JP2001085837A - Method for manufacturing multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing multilayer printed wiring board, where a rough surface comprising a constant rough is formed at the formation of a rough surface on the surface of an interlayer resin insulating layer, while no peeling occurs between the interlayer resin insulating layer and a conductor circuit comprising a metal layer. SOLUTION: A conductor circuit 4 and an interlayer resin insulating layer 2 are laminated sequentially on a substrate. Here, at the formation of the interlayer resin insulating layer 2, resin film such as particles 22 soluble in acid or an oxidant dispersed on in a resin 21, which is hardly soluble in acid or oxidant is press-fitted temporarily to a substrate surface comprising a conductor circuit at a pressure of 1.0-7.0 kg/cm2, and then under reduced pressure or vacuum, it is appropriately press-fitted at a pressure of 2.0-10 kg/cm2, forming a non-through hole and/or through-hole.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a multilayer printed wiring board.

[0002]

2. Description of the Related Art As the frequency of a signal becomes higher, the material of a package substrate is required to have a low dielectric constant and a low dielectric loss tangent. Therefore, the mainstream of the package substrate material is shifting from ceramic to resin.

A multilayer printed wiring board called a so-called multilayer build-up wiring board is manufactured by a semi-additive method or the like, and has a thickness of 0.5 to 1.5 mm called a core.
It is manufactured by alternately laminating a conductive circuit made of copper or the like and an interlayer resin insulating layer on a resin substrate reinforced with a glass cloth or the like. The connection between the conductor circuits via the interlayer resin insulation layer of the multilayer printed wiring board is performed by via holes or the like.

Conventionally, build-up multilayer printed wiring boards have been manufactured by a method disclosed in, for example, Japanese Patent Application Laid-Open No. 4-55555. That is, first, a through-hole is formed in the copper-clad laminate on which the copper foil is stuck, and then a through-hole is formed by performing an electroless copper plating process. Subsequently, the surface of the substrate is etched into a conductor pattern to form a conductor circuit, and on the surface of the conductor circuit,
A roughened surface is formed by electroless plating or etching.
Then, after a resin insulating layer containing epoxy acrylate or the like is formed on the conductor circuit having the roughened surface, exposure and development are performed to form a via hole opening.
After V curing and main curing, an interlayer resin insulating layer is formed.

Further, after roughening the interlayer resin insulating layer with an acid or an oxidizing agent, a thin electroless plating film is formed, and a plating resist is formed on the electroless plating film.
Thickening is performed by electrolytic plating, and etching is performed after the plating resist is stripped to form a conductive circuit connected to the lower conductive circuit and the via hole. After repeating this process, finally, a solder resist layer for protecting the conductor circuit is formed, an opening is formed for connection with an IC chip or the like, plating is performed on the exposed conductor circuit, and a solder paste is applied. By printing and forming solder bumps,
Complete the manufacture of the build-up multilayer printed wiring board.

[0006] The build-up multilayer printed wiring board manufactured in this manner is connected to another board called a motherboard or a daughter board.
An electronic component such as a capacitor is mounted, and wiring is formed to match electrical characteristics such as characteristic impedance, and then used as a package substrate.

However, in the case of manufacturing a build-up multilayer printed wiring board by the above method, first, a through hole is formed in a copper-clad laminated board to which a copper foil is adhered, followed by an electroless copper plating treatment. After forming a through-hole by performing the above, the conductor circuit and the interlayer resin insulation layer are sequentially formed, and when forming the interlayer resin insulation layer, a resin liquid is applied and then cured. For example, the process was complicated.

[0008]

The problem to be solved by the present invention is disclosed in
In Japanese Patent No. 1547, instead of applying a resin solution, a resin film composed of resin particles soluble in an acid or an oxidizing agent and a resin hardly soluble in an acid or an oxidizing agent is bonded by pressure bonding under reduced pressure or vacuum. Then, after forming an opening for a via hole and a through hole using a laser or a drill,
A method of manufacturing a multilayer printed wiring board in which a roughened surface is provided on the surface of an insulating layer made of a resin film and a metal layer is further provided to form a conductor circuit and a via hole is disclosed.

However, in the multilayer printed wiring board thus obtained, the metal layer formed on the insulating layer whose surface has been subjected to the roughening treatment is peeled off under heat cycle conditions or high temperature and high humidity conditions. There was a case. In particular, if the pressing force when pressing the resin film is too strong,
As shown in FIGS. 3 (a) to 3 (c), the soluble resin particles 122 aggregate near the surface layer of the interlayer resin insulating layer 2 in which the conductive circuit 4 made of a metal layer is formed on the lower surface. When the soluble resin particles 122 are dissolved and removed using an acid or an oxidizing agent in this portion, all of the soluble resin particles 122 aggregated in this portion are removed, and the surface becomes planar, and a roughened surface having a certain degree of unevenness is formed. It could not be formed, and the conductor circuit formed in this portion had low adhesion to the interlayer resin insulating layer 2 and was likely to cause peeling.

When the pressure of the resin film is low, the adhesion between the interlayer resin insulating layer and the conductor circuit formed under the interlayer resin insulating layer is low, so that peeling occurs between the two. It was easy. Further, in the step after forming the via hole opening in the interlayer resin insulating layer, when the substrate is immersed in a plating solution or a roughening solution for forming a roughened surface, these are immersed in the interlayer resin opening in the via hole opening. In some cases, they may invade from the interface between the insulating layer and the conductor circuit and cause a defect in the manufactured multilayer printed wiring board.

Further, when the resin film and the substrate including the conductive circuit cannot be accurately positioned at the time of pressure bonding, that is, the resin film cannot be accurately bonded to a portion to be bonded. in case of,
It is possible that the resin film does not exist in the necessary part. However, in this case, it is difficult to re-attach the resin film, which has led to a decrease in the yield of the manufacturing process.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and an object of the present invention is to provide a method of forming a roughened surface on an interlayer resin insulating layer, the method having a rough surface having a uniform roughness. An object of the present invention is to propose a method for efficiently manufacturing a multilayer printed wiring board which can form a patterned surface and does not cause peeling between an interlayer resin insulating layer and a conductor circuit formed of a metal layer.

[0013]

Means for Solving the Problems The present inventors have conducted intensive studies to achieve the above object, and as a result, a resin film in which particles soluble in an acid or an oxidizing agent are dispersed in a resin hardly soluble in an acid or an oxidizing agent. When the resin film is misaligned by temporarily compressing the resin film at a relatively low pressure and a low temperature using the above, it is possible to remove the resin film once and then reattach it. Therefore, the resin film can be used efficiently, and the cost can be reduced.After that, under pressure reduction or vacuum, the final pressure bonding is performed at a relatively high pressure and a high temperature, so that the interlayer resin insulation layer can be efficiently formed. Further, by forming a non-through hole and / or a through hole, a conductor circuit comprising an interlayer resin insulating layer and a metal layer can be formed even when used under heat cycle conditions or under high temperature and high humidity. DOO is found to be able to produce a multilayer printed wiring board without peeling, it reached the present invention to the contents described below as the summary and construction.

That is, a method of manufacturing a multilayer printed wiring board according to the present invention is a method of manufacturing a multilayer printed wiring board in which a conductor circuit and an interlayer resin insulating layer are sequentially formed on a substrate. In forming the resin film, a resin film in which particles soluble in an acid or an oxidizing agent are dispersed in a resin hardly soluble in an acid or an oxidizing agent is used.
Temporarily press-bonded to the surface of the substrate including the conductor circuit at a pressure of 0 to 7.0 kgf / cm ² , and then completely press-bonded at a pressure of 2.0 to 10 kgf / cm ² under reduced pressure or vacuum. And / or forming a through hole.

In the method for producing a multilayer printed wiring board, the particles soluble in the acid or oxidizing agent are desirably at least one selected from the group consisting of resin particles, inorganic particles and metal particles.

In the method for producing a multilayer printed wiring board, the temperature at which the resin film is preliminarily pressure-bonded is 50 to 50.
110 ° C and the temperature at the time of final pressure bonding is 60 to 120 ° C
It is desirable that Further, the time for the final pressure bonding of the resin film is desirably 10 to 120 seconds. The degree of vacuum when the resin film is completely press-bonded is 0.1 to 10
Torr is desirable.

[0017] The resin that is hardly soluble in an acid or an oxidizing agent constituting the resin film is at least one selected from the group consisting of an epoxy resin, a phenol resin, a polyimide resin, a polyphenylene resin, a polyolefin resin, and a fluororesin. It is desirable to contain

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a multilayer printed wiring board according to the present invention is a method for manufacturing a multilayer printed wiring board in which a conductive circuit and an interlayer resin insulating layer are sequentially formed on a substrate.
When forming the interlayer resin insulation layer, using a resin film in which particles soluble in an acid or an oxidizing agent are dispersed in a resin that is hardly soluble in an acid or an oxidizing agent,
At a pressure of 7.0 kgf / cm ² , it is temporarily pressure-bonded to the surface of the substrate including the conductor circuit, and then under reduced pressure or vacuum,
A non-through hole and / or a through hole is formed after the final press bonding at a pressure of 2.0 to 10 kgf / cm ² .

According to the method for manufacturing a multilayer printed wiring board described above, when the resin film is crimped, it is temporarily crimped and then the final crimping is performed. The film can be reattached, the yield can be improved, and the alignment between the resin film and the substrate including the conductive circuit can be accurately performed. In addition, since the resin film can be cut after the resin film is accurately positioned, the resin film can be used efficiently and cost can be reduced.

Further, since the resin film is fully press-bonded under reduced pressure or vacuum at a pressure of 2.0 to 10 kgf / cm ² , the adhesion between the interlayer resin insulating layer and the lower conductive circuit becomes excellent. Furthermore, it is possible to form a roughened surface with unevenness of uniform roughness on the surface of the interlayer resin insulation layer, and even under heat cycle conditions or under high temperature and high humidity, a conductor circuit consisting of a metal layer underneath it Regardless of the presence or absence, since the conductor circuit formed of the metal layer formed on the interlayer resin insulating layer does not peel off, it is possible to manufacture a multilayer printed wiring board having excellent connection reliability and electrical connectivity, and Since the through-holes and / or the non-through-holes are collectively formed after the resin film is completely pressed, a multilayer printed wiring board can be efficiently manufactured.

In the resin film used in the production method of the present invention, particles soluble in an acid or an oxidizing agent (hereinafter referred to as soluble particles) are contained in a resin which is hardly soluble in an acid or oxidizing agent (hereinafter referred to as a hardly soluble resin). It is dispersed. The terms “sparingly soluble” and “soluble” as used in the present invention, when immersed in a solution containing the same acid or oxidizing agent for the same time, have a relatively high dissolution rate and are called “soluble” for convenience. Those having a relatively low dissolution rate are referred to as "poorly soluble" for convenience.

Examples of the soluble particles include resin particles soluble in an acid or an oxidizing agent (hereinafter referred to as “soluble resin particles”), inorganic particles soluble in an acid or an oxidizing agent (hereinafter referred to as “soluble inorganic particles”), and an acid or an oxidizing agent. Soluble metal particles (hereinafter referred to as “soluble metal particles”) and the like. These soluble particles may be used alone or in combination of two or more.

The shape of the soluble particles is not particularly limited.
Spherical, crushed and the like. The shape of the soluble particles is desirably a uniform shape. This is because a roughened surface having unevenness with a uniform roughness can be formed.

The average particle size of the above-mentioned soluble particles is 0.1.
1 to 10 μm is desirable. Within this particle size range, 2
More than one kind of particles having different particle sizes may be contained. That is, it contains soluble particles having an average particle size of 0.1 to 0.5 μm and soluble particles having an average particle size of 1 to 3 μm.
Thereby, a more complicated roughened surface can be formed,
Excellent adhesion to conductor circuits. In the present invention, the particle size of the soluble particles is the length of the longest portion of the soluble particles.

Examples of the soluble resin particles include those made of a thermosetting resin, a thermoplastic resin, and the like. When immersed in a solution containing an acid or an oxidizing agent, the soluble resin particles have a higher dissolution rate than the hardly soluble resin. If it is, there is no particular limitation. Specific examples of the soluble resin particles include, for example, those made of epoxy resin, phenol resin, polyimide resin, polyphenylene resin, polyolefin resin, fluororesin, and the like, and may be made of one of these resins. Alternatively, it may be composed of a mixture of two or more resins.

As the soluble resin particles, resin particles made of rubber can be used. Examples of the rubber include polybutadiene rubber, various modified polybutadiene rubbers such as epoxy-modified, urethane-modified, (meth) acrylonitrile-modified, and (meth) acrylonitrile-butadiene rubber containing a carboxyl group. By using these rubbers, the soluble resin particles are easily dissolved in an acid or an oxidizing agent. In other words, when dissolving the soluble resin particles using an acid, an acid other than a strong acid can be dissolved, and when dissolving the soluble resin particles using an oxidizing agent, permanganese having a relatively weak oxidizing power is used. It can also dissolve in acids. Even when chromic acid is used, it can be dissolved at a low concentration. for that reason,
Acid or oxidizing agent does not remain on the resin surface, and as described later, after forming a roughened surface, when a catalyst such as palladium chloride is applied, the catalyst is not applied or the catalyst is oxidized. Nothing.

The soluble inorganic particles include, for example, particles made of at least one selected from the group consisting of aluminum compounds, calcium compounds, potassium compounds, magnesium compounds and silicon compounds.

Examples of the aluminum compound include alumina and aluminum hydroxide. Examples of the calcium compound include calcium carbonate and
Examples of the potassium compound include potassium carbonate.Examples of the magnesium compound include magnesia, dolomite, and basic magnesium carbonate.Examples of the silicon compound include silica and zeolite. Is mentioned. These may be used alone or in combination of two or more.

Examples of the soluble metal particles include, for example,
Copper, nickel, iron, zinc, lead, gold, silver, aluminum,
Examples include particles made of at least one selected from the group consisting of magnesium, calcium, and silicon. These soluble metal particles may have a surface layer coated with a resin or the like in order to ensure insulation.

When two or more of the above-mentioned soluble particles are used in combination, the combination of the two types of soluble particles to be mixed is preferably a combination of resin particles and inorganic particles. Both have low conductivity, so that the insulation of the resin film can be ensured, and thermal expansion can be easily adjusted with the poorly soluble resin, and no crack occurs in the interlayer resin insulation layer made of the resin film. This is because peeling does not occur between the interlayer resin insulating layer and the conductor circuit.

The hardly soluble resin is not particularly limited as long as it can maintain the shape of the roughened surface when the roughened surface is formed by using an acid or an oxidizing agent in the interlayer resin insulating layer. Examples thereof include thermosetting resins, thermoplastic resins, and composites thereof. Further, a photosensitive resin obtained by imparting photosensitivity to these resins may be used. By using a photosensitive resin, an opening for a via hole can be formed in an interlayer resin insulating layer by using exposure and development processes. Among these, those containing a thermosetting resin are desirable. Thereby, the shape of the roughened surface can be maintained even by the plating solution or various heat treatments.

Specific examples of the hardly soluble resin include, for example, epoxy resin, phenol resin, polyimide resin,
Examples thereof include polyphenylene resin, polyolefin resin, and fluorine resin. These resins may be used alone or in combination of two or more. Further, an epoxy resin having two or more epoxy groups in one molecule is more desirable. Not only can the above-described roughened surface be formed, but also excellent in heat resistance, etc., even under heat cycle conditions, stress concentration does not occur in the metal layer, and peeling of the metal layer does not easily occur. Because.

Examples of the epoxy resin include cresol novolak epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, phenol novolak epoxy resin, alkylphenol novolak epoxy resin, biphenol F epoxy resin, and naphthalene epoxy resin. Resin, dicyclopentadiene type epoxy resin, epoxidized product of condensate of phenols and aromatic aldehyde having phenolic hydroxyl group,
Triglycidyl isocyanurate, alicyclic epoxy resin and the like. These may be used alone or in combination of two or more. Thereby, it becomes excellent in heat resistance and the like.

In the resin film used in the present invention, the soluble particles are desirably substantially uniformly dispersed in the hardly-soluble resin. It is possible to form a roughened surface with unevenness of uniform roughness, and even if via holes and through holes are formed in the resin film, it is possible to secure the adhesion of the metal layer of the conductor circuit formed thereon. Because you can. Alternatively, a resin film containing soluble particles only in the surface layer forming the roughened surface may be used. Thereby,
Since the portions other than the surface layer of the resin film are not exposed to the acid or the oxidizing agent, the insulation between the conductor circuits via the interlayer resin insulating layer is reliably maintained.

In the above resin film, the amount of the soluble particles dispersed in the poorly soluble resin is preferably 3 to 40% by weight based on the resin film. If the amount of the soluble particles is less than 3% by weight, it may not be possible to form a roughened surface having desired irregularities. If the amount exceeds 40% by weight, the soluble particles may be dissolved using an acid or an oxidizing agent. In addition, there is a case where the resin film is melted to a deep portion of the resin film and the insulation between the conductor circuits via the interlayer resin insulating layer made of the resin film cannot be maintained, which may cause a short circuit.

The resin film desirably contains a curing agent and other components in addition to the soluble particles and the hardly soluble resin. As the curing agent, for example,
Imidazole-based curing agents, amine-based curing agents, guanidine-based curing agents, epoxy adducts of these curing agents and microcapsules of these curing agents, and organic materials such as triphenylphosphine, tetraphenylphosphonium, and tetraphenylborate. Phosphine compounds and the like can be mentioned.

The content of the curing agent is desirably 0.05 to 10% by weight based on the resin film. 0.
If the amount is less than 05% by weight, the resin film is insufficiently cured, so that the degree of penetration of the acid or the oxidizing agent into the resin film is increased, and the insulating property of the resin film may be impaired. On the other hand, when the content exceeds 10% by weight, an excessive curing agent component may modify the composition of the resin, which may cause a decrease in reliability.

Examples of the other components include fillers such as inorganic compounds or resins which do not affect the formation of a roughened surface. As the inorganic compound, for example,
Examples of the resin include silica, alumina, and dolomite. Examples of the resin include a polyimide resin, a polyacryl resin, a polyamideimide resin, a polyphenylene resin, a melanin resin, and an olefin resin. By incorporating these fillers, the performance of the printed wiring board can be improved by matching the thermal expansion coefficient, improving heat resistance and chemical resistance, and the like.

Further, the resin film may contain a solvent. As the solvent, for example, acetone,
Ketones such as methyl ethyl ketone and cyclohexanone,
Ethyl acetate, butyl acetate, cellosolve acetate, and aromatic hydrocarbons such as toluene and xylene. These may be used alone or in combination of two or more.

In the method for manufacturing a multilayer printed wiring board according to the present invention, when the resin film is pressed on a substrate or a conductor circuit, the resin film is temporarily pressed at a pressure of 1.0 to 7.0 kgf / cm ² , 2.0 ~ under reduced pressure or vacuum
The final compression bonding is performed at a pressure of 10 kgf / cm ² , and then a non-through hole and / or a through hole is formed.

If the pressure at the time of temporarily compressing the resin film is less than 1.0 kgf / cm ² , the adhesion between the resin film and the surface of the substrate including the conductive circuit is weak. In some cases, the resin film is displaced. On the other hand, when the resin film exceeds 7.0 kgf / cm ² , it becomes difficult to remove the attached resin film again.

The temperature at which the resin film is pre-compressed is preferably 50 to 110 ° C. When the temperature is lower than 50 ° C., the adhesive strength between the resin film and the substrate surface including the conductor circuit is weak, so that when the resin film is cut, the resin film may be displaced. This makes it difficult to remove the attached resin film again. A more desirable temperature is 60 to 90 ° C.

It is desirable that the pressure bonding time for temporarily pressing the resin film is 3 to 15 seconds. If the pressing time is less than 3 seconds, the adhesive strength between the resin film and the substrate surface including the conductive circuit is weak, so that when the resin film is cut, the resin film may be displaced. If it exceeds, it becomes difficult to remove the attached resin film again. Through the process of temporary crimping under such conditions, it is possible to accurately align the resin film with the substrate including the conductive circuit, and after accurately aligning the resin film, cut the resin film. Therefore, the resin film can be used efficiently and the cost can be reduced.

The pressure at which the resin film is completely pressed is 2.0 to 10 kgf / cm ² . If the pressure is less than 2.0 kgf / cm ² , the adhesion between the conductor circuit formed under the interlayer resin insulation layer and the interlayer resin insulation layer is low, and the interlayer resin insulation layer may peel off or the interlayer resin insulation layer may not be peeled off. After forming the opening for the via hole in the insulating layer, when forming the roughened surface using an acid or an oxidizing agent, the acid or the oxidizing agent is used to form the interlayer resin insulating layer and the conductor circuit from near the bottom surface of the opening for the via hole. May easily invade the interface of the two, and may cause separation of both. On the other hand, when the pressure at the time of pressing the resin film exceeds 10 kgf / cm ² , FIG.
As shown in (b), a portion where the soluble particles such as the soluble resin particles 122 aggregate in the surface layer of the interlayer resin insulating layer 2 occurs, and desired irregularities cannot be formed on the roughened surface. Since the adhesion strength between the interlayer resin insulation layer and the conductor circuit formed on the interlayer resin insulation layer becomes 0.5 kg or less and the conductor circuit is easily peeled off, the above range is limited.

The pressure at which the resin film is completely pressed is desirably ^{3 to} 7 kgf / cm ² . this is,
A roughened surface having uniform irregularities can be formed irrespective of the size and density of the soluble particles, and a desired adhesion strength can be maintained between the interlayer resin insulating layer and the conductive circuit. This is because the conductor circuit formed on the layer does not peel off.

It is desirable that the temperature at which the resin film is completely press-bonded is 60 to 120 ° C. When the temperature is lower than 60 ° C, the effect of heating is hardly observed. When the temperature is higher than 120 ° C, when the resin film contains a curing agent or a solvent, the curing agent or the solvent volatilizes, and the resin film is cured. May be insufficient, or the curing may proceed too much, and the resin may remain as a residue on the bottom surface of the via hole opening, and the connection reliability of the conductor circuit including the via hole may be reduced.

The temperature at which the resin film is completely press-bonded is more preferably 70 to 100 ° C. This is because the soluble particles in the resin film do not agglomerate, and the curing agent and other components contained in the resin film do not volatilize or denature before curing.

It is desirable that the pressure bonding time for the final pressure bonding of the resin film is 10 to 120 seconds. The above crimping time is 10
If the time is less than seconds, the pressure bonding of the resin film is insufficient, and even if the pressure bonding time exceeds 120 seconds, the adhesion between the resin film and the conductor circuit is hardly improved.

It is desirable that the degree of vacuum when the resin film is completely press-bonded is 0.1 to 10 Torr. The above degree of vacuum,
It is not technically easy to reduce the pressure to less than 0.1 Torr, and it takes time. On the other hand, if it exceeds 10 Torr, the resin film may not be completely filled between the conductor circuits having a wiring interval of 50 μm or less.

In the manufacturing method of the present invention, non-through holes and / or through holes are formed after the resin film is completely press-bonded. After the formation of the non-through hole, a metal layer is formed on the inner wall of the non-through hole, so that the conductor circuit can be electrically connected via the interlayer resin insulating layer as a via hole. In addition, by forming a metal layer on the inner wall of the through hole after the formation of the through hole, the conductor circuit can be electrically connected via the substrate as a through hole.
These metal layers can be formed using electroless plating, vapor deposition, or the like. Further, after the interlayer resin insulating layer is formed once, the through hole and the non-through hole can be simultaneously formed by using a laser, so that a multilayer printed wiring board can be efficiently manufactured.

FIGS. 1 (a) to 1 (c) are cross-sectional views schematically showing a step of forming a roughened surface by applying a resin film by permanent bonding in the manufacturing process of the multilayer printed wiring board of the present invention. FIG. In the present invention, FIG.
As shown in (b), the resin film (interlayer resin insulating layer) temporarily press-bonded onto the substrate 1 on which the lower conductor circuit 4 is formed is completely press-bonded under the above-mentioned press-bonding conditions, thereby forming the interlayer resin insulating layer 2 and the lower layer. Adhesion with the conductor circuit 4 becomes excellent,
Furthermore, since the soluble particles 22 do not agglomerate on the surface layer of the interlayer resin insulating layer 2, the soluble particles 22 dispersed in the poorly soluble resin 21 are dissolved with an acid or an oxidizing agent to thereby form the interlayer resin insulating layer 2. The surface 2a can have a roughened surface 2a having uniform irregularities, and the adhesion between the interlayer resin insulating layer 2 and the conductor circuit formed on the interlayer resin insulating layer 2 is also excellent.

Next, a method of manufacturing a printed wiring board according to the present invention will be briefly described in the order of steps. (1) In the method for manufacturing a printed wiring board of the present invention, first, a substrate having a conductive circuit formed on a surface of an insulating substrate is prepared.

As the insulating substrate, a resin substrate is desirable. Specifically, for example, a glass epoxy substrate, a polyester substrate, a polyimide substrate, a bismaleimide-triazine resin substrate, a thermosetting polyphenylene ether substrate,
Fluororesin substrate, ceramic substrate, copper-clad laminate, RCC
Substrates and the like can be mentioned. At this time, a through hole may be provided in the insulating substrate. In this case, the through hole has a diameter of 100 to
It is desirable to form using a 300 μm drill, a laser beam or the like.

(2) Next, after performing electroless plating, a conductive circuit-shaped etching resist is formed on the substrate, and the conductive circuit is formed by performing etching. Copper plating is desirable as the electroless plating. Also, when a through hole is provided in the insulating substrate, by simultaneously applying electroless plating to the wall surface of the through hole to form a through hole, the conductor circuits on both surfaces of the substrate are electrically connected. You may.

After the electroless plating, a roughening process is generally performed on the surface of the electroless plating film and the inner wall of the through hole when the through hole is formed. Examples of the roughening forming treatment method include blackening (oxidation) -reduction treatment, spray treatment with a mixed aqueous solution of an organic acid and a cupric complex, Cu-Ni-
P needle-like alloy plating, and the like. At this time, the average roughness Rz of the irregularities obtained by the roughening forming process
Is preferably 0.1 to 5 μm. Further, in consideration of the adhesion between the conductor circuit and the interlayer resin insulating layer, the ease with which the metal layer is etched, and the like, the thickness is more preferably 2 to 4 μm.

As a specific method of the blackening (oxidation) -reduction treatment, NaOH (10 g / l), NaClO ₂
(40 g / l), a blackening treatment using an aqueous solution containing Na ₃ PO ₄ (6 g / l) as a blackening bath (oxidizing bath), and NaO
A method of performing a reduction treatment using an aqueous solution containing H (10 g / l) and NaBH ₄ (6 g / l) as a reduction bath is exemplified.

(3) Next, a resin film in which the above-mentioned soluble particles are dispersed in a hardly-soluble resin is attached to the surface of the substrate on which the conductive circuit is formed, thereby forming an interlayer resin insulating layer. The formation of the interlayer resin insulation layer is first performed in 1.0 to
Temporary pressure bonding is performed at a pressure of 7.0 kgf / cm ² and a temperature of 50 to 110 ° C., and then, using a device such as a vacuum laminator, under the above-mentioned conditions, that is, 2.0 to 10 kgf under reduced pressure or vacuum. / Cm ² pressure, 60-12
This is performed by performing full pressure bonding at a temperature of 0 ° C., and then thermosetting the resin film. After the temporary compression bonding, the resin film may be cut if necessary. The thermal curing may be performed after forming a via hole opening and a through hole described later.

(4) Next, a via hole opening and, if necessary, a through hole are formed in the substrate on which the interlayer resin insulating layer is formed. The via hole opening is formed by laser processing or the like. When a resin film made of a photosensitive resin is used as the resin film, the opening for the via hole may be provided by performing exposure and development processing. The laser light used at this time includes, for example, a carbon dioxide gas (CO ₂ ) laser, an ultraviolet laser, an excimer laser, etc. Among them, an excimer laser or a short-pulse carbon dioxide laser is desirable.

The excimer laser can form a large number of via hole openings at once by using a mask or the like in which a through hole is formed in a portion where the via hole opening is formed, as described later. This is because the short-pulse carbon dioxide laser has less resin residue in the opening and less damage to the resin around the opening.

It is desirable to use a hologram type excimer laser among excimer lasers. The hologram method is a method of irradiating a laser beam to a target object through a hologram, a condensing lens, a laser mask, a transfer lens, and the like. The opening can be formed efficiently.

When a carbon dioxide laser is used, the pulse interval is desirably 10 ⁻⁴ to 10 ⁻⁸ seconds. The time for irradiating the laser for forming the opening is preferably 10 to 500 μsec. The through-hole of the mask in which the through-hole is formed in the portion for forming the via-hole opening is required to be a perfect circle in order to make the spot shape of the laser beam a perfect circle, and the diameter of the through-hole is
About 0.1 to 2 mm is desirable.

When an opening is formed by a laser beam, particularly when a carbon dioxide laser is used, desmearing is preferably performed. The desmear treatment can be performed using an oxidizing agent composed of an aqueous solution such as chromic acid and permanganate. Alternatively, the treatment may be performed using oxygen plasma, a mixed plasma of CF ₄ and oxygen, corona discharge, or the like. The surface can also be modified by irradiating ultraviolet rays using a low-pressure mercury lamp. When a through-hole is formed in the substrate on which the interlayer resin insulating layer is formed, the diameter is 500 to 30.
A through hole is formed using a 0 μm drill, laser light, or the like.

(5) Next, the surface of the interlayer resin insulating layer including the inner wall of the opening for the via hole and the inner wall of the through hole in the case where the through hole is formed in the above step are roughened with an acid or an oxidizing agent. To form a surface. Examples of the acid include sulfuric acid, nitric acid, hydrochloric acid,
Examples of the oxidizing agent include phosphoric acid, formic acid, and the like. Examples of the oxidizing agent include permanganates such as chromic acid, chromic sulfuric acid, and sodium permanganate.

Thereafter, when the roughened surface is formed by using an acid, an aqueous solution of an alkali or the like is used, and when the roughened surface is formed by using an oxidizing agent, a neutralizing solution is used. Neutralizes the inside of the through hole. By this operation, the acid and the oxidizing agent are removed so that the next step is not affected. The average roughness Rz of the roughened surface formed in this step is 0.1 to 5 μm.
m is desirable.

(6) Next, a catalyst is applied to the formed roughened surface, if necessary. Examples of the catalyst include palladium chloride. At this time, in order to reliably apply the catalyst, a dry treatment such as a plasma treatment with oxygen, nitrogen or the like or a corona treatment is performed to remove a residue of an acid or an oxidizing agent and to modify the surface of the interlayer resin insulating layer. By doing so, the catalyst can be reliably applied, the metal can be deposited during electroless plating, and the adhesion of the electroless plated film to the interlayer resin insulating layer can be improved. In particular, the bottom surface of the via hole opening can be improved. In the above, a great effect can be obtained.

(7) Then, if necessary, a coating layer made of tin, zinc, copper, nickel, cobalt, thallium, lead, or the like is formed on the roughened surface by electroless plating, vapor deposition, or the like. Among these, it is desirable to form a coating layer made of copper in consideration of electrical characteristics, economy, and the like. The thickness of the coating layer is desirably 0.3 to 2.0 μm. If the thickness of the coating layer is less than 0.3 μm, the coating layer may not be able to follow the shape of the roughened surface,
If the thickness exceeds 2.0 μm, the coating layer cannot be completely removed when removing the coating layer in a step described later, which may cause a short circuit. When the through hole is formed in the step (4), a through-hole may be formed by forming a coating layer made of metal on the inner wall surface of the through hole in this step.

When a through hole is formed in the above step (7), it is desirable to perform the following processing steps. That is, the surface of the electroless plating film and the inner wall of the through hole are subjected to blackening (oxidation) -reduction treatment, spray treatment with a mixed aqueous solution of an organic acid and a cupric complex, treatment with Cu-Ni-P needle-like alloy plating, or the like. To perform a roughening process. Thereafter, the inside of the through hole is further filled with a resin filler or the like, and then the surface layer of the resin filler and the surface of the electroless plating film are flattened by a polishing treatment method such as buffing. Further, by performing electroless plating and forming an electroless plating film on the coating layer made of a metal and the surface layer of the resin filler, a cover plating layer is formed on the through hole.

(8) Next, electroplating is performed using the thin metal film formed on the interlayer resin insulating layer as a plating lead to thicken the conductor circuit. Electroplating film thickness is 5-30μ
m is preferred. At this time, the via hole opening may be filled with electroplating to form a field via structure, and after filling the via hole opening with a conductive paste or the like, a lid plating layer may be formed thereon to form a field via structure. Good. By forming a field via structure, a via hole can be provided immediately above the via hole.

(9) After forming the electroplating film, the plating resist is peeled off, and the coating layer made of metal existing under the plating resist is removed by etching, thereby forming an independent conductor circuit. It is desirable to use copper plating as the electroplating. Examples of the etchant include a sulfuric acid-hydrogen peroxide aqueous solution, ammonium persulfate, sodium persulfate, a persulfate aqueous solution such as potassium persulfate,
An aqueous solution of ferric chloride and cupric chloride, hydrochloric acid, nitric acid, hot dilute sulfuric acid and the like can be mentioned. Alternatively, a roughened surface may be formed simultaneously with etching between conductor circuits using an etching solution containing the above-described cupric complex and an organic acid. Further, if necessary, the catalyst on the interlayer resin insulating layer may be removed using an acid or an oxidizing agent. By removing the catalyst, the metal such as palladium used for the catalyst disappears, so that a decrease in the electrical characteristics can be prevented.

(10) Thereafter, if necessary, the steps (3) to (9) are repeated, and then, if necessary, the uppermost conductive circuit is subjected to electroless plating or the like under the same conditions as in the step (3). A roughened surface is formed by performing etching or the like.

(11) Next, a solder resist resin composition is applied to the surface of the substrate including the uppermost conductive circuit by a roll coater method or the like, and an opening process such as a laser process, an exposure and a development process is performed, and a curing process or the like is performed. Is performed to form a solder resist layer. After that, a corrosion-resistant metal layer made of Ni, Au, or the like is formed in the opening of the solder resist layer by plating, sputtering, evaporation, or the like.
Solder bumps are formed on the chip connection surface by printing solder paste, and BGA (Ba
ll Grid Array), PGA (Pin Grid Array), etc., to complete the manufacture of the printed wiring board.

When the above PGA is provided, it is desirable to connect a pin made of an alloy such as Kovar or 42 alloy through a conductive adhesive layer such as a solder paste. Mold pins are preferred.

FIG. 2 shows a method of disposing the PGA.
This will be briefly described with reference to FIG. FIG. 2 is a cross-sectional view schematically showing a process of disposing PGA. (1) First, solder bump 1 on the surface of solder resist layer
The multilayer printed wiring board 30 on which the PGA 7 is formed is placed on a jig 31 for a printed wiring board made of graphite or the like so that the surface on which the PGA is disposed is the upper surface (see FIG. 2A). Thereafter, a solder paste 190 is printed on the opening of the solder resist layer on which the corrosion-resistant metal layer made of Ni, Au, or the like is formed (see FIG. 2B).

(2) Although not shown, the above (1)
Separately from the step, a through hole is provided in a portion corresponding to a portion on which the solder paste 190 is printed (a portion where a pin is to be formed), and a nail shape is formed in the through hole of a pin jig 34 made of graphite or the like. Insert the pin 20 with the head up and fix it. (3) Next, after the pin jig 34 into which the pin 20 has been inserted is inverted, the pin 20 is placed on the jig 31 for the printed wiring board (see FIG. 2C), and the pin 20 is lowered. Then, the pins 20 are connected to the conductor layers of the multilayer printed wiring board 30 via the solder 19 by reflow (see FIG. 2D). Thereafter, the multilayer printed wiring board to which the pins 19 are connected is taken out of the jig, and flux cleaning is performed to complete the multilayer printed wiring board on which the PGA is provided.

In addition, a plasma treatment with oxygen, carbon tetrachloride, or the like may be performed as needed for a character printing step for forming a product recognition character or the like or for modifying a solder resist layer. Although the above method is based on the semi-additive method, a full additive method may be employed.

[0076]

The present invention will be described in more detail below. Example 1 A. Preparation of Resin Film for Interlayer Resin Insulation Layer Bisphenol A type epoxy resin (Epoxy equivalent 46
9. Yuka Shell Epoxy Epicoat 1001) 30
Parts by weight, 40 parts by weight of a cresol novolak type epoxy resin (epoxy equivalent: 215, Epicron N-673 manufactured by Dainippon Ink and Chemicals, Inc.) Light KA-705
2) 30 parts by weight were dissolved by heating in 20 parts by weight of ethyl diglycol acetate and 20 parts by weight of solvent naphtha while stirring, and epoxidized polybutadiene rubber (Denalex R-45EPT manufactured by Nagase Kasei Kogyo Co., Ltd.) was added thereto.
15 parts by weight, 1.5 parts by weight of a crushed product of 2-phenyl-4,5-bis (hydroxymethyl) imidazole, 2 parts by weight of finely divided silica, and 0.5 part by weight of a silicon-based antifoaming agent are added, and an epoxy resin composition is added. Was prepared. The resulting epoxy resin composition is applied on a 38 μm-thick PET film using a roll coater so that the thickness after drying becomes 50 μm, and then dried at 80 to 120 ° C. for 10 minutes to form an interlayer resin. A resin film for an insulating layer was produced.

B. Preparation of resin filler 1) 100 parts by weight of bisphenol F type epoxy monomer (manufactured by Yuka Shell Co., molecular weight: 310, YL983U), the average particle size of which surface is coated with a silane coupling agent is 1.6 μm, and the largest particle Having a diameter of 15 μm or less
iO ₂ spherical particles (CRS 1101- manufactured by Adtech Co., Ltd.)
CE) 170 parts by weight and 1.5 parts by weight of a leveling agent (Perenol S4 manufactured by San Nopco Co.) are placed in a container, and the mixture is stirred and mixed to have a viscosity of 45-4 at 23 ± 1 ° C.
A 9 Pa · s resin filler was prepared. In addition, as a curing agent, an imidazole curing agent (2E4MZ- manufactured by Shikoku Chemicals Co., Ltd.)
6.5 parts by weight (CN).

C. Manufacturing method of printed wiring board (1) Glass epoxy resin or BT with a thickness of 0.8 mm
A copper-clad laminate in which 18 μm copper foils 8 were laminated on both sides of a substrate 1 made of (bismaleimide triazine) resin was used as a starting material (see FIG. 3A). First, the copper-clad laminate was drilled, subjected to electroless plating, and etched in a pattern to form a lower conductor circuit 4 and through holes 9 on both surfaces of the substrate 1.

(2) Through-hole 9 and lower conductor circuit 4
After the substrate on which was formed was washed with water and dried, NaOH (1
0 g / l), NaClO ₂ (40 g / l), Na ₃ PO
₄ A blackening treatment using an aqueous solution containing (6 g / l) as a blackening bath (oxidizing bath), NaOH (10 g / l), NaBH
₄ A reduction treatment was performed using an aqueous solution containing (6 g / l) as a reducing bath, and roughened surfaces 4a and 9a were formed on the entire surface of the lower conductor circuit 4 including the through holes 9 (see FIG. 3B). .

(3) After preparing the resin filler described in the above B, within 24 hours after preparation by the following method, the conductive circuit non-formed portion and the conductive circuit in the through hole 9 and on one side of the substrate 1 A layer of the resin filler 10 was formed on the outer edge portion of No. 4. That is, first, the resin filler was pushed into the through holes using a squeegee, and then dried at 100 ° C. for 20 minutes. Next, a mask having an opening corresponding to the conductive circuit non-forming portion is placed on the substrate, and a layer of the resin filler 10 is formed in the conductive circuit non-forming portion having a concave portion using a squeegee. It was dried at 20 ° C. for 20 minutes (see FIG. 3C).

(4) One surface of the substrate after the treatment of the above (3) is subjected to belt sander polishing using # 600 belt polishing paper (manufactured by Sankyo Rikagaku) to form the surface of the inner layer copper pattern 4 and the through holes 9. Polishing was performed so that the resin filler 10 did not remain on the land surface, and then buffing was performed to remove scratches caused by the belt sander polishing. Such a series of polishing was similarly performed on the other surface of the substrate. Next, a heat treatment was performed at 100 ° C. for 1 hour and at 150 ° C. for 1 hour to cure the resin filler 10.

In this way, the surface portion of the resin filler 10 formed in the through-hole 9 and the portion where the conductor circuit is not formed and the surface of the lower conductor circuit 4 are flattened, and the resin filler 10 and the side surfaces of the lower conductor circuit 4 are flattened. 4a is firmly adhered through the roughened surface, and the inner wall surface 9a of the through hole 9 and the resin filler 10
Was firmly adhered through the roughened surface to obtain an insulating substrate (see FIG. 3D). That is, by this step, the surface of the resin filler 10 and the surface of the lower conductive circuit 4 become flush with each other.

(5) The above substrate is washed with water and acid-degreased, and then soft-etched. Then, an etching solution is sprayed on both surfaces of the substrate by spraying, so that the surface of the lower conductor circuit 4, the land surface of the through hole 9 and the inner wall are formed. Thus, roughened surfaces 4a and 9a were formed on the entire surface of the lower conductor circuit 4 (see FIG. 4A). As an etchant,
An etching solution (Mec etch bond, manufactured by Mec) comprising 10 parts by weight of imidazole copper (II) complex, 7 parts by weight of glycolic acid, and 5 parts by weight of potassium chloride was used.

(6) On both sides of the substrate, a resin film for an interlayer resin insulating layer slightly larger than the substrate prepared in A was placed on the substrate, and the pressure was 4 kgf / cm ² , the temperature was 80 ° C., and the compression time was 10 seconds. After temporary compression bonding under the conditions and cutting, an interlayer resin insulating layer was further formed by bonding using a vacuum laminator apparatus by the following method (see FIG. 4B). That is, a resin film for an interlayer resin insulating layer is formed on a substrate by applying a vacuum of 0.5 Torr, a pressure of 4 kgf / cm ² ,
The final compression bonding was performed under the conditions of a temperature of 80 ° C. and a compression bonding time of 60 seconds, and thereafter, thermosetting was performed at 170 ° C. for 30 minutes.

(7) Next, a CO ₂ gas laser having a wavelength of 10.4 μm is used to form a beam having a beam diameter of 4.0 through a mask having a through hole having a thickness of 1.2 mm formed on the interlayer resin insulating layer 2.
The via hole opening 6 having a diameter of 80 μm was formed in the interlayer resin insulating layer 2 under the conditions of 1 mm, a top hat mode, a pulse width of 8.0 μsec, a diameter of a through hole of the mask of 1.0 mm, and one shot (FIG. c)).

(8) The substrate in which the via hole opening 6 was formed was placed in a 80 ° C. solution containing 60 g / l of permanganate.
The surface of the interlayer resin insulation layer 2 including the inner wall of the via hole opening 6 was roughened by dissolving and removing the epoxy resin particles present on the surface of the interlayer resin insulation layer 2 for 0 minute (FIG. 4 ( d)).

(9) Next, the substrate after the above treatment was immersed in a neutralizing solution (manufactured by Shipley) and washed with water. Further, by applying a palladium catalyst to the surface of the substrate subjected to the surface roughening treatment (roughening depth: 3 μm), a catalyst nucleus is attached to the surface of the interlayer resin insulating layer 2 and the inner wall surface of the via hole opening 6. Was.

(10) Next, the substrate is immersed in an aqueous solution of electroless copper plating having the following composition, and has a thickness of 0.6 to 3.
An electroless copper plating film 12 having a thickness of 0 μm was formed (FIG. 5A).
reference). [Electroless plating aqueous solution] NiSO ₄ 0.003 mol / l tartaric acid 0.200 mol / l copper sulfate 0.030 mol / l HCHO 0.050 mol / l NaOH 0.100 mol / l α, α'-bipyridyl 40 mg / l Polyethylene glycol (PEG) 0.10 g / l [Electroless plating conditions] 40 minutes at a liquid temperature of 35 ° C

(11) A commercially available photosensitive dry film is stuck on the electroless copper plating film 12, and a mask is placed thereon.
Exposure was performed at mJ / cm ² , and a development treatment was performed with a 0.8% aqueous sodium carbonate solution to provide a plating resist 3 having a thickness of 30 μm (see FIG. 5B).

(12) Next, the substrate was washed with water at 50 ° C., degreased, washed with water at 25 ° C., further washed with sulfuric acid, and then subjected to electrolytic copper plating under the following conditions to a thickness of 20 μm. Was formed (see FIG. 5C). [Electroplating aqueous solution] sulfuric acid 2.24 mol / l copper sulfate 0.26 mol / l additive 19.5 ml / l (manufactured by Atotech Japan, Capparaside HL) [electroplating conditions] current density 1 A / dm ² hours 65 minutes Temperature 22 ± 2 ℃

(13) After the plating resist 3 is peeled and removed with 5% NaOH, the electroless plating film 12 under the plating resist 3 is dissolved and removed by etching with a mixed solution of sulfuric acid and hydrogen peroxide. An 18 μm-thick conductor circuit (via hole 7) composed of copper plating film 12 and electrolytic copper plating film 13
5 was formed (see FIG. 5D).

(14) The same treatment as in (5) was performed, and a roughened surface was formed with an etching solution containing a cupric complex and an organic acid (see FIG. 6A).

(15) By repeating the above steps (6) to (14), a conductor circuit of a further upper layer was formed, and a multilayer wiring board was obtained (see FIGS. 6 (b) to 7 (b)). .

(16) Next, a cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) dissolved in diethylene glycol dimethyl ether (DMDG) to a concentration of 60% by weight was used. 46.67 parts by weight of an oligomer for imparting properties (molecular weight: 4000), 15.0 parts by weight of a bisphenol A type epoxy resin (trade name: Epicoat 1001 manufactured by Yuka Shell Co., Ltd.) dissolved in methyl ethyl ketone, and imidazole cured Agent (Shikoku Chemicals, trade name: 2E4MZ-CN)
1.6 parts by weight, 4.5 parts by weight of a photosensitive monomer, bifunctional acrylic monomer (trade name: R604, manufactured by Nippon Kayaku Co., Ltd.), and similarly polyvalent acrylic monomer (trade name: DPE6A, manufactured by Kyoei Chemical Co., Ltd.) 1 0.5 part by weight and 0.71 part by weight of a dispersion antifoaming agent (manufactured by San Nopco Co., S-65) are placed in a container, stirred and mixed to prepare a mixed composition, and photopolymerization of the mixed composition is started. By adding 2.0 parts by weight of benzophenone (manufactured by Kanto Kagaku) as an agent and 0.2 parts by weight of Michler's ketone (manufactured by Kanto Kagaku) as a photosensitizer,
A solder resist composition having a viscosity adjusted to 2.0 Pa · s at 25 ° C. was obtained. The viscosity was measured with a B-type viscometer (DVL-B type, manufactured by Tokyo Keiki Co., Ltd.) when the rotor No. was 60 rpm. In the case of 4, 6 rpm, the rotor No. According to 3.

(17) Next, the above-mentioned solder resist composition is applied to both sides of the multilayer wiring board in a thickness of 20 μm,
After performing a drying process under the conditions of 20 ° C. for 20 minutes and 70 ° C. for 30 minutes, a 5 mm-thick photomask on which a pattern of the opening of the solder resist is drawn is brought into close contact with the solder resist layer, and an ultraviolet ray of 1000 mJ / cm ² is applied. Exposure with DM
Development was performed with a TG solution to form an opening having a diameter of 200 μm. Then, at 80 ° C. for 1 hour, and at 100 ° C. for 1 hour.
The solder resist layer was cured by performing heat treatment under the conditions of 120 ° C. for 1 hour and 150 ° C. for 3 hours to form a solder resist pattern layer 14 having an opening and a thickness of 20 μm. As the solder resist composition, a commercially available solder resist composition can be used.

(18) Next, the substrate on which the solder resist layer 14 was formed was coated with nickel chloride (2.3 × 10 ⁻¹ mol / mol).
l), sodium hypophosphite (2.8 × 10 ⁻¹ mol /
l), sodium citrate (1.6 × 10 ⁻¹ mol /
2) in the electroless nickel plating solution having pH = 4.5 containing l)
This was immersed for 0 minutes to form a nickel plating layer 15 having a thickness of 5 μm in the opening. Furthermore, the substrate gold potassium cyanide ^{(7.6 × 10 -3 mol / l} ), ammonium chloride ^{(1.9 × 10 -1 mol / l} ), sodium citrate (1.2 × 10 ^-1 mol / l), immersed in an electroless gold plating solution containing sodium hypophosphite (1.7 × 10 ^-1 mol / l) for 7.5 minutes at 80 ° C. A gold plating layer 16 of 0.03 μm was formed.

(19) Thereafter, a solder paste containing tin-lead is printed on the opening of the solder resist layer 14 on the surface of the substrate on which the IC chip is to be mounted, and the opening of the solder resist layer 14 on the other surface is further printed. After printing a solder paste containing tin-antimony on the substrate, a solder bump (solder body) 17 was formed by reflow at 200 ° C. to manufacture a multilayer wiring printed board having the solder bump 17 (FIG. 7C). reference).

Example 2 A. In the same manner as in Example 1, a resin film for an interlayer resin insulating layer was prepared, and a resin filler was prepared.

B. Manufacturing method of printed wiring board (1) 1.0 mm thick glass epoxy resin or BT
A copper-clad laminate in which a 18 μm copper foil 8 was laminated on both sides of a substrate 1 made of (bismaleimide triazine) resin was used as a starting material (see FIG. 8A). First, the copper-clad laminate was etched in a pattern to form a lower conductive circuit 4 on both surfaces of the substrate 1.

(2) The substrate was washed with water and acid degreased, and then soft-etched. Then, an etching solution was sprayed on both surfaces of the substrate by spraying, and the etching solution was conveyed to the surface of the substrate by conveyance rolls. Is etched to form a roughened surface 4a on the entire surface of the lower conductive circuit 4 (see FIG. 8B). As an etchant,
An etching solution (Mec etch bond, manufactured by Mec) comprising 10 parts by weight of imidazole copper (II) complex, 7 parts by weight of glycolic acid, and 5 parts by weight of potassium chloride was used.

(3) On both sides of the substrate, a resin film for an interlayer resin insulating layer slightly larger than the substrate prepared in A was placed on the substrate, and the pressure was 4 kgf / cm ² , the temperature was 80 ° C., and the compression time was 10 seconds. After temporary compression bonding and cutting, an interlayer resin insulating layer 2 was formed by bonding using a vacuum laminator under the following conditions (see FIG. 8C). That is, the resin film for the interlayer resin insulation layer is placed on the substrate,
Vacuum degree 0.5 Torr, pressure 4 kgf / cm ² , temperature 8
This was completely press-bonded at 0 ° C. for 60 seconds, and then thermally cured at 170 ° C. for 30 minutes.

(4) Next, a CO ₂ gas laser having a wavelength of 10.4 μm is used to form a beam diameter of 4.0 through a mask having a through hole having a thickness of 1.2 mm formed on the interlayer resin insulating layer 2.
The via hole opening 6 having a diameter of 80 μm was formed in the interlayer resin insulating layer 2 under the conditions of mm, top hat mode, pulse width 8.0 μsec, diameter of the through hole of the mask 1.0 mm, and one shot. Further, the substrate on which the interlayer resin insulating layer 2 was formed was drilled to form a through hole 18.
(D)).

(5) The substrate in which the via hole opening 6 and the through hole 18 were formed was immersed in a solution containing 60 g / l of permanganic acid at 80 ° C. for 10 minutes to form the interlayer resin insulating layer 2.
The surface of the interlayer resin insulating layer 2 was roughened by dissolving and removing the epoxy resin particles present on the surface of FIG.
(A)). Furthermore, surface roughening treatment (roughening depth 6 μm)
Palladium catalyst (made by Atotech) on the surface of the substrate
The catalyst nuclei were attached to the surfaces of the interlayer resin insulating layer 2 and the through holes 18 and the inner wall surfaces 6 of the via hole openings.

(6) Next, the substrate is immersed in an aqueous solution of electroless copper plating having the following composition, and has a thickness of 0.6 to 3.
A 0 μm electroless copper plating film 12a was formed (FIG. 9).
(B)). [Electroless plating aqueous solution] NiSO ₄ 0.003 mol / l tartaric acid 0.200 mol / l copper sulfate 0.030 mol / l HCHO 0.050 mol / l NaOH 0.100 mol / l α, α′-bipyridyl 40 mg / l Polyethylene glycol (PEG) 0.10 g / l [Electroless plating conditions] 40 minutes at a liquid temperature of 35 ° C

(7) The substrate on which the electroless plating film 12a was formed was washed with water and dried, and then NaOH (10 g / l), N
aClO ₂ (40 g / l), Na ₃ PO ₄ (6 g / l)
Blackening to blackening bath (oxidizing bath) an aqueous solution containing, and, NaOH (10g / l), NaBH 4 (6g / l)
A reduction treatment was performed using an aqueous solution containing Pb as a reduction bath to form a roughened surface on the entire surface of the electroless plating film 12a.

(8) After the resin filler described in B above was prepared, the resin filler 10 was filled into the through hole 29 within 24 hours after the preparation by the following method. That is,
After the resin filler was pushed into the through hole 29 using a squeegee, it was dried at 100 ° C. for 20 minutes. After the drying, buffing was performed to flatten the surface of the electroless plating film 12a and the surface layer portion 10a of the resin filler. Next, at 100 ° C. for 1 hour, at 120 ° C. for 3 hours,
Heat treatment was performed at 150 ° C. for 1 hour and at 180 ° C. for 7 hours to cure the resin filler 10 (see FIG. 9C).

(9) Next, a palladium catalyst (manufactured by Atotech) was applied to the surface layer portion 10a of the resin filler, so that catalyst nuclei were attached to the surface layer portion 10a of the resin filler.
Further, electroless plating is performed under the same conditions as in (6) above,
On the electroless plating film 12a formed in the above (6) and the surface portion 10a of the resin filler, a thickness of 0.6 to 3.0 μm is further added.
m of the electroless plating film 12b was formed (see FIG. 9D). By this step, a cover plating layer could be formed on the through hole 29.

(10) A commercially available photosensitive dry film is adhered to the electroless copper plating film 12b, and a mask is placed thereon.
The plating resist 3 having a thickness of 30 μm was provided by exposing at 0 mJ / cm ² and developing with an aqueous 0.8% sodium carbonate solution (see FIG. 10A).

(11) Next, the substrate was washed with water at 50 ° C., degreased, washed with water at 25 ° C., further washed with sulfuric acid, and then subjected to electrolytic copper plating under the following conditions to give a thickness of 20 μm. Was formed (see FIG. 10B). [Electroplating aqueous solution] sulfuric acid 2.24 mol / l copper sulfate 0.26 mol / l additive 19.5 ml / l (manufactured by Atotech Japan, Capparaside HL) [electroplating conditions] current density 1 A / dm ² hours 65 minutes Temperature 22 ± 2 ℃

(12) After removing and removing the plating resist 3 with 5% NaOH, the electroless plating films 12a and 12b under the plating resist 3 are dissolved and removed by etching with a mixed solution of sulfuric acid and hydrogen peroxide. A conductor circuit (including the via hole 7) 5 having a thickness of 18 μm comprising the electroless copper plating film 12 and the electrolytic copper plating film 13 was formed (see FIG. 10C).

(13) The same treatment as in (5) was performed, and a roughened surface was formed with an etching solution containing a cupric complex and an organic acid (see FIG. 10D).

(14) By repeating the above steps (6) to (13), a conductor circuit of a further upper layer was formed, and a multilayer wiring board was obtained (see FIGS. 11A to 12A). .

(15) Next, a cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) dissolved in diethylene glycol dimethyl ether (DMDG) to a concentration of 60% by weight was used. 46.67 parts by weight of an oligomer for imparting properties (molecular weight: 4000), 15.0 parts by weight of a bisphenol A type epoxy resin (trade name: Epicoat 1001 manufactured by Yuka Shell Co., Ltd.) dissolved in methyl ethyl ketone, and imidazole cured Agent (Shikoku Chemicals, trade name: 2E4MZ-CN)
1.6 parts by weight, 4.5 parts by weight of a photosensitive monomer, bifunctional acrylic monomer (trade name: R604, manufactured by Nippon Kayaku Co., Ltd.), and similarly polyvalent acrylic monomer (trade name: DPE6A, manufactured by Kyoei Chemical Co., Ltd.) 1 0.5 part by weight and 0.71 part by weight of a dispersion antifoaming agent (manufactured by San Nopco Co., S-65) are placed in a container, stirred and mixed to prepare a mixed composition, and photopolymerization of the mixed composition is started. By adding 2.0 parts by weight of benzophenone (manufactured by Kanto Kagaku) as an agent and 0.2 parts by weight of Michler's ketone (manufactured by Kanto Kagaku) as a photosensitizer,
A solder resist composition having a viscosity adjusted to 2.0 Pa · s at 25 ° C. was obtained. The viscosity was measured with a B-type viscometer (DVL-B type, manufactured by Tokyo Keiki Co., Ltd.) when the rotor No. was 60 rpm. In the case of 4, 6 rpm, the rotor No. According to 3.

(16) Next, the above-mentioned solder resist composition is applied to both sides of the multilayer wiring board in a thickness of 20 μm,
After performing a drying process under the conditions of 20 ° C. for 20 minutes and 70 ° C. for 30 minutes, a 5 mm-thick photomask on which a pattern of the opening of the solder resist is drawn is brought into close contact with the solder resist layer, and an ultraviolet ray of 1000 mJ / cm ² is applied. Exposure with DM
Development was performed with a TG solution to form an opening having a diameter of 200 μm. Then, at 80 ° C. for 1 hour, and at 100 ° C. for 1 hour.
The solder resist layer was cured by performing heat treatment under the conditions of 120 ° C. for 1 hour and 150 ° C. for 3 hours to form a solder resist pattern layer 14 having an opening and a thickness of 20 μm. As the solder resist composition, a commercially available solder resist composition can be used.

(17) Next, the substrate on which the solder resist layer 14 has been formed is coated with nickel chloride (2.3 × 10 ^-1 mol / mol).
l), sodium hypophosphite (2.8 × 10 ⁻¹ mol /
l), sodium citrate (1.6 × 10 ⁻¹ mol /
2) in the electroless nickel plating solution having pH = 4.5 containing l)
This was immersed for 0 minutes to form a nickel plating layer 15 having a thickness of 5 μm in the opening. Furthermore, the substrate gold potassium cyanide ^{(7.6 × 10 -3 mol / l} ), ammonium chloride ^{(1.9 × 10 -1 mol / l} ), sodium citrate (1.2 × 10 ^-1 mol / l), immersed in an electroless gold plating solution containing sodium hypophosphite (1.7 × 10 ^-1 mol / l) for 7.5 minutes at 80 ° C. A gold plating layer 16 of 0.03 μm was formed.

(18) Thereafter, a solder paste containing tin-lead is printed on the opening of the solder resist layer 14 on the surface of the substrate on which the IC chip is to be mounted, and the opening of the solder resist layer 14 on the other surface is further printed. A solder paste containing tin-antimony is printed on the solder paste, pins are placed on the solder paste, and reflow is performed at 200 ° C. to form solder bumps (solder bodies) 17 on the surface on which the IC chip is placed. On the other side, PGA was formed using the same method as that described with reference to FIG. 2 to manufacture a multilayer wiring printed board (see FIG. 12B).

(Comparative Example 1) A multilayer printed wiring board was manufactured in the same manner as in Example 1 except that in the above-mentioned step (6), the film for an interlayer resin insulating layer was temporarily pressure-bonded under the following conditions. That is, a resin film for an interlayer resin insulation layer is placed on a substrate, and a pressure of 0.2 kgf / cm ² , a temperature of 100 ° C.,
Temporary crimping was performed by pasting with a crimping time of 10 seconds.

(Comparative Example 2) A multilayer printed wiring board was manufactured in the same manner as in Example 1 except that in the above-mentioned step (6), the interlayer resin insulating layer film was temporarily pressure-bonded under the following conditions. That is, a resin film for an interlayer resin insulation layer was placed on a substrate, and was preliminarily pressure-bonded by applying a pressure of 9 kgf / cm ² , a temperature of 80 ° C., and a pressure bonding time of 10 seconds.

(Comparative Example 3) In the above-mentioned step (6), the interlayer resin insulating layer was formed by attaching a film for an interlayer resin insulating layer by using a vacuum laminator under the following conditions. Similarly, a multilayer printed wiring board was manufactured. That is, a resin film for an interlayer resin insulating layer is placed on a substrate, and is adhered at a degree of vacuum of 0.5 Torr, a pressure of 1.0 kgf / cm ² , a temperature of 80 ° C., and a pressing time of 60 seconds, and then at 170 ° C. for 30 minutes. Heat cured.

(Comparative Example 4) In the above-mentioned step (6), the interlayer resin insulating layer was formed by attaching a film for an interlayer resin insulating layer by using a vacuum laminator under the following conditions. Similarly, a multilayer printed wiring board was manufactured. That is, a resin film for an interlayer resin insulating layer is placed on a substrate, and is adhered at a degree of vacuum of 0.5 Torr, a pressure of 15 kgf / cm ² , a temperature of 80 ° C., and a pressure bonding time of 60 seconds. I let it.

Examples 1 and 2 and Comparative Examples 1 to 5
In the manufacturing process of 4, after the resin film is temporarily compressed,
When the resin film was peeled off, in Examples 1 and 2 and Comparative Examples 1, 3 and 4, no resin residue or the like was generated on the substrate, and the peeled resin film could be used again as a film for an interlayer resin insulating layer. In contrast, in Comparative Example 2, resin residue was left on the substrate and the resin film was torn, so that the peeled resin film could not be used again as a film for an interlayer resin insulating layer.

Further, when the resin film was cut, the resin film could be cut without any positional deviation in Examples 1 and 2 and Comparative Examples 2 to 4, whereas in Comparative Example 1, the resin film was cut. When the film was cut, the resin film was misaligned.

Further, the multilayer printed wiring boards of Examples 1 and 2 and Comparative Examples 3 and 4 were manufactured at −55 ° C. for 3 hours.
After holding for 0 minutes, a heat cycle test in which a heat cycle of holding at 125 ° C. for 30 minutes is repeated 1000 times is performed, and the roughened surface of the interlayer resin insulating layer and the peeling between the interlayer resin insulating layer and the conductive circuit are removed. The presence or absence was examined by cross-cutting and microscopic observation.

As a result, in the multilayer printed wiring boards according to Examples 1 and 2 and Comparative Example 3, the roughened surface formed on the interlayer resin insulating layer had an average roughness Rz of 1.5 to 2.5 μm.
Whereas the multilayer printed wiring board according to Comparative Example 4 was formed on the entire surface of the interlayer resin insulating layer regardless of the presence or absence of the lower conductive circuit, the surface layer of the interlayer resin insulating layer in the portion where the lower conductive circuit was formed was used. The part where the roughened surface was not formed was observed in the part.

In the multilayer printed wiring boards according to Examples 1 and 2, no peeling occurred between the interlayer resin insulating layer and the conductive circuit, whereas in the multilayer printed wiring board according to Comparative Example 3, In the multilayer printed wiring board according to Comparative Example 4, the portion where the roughened surface was not formed was observed in the portion where the peeling occurred between the interlayer resin insulating layer and the lower conductive circuit. A portion where peeling occurred between the conductor circuit and the conductor circuit was observed.

Further, Examples 1 and 2 and Comparative Examples 3 and 4
When a continuity test was performed on the multilayer printed wiring boards according to Comparative Examples 3 and 4, no conduction failure occurred in the multilayer printed wiring boards according to Examples 1 and 2, whereas in the multilayer printed wiring boards according to Comparative Examples 3 and 4, A conduction defect occurred in a part of the circuit.

[0127]

As described above, according to the method for manufacturing a printed wiring board of the present invention, when the resin film is crimped, it is temporarily crimped, and then the final crimping is performed. When this occurs, the resin film can be reattached, the yield can be improved, and the alignment between the resin film and the substrate including the conductive circuit can be accurately performed. In addition, since the resin film can be cut after the resin film is accurately positioned, the resin film can be used efficiently and cost can be reduced. Furthermore, after forming a non-through hole and / or a through hole in the resin film,
When a roughened surface is formed using an acid or an oxidizing agent on an interlayer resin insulating layer formed of a resin film, a roughened surface having unevenness of uniform roughness is formed, and the conductive circuit and the interlayer resin insulating layer are A multilayer printed wiring board having excellent adhesion and excellent reliability can be manufactured. Further, even if the pre-compression is performed and then re-compression is performed, no decrease in the adhesion and reliability between the conductor circuit and the interlayer resin insulating layer is observed.

[Brief description of the drawings]

FIGS. 1A to 1C are cross-sectional views schematically showing a step of attaching a resin film and forming a roughened surface in a manufacturing process of a multilayer printed wiring board according to the present invention.

FIGS. 2A to 2D are cross-sectional views schematically showing a process of disposing a PGA.

FIGS. 3A to 3D are cross-sectional views illustrating a part of the manufacturing process of the multilayer printed wiring board according to the present invention.

FIGS. 4A to 4D are cross-sectional views illustrating a part of the manufacturing process of the multilayer printed wiring board according to the present invention.

FIGS. 5A to 5D are cross-sectional views showing a part of the manufacturing process of the multilayer printed wiring board of the present invention.

FIGS. 6A to 6C are cross-sectional views showing a part of the manufacturing process of the multilayer printed wiring board of the present invention.

FIGS. 7A to 7C are cross-sectional views showing a part of the manufacturing process of the multilayer printed wiring board of the present invention.

FIGS. 8A to 8D are cross-sectional views illustrating a part of the manufacturing process of the multilayer printed wiring board according to the present invention.

FIGS. 9A to 9D are cross-sectional views showing a part of the manufacturing process of the multilayer printed wiring board of the present invention.

FIGS. 10A to 10D are cross-sectional views illustrating a part of the manufacturing process of the multilayer printed wiring board according to the present invention.

FIGS. 11A to 11C are cross-sectional views illustrating a part of the manufacturing process of the multilayer printed wiring board according to the present invention.

FIGS. 12A and 12B are cross-sectional views showing a part of the manufacturing process of the multilayer printed wiring board of the present invention.

FIGS. 13 (a) to 13 (c) are cross-sectional views schematically showing steps of attaching a resin film and forming a roughened surface in a conventional manufacturing process of a multilayer printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Interlayer resin insulation layer 3 Plating resist 4 Lower conductor circuit 4a Roughened surface 5 Conductor circuit 6 Via hole opening 7 Via hole 8 Copper foil 9, 29 Through hole 9a Roughened surface 10 Resin filler 12a Electroless copper plating Layer 12b Electroless copper plating layer 13 Electrolytic copper plating film 14 Solder resist layer 15 Nickel plating film 16 Gold plating film 17 Solder bump 18 Through hole 19 Solder 20 pin 30 Multilayer printed wiring board 31 Jig for printed wiring board 34 For pin Jig 190 Solder paste

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hiroaki Satake 300 Aoyagicho, Ogaki-shi, Gifu F-term in IBIDEN CO., LTD. AA05 AA06 AA12 AA15 AA32 AA35 AA43 BB01 CC08 CC09 CC10 CC13 CC14 CC31 CC58 DD02 DD22 DD33 DD47 EE31 EE35 EE38 GG01 GG02 GG15 GG17 GG22 GG23 GG27 GG28 HH07 HH11

Claims (6)

[Claims] 1. A method for manufacturing a multilayer printed wiring board, wherein a conductive circuit and an interlayer resin insulation layer are sequentially formed on a substrate, wherein the interlayer resin insulation layer is soluble in an acid or an oxidizing agent. A resin film in which particles are dispersed in a resin that is hardly soluble in an acid or an oxidizing agent is used.
Temporarily press-bonded to the surface of the substrate including the conductive circuit at a pressure of 0 to 7.0 kgf / cm ² , and then completely press-bonded under reduced pressure or vacuum at a pressure of 2.0 to 10 kgf / cm ² , And / or a method of manufacturing a multilayer printed wiring board, characterized by forming a through hole. 2. The particles soluble in the acid or oxidizing agent,
The method for producing a multilayer printed wiring board according to claim 1, wherein the method is at least one selected from the group consisting of resin particles, inorganic particles, and metal particles. 3. The temperature at the time of temporarily pressing the resin film is 50 to 110 ° C., and the temperature at the time of final pressure bonding is 60 to 110 ° C.
The method for producing a multilayer printed wiring board according to claim 1, wherein the temperature is 120 ° C. 4. 4. The time for fully pressing the resin film is:
The method for producing a multilayer printed wiring board according to any one of claims 1 to 3, wherein the time is 10 to 120 seconds. 5. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the degree of vacuum when the resin film is completely bonded is 0.1 to 10 Torr. 6. The resin hardly soluble in an acid or an oxidizing agent,
The method for producing a multilayer printed wiring board according to any one of claims 1 to 5, comprising at least one selected from the group consisting of an epoxy resin, a phenol resin, a polyimide resin, a polyphenylene resin, a polyolefin resin, and a fluororesin.