JP2000323830A - Apparatus for mounting components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for mounting and soldering components with which a component can be mounted with high accuracy, the quantity of nitrogen to be sprayed can be reduced, and high-quality soldering can be performed when a component is mounted on a printed board. SOLUTION: A tapered pin is vertically moved by a motor drive to control to open and close a chuck pawl 3 for chucking a component 1. On the other hand, for soldering, a nitrogen chamber filled with nitrogen is constituted and the chuck pawl 3 chucking the component is inserted into an insert port of a cap of the nitrogen chamber. When the nitrogen is filled in the chamber and the oxygen concentration becomes a certain level or less, solder is heated and melted. While the chuck pawl 3 is chucking the component 1 on a work, rubbing operation is performed during soldering.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for mounting components,
In connection with a component mounting device that solders the components,
The present invention relates to a component mounting apparatus that can be mounted in a narrow part with high accuracy and can perform high-quality soldering, and is particularly suitable for micro components such as optical components.

[0002]

2. Description of the Related Art Conventionally, when soldering a micro component to a printed circuit board or the like, the mounting of the component has been performed manually. Further, with the progress of mechanization in factories, a method of mounting components by suction chucks that suction components by air has been used. As a technique for mounting such a component by a suction chuck, there is, for example, a "chip mounter" disclosed in JP-A-9-83192.

[0003]

Since a surface oxide film of a solder chip used as a soldering means is present before melting, it is necessary to remove the solder oxide film by stirring during melting. . The soldering operation has a problem that the adhesion of oxygen causes an oxide film unless the solder to be soldered is in an atmosphere of low oxygen concentration, which causes deterioration of solder wettability.

When mounting components manually,
Therefore, in order to improve the solder wettability, an operation of rubbing the component and the molten solder is performed while spraying nitrogen onto the component soldering portion.

However, in this manual mounting of components, the mounting position shifts due to manual operation, the variation in the pressing force of the operator, and the variation in the surface temperature of the component mounting portion during soldering due to the change in the amount of nitrogen sprayed. Accordingly, there is a problem that the soldering quality varies. In addition, since the amount of nitrogen to be sprayed is also applied to the entire printed circuit board from beginning to end, the amount of nitrogen to be sprayed is enormous, and there is a problem that the cost is high.

On the other hand, a technique of mounting components by a suction chuck, for example, a suction chuck as disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 9-83192, is easy to control the suction and moves the components in the horizontal and vertical directions. Another advantage is that the mounting accuracy with respect to the target mounting position can be satisfied.

However, when considering the soldering operation during melting of the component and the component, it is difficult to follow the operation due to lack of stability of the component position at the suction point, and it is difficult to mount the component with high precision after the mounting operation. There was a problem.

[0008] In general, the micro component such as an optical component has a very narrow component mounting area and a strict mounting accuracy is required at present, so that the difficulty in mounting the component becomes even more problematic.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a component mounting apparatus for soldering components, which mounts components with high precision when mounting components on a printed circuit board. It does not require much nitrogen to stabilize solder quality,
An object of the present invention is to provide a component mounting apparatus capable of performing high-quality soldering.

[0010]

In order to achieve the above-mentioned object, according to the present invention, there is provided a component mounting apparatus for mounting a component to be soldered on a work in a component mounting apparatus for soldering a component. And a soldering section for housing the component and the work and performing soldering there, wherein the component mounting section has a chuck claw for chucking a component provided opposite thereto. Wherein the soldering section comprises a nitrogen chamber cap for forming a nitrogen chamber during soldering, a nitrogen chamber outer periphery, a means for supplying nitrogen to the nitrogen chamber, a means for heating the solder, Means for measuring the oxygen concentration in the chamber, and at the time of soldering, insert a chuck claw that chucks the component from the insertion port of the nitrogen chamber cap. Then, when the nitrogen in the nitrogen chamber is filled and the oxygen concentration falls below a certain level, the solder is heated and melted by the means for heating the solder, and the chuck claws chuck the component on the work. The soldering operation can be performed during soldering.

More specifically, in the above component mounting apparatus, the component mounting apparatus further includes a lower camera for imaging the component, an upper camera for imaging the workpiece, and θ Means for rotating in the axial direction, the component mounting portion, means for moving the soldering portion in the vertical and horizontal X-axis and Y-axis directions, the component imaged by the lower camera, and the imaged image by the upper camera. Calculate the position of the work, rotate the work so as to correct the deviation from the reference value, correct the position in the θ-axis direction, move the component mounting part and the soldering part, and X axis
The position is corrected in the Y-axis direction.

[0012] Further, regarding the component mounting portion,
In the above component mounting apparatus, the component mounting portion further includes a motor as a drive source, and a tapered pin that is vertically moved by the motor, and the tapered pin is attached to one end of the chuck pawl. By rotating, the distance between the rollers is expanded,
The component is opened by chucking the component and reducing the interval between the rollers.

[0013] Further, in detail regarding the component mounting portion, the component mounting portion further includes a motor as a drive source, an opposing tapered block moved up and down by the motor, and an ejector pin for pushing the component downward. By having the tapered block rotate the opposing rollers attached to one end of the chuck pawl to widen the gap between the rollers, chuck the component, and reduce the gap between the rollers, When the component is opened and the chuck pawl chucks the component, a force for pushing the component downward can be applied by the ejector pin.

Further, in detail regarding the component mounting portion, the chuck claw is a stepped collet chuck claw, and the component mounting portion further includes a means for supplying and exhausting air, a cylinder, and the chuck claw. A housing for accommodating the cylinder, and supplying and exhausting air from an air supply / exhaust port provided in the housing to move the cylinder so that the cylinder is in contact with the chuck pawl. When the cylinder moves downward, the pressure applied to the chuck pawl is reduced so that the chuck pawl opens a part.When the cylinder moves upward, the pressure applied to the chuck pawl is reduced. The chuck pawls are made higher so as to chuck parts according to the dimensions of the steps provided on the chuck pawls. It is.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described below with reference to FIGS. [Embodiment 1] Hereinafter, a first embodiment according to the present invention will be described.
This will be described with reference to FIGS. (I) Overall Configuration of Component Mounting Apparatus First, the overall configuration of the component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 1 is an external view of a component mounting apparatus according to the present invention. The configuration of the component mounting apparatus will be described with reference to FIG.

This component mounting apparatus is for mounting components on a work such as a printed circuit board and soldering them.

Above the apparatus, there is an X-axis table 12 which is variable in the X-axis direction, and a component chuck section 10, a suction chuck section 11, and an upper camera 20 are mounted thereon. The suction chuck 11 sucks and moves a solder chip 30 (not shown in FIG. 1) for soldering the component, and the component chuck 10 holds the component 1 (not shown). It is for chucking and moving. The upper camera 20 is provided to capture an image of the work 2 (not shown) and calculate a shift of the work position, as described later. The image captured by the upper camera 20 is displayed on the upper camera monitor 22.

On one side, there is a Y-axis table 18 which can be changed in the Y-axis direction, and a component tray setting section 13, a solder chip tray setting section 14, and a soldering section 24 are attached. Further, the soldering portion 24 is mounted on the θ-axis table 26 and can be rotated in the θ-axis direction.

The components are soldered at a soldering section 24. Work 2, component 1,
A solder chip 30 is set, and the solder is melted and soldered by a heater mechanism therein.

At the time of soldering, the soldered portion 2
4 is covered with a nitrogen chamber cap 17, and then nitrogen is supplied to create a low oxygen concentration atmosphere to prevent adverse effects due to the oxide film.

As a place for placing the component 1, a component tray setting section 13 is provided for setting a component tray 31 (not shown) on which the component 1 is placed, and
0 is placed at the solder chip tray setting section 14
Is a solder chip tray 32 on which a solder chip 30 is placed.
(Not shown) is provided.

The lower camera 19 is provided for imaging the component 1 and calculating a displacement of the component position as described later. What is captured by the lower camera 19 is displayed on the lower camera monitor 21.

In order to start the component mounting apparatus, an operator operates a start button (not shown) on the operation panel 23.
You just have to press.

(II) Outline of Component Mounting Process Next, an outline of a component mounting process performed by the component mounting apparatus according to the present invention will be described with reference to FIGS. FIG.
5 is a flowchart showing a component mounting process performed by the component mounting apparatus according to the present invention.

First, as a preparation, the component tray setting section 1
Set the component tray 31 on which the component 1 is placed, and
Solder chips 30 are placed in the solder chip tray set section 14.
Is set on the solder chip tray 32 on which is mounted (S20)
1).

Next, a work 2 (not shown) such as a printed circuit board is set on the soldering section 24 (S202).

When the operator presses a start button on the operation panel 23 (S203), the component mounting apparatus is started, and the component chucking unit 10 chucks the component 1 on the component tray 31 (S204). The solder chuck 30 sucks the solder chip 30 on the solder chip tray 32 by suction chuck 11 (S205).

Next, the component 1 is imaged by the lower camera 19, and the deviation from the reference is measured. The upper camera 20 also images the workpiece 2, and the deviation from the reference is measured (S).
206). At this time, the image of the component 1 is displayed on the lower camera monitor 21, and the image of the work 2 is displayed on the upper camera monitor 22.

Next, the nitrogen chamber cap 17 is put on the soldering part 24 to supply nitrogen. Then, a nitrogen chamber is formed by the nitrogen chamber cap 17 and the nitrogen chamber outer periphery 16 of the soldering part 24, and the inside of the chamber becomes a low oxygen concentration atmosphere (S207).

Next, the suction chuck section 11 is moved, and the solder chip 30 is mounted at a specified position on the work 2 through the insertion opening 82 opened on the nitrogen chamber cap 17 (S208).

After the solder chip 30 is mounted, the component chuck 10 is moved in the same manner, and the component 1 is mounted at a specified position on the workpiece 2 through the insertion opening 82 opened on the nitrogen chamber cap 17. (S208). At this time, the position is corrected based on the numerical value measured in step S206 to reduce the displacement.

Next, after mounting the component 1, it is heated by activating the heater mechanism in the soldering section 24 to perform soldering (S210). Heating shall be started when the concentration of oxygen in the nitrogen chamber drops below a certain value. Also, when the solder is melted, the component chuck 10 chucks the component 1 and makes a minute reciprocating motion (that is, a sliding operation) as it is. Then, when the operation of the heater mechanism is stopped and cooled, the soldering is completed.

After the soldering is completed, the component 1 is released from the component chuck 10 and lifted, and the nitrogen chamber cap 1
7, the work 2 is removed from the soldering part 24 (S211).

(III) Configuration of Component Chuck Next, the configuration of the component chuck 10 according to this embodiment will be described with reference to FIGS. FIG. 3 shows a component chuck unit 10 and a component tray setting unit 1 by a motor driven taper pin vertical chuck mechanism according to the present embodiment.
3 is a cross-sectional view of the component mounting section 24. FIG. 4 is a cross-sectional view when the chuck jaw opening / closing adjusting mechanism is added to the component chuck section 10 shown in FIG.

The component checking unit 10 according to the present embodiment
The taper pin 37 is moved up and down by driving a motor, thereby opening and closing the chuck claw 3 for chucking the component 1.

As shown in FIG. 3, the chuck pawl 3 is for chucking the component 1 and can be opened and closed about a fulcrum 5. In order to cause the chuck claw 3 to open and close, the taper pin 37 is moved up and down. The taper pin 37 is in contact with the roller 4 attached to one end of the chuck 3, and when the taper pin 37 is moved downward, the roller 4 is pushed in the outer circumferential direction and the chuck 3 opens. And the taper pin 3
7 rotates the motor (1) 40 and feeds the screw (1) 3
6 will move up and down.

The fulcrum 5, the taper pin 37 and the spring 3
The motor 8 and the motor (1) 40 are attached to and supported by the block 35. Further, a spring 38 is attached to the chuck claw 38 inward, and a force based on the lever principle with the fulcrum 5 as an axis is applied so that the taper pin 37 and the roller 4 always contact. By changing the length and the spring constant of the spring 38, the opening / closing timing and the gripping force can be changed.

The block 35 is attached to the table (1) 39, and is moved up and down by the feed screw (2) 43. It is the motor (2) 42 thereon that causes the feed screw (2) 43 to rotate.

Further, the motor (2) 42 is attached to a larger table (2) 41. The table (2) 41 is moved left and right by a feed screw (3) 44. It is the motor (3) 45 on the far left that gives the feed screw (3) 44 a rotational movement.

On the other hand, the component tray setting section 13
And a component tray base 46 on which the component tray 31 is set.

The heater 2 includes a heater block 15 for setting the work 2, a heater 47 for heating the heater block 15, and a nitrogen chamber outer periphery 16. Further, when configuring the nitrogen chamber, it is covered with a nitrogen chamber cap 17, although not shown.

Next, a modification of the component chuck 10 described with reference to FIG. 3 will be described with reference to FIG.

In this example, the stopper 93 is
And a nut 94 for fixing the stopper 93. The stopper 93 changes the relative position between the roller 4 at one end of the chuck 3 and the taper pin 37 to change the opening / closing timing of the chuck 3,
The opening and closing amount is adjusted. That is, FIG.
As shown in (b), when the stopper 93 is screwed, the distance between the roller 4 and the taper pin 37 becomes large via the fulcrum 5, whereby the taper pin becomes less effective and the opening / closing width becomes narrower.

(IV) Component Chuck Operation of Component Chuck Next, a series of operations for the component chuck 10 to perform component chucking and release will be described with reference to FIGS. FIG. 5 is a flowchart for explaining a series of procedures in which the component chuck unit 10 performs component chucking. 6 to 9 are views for explaining the operation of the component chuck unit 10, and FIGS.
0 and a cross-sectional view of the component tray setting section 13, FIGS. 8 and 9
Is a sectional view of the component chuck section 10 and the soldering section 24.

Hereinafter, description will be given with reference to FIGS. 6 to 9 while following the flow of FIG.

First, as shown in FIG. 6A, the motor (3) 45 is rotated to move the table (2) 41 to the chuck position of the component 1 on the component tray 31 set on the component tray base 46. It moves to the upper part (S221). Next, by rotating the motor (1) 40, the feed screw (1) 3
6, the taper pin 37 is moved downward to open the chuck pawl 3 to a state sufficiently larger than the component 1 (S222).

Then, as shown in FIG. 6B, the motor (2) 42 is rotated, and the table (1) 39 is moved downward by the feed screw (2) 43 until the chuck pawl 3 can chuck the component 1. (S223).

Next, as shown in FIG. 7C, the chuck (3) is closed by rotating the motor (1) 40 and moving the taper pin 37 upward by the feed screw (1) 36. The part 1 is chucked (S224).

Then, as shown in FIG. 7E, the motor (2) 42 is rotated, and the table (1) 39 is moved up to the uppermost position by the feed screw (2) 43 (S22).
5).

Up to this point, from the component tray set 13
This is a phase for chucking the component 1. After this, it is the phase of setting the chucked component 1 to the soldering section 24.

First, since the chucked component 1 must be brought to the position of the soldering portion 24, the motor (3) 45 is rotated as shown in FIG. 41 is moved to the position above the component 1 mounting position of the work 2 on the heater block 15 (S226).

Next, as shown in FIG. 8 (f), the motor (2) 42 is rotated, and the table (1) 39 is moved downward by the feed screw (2) 43 to the mounting position of the component 1 of the work 2. (S227).

After placing the part 1, FIG. 9 (g)
As shown in (2), the motor (1) 40 is rotated to move the taper pin 37 downward by the feed screw (1) 36, and the chuck pawl 3 is opened until the part 1 is separated (S22).
8). Finally, as shown in FIG. 9H, the motor (2) 42 is rotated, and the table (1) 39 is moved up to the uppermost position by the feed screw (2) 43 (S22).
9).

(V) Configuration of Soldering Mechanism of Component Mounting Apparatus Next, a configuration of a main part of a mechanism related to soldering by the component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 10 is a diagram showing a configuration of a main part of a mechanism related to soldering of the component mounting apparatus according to the present invention. Here, FIG. 10B is a view taken along the line AA in FIG. 10A.

The soldering by the component mounting apparatus of the present invention is performed in a nitrogen chamber filled with nitrogen at a low oxygen concentration. The nitrogen chamber for that purpose is configured by covering the nitrogen chamber outer periphery 16 with a nitrogen chamber cap 17 at the time of soldering. The nitrogen chamber cap 17 has the component 1 and the solder chip 3 therethrough.
The insertion port 82 for mounting the “0” is open. The nitrogen chamber cap 17 can be moved left and right by a cylinder 72 via a bracket 73.

In order to supply nitrogen into the chamber 83 of the nitrogen chamber, a nitrogen supply 74 is used. The supply of nitrogen is performed by discharging nitrogen from a nitrogen supply device 74 through a nitrogen supply hose 75 to a chamber chamber 83 from a nitrogen supply port 76 attached to the outer periphery 16 of the nitrogen chamber.

The oxygen concentration in the chamber 83 is measured by an oxygen concentration measuring device 77. Therefore, chamber chamber 83
A suction port 78 for introducing the air inside is provided on the outer periphery 16 of the nitrogen chamber. The reason why the oxygen concentration in the chamber 83 is measured is to control the nitrogen supply by the nitrogen supply 74 and to control the heater mechanism such as starting heating by the heater mechanism when the oxygen concentration falls below a certain amount. is there.

The work 2 is set on the heater block 15, and the heater 47 is heated by the heater 47. A temperature sensor 80 is embedded in the heater block 15, and the temperature controller 79 controls the heater block 15 to a predetermined temperature according to the value.

This component mounting apparatus has a suction chuck portion 11 for setting the solder chip 30 on the work 2 and a component chuck portion 10 for setting the component 1. The suction chuck 11 and the component chuck 10 are attached to the table (1) 39, and the motor (3) 45
Thereby, it is possible to move left and right through the feed screw (3) 44.

Since the structure of the component chuck 10 has already been described, the structure of the suction chuck 11 will now be described. The suction chuck section 11 includes a suction chuck 25,
Block 69, feed screw (4) 71, motor (4) 70
It is composed of

The suction chuck 25 sucks and holds the solder chip 30. The suction chuck 25 is a block 69
, And can be moved up and down by a motor (4) 70 through a feed screw (4) 71.

(VI) Soldering Operation of Component Mounting Apparatus Next, a series of soldering operations by the component mounting apparatus according to the present invention will be described with reference to FIGS.
FIG. 11 is a flowchart for explaining a series of soldering procedures performed by the component mounting apparatus according to the present invention.
FIGS. 12 to 15 are views showing the configuration of a main part of a mechanism related to soldering for explaining the soldering operation of the component mounting apparatus according to the present invention.

First, as shown in FIG. 12A, the solder chip 30 on the solder chip set tray set 14 is sucked by the suction chuck 25, and the component 1 on the component tray set 13 is chucked by the chuck claw 3 ( S241).

Next, as shown in FIG. 12B, the nitrogen chamber cap 17 is moved to the upper position of the outer periphery 16 of the nitrogen chamber by the cylinder 72 and is covered to form a nitrogen chamber (S242). Then, a nitrogen supply port 76 is supplied from a nitrogen supply device 74 through a nitrogen supply hose 75.
Then, nitrogen is supplied to the chamber 83, and the chamber 83 is set to a low oxygen concentration atmosphere (S243).

First, the solder chip 30 is mounted on the work 2 in the nitrogen chamber. To do so, the motor (3) 4
5, the table (4) 81 needs to be moved via the feed screw (3) 44 to move the solder chip 30 to an upper position of the work 2 on which the solder chip 30 is mounted. Then, as shown in FIG. 13C, the motor (4) 70 is rotated, the suction chuck 25 is moved downward via the feed screw (4) 71, and the suction chuck 25 is Pass through the insertion opening 82. Thereafter, the suction of the solder chip 30 is released, and the solder chip 30 is placed on the work 2 at the solder chip 30 mounting position.
Is mounted (S244). Then, when the mounting of the solder chip 30 is completed, although not shown in the drawing, the motor (4) 70
Is rotated in the opposite direction, and the suction chuck 25 is moved upward via the feed screw (4) 71.

Next, the part 1 is placed on the work 2 in the nitrogen chamber.
With. For this purpose, as shown in FIG. 14D, the motor (3) 45 is rotated, the table (4) 81 is moved via the feed screw (3) 44, and the component 1 is mounted on the workpiece 2 on the component 1. Move to the top of the position. And then, FIG.
The motor (2) 42 is rotated as shown in FIG.
The table (1) 39 is moved downward via the feed screw (2) 43, and the chuck claw 3 is
The part 1 is set at the position where the part 1 is mounted on the work 2 (S245).

Next, the part 1 is melted by melting the solder and the work 2
This is the step of soldering. The soldering is performed by heating the heat block 15 by the heater 47. The trigger of the heating is when the oxygen concentration measuring device 77 recognizes that the oxygen concentration has reached a predetermined value or less. (S246). Heating like this,
In a situation where the part 1 and the work 2 are being sandwiched and melted by the solder, the motor (3) 45 is rotated as shown in FIG. The chuck claw 3 that is being chucked is reciprocated a predetermined number of times in the left-right direction (S247). The work 2 and the component can be firmly fixed to the solder by the sliding motion. Such a sliding motion can be performed by the mechanism for chucking the component 1 with the chuck claw 3, which is one of the features of the present invention which cannot be performed by the conventional mechanism for sucking and mounting the component.

When the predetermined number of reciprocating movements of the chuck claw 3 is completed, the chuck 3 is stopped at the component 1 mounting position,
7 is stopped, and the heater block 15 is cooled down to a predetermined temperature (S248).

Finally, as shown in FIG. 15 (f), the chuck claw 3 is slightly released from the chuck amount of the component 1 so as not to interfere with the periphery of the mounting portion of the component 1, and the motor (2) 42
Is rotated in the opposite direction, and the table 39 is moved to the uppermost position via the feed screw (2) 43 (S24).
9).

(VII) Configuration of Position Correction Mechanism of Component Mounting Apparatus Next, the configuration of the main part of the position correction mechanism of the component mounting apparatus according to the present invention will be described with reference to FIG. FIG.
It is a figure showing composition of a main part of a position correction mechanism of a component mounting device concerning the present invention. Here, FIG.
It is an AA arrow line view of (a).

The position correcting mechanism can be broadly classified into a mechanism for capturing an image of the component 1 and the work 2 and displaying the image, and a mechanism for moving the positions of the component 1 and the work 2.

The lower camera 19 picks up an image of the component 1 held by the chuck claw 3, and the image picked up by the lower camera 19 is displayed on the lower camera monitor 21 to determine its position. On the other hand, the upper camera 20 captures the component 1 that has captured the workpiece 2, and the image captured by the upper camera 22 is displayed on the upper camera monitor 21, and its position can be determined.

The X-axis table 12 has a component chuck 1
0 and the upper camera 20 are attached. In addition, in the overall configuration diagram of FIG. 1, the suction chuck portion 11 is located to the left of the component chuck portion 10, but is omitted in this drawing because it is not related to the position correction.

The X-axis table 12 can be moved in the X-axis direction on the left and right sides of the figure through the feed screw (3) 44 by the rotation of the motor (3) 45.

The Y-axis table 18 is driven by the rotation of the motor (5) 90 shown in FIG.
2 can be moved in the Y-axis direction extending in a direction perpendicular to the X-axis.

The nitrogen chamber outer periphery 16 is placed on the Y-axis table 18, on which the θ-axis table 26 is placed. On top of this, the heater 47, the heat block 15, and the work 2 are arranged in this order. It is posted. The θ-axis table 26 can be rotated about a center by a motor (6) 91 as a drive source.

(VIII) Position Correction Process of Component Mounting Apparatus Next, a procedure of a position correction process of a component mounting position according to the present invention will be described with reference to FIGS. FIG.
9 is a flowchart of a position correction processing procedure of a component mounting position according to the present invention. FIGS. 18 and 19 are views showing the configuration of the main part of the position correction mechanism for describing the position correction processing procedure of the component mounting position according to the present invention.

Hereinafter, while following the flow of FIG. 17, FIG.
8 and FIG. 19 will be described.

First, as shown in FIG. 18A, the motor (3) 45 is rotated, the X-axis table 12 is moved, and the component chuck 10 holding the component 1 with the chuck claw 3 is moved to the lower camera. 19 (S2
60). Thereafter, the motor (2) 42 is rotated, and the component chuck 10 is lowered via the feed screw (2) 43 so that the image of the component 1 is focused on the lower camera 19 (S261). Then, the image of the component 1 is projected on the lower camera monitor 21 by the lower camera 19, and the amount of deviation of the chucked component 1 from the reference position in the θ-axis direction, the X-axis direction, and the Y-axis direction is calculated. Perform the calculation (S2
62).

Next, the motor (3) 45 is rotated as shown in FIG.
The axis table 12 is moved and the motor (5) 90
(Not shown), the Y-axis table 18 is moved via the feed screw (5) 92 (not shown), and the upper camera 20 is moved.
Is positioned above the work 2 (S263). Then, an image of the work 2 is projected on the upper camera monitor 22 by the upper camera 20, and the work 2 is moved in the θ axis direction, the X axis direction,
The amount of deviation from the reference position in the axial direction is calculated (S262).

On the basis of the shift amounts obtained twice, the shift amounts are offset as shown in FIGS. 19C and 19D, and the shift between the component 1 and the work 2 is eliminated. The θ-axis table 26, the X-axis table 12, the Y-axis table 18
To motor (6) 91, motor (3) 45,
The position is corrected by driving the motor (5) 90. The order of the position correction is as follows. First, the θ-axis table 26 is moved to correct the position in the θ-axis direction, and then the X-axis table 12 and the Y-axis table 18 are corrected in the X-axis and Y-axis directions. do. This means that if the rotation direction is not corrected, X
This is because correction in the axis and Y axis directions cannot be performed.

Embodiment 2 Hereinafter, a second embodiment of the present invention will be described with reference to FIG. FIG. 20 is a cross-sectional view of the component chuck unit 10 by the chuck opening / closing mechanism driven by the outer peripheral taper block according to the present embodiment.

In the component mounting apparatus of the present embodiment, the component chuck 10 has a structure different from that of the first embodiment. In the first embodiment, the opening and closing of the chuck pawl 3 is based on moving the taper pin 37 up and down between the rollers 4 at one end of the chuck pawl 3.
In the component chuck section 10 of the present embodiment, a tapered block is provided at a portion corresponding to one end of the chuck claw 3 and outside the roller 4 opposed thereto, and thereby the opening / closing amount of the chuck claw 3 is changed.

The component chuck section 10 of the present embodiment includes a feed screw (6), a nut 51,
Taper block 50, motor (1) 40 (not shown),
The mechanism for chucking includes a chuck claw 3, a return spring 52, a block 49, a fulcrum 5, a roller 4, and an ejector pin 53 as a mechanism for ejecting a component.

The motor (1) 40 rotates the feed screw (6), and the rotational movement is converted into a vertical movement by the nut 51. Opposing taper block 50
Are spread downward and are in contact with the roller 4. Thereby, as the tapered block 50 moves downward, the interval between the rollers 4 decreases, and as the distance increases upward, the interval increases.

The block 49 has a chuck claw 3 for gripping the component 1 at its tip and a roller attached to the opposite end, so that the block 49 itself rotates about the fulcrum 5. In addition, return springs 52 are attached so as to push each other inward.

The ejector pins 53 apply a force for pushing the component 1 from above, support the upper end surface so that the posture of the component 1 does not change, and allow the component 1 to be firmly grasped.

When the component 1 is released from the component chuck section 10, the feed screw (6) 6 is rotated by the motor (1) 40 in the direction in which the nut 51 is lowered, as shown in FIG. Then, taper block 4
As a result, the distance between the rollers 4 is reduced, the force of the return spring 52 is applied, and the direction of the chuck pawl 3 of the block 49 is opened by leverage.

Conversely, when the part 1 is gripped,
(B) As shown in FIG.
The feed screw (6) 6 is rotated in the direction in which 1 rises. Then, the taper block 4 also rises, the interval between the rollers 4 is widened, the force of the return spring 52 is applied, and the direction of the chuck claw 3 of the block 49 is closed by leverage. When grasping the component 1, the ejector pin 5
By 3, a force for pushing the component 1 from above is applied to support the upper end surface so that the posture of the component 1 does not change.

As described above, the opening / closing amount of the chuck claw 3 can be arbitrarily set by controlling the feed screw (6) 6 that moves the nut 51 up and down.
Components can be mounted in narrow spaces with high precision.

[Embodiment 3] Hereinafter, a third embodiment of the present invention will be described with reference to FIG. FIG. 21 is a cross-sectional view of the component chuck section 10 by the chuck opening / closing mechanism using the stepped collet chuck and the air driven piston according to the present embodiment.

The component chucks 10 of the first embodiment and the second embodiment have different structures and are both driven by a motor.
It is operated by air supplied from outside. The component chuck section 10 of the present embodiment includes a stepped collet chuck claw 54, a housing 55, and a piston 57. The stepped collet chuck pawl 54 is
And is fixed in the center. In the housing 55, a piston 57 is housed next to the stepped collet chuck claw 54. This piston 57
An upper air supply / exhaust hole 56A and a lower air supply / exhaust hole 5 provided in a housing 55 for supplying / exhausting air.
It moves up and down by air from 6B.

When the component 1 is released from the component chuck section 10, air is supplied from an upper air supply / exhaust hole 56A as shown in FIG. Then, the pressure in the upper chamber A generated between the piston 57 and the housing 55 increases, whereby the piston 57 descends. At the same time, the air accumulated in the lower chamber B is exhausted from the lower air supply / exhaust hole 56B. The tip of the piston 57
It is bent inward to tighten the stepped collet chuck pawl 54. The stepped collet chuck pawl 54 has a step as shown in the figure, and the tightening force becomes weaker as the piston descends, and a force is applied in the opening direction by the elasticity of the stepped collet chuck pawl 54 itself.

Conversely, when the component 1 is to be chucked by the component chuck section 10, air is supplied from the lower air supply / exhaust hole 56B as shown in FIG. Then, the pressure in the lower chamber B generated between the piston 57 and the housing 55 increases, whereby the piston 57 rises. At the same time, from the upper air supply / exhaust hole 56A,
The air accumulated in the upper room A is exhausted. Piston 5
When 7 rises, the force of tightening the stepped collet chuck pawl 54 by the tip of the piston 57 increases, and the component 1 is gripped by the stepped collet chuck pawl 54.

In this way, the supply and exhaust of air
By controlling the piston 57 to move up and down, the stepped chuck pawl 54 can be opened and closed. In addition, by controlling the number of steps of the stepped chuck pawls 54 and the air at the piston 57 to control the stop in the middle, the opening / closing amount of the stepped chuck pawls 54 can be controlled in a stepwise manner. And mounting components in narrow spaces with high precision.

[0096]

According to the present invention, in a component mounting apparatus for soldering components, when components are mounted on a printed circuit board, the components can be mounted with high accuracy, and nitrogen for stabilizing solder quality can be obtained. It is possible to provide a component mounting apparatus that does not require much and can perform high-quality soldering.

[Brief description of the drawings]

FIG. 1 is an external view of a component mounting apparatus according to the present invention.

FIG. 2 is a flowchart showing a component mounting process performed by the component mounting apparatus according to the present invention.

FIG. 3 is a cross-sectional view of a component chuck unit 10, a component tray setting unit 13, and a component mounting unit 24 by a motor-driven taper pin vertical chuck mechanism according to the first embodiment of the present invention.

4 is a cross-sectional view when a chuck jaw opening / closing adjustment mechanism is added to the component chuck section 10 shown in FIG.

FIG. 5 is a flowchart for explaining a series of procedures in which the component chuck unit 10 performs component chucking.

FIG. 6 is a cross-sectional view of the component chuck unit and the component tray setting unit for explaining the operation of the component chuck unit (part 1).

FIG. 7 is a cross-sectional view of the component chuck unit and the component tray setting unit for explaining the operation of the component chuck unit (part 2).

FIG. 8 is a cross-sectional view of the component chuck 10 and the soldering unit 24 for explaining the operation of the component chuck 10 (part 1).

FIG. 9 is a cross-sectional view of the component chuck section 10 and the soldering section 24 for explaining the operation of the component chuck section 10 (part 1).

FIG. 10 is a diagram showing a configuration of a main part of a mechanism related to soldering of the component mounting apparatus according to the present invention.

FIG. 11 is a flowchart for explaining a series of soldering procedures by the component mounting apparatus according to the present invention.

FIG. 12 is a diagram illustrating a configuration of a main part of a mechanism related to soldering for describing a soldering operation of the component mounting apparatus according to the present invention (part 1).

FIG. 13 is a view showing a configuration of a main part of a mechanism related to soldering for explaining a soldering operation of the component mounting apparatus according to the present invention (part 2).

FIG. 14 is a view illustrating a configuration of a main part of a mechanism related to soldering for describing a soldering operation of the component mounting apparatus according to the present invention (part 3).

FIG. 15 is a view showing a configuration of a main part of a mechanism related to soldering for explaining a soldering operation of the component mounting apparatus according to the present invention (part 4).

FIG. 16 is a diagram showing a configuration of a main part of a position correction mechanism of the component mounting apparatus according to the present invention.

FIG. 17 is a flowchart of a position correction processing procedure of a component mounting position according to the present invention.

FIG. 18 is a diagram illustrating a configuration of a main part of a position correction mechanism for describing a position correction processing procedure of a component mounting position according to the present invention (part 1).

FIG. 19 is a view showing a configuration of a main part of a position correcting mechanism for explaining a position correcting process procedure of a component mounting position according to the present invention (part 2).

FIG. 20 is a cross-sectional view of a component chuck unit 10 by a chuck opening / closing mechanism driven by an outer peripheral taper block according to a second embodiment of the present invention.

FIG. 21 is a cross-sectional view of a component chuck unit 10 by a chuck opening / closing mechanism using a stepped collet chuck and an air driven piston according to a third embodiment of the present invention.

[Explanation of symbols]

1 ... parts, 2 ... work, 3 ... chuck pawl, 4 ... roller,
5 fulcrum, 6 feed screw (6), 10 chuck part, 11 suction chuck, 12 X-axis table, 13
Component tray setting section, 14: Solder chip tray setting section, 15: Heater block, 16: Outer circumference of nitrogen chamber,
17: nitrogen chamber cap, 18: Y-axis table, 1
9 lower camera, 20 upper camera, 21 lower camera monitor, 22 upper camera monitor, 23 operation panel, 24 ...
Soldering part, 25: suction chuck, 26: θ-axis table, 30: solder chip, 31: component tray, 32: solder chip tray, 35: block, 36: feed screw (1), 37: taper pin, 38: spring 39, Table (1), 40: Motor (1), 41: Table (2), 42: Motor (2), 43: Feed screw (2),
44: feed screw (3), 45: motor (3), 46: component tray base, 47: heater, 49: block, 50
... taper block, 51 ... nut, 52 ... return spring, 5
3 ... ejector pin, 54 ... stepped collet chuck claw, 55 ... housing, 56A ... upper air supply / exhaust hole, 56B ... lower air supply / exhaust hole, 57 ... piston
69 ... block, 70 ... motor (4), 71 ... feed screw (4), 72 ... cylinder, 73 ... bracket, 74 ... nitrogen supply device, 75 ... nitrogen supply hose, 76 ... nitrogen supply port,
77: oxygen concentration measuring device, 78: nitrogen inlet, 79 ...
Temperature controller, 80: temperature sensor, 81: table (4), 82: insertion port, 83: chamber, 90: motor (5), 91: motor (6), 92: feed screw (5), stopper 93 , 94 ... nut.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) B25J 15/08 B25J 15/08 FL H05K 13/04 H05K 13/04 AM 13/08 13/08 Q (72) Inventor Kazuo Takai 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Communication Systems Division of Hitachi, Ltd. F term in the System Business Unit (reference)

Claims (5)

[Claims] 1. A component mounting apparatus for soldering a component, comprising: a component mounting section for mounting a component to be soldered on a work; and a component mounting section for accommodating the component and the work and performing soldering there. A soldering portion, wherein the component mounting portion has chuck claws for chucking components provided opposite to each other, and the soldering portion has a nitrogen chamber cap for forming a nitrogen chamber at the time of soldering. A means for supplying nitrogen to the nitrogen chamber; a means for heating the solder; and a means for measuring the oxygen concentration in the nitrogen chamber. When soldering, the nitrogen chamber cap Insert the chuck claw that has chucked the component from the insertion port, and fill the nitrogen chamber with nitrogen, and when the oxygen concentration falls below a certain level. Heating the solder by means of heating the solder to melt the solder, and the chuck claws can perform a fitting operation during soldering while the component is chucked on the work. Component mounting equipment. 2. The component mounting apparatus further includes: a lower camera for imaging the component; an upper camera for imaging the work; and means for mounting the work and rotating the work in the θ-axis direction; The component mounting part and the soldering part are vertically and horizontally X-axis and Y-axis.
Means for moving in the axial direction, the part imaged by the lower camera, and the position of the work imaged by the upper camera are calculated, and the work is rotated so as to correct a deviation from a reference value, 2. The component mounting apparatus according to claim 1, wherein the position is corrected in the θ-axis direction, and the component mounting section and the soldering section are moved to correct the position in the vertical and horizontal X-axis and Y-axis directions. 3. The component mounting section further includes a motor as a driving source, and a tapered pin that is moved up and down by the motor. The component mounting according to claim 1, wherein the component is chucked by rotating the roller to increase the interval between the rollers, and the component is opened by reducing the interval between the rollers. apparatus. 4. The component mounting section further includes: a motor as a drive source; a tapered block opposing the motor; and an ejector pin for pushing out a component in a downward direction. By rotating the opposing rollers attached to one end of the chuck pawl to widen the interval between the rollers, the component is chucked, and by narrowing the interval between the rollers, the component is opened, and the chuck pawl is opened. The component mounting apparatus according to claim 1, wherein when ejecting a component, a force for pushing the component downward is applied by the ejector pin. 5. The chuck according to claim 1, wherein the chuck claw is a stepped collet chuck claw, and the component mounting unit further includes: a means for supplying and discharging air; a cylinder; and a housing for accommodating the chuck claw and the cylinder. By supplying and exhausting air from a supply / exhaust port provided in the housing, the cylinder is moved to change a point where the cylinder is in contact with the chuck claw, and the cylinder is moved downward. When the pressure is applied to the chuck pawl, the pressure applied to the chuck pawl is reduced so that the chuck pawl opens the part. When the cylinder moves upward, the pressure applied to the chuck pawl is increased, and 2. The component mounting apparatus according to claim 1, wherein the component is chucked in accordance with a dimension of a step provided on the chuck claw.