JP2001047354A - ウェーハの研磨装置 - Google Patents

ウェーハの研磨装置

Info

Publication number
JP2001047354A
JP2001047354A JP22348199A JP22348199A JP2001047354A JP 2001047354 A JP2001047354 A JP 2001047354A JP 22348199 A JP22348199 A JP 22348199A JP 22348199 A JP22348199 A JP 22348199A JP 2001047354 A JP2001047354 A JP 2001047354A
Authority
JP
Japan
Prior art keywords
ring
wafer
polishing
plate
carrier plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22348199A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001047354A5 (https=
Inventor
Yasuhide Denda
康秀 傳田
Yoshio Nakamura
由夫 中村
Yoshinobu Nishimoto
吉伸 西本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Priority to JP22348199A priority Critical patent/JP2001047354A/ja
Publication of JP2001047354A publication Critical patent/JP2001047354A/ja
Publication of JP2001047354A5 publication Critical patent/JP2001047354A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP22348199A 1999-08-06 1999-08-06 ウェーハの研磨装置 Pending JP2001047354A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22348199A JP2001047354A (ja) 1999-08-06 1999-08-06 ウェーハの研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22348199A JP2001047354A (ja) 1999-08-06 1999-08-06 ウェーハの研磨装置

Publications (2)

Publication Number Publication Date
JP2001047354A true JP2001047354A (ja) 2001-02-20
JP2001047354A5 JP2001047354A5 (https=) 2006-09-21

Family

ID=16798818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22348199A Pending JP2001047354A (ja) 1999-08-06 1999-08-06 ウェーハの研磨装置

Country Status (1)

Country Link
JP (1) JP2001047354A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101625434B1 (ko) * 2014-12-22 2016-05-30 주식회사 엘지실트론 웨이퍼 연마장치 및 웨이퍼 평탄도 조절 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101625434B1 (ko) * 2014-12-22 2016-05-30 주식회사 엘지실트론 웨이퍼 연마장치 및 웨이퍼 평탄도 조절 방법

Similar Documents

Publication Publication Date Title
KR100939096B1 (ko) 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템
US5820448A (en) Carrier head with a layer of conformable material for a chemical mechanical polishing system
US6506104B2 (en) Carrier head with a flexible membrane
US7001260B2 (en) Carrier head with a compressible film
US6050882A (en) Carrier head to apply pressure to and retain a substrate
US6036587A (en) Carrier head with layer of conformable material for a chemical mechanical polishing system
US9199354B2 (en) Flexible diaphragm post-type floating and rigid abrading workholder
US6764387B1 (en) Control of a multi-chamber carrier head
JP7677789B2 (ja) 基板処理システムのための平坦化膜および方法
US6569771B2 (en) Carrier head for chemical mechanical polishing
JP4757580B2 (ja) 研磨方法及び研磨装置、並びに研磨装置制御用プログラム
US20200086454A1 (en) Polishing head and polishing carrier apparatus having the same
JP3734878B2 (ja) ウェーハの研磨装置
US6435956B1 (en) Wafer holder and polishing device
JPWO2000045993A1 (ja) 基板把持装置及び研磨装置
EP0835723A1 (en) A carrier head with a layer of conformable material for a chemical mechanical polishing system
JP3218572B2 (ja) ウェーハ加圧用ポリッシングプレート
WO2002018101A2 (en) Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby
US6641461B2 (en) Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
JP2001047354A (ja) ウェーハの研磨装置
JP7219009B2 (ja) 基板保持装置およびドライブリングの製造方法
KR100419135B1 (ko) 직접 공기 웨이퍼 연마 압력 장치를 구비한 헤드를 이용한화학적 기계적 연마용 장치 및 방법
US7018273B1 (en) Platen with diaphragm and method for optimizing wafer polishing
JP2001047354A5 (https=)
JP3615592B2 (ja) 研磨装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060803

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060803

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080409

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080415

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080819