means for pushing the pin 13 into. FIG. 4 shows a state where the pin 13 is clamped by the clamp tool. FIG. 4 (b) is the same as FIG.
AA cross section of FIG.
a is the contact point P by the end 26b of the clamp claw 26a.
1. Two points of contact P1 and P2 on the inner surface of the V-shaped cross section of the clamp claw 27a come into contact with and pinch the pin 13 at three points. As a result, the axial center position of the pin 13 is
Positioning is performed at three contact points with 6a and 27a. That is, the clamp claws 26a and 27a serve as axis positioning means for positioning the axis position of the pin 13. FIG.
As shown in (a), in the clamped state, the clamp pawl 26
The end 26b of a is fitted into the groove 13b of the pin 13. Thereby, the vertical position of the pin 13 with respect to the clamp claw 26a is restricted during clamping. That is, the end 26b provided on the clamp claw 26a is a fitting end that fits into the groove 13b, and serves as a vertical positioning means for regulating the position of the pin 13 in the vertical direction. This prevents the pins 13 from falling off during the pin attaching / detaching operation. At the time of clamping, the linear portion 27b of the clamp claw 27a is
The pin 13 is held in a posture following the straight portion 27b, and the holding direction is regulated by the straight portion 27b. That is, the clamp claw 27
The straight line portion a is an abutting portion that abuts along the side surface of the pin 13 and serves as a direction determining means that regulates the holding direction of the pin 13. Since the length of the linear portion 27b is set to be a predetermined ratio with respect to the length of the pin 13, the accuracy of the holding direction of the pin 13 in the clamped state is sufficiently ensured. Next, a method of attaching the pin 13 to the lower receiving jig 3a using the clamp tool 16 will be described with reference to FIG. This mounting operation is performed after mounting the clamp tool 16 on the mounting head 7. First, clamp tool 16
Is moved above the pin stocker 11, and the pin 13 is clamped by the clamp claws 26a and 27a. Thereafter, the pins 13 are taken out by raising the mounting head 7 as shown in FIG.
Next, as shown in FIG. 5B, the mounting head 7 is positioned above the pin hole 14 to be mounted on the lower receiving jig 3a, and the pin 13 is aligned with the pin hole 14. Thereafter, the mounting head 7 is lowered with respect to the lower receiving jig 3a, and FIG.
The lower end of the lower receiving pin 13 is inserted into the guide tapered portion 14a of the pin hole 14 as shown in FIG. And in this state,
The clamps 26a and 27a are opened to
Release the clamp. As a result, as shown in FIG. 5 (d), the pin 13 is slightly free-fall, and is temporarily inserted into the pin hole 14. At this time, even if there is a slight misalignment, the guide hole 14a of the pin hole 14 and the pin 1
The pin 13 is positioned in the pin hole 14 in the process of free fall by the chamfered portion 13a of 3, and after the fall, the lower end of the pin 13 enters the pin hole 14 in a temporary insertion state. Next, as shown in FIG.
The mounting head 7 is lowered with the a and 27a opened.
As a result, the protrusion 22b of the clamp tool 16 is
The pin 13 is pushed into the pin hole 14 by making contact with the head of No. 3 and continuing to lower the mounting head 7. In this pushing operation, the pin 13 is pushed from above without being restrained by the clamp claws 26a and 27a. Therefore, the pin 13 is smoothly pushed into the pin hole 14 without the occurrence of galling caused by being pushed in the restrained state. Is performed. When the pin 13 is pushed down to the predetermined height position, the mounting head 7 returns to the position on the pin stocker 11 and repeats the above-described pin mounting operation. According to the clamp mechanism of the clamp tool 16 used for this pin mounting operation, the axial position, the vertical position, and the holding direction of the pin 13 can be regulated during clamping, so that
The pin 13 is securely clamped while maintaining a good posture and position. Further, the vertical positioning means also serves to prevent the pins 13 from dropping, so that the pins can be reliably prevented from dropping during clamping. Further, by using such a clamp mechanism, it is possible to correctly align the pins with the pin holes and to perform temporary insertion by free fall. Thus, a problem such as a galling which is likely to occur when the pin in the restrained state is press-fitted in the state of the displacement is not generated.

According to the present invention, the clamping mechanism for clamping the board support pin is provided with shaft positioning means for positioning the axis of the board support pin during clamping, and the vertical position of the board support pin. Since the vertical positioning means for regulating and the direction determining means for regulating the holding direction of the board support pins are provided, the board support pins can be clamped in the correct posture and position, and the work of attaching and removing the support pins can be automated. . In addition, in this automatic attachment / detachment, the board supporting pins are clamped and aligned with the pin holes, and the board supporting pins are temporarily inserted into the mounting holes by a predetermined length, and then the board supporting pins are released. Since the inserted board support pins are pushed in, problems due to staking of the board support pins do not occur, and mounting errors are prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2A is a partial cross-sectional view of a board positioning unit of the electronic component mounting apparatus according to one embodiment of the present invention; FIG. 2B is a side view of a board support pin according to one embodiment of the present invention;

FIG. 3 is a cross-sectional view of a clamp mechanism of a board supporting pin of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 4 (a) is a partial side view of a clamp mechanism for a board support pin according to an embodiment of the present invention; and (b) a partial cross-sectional view of a clamp mechanism for a board support pin according to an embodiment of the present invention.

FIG. 5 is a process explanatory view of a mounting method of a board support pin in the electronic component mounting apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 3 Board positioning part 3a Lower receiving jig 4 Supply part 7 Mounting head 11 Pin stocker 13 Pin 13b Groove part 14 Pin hole 16 Clamp tool 26a, 27a Clamp claw 26b End part 27b Linear part

(72) Inventor Hironori Kitajima 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 5E313 AA02 AA11 AA15 AA32 CC03 CC09 EE02 EE05 EE23 EE24 EE25 EE34 EE35 EE37 FF12

Claims (6)

[Claims] An electronic component mounting apparatus for clamping a board support pin when the board support pin is attached to or detached from the board in the electronic component mounting apparatus. A plurality of claw members for clamping by sandwiching the claw members from the side, opening and closing drive means for opening and closing these claw members, shaft positioning means for positioning the axial position of the substrate supporting pin at the time of clamping, and A board support in an electronic component mounting apparatus, comprising: vertical positioning means for controlling the position of the board support pins in the vertical direction; and direction determining means for controlling the holding direction of the board support pins during clamping. Pin clamping mechanism. 2. An electronic component mounting apparatus according to claim 1, further comprising a pushing means for pushing said board support pin into a pin hole in a state where said clamp by said claw member is released. Clamp mechanism. 3. The board supporting pin in an electronic component mounting apparatus according to claim 1, wherein said shaft positioning means is a plurality of claw members which abut on and pinch said board supporting pin at at least three points. Clamp mechanism. 4. The vertical positioning means is provided on at least one of the claw members, and is a fitting end that fits into a groove provided circumferentially on a side surface of the board supporting pin. 2. A clamp mechanism for a board supporting pin in an electronic component mounting apparatus according to claim 1. 5. The apparatus according to claim 1, wherein the direction determining means is a contact portion formed linearly on a side surface of the claw member other than the one claw member and abutting on a side surface of the board supporting pin in a vertical direction. 2. A clamp mechanism for a board supporting pin in the electronic component mounting apparatus according to claim 1. 6. A method of mounting a board support pin in an electronic component mounting apparatus, wherein a board support pin for receiving a board in an electronic component mounting apparatus is mounted in a pin hole of a support jig. A step of clamping the pins to align them with the pin holes, a step of temporarily inserting the board support pins into the pin holes, a step of releasing the clamp of the board support pins in the temporarily inserted state, and a step of temporarily inserting the board. Pressing the support pins into the pin holes.