JP2001015635A - Package for storing optical semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep an optical semiconductor element always at a proper temperature even with a cooling member of low output, operate the optical semiconductor element normally and stably for a long period by storing the optical semiconductor element airtightly, and provide a compact and light package by preventing drop of cooling efficiency without allowing heat dissipation from a cooling member to work on an optical semiconductor element through a substrate. SOLUTION: An optical semiconductor element 4 is mounted on an upper surface of a ceramic substrate 5b at an upper side, a lower surface of a ceramic substrate at a lower side is exposed to the outside, and a metallized layer 5d is provided to a side surface of at least one ceramic substrate. A cooling member 5 wherein an electronic cooling element 5e is arranged between the ceramic substrates 5b, 5c is brazed to the inner side of a hole 1a of a frame-like substrate 1. As a result, heat generated from an optical semiconductor element 4 is emitted effectively without passing through the substrate 1, and compactness and thinning can be realized while storing the optical semiconductor element 4 airtightly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor element housing package for housing an optical semiconductor element.

[0002]

2. Description of the Related Art Conventionally, a package for housing an optical semiconductor element for housing an optical semiconductor element is generally made of iron-nickel-
A base made of a metal material such as a cobalt alloy or a copper-tungsten alloy, and having a mounting portion in the center of the upper surface where the optical semiconductor element is mounted with a cooling member including an electronic cooling element interposed therebetween; A frame body made of a metal material such as an iron-nickel-cobalt alloy having a through-hole and a cutout on a side portion, which is joined to the base via a brazing material such as silver brazing so as to surround the mounting portion, Attached to the through hole of the frame,
Iron-nickel with space for transmitting optical signals inside
A cylindrical fixing member made of a metal material such as a cobalt alloy;
The cylindrical fixing member has a melting point of 200 ° C to 400 ° C.
A translucent member made of amorphous glass or the like that blocks the inside of the fixing member attached via a low melting point brazing material such as a tin alloy; A ceramic terminal body in which a metallized wiring layer in which each electrode of the optical semiconductor element is electrically connected via a bonding wire to an insulator made of a body, and an optical semiconductor element attached to the upper surface of the frame body And a lid for hermetically sealing the optical semiconductor element. The optical semiconductor element is mounted and fixed on the optical semiconductor element mounting portion of the base with a cooling member interposed therebetween, and each electrode of the optical semiconductor element is bonded. Electrically connected to the metallized wiring layer of the ceramic terminal body via the wire,
Thereafter, a lid is joined to the upper surface of the frame, the optical semiconductor element is hermetically housed in a container formed of the base, the frame, and the lid, and the optical fiber member is attached to the cylindrical fixing member by, for example, YAG welding. An optical semiconductor device as a product can be obtained by attaching the optical semiconductor device.

In the optical semiconductor device, for example, an optical component such as an optical semiconductor element is cooled by a cooling member, and the optical semiconductor element is optically excited by a drive signal supplied from an external electric circuit, and the excited light is transmitted. It is used for high-speed communication and the like by transmitting and receiving an optical fiber member via an optical member and transmitting the optical fiber member inside the optical fiber.

Japanese Patent Application Laid-Open No. 9-55489 discloses that
A solid-state imaging device is provided on the front side of the lead frame, and a cooling member is provided on the back side. The solid-state imaging device and the cooling member are packaged in a resin package such that the surface of the cooling member on the side opposite to the solid-state imaging device is exposed to the outside. A mounted solid-state imaging device is disclosed.

According to this solid-state image pickup device, the solid-state image pickup device and the cooling member are both sealed with resin, and the cooling member has a package structure in which the surface on the side opposite to the solid-state image pickup device is exposed. Therefore, the cooling efficiency can be improved without unnecessarily increasing the size of the solid-state imaging device.

[0006]

However, in the above-mentioned conventional package for housing an optical semiconductor element, a metal material such as an iron-nickel-cobalt alloy or a copper-tungsten alloy or a ceramic terminal forming the base and the frame is used. Since the thermal conductivity of the aluminum oxide sintered body forming the insulator of the body is as large as 15 W / m · K or more, the optical semiconductor element can be externally cooled while cooling the optical semiconductor element with a cooling member. When the optical signal is excited by a drive signal supplied from an electric circuit, the ceramic substrate on the upper surface of the cooling member on which the optical semiconductor element is mounted has an appropriate temperature, but the ceramic substrate on the lower surface in contact with the base has a high temperature (about 100 ° C.). Because of the heat, the optical semiconductor element is transferred from the ceramic substrate on the lower surface through the base, the frame, the ceramic terminal, and the bonding wires. The heat acts largely had a problem that the cooling results in efficiency greatly reduce by cooling member of the optical semiconductor element.

In addition, since the height of the frame needs to be equal to or greater than the total height of the cooling member and the optical semiconductor element, the package for storing the optical semiconductor element is reduced in size and weight. In addition, there is a problem that the optical semiconductor device is difficult, and a similar problem occurs when the optical semiconductor device is formed as a product.

In the case of a structure having a cooling member such as an optical semiconductor element housing package used in a solid-state imaging device disclosed in Japanese Patent Application Laid-Open No. 9-55489, cooling efficiency is improved. However, since the resin having high water absorption is generally used for the package body, and the resin has a large difference in thermal expansion coefficient from the cooling member, the resin emits when the solid-state imaging device is operated. A large difference in thermal expansion occurs due to the applied heat, and the adhesion between the solid-state imaging device and the resin is deteriorated. Therefore, it is difficult to hermetically accommodate an optical semiconductor device such as a solid-state imaging device. Had.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to effectively reduce the cooling efficiency without heat radiation from a cooling member acting on an optical semiconductor element via a base. By preventing, the optical semiconductor element can always be kept at an appropriate temperature even by a low-power cooling member,
In addition, it is an object of the present invention to provide a compact and lightweight package for housing an optical semiconductor element which can be normally and stably operated for a long period of time by housing the optical semiconductor element in an airtight manner.

[0010]

The optical semiconductor device housing package of the present invention has a frame-shaped base and a mounting portion which is inserted inside the base and on which the optical semiconductor element is mounted. A cooling member having a lower surface exposed to the outside, a frame body having a through-hole and a cut-out portion on the side, and being attached to the base so as to surround the mounting portion, and being attached to the through-hole. A cylindrical fixing member into which the optical fiber member is inserted and fixed; and a metallized wiring layer which is inserted into the cutout portion and electrically connected to each electrode of the optical semiconductor element on the insulator. A structure comprising a ceramic terminal body and a lid attached to an upper surface of the frame body and hermetically sealing the optical semiconductor element, wherein the cooling member has an electronic cooling element arranged between upper and lower ceramic substrates. And at least one of the ceramic substrates Is characterized in that through a metallized layer formed on the surface is brazed to the inside of the substrate.

According to the package for housing an optical semiconductor element of the present invention, as a structure for dissipating heat generated from the optical semiconductor element, the package is provided inside a frame-shaped base having a hole penetrated substantially in the center, that is, In the hole portion, a ceramic substrate having a mounting portion for mounting the optical semiconductor element on the upper surface,
In order to insert a cooling member composed of a ceramic substrate whose lower surface is exposed to the outside of the frame-shaped base and an electronic cooling element disposed therebetween, a metallized layer is formed on a side surface of at least one of the ceramic substrates. The metal member has a structure that is brazed to the side surface of the hole of the frame-shaped base via the metallized layer, so that the frame-shaped base and the cooling member can be firmly joined together and have excellent airtightness. Since the bonding, that is, the brazing, is performed, the optical semiconductor element can be hermetically housed inside the optical semiconductor element housing package, and can be normally and stably operated for a long period of time.

Also, since the cooling member is inserted into the hole of the frame-shaped base, the height of the frame can be reduced by the amount of the cooling member inserted into the frame-shaped base, as a result,
A compact and lightweight package for housing an optical semiconductor element can be obtained.

Further, when the optical semiconductor element is optically excited by a drive signal supplied from an external electric circuit while being cooled by the cooling member, the heat released from the cooling member does not pass through the frame-shaped base but to the outside. Since it is radiated from the exposed lower surface, it does not act on the optical semiconductor element, and as a result, the cooling efficiency of the optical semiconductor element by the cooling member can be increased. Can always be operated at an appropriate temperature.

[0014]

Next, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an embodiment of an optical semiconductor element housing package according to the present invention, and FIG. 2 is a plan view of the optical semiconductor element housing package without a cover. In these figures, 1 is a frame-shaped base, 2 is a frame, 3 is a lid, 4 is an optical semiconductor element, and 5 is a cooling member. The frame-shaped base 1, frame 2, lid 3, and cooling member 5 constitute a container for housing the optical semiconductor element 4 therein.

The frame-shaped substrate 1 is made of a metal material such as iron-nickel-cobalt alloy or iron-nickel alloy, aluminum oxide sintered body, aluminum nitride sintered body, mullite sintered body, silicon nitride sintered body. A hole 1a for inserting the cooling member 5 is formed in the center of the ceramic material.

When the frame-shaped substrate 1 is made of a metal material, for example, an ingot such as an iron-nickel-cobalt alloy is used.
It is formed into a predetermined shape by applying a conventionally known metal working method such as a rolling method or a punching method.

When the frame-shaped substrate 1 is made of a ceramic material, for example, in the case of an aluminum oxide sintered body, an appropriate organic binder, a solvent or the like is added to a raw material powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide or the like. A ceramic green sheet (ceramic green sheet) is formed by adding and mixing to form a slurry, and using the slurry by a doctor blade method or a calendar roll method.
Thereafter, the ceramic green sheet is manufactured by subjecting the ceramic green sheet to a suitable punching process and laminating one or a plurality of the green sheets and firing at a temperature of about 1600 ° C.

A cooling member 5 is inserted into a hole 1a formed in the center of the frame-shaped base 1. The cooling member 5 functions as a support member for supporting the optical semiconductor element 4, and has a mounting section 5a for mounting the optical semiconductor element 4 at a substantially central portion of the upper surface thereof. The optical semiconductor element 4 is bonded and fixed via a low-temperature solder such as tin-bismuth.

As shown in FIG. 1, the cooling member 5 includes a ceramic substrate 5b on the upper side and a ceramic substrate 5 on the lower side.
c are equal in length, and an electronic cooling element 5e is arranged between them.

The thermoelectric cooler 5e is composed of two types of thermoconductive semiconductors composed of a P-type element and an N-type element alternately between a ceramic substrate 5b on the upper surface and a ceramic substrate 5c on the lower surface, for example, via a metal electrode. They are arranged in such a manner that heat generated from the optical semiconductor element is absorbed by the upper ceramic substrate 5b and is radiated (heated) by the lower ceramic substrate 5c. Accordingly, the upper ceramic substrate 5b on which the optical semiconductor element 4 is mounted is always at an appropriate temperature, while the lower ceramic substrate 5c is at a high temperature.

As shown in FIG. 1, the cooling member 5 has a side surface of a through hole 1a provided in the center of the frame-shaped base 1, and a top surface side on which the optical semiconductor element 4 is mounted. The metallized layer 5d provided on both the side surface of the ceramic substrate 5b and the side surface of the ceramic substrate 5c on the lower surface is in contact with tin-
It is bonded and fixed via low-temperature solder such as lead solder or tin-silver solder. Thereby, the cooling member 5 is connected to the hole 1a of the frame-shaped base 1.
And the optical semiconductor element 4 can be housed in an airtight manner, and the heat generated from the optical semiconductor element 4 is transferred to the ceramic substrate 5c on the lower side, which is heated to a high temperature by this heat. Therefore, heat can be efficiently dissipated without passing through the frame-shaped base 1.

As shown in FIG. 3, the length of the upper ceramic substrate 5b is shorter than that of the lower ceramic substrate 5c.
An electronic cooling element 5e may be provided between them. In the case of this example, the side surface of the penetrated hole 1a provided at the center of the frame-shaped base 1 and the metallized layer 5d provided only on the side surface of the ceramic substrate 5b on the upper surface side
Are bonded and fixed via low-temperature solder such as tin-lead solder or tin-silver solder. In this way, the optical semiconductor element 4 can be housed in an airtight manner, and the heat generated from the optical semiconductor element 4 does not not only pass through the frame-shaped base 1 but also the ceramic substrate 5c on the lower surface side. Therefore, heat can be dissipated more efficiently.

The ceramic substrate 5b on the upper surface side and the ceramic substrate 5c on the lower surface side of the cooling member 5 are made of an aluminum oxide sintered body, an aluminum nitride sintered body, or the like.
For example, in the case of an aluminum nitride sintered body, a suitable organic binder, a solvent, etc. are added to raw material powders such as aluminum nitride, yttrium oxide, and calcium oxide to form a slurry, and the slurry is doctor bladed. And ceramic green sheet (ceramic raw sheet)
Thereafter, the ceramic green sheet is manufactured by subjecting the ceramic green sheet to appropriate punching and sintering at a temperature of about 1700 ° C.

The metallized layer 5d functions as an adhesive layer when it is bonded and fixed to the hole 1a of the frame-shaped substrate 1, and is made of a high melting point metal powder such as tungsten, molybdenum, manganese or the like.

The metallized layer 5d is made of a metal paste obtained by adding a suitable organic binder, a solvent and the like to a high melting point metal powder such as tungsten, molybdenum, manganese or the like, and mixing the metal paste with an upper ceramic substrate 5b and a lower ceramic substrate. The ceramic green sheet 5c is formed on the ceramic substrate 5b on the upper surface side and the ceramic substrate 5c on the lower surface side by printing and applying on at least one side surface of the ceramic green sheet by a conventionally well-known screen printing method and then firing.

The metallized layer 5d is preferably provided with a metal having excellent corrosion resistance such as nickel and gold and excellent wettability with a brazing material to a thickness of 1 μm to 20 μm by a plating method on the exposed surface. And the metallization layer 5d can be effectively prevented from being oxidized and corroded.
d can be more firmly brazed to the side surface of the hole 1a of the frame-shaped base 1. Therefore, the metallization layer 5d
It is preferable that a metal having excellent corrosion resistance, such as nickel and gold, and having excellent wettability with a brazing material is applied to the exposed surface to a thickness of 1 μm to 20 μm.

Further, on the upper surface of the frame-shaped base 1 on which the cooling member 5 is inserted, a mounting portion 5a on which the optical semiconductor element 4 is mounted.
The frame 2 is joined so as to surround the optical semiconductor element 4. A space for accommodating the optical semiconductor element 4 is formed inside the frame 2.

The frame 2 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. For example, the frame 2 is formed by pressing an ingot of such a metal material into a frame shape by pressing. Attachment to the frame-shaped base 1 is performed by brazing the upper surface of the frame-shaped base 1 and the lower surface of the frame 2 via a silver brazing material.

The frame 2 also has a through hole 2a on the side thereof, and a cylindrical fixing member 6 is formed on the inner wall surface of the through hole 2a.
Further, at one end inside the cylindrical fixing member 6, for example, a light transmitting member 7 for condensing light excited by the optical semiconductor element 4 is attached.

A through hole 2a formed on the side of the frame 2
Acts as an attachment hole for attaching the fixing member 6 to the frame 2, and is formed into a predetermined shape by performing a conventionally well-known drilling process on a side portion of the frame 2.

The fixing member 6 attached to the through hole 2a of the frame 2 functions as a base fixing member when fixing the optical fiber member 9 to the frame 2, and also reduces the light excited by the optical semiconductor element 4. The optical fiber member 9 is transmitted to the optical fiber member 9, and the optical fiber member 9 is attached and connected to one end on the outside.

The cylindrical fixing member 6 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. For example, the fixing member 6 is formed by pressing an ingot of such a metal material into a cylinder by pressing. Is done.

Further, the fixing member 6 has, for example, a light-transmitting member 7 attached to one inner end thereof.
Is used to close the internal space of the fixing member 6, and to form a frame-shaped base 1 and a frame 2
The light excited by the optical semiconductor element 4, which transmits the internal space of the fixing member 6 while maintaining the hermetic sealing of the container composed of the container 3 and the lid 3, is transmitted as it is to the optical fiber member 9 attached to and connected to the fixing member 6. It has the effect of causing.

The light-transmitting member 7 is made of, for example, a lead-based amorphous glass mainly containing silicon oxide and lead oxide and a borosilicate-based amorphous glass mainly containing boric acid and silica sand.
Since the amorphous glass has no crystal axis, the light excited by the optical semiconductor element 4 is transmitted and transmitted to the optical fiber member 9 by passing the light excited by the optical semiconductor element 4 through the translucent member 7. The birefringence does not occur in the optical member 7 and is transmitted / received to the optical fiber member 9 as it is. As a result, the transmission / reception of the light excited by the optical semiconductor element 4 to / from the optical fiber member 9 becomes highly efficient. Signal transmission efficiency can be increased.

For attaching the light transmitting member 7 to the fixing member 6, for example, as shown in FIG. 4, a metal film 8 is previously applied to the outer periphery of the light transmitting member 7, 8 and the fixing member 6 are brazed through a brazing material such as a gold-tin alloy. In this case, since the attachment of the translucent member 7 to the fixing member 6 is performed by brazing with a gold-tin alloy or the like, the attachment is highly reliable. The hermetic sealing of the container accommodating the optical semiconductor element 4 at the portion where the optical semiconductor element 4 is attached to the container 7 is completed, and the optical semiconductor element 4 accommodated in the container can be normally and stably operated for a long time.

The melting point of the amorphous glass constituting the light transmitting member 7 is as low as about 700 ° C., and the metal film 8 previously coated on the outer peripheral portion of the light transmitting member 7 is low. -M
Since it cannot be formed by adopting the n method, as shown in FIG. 4, it is active against amorphous glass and is formed from at least one of titanium, titanium-tungsten, and tantalum nitride which are strongly bonded. First layer 8a
And the first layer 8a is diffused into a third layer 8c, which will be described later, by heat generated when the translucent member 7 is brazed to the fixing member 6,
The second layer 8b made of at least one of platinum, nickel, and nickel-chromium, which effectively prevents the bonding strength of the metal film 8 to the translucent member 7, and the wettability of the brazing material to the metal film 8 The third layer 8c made of at least one of gold, platinum, and copper is sequentially laminated, in which the brazing material is firmly joined to the metal film 8 to firmly attach the light transmitting member 7 to the fixing member 6. In particular, the metal film 8 formed by sequentially laminating titanium-platinum-gold has a high bonding strength with the light-transmitting member 7, a good wettability with the brazing material, and a good light-transmitting property. Since the member 7 can be brazed to the fixing member 6, it is very suitable as the metal film 8.

Further, the first layer 8a made of at least one of titanium, titanium-tungsten, and tantalum nitride
And at least one of platinum, nickel and nickel-chromium
A second layer 8b of seeds and at least one of gold, platinum and copper
The metal film 8 having a three-layer structure with the third layer 8c made of a seed is formed by depositing a metal material or nitride on the outer periphery of the light transmitting member 7 by a sputtering method, a vapor deposition method, an ion plating method, or the like.
It is formed by sequentially applying a predetermined thickness by a plating method or the like.

Further, the metal film 8 is formed of a first layer 8a made of at least one of titanium, titanium-tungsten, and tantalum nitride, a second layer 8b made of at least one of platinum, nickel, and nickel-chromium. When the third layer 8c made of at least one of gold, platinum and copper is used, if the thickness of the first layer 8a is less than 500 °, the metal film 8
Tends to weaken the bonding strength to the light transmitting member 7. If the thickness exceeds 2000 °, the first layer 8
a, large stress is generated inside the first layer 8a when the first layer 8a is applied, and the first layer 8a
It tends to be more easily peeled. Therefore, the first layer 8
It is preferable that the thickness of a is set in the range of 500 ° to 2000 °.

When the thickness of the second layer 8b is less than 500 °, the first layer 8a is effectively prevented from diffusing into the third layer 8c due to the heat generated when the translucent member 7 is brazed to the fixing member 6. This cannot be prevented, and there is a risk that the bonding strength of the metal film 8 to the translucent member 7 may be reduced. On the other hand, 10
If it exceeds 000 °, a large stress is generated in the second layer 8b when the second layer 8b is applied on the first layer 8a, and the second layer 8b is easily separated from the first layer 8a due to the intrinsic stress. Tend to be. Therefore, the thickness of the second layer 8b is 5
It is preferable to set the range between 00 ° and 10000 °.

If the thickness of the third layer 8c is less than 0.5 μm, the wettability of the brazing material to the metal film 8 is not significantly improved, and the light transmitting member 7 is firmly brazed to the fixing member 6. It tends to be difficult to wear. On the other hand, if it exceeds 5 μm, a large stress is generated in the third layer 8c when the third layer 8c is deposited on the second layer 8b, and the third layer 8c is separated from the second layer 8b due to the intrinsic stress. It tends to be easier. Therefore, the thickness of the third layer 8c is 0.5 μm to 5 μm.
It is preferable to keep the range of μm.

Further, the frame 2 has a notch 2b on its side.
Are formed, and a ceramic terminal body 10 is inserted into the notch 2b.

The ceramic terminal 10 comprises an insulator 11 made of an electrically insulating material and a plurality of metallized wiring layers 12. The metallized wiring layer 12 is electrically insulated from the frame 2 from the inside to the outside of the frame 2. A metallized metal layer is applied to the side surface of the insulator 11 in advance, and the metallized metal layer is applied to the inner wall surface of the cutout 2a of the frame 2 through a brazing material such as silver braze. By being attached, it is inserted into the notch 2a of the frame 2.

The insulator 11 of the ceramic terminal body 10 is made of an aluminum oxide sintered body, a mullite sintered body, a glass ceramic sintered body, or the like. Is the same as the manufacturing method of the frame-shaped substrate 1 in the case of the aluminum oxide sintered body.

A plurality of metallized wiring layers 12 extending from the inside to the outside of the frame 2 are buried in the ceramic terminal body 10.
Each electrode of the optical semiconductor element 4 is electrically connected to a region located inside the second frame 2 via a bonding wire 13, and is connected to an external electric circuit in a region located outside the second frame 2. An external lead terminal 14 is attached via a brazing material such as silver brazing.

The metallized wiring layer 12 functions as a conductive path when connecting each electrode of the optical semiconductor element 4 to an external electric circuit, and is formed of a high melting point metal powder such as tungsten, molybdenum, and manganese.

The metallized wiring layer 12 is formed by adding a metal paste obtained by adding an appropriate organic binder, a solvent and the like to a high melting point metal powder such as tungsten, molybdenum, manganese or the like to a ceramic green sheet serving as the insulator 11 in advance. It is formed on the insulator 11 by printing and applying a predetermined pattern by a well-known screen printing method and then firing.

The metallized wiring layer 12 is formed by coating a metal having excellent corrosion resistance such as nickel and gold and having excellent wettability with a brazing material to a thickness of 1 μm to 20 μm on an exposed surface by plating. In other words, metallized wiring layer 1
2 can be effectively prevented, and the brazing of the external lead terminals 14 to the metallized wiring layer 12 can be firmly performed. Therefore, the metallized wiring layer 12 is made of a metal having excellent corrosion resistance such as nickel and gold and excellent wettability with a brazing material of 1 μm on the exposed surface.
It is preferable to apply it to a thickness of 20 μm.

External lead terminals 14 are brazed to the metallized wiring layer 12 via a brazing material such as silver brazing. The external lead terminals 14 are provided for the optical semiconductor element 4 housed in the container. The optical semiconductor element 4 accommodated in the container by connecting each electrode to an external electric circuit and connecting the external lead terminal 14 to the external electric circuit is connected to the bonding wire 13, the metallized wiring layer 12, and the outside. It will be connected to an external electric circuit via the lead terminal 14.

The external lead terminals 14 are made of iron-nickel-
It is made of a metal material such as a cobalt alloy or an iron-nickel alloy. For example, a predetermined well-known metal working method such as a rolling method or a punching method is applied to an ingot made of the metal material of these alloys. It is formed into a shape.

Further, a lid 3 made of a metal material such as, for example, an iron-nickel-cobalt alloy or an iron-nickel alloy is joined to the upper surface of the frame 2 to thereby form a frame-shaped base 1 and a frame. The optical semiconductor element 4 is hermetically sealed inside a container including the lid 2 and the lid 3.

The joining of the lid 3 to the upper surface of the frame 2 is performed by, for example, welding such as a seam welding method.

Thus, according to the package for housing an optical semiconductor element of the present invention, a through-hole 1a is provided substantially at the center of the frame-shaped substrate 1, and the ceramic substrate on the upper surface side of the cooling member 5 is provided in the hole 1a. The metallized layer 5d applied to at least one of the side surface of the ceramic substrate 5c and the side surface of the ceramic substrate 5c on the lower surface is bonded and fixed via low-temperature solder, and the optical semiconductor element 4 is mounted on the optical semiconductor element mounting portion 5a of the cooling member 5. And the electrodes of the optical semiconductor element 4 are electrically connected to the external lead terminals 14 via the bonding wires 13, and then the lid 3 is joined to the upper surface of the frame 2 to form a frame-shaped base. The optical semiconductor element 4 is accommodated in a container including the cooling member 5, the cooling member 5, the frame 2, and the lid 3, and the optical fiber member 9 is finally mounted on the cylindrical fixing member 6 attached to the frame 2. The final product by connecting The optical semiconductor device as. Then, light is excited in the optical semiconductor element 4 by a drive signal supplied from an external electric circuit, and the excited light is transmitted to and received from the optical fiber member 9 through the transparent member 7 made of amorphous glass. It is used for high-speed optical communication and the like by transmitting the inside of the optical fiber of the fiber member 9.

The present invention is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present invention. For example, the cooling member 5 is configured such that the length of the ceramic substrate 5b on the upper surface side is longer than the length of the ceramic substrate 5c on the lower surface side, and the side surface of the through hole 1a provided in the central portion of the frame-shaped base body 1 Alternatively, the metallized layer 5d applied only to the side surface of the lower ceramic substrate 5c may be bonded and fixed via low-temperature solder such as tin-lead solder or tin-silver solder.

[0055]

According to the package for housing an optical semiconductor element of the present invention, as a structure for dissipating the heat generated from the optical semiconductor element, the inside of a frame-shaped base having a hole penetrated substantially at the center, that is, An upper surface-side ceramic substrate having a mounting portion for mounting an optical semiconductor element on the upper surface, a lower surface side ceramic substrate having a lower surface exposed to the outside of the frame-shaped base; A metallization layer is provided on at least one side surface of the ceramic substrate in order to insert a cooling member composed of an electronic cooling element disposed between them, and a side surface of the hole of the frame-shaped base is provided through the metallization layer. Since the frame-shaped base and the cooling member can be firmly joined together with the air-tight metal bonding, that is, brazing, the inside of the optical semiconductor element housing package is The optical semiconductor element housed in an airtight, can be actuated normally and stably for a long period of time.

Also, since the cooling member is inserted into the hole of the frame-shaped base, the height of the frame can be reduced by the amount of the cooling member inserted into the frame-shaped base. as a result,
A compact and lightweight package for housing an optical semiconductor element can be obtained.

Further, when the optical semiconductor element is optically excited by a drive signal supplied from an external electric circuit while being cooled by the cooling member, the heat released from the cooling member does not pass through the frame-shaped base but to the outside. Since it is radiated from the exposed lower surface, it does not act on the optical semiconductor element, and as a result, the cooling efficiency of the optical semiconductor element by the cooling member can be increased. Can always be operated at an appropriate temperature.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of an embodiment of an optical semiconductor element housing package of the present invention.

FIG. 2 is a plan view of the package for housing an optical semiconductor element shown in FIG. 1 excluding a lid.

FIG. 3 is an enlarged sectional view of a main part of an example using a cooling member having a shape different from that of the cooling member shown in FIG. 1;

FIG. 4 is an enlarged sectional view of a main part for explaining a light-transmitting member used in the package for housing an optical semiconductor element shown in FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Frame-shaped base | substrate 2 ... Frame 2a ... Through-hole 2b ... Notch 3 ... Lid 4 ... Optical semiconductor element 5 ... Cooling member 5a ... Mounting part 5b Upper ceramic substrate 5c Lower ceramic substrate 5d Metallization layer 5e Electronic cooling element 6 Fixing member 9 Optical fiber member 10 Ceramic terminal body 11 ・ ・ ・ Insulator 12 ・ ・ ・ Metalized wiring layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H01L 33/00 H01S 5/022 H01S 5/022 H01L 23/36 M

Claims (1)

[Claims] 1. A cooling member having a frame-shaped base, a mounting portion inserted inside the base, and having an upper surface on which an optical semiconductor element is mounted and having a lower surface exposed to the outside, A frame body having a through hole and a cutout on the side, and a cylindrical fixing member attached to the through hole and into which the optical fiber member is inserted and fixed. And a ceramic terminal body in which a metallized wiring layer in which an electrode of the optical semiconductor element is electrically connected to an insulator is formed, and is attached to an upper surface of the frame body. An optical semiconductor element housing package comprising a lid for hermetically sealing the optical semiconductor element, wherein the cooling member is provided by disposing an electronic cooling element between upper and lower ceramic substrates; Through the metallized layer formed on the side of the substrate A package for housing an optical semiconductor element, wherein the package is brazed inside the base.