JP2001047354A5 - - Google Patents
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- Publication number
- JP2001047354A5 JP2001047354A5 JP1999223481A JP22348199A JP2001047354A5 JP 2001047354 A5 JP2001047354 A5 JP 2001047354A5 JP 1999223481 A JP1999223481 A JP 1999223481A JP 22348199 A JP22348199 A JP 22348199A JP 2001047354 A5 JP2001047354 A5 JP 2001047354A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- ring
- pressure
- carrier plate
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 description 95
- 238000005498 polishing Methods 0.000 description 58
- 239000012530 fluid Substances 0.000 description 29
- 230000002093 peripheral effect Effects 0.000 description 19
- 238000003825 pressing Methods 0.000 description 17
- 238000004891 communication Methods 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22348199A JP2001047354A (ja) | 1999-08-06 | 1999-08-06 | ウェーハの研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22348199A JP2001047354A (ja) | 1999-08-06 | 1999-08-06 | ウェーハの研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001047354A JP2001047354A (ja) | 2001-02-20 |
| JP2001047354A5 true JP2001047354A5 (https=) | 2006-09-21 |
Family
ID=16798818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22348199A Pending JP2001047354A (ja) | 1999-08-06 | 1999-08-06 | ウェーハの研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001047354A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101625434B1 (ko) * | 2014-12-22 | 2016-05-30 | 주식회사 엘지실트론 | 웨이퍼 연마장치 및 웨이퍼 평탄도 조절 방법 |
-
1999
- 1999-08-06 JP JP22348199A patent/JP2001047354A/ja active Pending
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