JP2000256542A - Thermoplastic copolyester resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoplastic copolyester resin composition which has excellent photodeterioration resistance and excellent thermal aging resistance. SOLUTION: This thermoplastic copolyester resin composition comprises (A) 100 pts.wt. of a copolyester resin and (B) 0.01-5 pts.wt. of a hindered amine- based photostabilizer alone or the combination of (B) 0.01-5 pts.wt. of the hindered amine-based photostabilizer with (C) 0.01-5 pts.wt. of a UV light absorbent. The component A is obtained from (a) a dicarboxylic acid component consisting mainly of (a-1) an aromatic dicarboxylic acid and (a-2) a hydrogenated dimer acid wherein the hydrogenated dimer acid is contained in an amount of 1-60 mol.% based on the total carboxylic acid component, and (b) a lower mol.wt. glycol which consists mainly of 1,4-butanediol and has a mol.wt. of <=300.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention has excellent moldability, high mechanical strength, rubber properties such as impact resistance, elastic recovery, flexibility, etc., and excellent light resistance and heat aging resistance. The present invention relates to a thermoplastic copolyester resin composition.

[0002]

2. Description of the Related Art A thermoplastic copolyester resin obtained by copolymerizing a crystalline aromatic polyester such as polybutylene terephthalate with dimer acid has rubber-like properties such as impact resistance, elastic recovery, flexibility and the like. It is known as a polyester resin having excellent heat aging resistance. For example, JP-A-50-90697 discloses a thermoplastic copolyester resin composed of an acid component containing dimer acid in addition to terephthalic acid, a glycol component mainly composed of an aliphatic diol, and an aromatic compound at the time of polymerization. The use of amine stabilizers, the hindered phenolic antioxidant and the mixture of thioether and phosphorus antioxidants are useful for stabilizing heat aging, and further stabilizing against ultraviolet rays It is disclosed that various ultraviolet absorbers may be blended.

However, Japanese Patent Application Laid-Open No. 50-9069 discloses
No. 7, the thermoplastic copolyester resin disclosed in
Polyester resin with excellent light resistance and heat aging resistance to some extent, but its light resistance and heat aging resistance over a long period of time are not sufficient. There is a problem that cracks are generated on the surface of the product and the appearance is deteriorated.

[0004]

SUMMARY OF THE INVENTION The present invention has been achieved as a result of studying to solve the problems in the prior art described above.

Accordingly, an object of the present invention is to provide excellent moldability, high mechanical strength, rubber properties such as impact resistance, elastic recovery, and flexibility, and excellent light resistance and heat aging resistance. To provide a thermoplastic copolyester resin composition.

[0006]

In order to achieve the above object, the thermoplastic copolyester resin composition of the present invention comprises:
(1) The aromatic dicarboxylic acid (a-1) and the hydrogenated dimer acid (a-2) are the main components, and the hydrogenated dimer acid (a-2) is 1 to 60 of the total dicarboxylic acid components.
Per 100 parts by weight of a thermoplastic copolyester resin (A) obtained from a dicarboxylic acid component (a) in an amount of 1 mol% and a low-molecular-weight glycol (b) having a molecular weight of 300 or less and composed mainly of 1,4-butanediol. 0.01 to 5 parts by weight of the hindered amine light stabilizer (B) alone, or 0.01 to 5 parts by weight of the hindered amine light stabilizer (B) and 0.01 to 5 parts by weight of the ultraviolet absorber (C). And an aromatic amine-based antioxidant (D) in an amount of 0.01 to 5 parts by weight, based on 100 parts by weight of the thermoplastic copolyester resin composition of (1). Further, 100 parts by weight of the thermoplastic copolyester resin composition is further mixed with a polyamide resin (E).
0.1 to 20 parts by weight, and further,
100 parts by weight of the thermoplastic copolyester resin composition of (1), 0.01 to 5 parts by weight of a hindered phenolic antioxidant (F) alone or a hindered phenolic antioxidant (F) It is a combination of 0.01 to 5 parts by weight and 0.01 to 5 parts by weight of a phosphorus-based antioxidant (G), and is further added to 100 parts by weight of the thermoplastic copolyester resin composition. It contains 0.01 to 5 parts by weight of an aromatic amine-based antioxidant (D), and further contains 100 parts by weight of the thermoplastic copolyester resin composition and 0.1 part by weight of a polyamide resin (E).
It contains 1 to 20 parts by weight.

The aromatic dicarboxylic acid (a-1)
Is terephthalic acid or naphthalenedicarboxylic acid, and the purity of the hydrogenated dimer acid (a-2) is 9
4% or more, the hydrogenated dimer acid (a
-2) the purity is 98% or more; the aromatic amine antioxidant (D) is a diphenylamine compound; the polyamide resin (E) is a copolymerized polyamide resin; The phenolic antioxidant (F) is a hindered phenolic compound having a molecular weight of 500 or more, and the phosphorus antioxidant (G) is a compound having two or more phosphorus atoms in a molecule.
However, these are all preferable conditions, and by applying these conditions, it is possible to expect to obtain a more excellent effect.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.

[0009] The dicarboxylic acid component (a) of the thermoplastic copolyester resin (A) forming the thermoplastic copolyester resin composition of the present invention is an aromatic dicarboxylic acid (a-1).
And hydrogenated dimer acid (a-2) as main components. Specific examples of the aromatic dicarboxylic acid (a-1) include:
Terephthalic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, or an ester-forming derivative thereof are preferable. In addition, isophthalic acid, phthalic acid, diphenyl-4,4′-dicarboxylic acid, Phenoxyethanedicarboxylic acid, 5-sulfoisophthalic acid, or an ester-forming derivative thereof can be used. As the hydrogenated dimer acid (a-2) used in the present invention, those obtained by hydrogenation of a purified dimer of a vegetable unsaturated fatty acid or ester-forming derivatives thereof can be used. . As the hydrogenated dimer acid (a-2), it is preferable to use a hydrogenated dimer acid obtained by removing a monomer or trimer by distillation purification. Since the polymerization reactivity and the physical properties of the copolymer are excellent, the hydrogenated dimer acid (a-2) preferably has a purity of 94% or more, particularly preferably 98% or more.

In the thermoplastic copolyester resin (A) forming the thermoplastic copolyester resin composition of the present invention, the hydrogenated dimer acid (a-2) contains 1 to 60 mol% of the total dicarboxylic acid component, Preferably it is 5 to 55 mol%, more preferably 10 to 50 mol%. If the amount of the hydrogenated dimer acid (a-2) is less than 1 mol%, the obtained copolymerized polyester resin composition does not have sufficient rubber-like elasticity such as impact resistance. If it exceeds 60 mol%,
In addition to a large decrease in rigidity, a low melting point and a low crystallization rate, only a thermoplastic copolyester resin composition having poor moldability can be obtained.

The thermoplastic copolyester resin (A) forming the copolymerized polyester resin composition of the present invention has a molecular weight of 3
The low molecular weight glycol component (b) having a molecular weight of 00 or less is 1,4-
The main component is butanediol, but other specific examples include ethylene glycol, trimethylene glycol,
Aliphatic diols such as pentamethylene glycol, hexamethylene glycol, neopentyl glycol and decamethylene glycol; alicyclic diols such as 1,4-cyclohexanedimethanol and tricyclodecanedimethylol; xylylene glycol; bis (p-hydroxy ) Diphenyl, bis (p-hydroxyphenyl) propane, 2,2-bis [4- (2-hydroxyethoxy)
Phenyl] propane, bis [4- (2-hydroxy) phenyl] sulfone, 1,1-bis [4- (2-hydroxyethoxy) phenyl] cyclohexane, 4,4′-dihydroxy-p-terphenyl, and 4, 4'-dihydroxy-p-quarterphenyl and the like can be mentioned. Further, two or more of these diol components can be used in combination.

In the thermoplastic copolyester resin (A) forming the thermoplastic copolyester resin composition of the present invention, if necessary, a trifunctional or higher polyfunctional carboxylic acid such as trimellitic acid, trimesic acid or pyromellitic acid may be used. The acid component, the polyfunctional oxyacid component, and the polyfunctional hydroxy component can be used in a small amount that does not cause gelation during polycondensation, for example, about 0.05 to 3 mol% based on all dicarboxylic acid components.

The preferred method for producing the thermoplastic copolyester resin (A) for forming the thermoplastic copolyester resin composition of the present invention includes, for example, a lower alcohol diester of an aromatic dicarboxylic acid, a hydrogenated dimer acid, A method of subjecting an excess amount of low-molecular-weight glycol to a transesterification reaction and an esterification reaction in the presence of a titanium compound and a hindered phenol compound, and polycondensing the obtained reaction product, or an aromatic dicarboxylic acid,
Examples include a method of subjecting a hydrogenated dimer acid and an excess amount of glycol to an esterification reaction in the presence of a titanium compound, a tin compound, and a hindered phenol compound, and polycondensing the obtained reaction product. Further, the hindered phenol compound may be added at the time of polycondensation, or a part thereof may be blended after completion of the polycondensation.

Specific examples of the hindered amine light stabilizer (B) which is one of the components used in the thermoplastic copolyester resin composition of the present invention include bis (2,2,6,6).
6, -tetramethyl-4-piperidinyl) ester, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, 2- (3,5-di-t-butyl-4-)
Bis (1,2,2,6,6-pentamethyl-4-piperidyl) hydroxybenzyl) -2-n-butylmalonate, dimethyl succinate-1- (2-hydroxyethyl) -4-hydroxy-2,2 , 6,6-tetramethylpiperidine polycondensate, poly [{6- (1,1,3,3-
(Tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl {(2,2,6,6-tetranimethyl-4-piperidyl) imino} hexamethylene} (2
2,6,6-tetramethyl-4-piperidyl) imino}], N, N'-bis (3-aminopropyl) ethylenediamine.2,4-bis [N-butyl-N- (1,
2,2,6,6-pentamethyl-4-piperidyl) amino] -6-chloro-1,3,5-triazine condensate. Among these, 2- (3,5-di-t)
Bis (1,2,2,6,6-pentamethyl-4) -butyl-4-hydroxybenzyl) -2-n-butylmalonate
-Piperidyl) or poly [{6- (1,1,3,3-tetramethylbutyl) amino-1,3,5-triazine-
2,4-diyl {(2,2,6,6-tetranimethyl-
4-piperidyl) imino {hexamethylene} (2,2
6,6-tetramethyl-4-piperidyl) imino}].

Specific examples of the ultraviolet absorbent (C), which is one of the components used in the thermoplastic copolyester resin composition of the present invention, include 2- (5-methyl-2-hydroxyphenyl) benzotriazole, -[2-hydroxy-
3,5-bis- (α, α-dimethylbenzyl) phenyl] -2H-benzotriazole, 2- (3,5-di-
t-butyl-2-hydroxyphenyl) benzotriazole, 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole, 2-
(3,5-di-t-butyl-2-hydroxyphenyl)
-5-chlorobenzotriazole, 2- (3,5-di-
t-Amyl-2-hydroxyfell) benzotriazole, 2 (2'-hydroxy-5'-t-octylphenyl) benzotriazole, methyl-3- [3-tert-butyl-5- (2H-benzotriazole-2) -Il) -4
-Hydroxyphenyl] propionate-a benzotriazole-based ultraviolet absorber such as a condensate with polyethylene glycol; 2,4-dihydroxybenzophenone; 2-hydroxy-4-methoxybenzophenone;
And benzophenone ultraviolet absorbers such as -hydroxy-4-methoxybenzophenone-5-sulfonic acid, 2-hydroxy-4-octyloxybenzophenone, and 2,2 ', 4,4'-tetrahydroxybenzophenone. Among these, 2- (3,5-di-t-butyl-2-hydroxyphenyl) benzotriazole,
-(3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole, 2- (3,5
-Di-t-butyl-2-hydroxyphenyl) -5-chlorobenzotriazole is preferred.

Each of the light stabilizers (B) and (C) is used in an amount of 100% of the thermoplastic copolyester resin (A).
0.01 to 5 parts by weight, preferably 0.05 to parts by weight
To 3 parts by weight, more preferably 0.1 to 1.5 parts by weight. If the amount is less than 0.01 part by weight, the degree of obtaining the desired improvement effect is small. If the amount exceeds 5 parts by weight, blooming occurs or the mechanical strength of the thermoplastic copolyester resin composition decreases. Therefore, it is not preferable.

Specific examples of the aromatic amine antioxidant (D) which is one of the components used in the thermoplastic copolyester resin composition of the present invention include phenylnaphthylamine, 4,4'-dimethoxydiphenylamine, , 4 '
Examples include -bis (α, α-dimethylbenzyl) diphenylamine and 4-isopropoxydiphenylamine, and among these, the use of a diphenylamine-based compound is preferred.

The polyamide resin (E) which is one of the components used in the thermoplastic copolyester resin composition of the present invention
Is a high molecular compound having an amide bond in the molecular chain, by reacting a polymer from lactam, adipic acid, sebacic acid, dodecanedioic acid, etc. with ethylenediamine, hexamethylenediamine, metaxylenediamine, etc. Examples thereof include a polymer of the obtained salt and a polymer derived from ω-aminocarboxylic acid. These polyamide resins may be copolymers or two or more different polymers may be used in combination. Among these polyamide resins, when a binary or ternary or higher copolymerized polyamide resin is used, higher effects can be obtained.

The amount of the polyamide resin (E) is 0.1 to 100 parts by weight of the thermoplastic copolyester resin (A).
To 20 parts by weight, preferably 0.3 to 10 parts by weight, more preferably 0.5 to 5 parts by weight. If the blending amount of the polyamide resin (E) is less than 0.1 part by weight, the degree of obtaining the desired improvement effect is small, and if it exceeds 20 parts by weight, the inherent flexibility and rubber of the thermoplastic copolyester resin are obtained. It is not preferable because the mechanical properties are impaired.

Specific examples of the hindered phenolic antioxidant (F), which is one of the components used in the thermoplastic copolyester resin composition of the present invention, include 2,4-dimethyl-6-t-butylphenol, 2,6-di-t-butylphenol, 2,6-di-t-butyl-p-cresol, hydroxymethyl-2,6-di-t-butylphenol, 2,6-di-t-α-dimethylamino- p-cresol, 2,5-di-t-butyl-4-ethylphenol, 4,4′-bis (2,6-di-t-butylphenol), 2,2′-methylene-bis-4-methyl -6
t-butylphenol, 2,2′-methylene-bis (4
-Ethyl-6-t-butylphenol), 4,4'-methylene-bis (6-t-butyl-o-cresol),
4,4'-methylene-bis (2,6-di-t-butylphenol), 2,2'-methylene-bis (4-methyl-
6-cyclohexylphenol), 4,4′-butylidene-bis (3-methyl-6-t-butylphenol),
4,4'-thiobis (6-t-butyl-3-methylphenol), bis (3-methyl-4-hydroxy-5-t
-Butylbenzyl) sulfide, 4,4′-thiobis (6-t-butyl-o-cresol), 2,2′-thiobis (4-methyl-6-t-butylphenol), 2,
6-bis (2'-hydroxy-3'-t-butyl-5 '
-Methylbenzyl) -4-methylphenol, 3,5-
Diethyl ester of di-t-butyl-4-hydroxybenzenesulfonic acid, 2,2'-dihydroxy-3,3 '
-Di (α-methylcyclohexyl) -5,5′-dimethyl-diphenylmethane, α-octadecyl-3 (3 ′,
5'-di-t-butyl-4'-hydroxyphenyl) propionate, 6- (hydroxy-3,5-di-t-butylanilino) -2,4-bis-octyl-thio-1,
3,5-triazine, hexamethylene glycol-bis [β- (3,5-di-t-butyl-4-hydroxyphenol) propionate], N, N′-hexamethylene-bis (3,5-di-t -Butyl-4-hydroxyhydrocinnamic acid amide), 2,2-thio [diethyl-bis-3
(3,5-di-t-butyl-4-hydroxyphenyl)
Propionate], dioctadecyl ester of 3,5-di-t-butyl-4-hydroxybenzenephosphonic acid,
Tetrakis [methylene-3 (3,5-di-t-butyl-
4-hydroxyphenyl) propionate] methane,
1,3,5-trimethyl-2,4,6-tris (3,5
-Di-t-butyl-4-hydroxybenzyl) benzene, 1,1,3-tris (2-methyl-4-hydroxy-5-di-t-butylphenyl) butane, tris (3
5-di-t-butyl-4-hydroxyphenyl) isocyanurate, and tris [β- (3,5-di-t-butyl-4hydroxyphenyl) propionyl-oxyethyl] isocyanurate. Among these, especially tetrakis [methylene-3 (3,5-di-t-
It is preferable to use those having a molecular weight of 500 or more, such as [butyl-4-hydroxyphenyl) propionate] methane.

The phosphorus antioxidant (G) which is one of the components used in the thermoplastic copolyester resin composition of the present invention includes phosphoric acid, phosphorous acid, a hypophosphorous acid derivative, phenylphosphonic acid, Compounds containing phosphorus, such as polyphosphonates, dialkylpentaerythritol diphosphite, and dialkylbisphenol A diphosphite. Among these, it is preferable to use a compound having a sulfur atom together with a phosphorus atom in the molecule, or a compound having two or more phosphorus atoms in the molecule.

These antioxidants (D), (F),
The amount of (G) is 0.01 to 5 parts by weight, preferably 0.05 to 3 parts by weight, more preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the thermoplastic copolyester resin (A).
1.5 parts by weight. Antioxidants (E), (F),
If the compounding amount of (G) is less than 0.01 part by weight, the degree of obtaining the desired improvement effect is small, and if it exceeds 5 parts by weight, blooming occurs or the mechanical strength of the thermoplastic copolyester resin composition is reduced. It is not preferable because it lowers.

The method for producing the thermoplastic copolyester resin composition of the present invention is not particularly limited. For example, a polyamide resin, a predetermined light stabilizer and an antioxidant are mixed with the thermoplastic copolyester resin. Raw material is supplied to a screw-type extruder and melt-kneaded.Also, a thermoplastic copolyester resin is first supplied to a screw-type extruder and melted, and then polyamide resin, light stabilizer and oxidation prevention are supplied from other supply ports. For example, a method of supplying and kneading an agent can be appropriately employed.

The copolymerized polyester resin composition of the present invention thus constituted is excellent in light deterioration resistance and heat aging resistance.

Various additives can be added to the thermoplastic copolyester resin composition of the present invention as long as the object of the present invention is not impaired. For example, a molding aid such as a known crystal nucleating agent or a lubricant, a coloring agent such as a pigment or a dye, an antistatic agent, a conductive agent, a flame retardant, a reinforcing agent, a filler, a plasticizer, and a mold release agent are optionally contained. be able to.

The thermoplastic copolyester resin composition of the present invention is excellent in moldability, has high mechanical strength, rubber properties such as impact resistance, elastic recovery, flexibility, etc .; Excellent aging property. Therefore, it is useful for molded articles, various sheets, various films, and the like for automobiles, electronic / electric equipment, precision equipment.

[0027]

EXAMPLES The effects of the present invention will be described below with reference to examples. All percentages and parts in the examples are on a weight basis unless otherwise specified. The physical properties shown in the examples were measured as follows. [Relative viscosity] 0.5 using o-chlorophenol as a solvent
% Polymer solution was measured at 25 ° C. [Melting Point] Differential Scanning Calorimeter (Du Pont DSC-
910) was measured at the top of the melting peak when heated at a rate of 10 ° C./min in a nitrogen gas atmosphere. [Hardness (Shore D scale)] Measured according to JIS K-7215. [Light Deterioration Resistance] A JIS No. 2 type dumbbell test piece made by injection molding was applied to a weather panel with a black panel temperature of 83 ° C.
Ultraviolet irradiation was performed in an o-meter, and the time required for the tensile elongation at break to fall to half of the initial value was measured. [Heat-resistant aging property] A JIS No. 2 dumbbell test piece produced by injection molding was aged in a hot air oven at 150 ° C, and the time required for the tensile elongation at break to fall to half of the initial value was measured. Reference Examples 1 to 3 145 parts of terephthalic acid, 98% pure hydrogenated dimer acid "PRIPOL" 1009
117 parts (manufactured by Uniqema Co., Ltd.) and 160 parts of 1,4-butanediol were added to tetra-n-butyl titanate 0.15.
Parts together with 0.03 part of mono-n-butyl-monohydroxytin oxide in a reaction vessel equipped with a helical ribbon-type stirring blade, and an esterification reaction was carried out at 190 to 225 ° C. while distilling reaction water out of the system. Was. 0.45 parts of tetra-n-butyl titanate was added to the reaction mixture,
Further, 0.15 part of "Irganox" 1098 (an amide group-containing hindered phenol-based antioxidant manufactured by Ciba Geigy, molecular weight: 637) was added, and the temperature was raised to 245 ° C., and then the system was treated for 50 minutes. The pressure was reduced to 0.2 mmHg, and polymerization was carried out under these conditions for 2 hours and 45 minutes.
The obtained polymer was discharged in water in the form of a strand, cut, and pelletized to obtain a copolymerized polyester resin (A-1) in which the hydrogenated dimer acid was 19 mol% of all dicarboxylic acid components. Similarly, copolymerized polyester resins (A-2) and (A-3) shown in Table 1 were obtained. Table 1 shows the physical properties of the obtained copolyester resin.

[0028]

[Table 1] [Light stabilizer] The light stabilizer used in the following examples is as follows. B-1: Hindered amine light stabilizer "Tinuvin" 144 manufactured by Ciba-Geigy C-1: Benzotriazole-based ultraviolet absorber "Tinuvin" 327 manufactured by Ciba-Geigy [Antioxidant] The antioxidant used in the following examples is as follows. It is on the street. D-1: Uniroyal diphenylamine antioxidant "Nowgard" 445 F-1: Ciba Geigy hindered phenol antioxidant "Irganox" 1010 (molecular weight: 1177.
7) G-1: Asahi Denka Kogyo Co., Ltd. phosphorus-based antioxidant "ADEKA STAB" PEP-4C (containing two phosphorus atoms in the molecule) [Production of polyamide resin] Polycaprolactam and polyhexamethylene adipamide A copolymer (polyamide resin (E-1)) having a composition ratio of about 65/35, and a composition ratio of polycaprolactam, polyhexamethylene adipamide and polyhexamethylene sebacamide of about 45/35
/ 20 terpolymer (polyamide resin (E-
2)) was manufactured. [Examples 1 to 9] A light stabilizer, an antioxidant and a polyamide resin were added to the copolymerized polyester resins (A-1), (A-2) and (A-3) obtained in Reference Examples. The mixture was dry-blended at a mixing ratio as shown in FIG. 2, melt-kneaded at 240 ° C. using a twin-screw extruder having a screw of 45 mmφ, and then pelletized. The pellets are placed at 80 ° C for 5
After drying for an hour, at a molding temperature of 240 ° C and a mold temperature of 60 ° C,
It was injection molded into IS No. 2 dumbbells. Using this dumbbell injection molded, light deterioration resistance and heat aging resistance were evaluated. The light deterioration resistance is measured by irradiation in a sunshine-weather-o-meter at a black panel temperature of 83 ° C. while spraying water for 18 minutes for 120 minutes to reduce the retention of tensile elongation at break to 50%. Was examined. The heat aging resistance was measured by heat-treating in a gear oven at 150 ° C. and measuring the time required for the retention of tensile elongation at break to decrease to 50%. Table 3 shows the results.

[0029]

[Table 2]

[0030]

[Table 3] [Comparative Examples 1 to 6] The raw materials of the resin composition were dry-blended at the respective mixing ratios shown in Table 2, and pelletized as in Examples 1 to 9. These pellets and the polyester block copolymers (A-1) to (A-
3) A dumbbell was formed from the material itself by injection molding in the same manner as in Examples 1 to 9, and the light deterioration resistance and the heat aging resistance were similarly evaluated. The results are shown in Table 3.

As is clear from the results in Table 3, the thermoplastic copolyester resin composition of the present invention is excellent in both light deterioration resistance and heat aging resistance. On the other hand, as shown in the comparative examples, the thermoplastic copolyester resin composition to which only the ultraviolet absorber was added as the light stabilizer and the thermoplastic copolyester which was not stabilized at all had light deterioration resistance and heat aging resistance. Not enough.

[0032]

The thermoplastic copolyester resin composition of the present invention in which a hindered amine light stabilizer is added to the thermoplastic copolyester resin can give a molded article having excellent light deterioration resistance and heat aging resistance. it can.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08K 5/13 C08K 5/13 5/18 5/18 5/3432 5/3432 5/51 5/51 / / (C08L 67/02 79:04) (C08L 67/02 77:00 79:04) F-term (reference) 4J002 CF031 CF041 CF071 CF081 CF141 CL012 CL032 CL052 CM023 CM033 CQ014 DH029 EE037 EJ019 EJ029 EJ039 EJ049 EN068 EN00 EU189 EU197 EU199 EV079 EW069 EW129 FD010 FD020 FD043 FD046 FD057 FD074 FD078 FD079 FD090 FD100 FD110 FD130 FD160 GM00 GN00 GQ00 4J029 AA03 AB07 AC02 AD10 AE01 AE03 BA05 CA09 CB04A CB05A CB06A CB09A CC05A CC06A CD04 CF15 CH02 CH07 HA01 HB01 HB03A JB193 JF321 JF371 KE02 KE03 KE05 KH08

Claims (13)

[Claims] 1. An aromatic dicarboxylic acid (a-1) and a hydrogenated dimer acid (a-2) as main components, and the hydrogenated dimer acid (a-2) is one of the total dicarboxylic acid components.
６０60 mol% of dicarboxylic acid component (a);
-A hindered amine light stabilizer (B) 0.01 to 5 parts by weight per 100 parts by weight of a thermoplastic copolyester resin (A) obtained from a low molecular weight glycol (b) having a molecular weight of 300 or less containing butanediol as a main component. Parts by weight alone,
Or hindered amine light stabilizer (B) 0.01 to 5
A thermoplastic copolyester resin composition prepared by combining a weight part with 0.01 to 5 weight parts of an ultraviolet absorber (C). 2. A thermoplastic copolyester resin composition comprising 100 parts by weight of the thermoplastic copolyester resin composition according to claim 1 and 0.01 to 5 parts by weight of an aromatic amine-based antioxidant (D). object. 3. A thermoplastic copolyester resin composition comprising 100 parts by weight of the thermoplastic copolyester resin composition according to claim 2 and 0.1 to 20 parts by weight of a polyamide resin (E). 4. A thermoplastic copolyester resin composition according to claim 1, further comprising 0.01 to 5 parts by weight of a hindered phenolic antioxidant (F) alone or a hindered phenolic antioxidant (F). Antioxidant (F) 0.01
A thermoplastic copolyester resin composition which is prepared by combining 5 parts by weight with 0.01 to 5 parts by weight of a phosphorus-based antioxidant (G). 5. A thermoplastic copolyester resin composition comprising 100 parts by weight of the thermoplastic copolyester resin composition according to claim 4 and 0.01 to 5 parts by weight of an aromatic amine antioxidant (D). object. 6. A thermoplastic copolyester resin composition obtained by further mixing 0.1 to 20 parts by weight of a polyamide resin (E) with 100 parts by weight of the thermoplastic copolyester resin composition according to claim 5. 7. The method according to claim 1, wherein the aromatic dicarboxylic acid (a-1) is terephthalic acid or naphthalenedicarboxylic acid.
7. The thermoplastic copolyester resin composition according to any one of items 1 to 6. 8. The thermoplastic copolyester resin composition according to claim 1, wherein the purity of the hydrogenated dimer acid (a-2) is 94% or more. 9. The thermoplastic copolyester resin composition according to claim 1, wherein the purity of the hydrogenated dimer acid (a-2) is 98% or more. 10. The thermoplastic copolyester resin composition according to claim 2, wherein the aromatic amine antioxidant (D) is a diphenylamine compound. 11. The method according to claim 3, wherein the polyamide resin (E) is a copolymerized polyamide resin.
Item 10. The thermoplastic copolyester resin composition according to item 8. 12. The thermoplastic copolyester resin composition according to claim 4, wherein the hindered phenolic antioxidant (F) is a hindered phenolic compound having a molecular weight of 500 or more. 13. The phosphoric antioxidant (G) is a compound having two or more phosphorus atoms in a molecule.
The thermoplastic copolyester resin composition according to any one of the above.