JP2000236153A - Printed wiring board structure - Google Patents

Printed wiring board structure

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Publication number
JP2000236153A
JP2000236153A JP3702099A JP3702099A JP2000236153A JP 2000236153 A JP2000236153 A JP 2000236153A JP 3702099 A JP3702099 A JP 3702099A JP 3702099 A JP3702099 A JP 3702099A JP 2000236153 A JP2000236153 A JP 2000236153A
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JP
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Patent type
Prior art keywords
plurality
wiring board
electrodes
electrode
1b
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Pending
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JP3702099A
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Japanese (ja)
Inventor
Koji Okada
康治 岡田
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Nec Corp
日本電気株式会社
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Abstract

PROBLEM TO BE SOLVED: To enable a pressure welding/positioning operation to be carried out at a high speed. SOLUTION: A flexible wiring board 2 equipped with first electrodes 1a and a printed wiring board 5 equipped with second electrodes 1b are pressure- welded together, making the electrodes 1a and 1b confront each other and interposing an anisotropic conductive film 3 between the electrodes 1a and 1b for the formation of a printed wiring board structure, where projections 4 are provided between the first electrodes 1a or the second electrodes 1b, by which the flexible wiring board 2 shift in connection position is restrained to a minimum, even if the flexible wiring board 2 is thermally shrunk in a pressure-welding operation. The projections 4 are set higher than the first electrodes 1a or the second electrodes 1b, the height of the projection 4 is set lower than the sum of the heights of the first electrode 1a and second electrode 1b, and the projection 4 is locked inbetween the facing electrodes.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、プリント配線基板構造に関し、特に、フレキシブル配線基板が熱収縮を起こしても接続のずれを最小限に抑えることができるプリント配線基板構造を提供することにある。 BACKGROUND OF THE INVENTION The present invention relates to a printed wiring board structure, particularly, to provide a printed wiring board structure can be flexible wiring board is minimized deviation of the connection even cause thermal shrinkage .

【0002】 [0002]

【従来の技術】図5,図6は、プリント配線基板構造の従来例の構成を示す断面図である。 BACKGROUND ART FIG. 5, FIG. 6 is a sectional view showing a conventional example of a configuration of a printed wiring board structure. この図に示すように、従来例では、圧接時の熱でフレキシブル配線基板2 As shown in this figure, in the conventional example, the flexible wiring board 2 in the heat during pressing
が熱収縮を起こしたときズレを止める支えとなるものが無い。 There is nothing to be a support to stop the shift when that caused the thermal contraction. この目的のために、フレキシブル配線基板2およびプリント配線基板5に認識マークを設けたり、圧接装置に認識機構を設けたり、フレキシブル配線基板2の熱収縮を考慮して圧接電極ピッチを補正したりするという手法が採用されている。 For this purpose, it may be provided a recognition mark on the flexible wiring board 2 and the printed wiring board 5, or provided with a recognition mechanism to pressure welding apparatus, or to correct the pressure electrode pitch in consideration of heat shrinkage of the flexible wiring board 2 It has been adopted technique called.

【0003】 [0003]

【発明が解決しようとする課題】しかしながら、上述した従来の手法では、圧接部の電極ピッチが狭くなった場合、認識スピードの低下および圧接時のズレで隣り合う電極間の耐圧低下という問題をもたらしていた。 [SUMMARY OF THE INVENTION However, in the conventional method described above, when the electrode pitch of the contact portion is narrowed, brought the problem of decrease in breakdown voltage between the electrodes adjacent in deviation during lowering and pressing of the recognition speed which was.

【0004】そこで、本発明の主な目的の一つは、圧接位置決めのスピードアップを図ったプリント配線基板構造を提供することにある。 [0004] Therefore, one of the main objectives of the present invention is to provide a printed wiring board structure that speeds up the pressure positioning.

【0005】また、本発明の他の目的は、圧接時の熱でフレキシブル配線基板が収縮しても、圧接ズレを抑え、 [0005] Another object of the present invention, even if the flexible wiring board shrinks by heat during welding, suppress pressure deviation,
しかも電極間にレジスト等の突起が存在させて耐圧の向上を図ったプリント配線基板構造を提供することにある。 Moreover projections such as resist between the electrodes be present to provide a printed wiring board structure with improved withstand voltage.

【0006】 [0006]

【課題を解決するための手段】上記目的を達成するために、本発明のプリント配線基板構造は、複数の第1の電極を有するフレキシブル配線基板と、複数の第2の電極を有するプリント配線基板とが、複数の第1および第2 To achieve the above object, according to the Invention The printed wiring board structure of the present invention, a flexible wiring board having a plurality of first electrodes, a printed circuit board having a plurality of second electrodes DOO is, a plurality of first and second
の電極が対向するように異方性導電膜で圧接接続されているプリント配線基板構造において、複数の第1の電極間、または複数の第2の電極間に複数の突起を設け、圧接接続時の熱によりフレキシブル配線基板が熱収縮を起こしても接続のズレを最小限に抑えることができることを特徴とする。 In the printed wiring board structure where electrodes are connected under pressure with an anisotropic conductive film so as to face, a plurality of projections between the plurality of between the first electrode or the second electrode, during insulation displacement connection the flexible wiring board by heat is characterized by being able to minimize the deviation of the connection also undergo thermal shrinkage.

【0007】また、複数の突起は、複数の第2の電極間に設けられ、圧接接続を行ったときに複数の第1の電極間にはまり込むのが好ましい。 Further, a plurality of projections are provided between the plurality of second electrodes, preferably fitted between the plurality of first electrode when performing an insulation displacement connection.

【0008】さらに、複数の突起の高さは、複数の第2 Furthermore, the height of the plurality of protrusions, a plurality of second
の電極高さより高く、かつ、複数の第2の電極高さと、 Higher than the electrode height, and a high plurality of second electrodes of,
複数の第1の電極高さとの和より低くしたのが好ましい。 Preferably, it was lower than the sum of the plurality of first electrode height.

【0009】またさらに、複数の突起は、複数の第1の電極間に設けられ、圧接接続を行ったときに複数の第2 [0009] Further, a plurality of projections are provided between the plurality of first electrodes, a plurality of second when subjected to pressure connection
の電極間にはまり込むのが好ましい。 Preferably fitted between the electrodes.

【0010】また、複数の突起の高さは、複数の第1の電極高さより高く、かつ、複数の第1の電極高さと、複数の第2の電極高さとの和より低くしたのが好ましい。 [0010] The height of the plurality of protrusions is higher than the plurality of first electrode height, and a high plurality of first electrodes is preferably made lower than the sum of the plurality of second electrode height .

【0011】さらに、複数の突起は、ソルダーレジストを使用して設けるのが好ましい。 Furthermore, a plurality of protrusions are preferably provided using a solder resist.

【0012】またさらに、異方性導電膜は、はんだ等の導電材料であるのが好ましい。 [0012] Further, the anisotropic conductive film is preferably a conductive material such as solder.

【0013】以上説明したように、本発明の特徴は、プリント配線基板またはフレキシブル配線基板の電極部間に突起を設けたことにある。 [0013] As described above, features of the present invention is the provision of projections between the electrodes of the printed wiring board or a flexible wiring board.

【0014】 [0014]

【発明の実施の形態】次に、図面を参照して、本発明の実施の形態について詳細に説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, with reference to the drawings will be described in detail embodiments of the present invention.

【0015】図1は、本発明のプリント配線基板構造の実施の形態の構成を示す断面図である。 [0015] Figure 1 is a cross-sectional view showing the structure of an embodiment of a printed circuit board structure of the present invention. 本発明のプリント配線基板構造は、プリント配線基板5と、フレキシブル配線基板2とが、異方性導電膜3で圧接接続され、プリント配線基板5に複数の電極(第2の電極)1bが設けられ、フレキシブル配線基板2に複数の電極(第1の電極)1aが設けられた構成において、プリント配線基板5の圧接を行う第2の電極1b間にソルダーレジスト等を使用して突起4を設けていることを特徴とする。 Printed circuit board structure of the present invention includes a printed wiring board 5, and the flexible wiring board 2 are insulation displacement connection with the anisotropic conductive film 3, a plurality of electrodes (second electrodes) 1b is provided on the printed wiring board 5 is, in a configuration in which a plurality of electrodes (first electrode) 1a is provided on the flexible wiring board 2, by using the solder resist between the second electrode 1b performing welding of the printed circuit board 5 provided with projections 4 and wherein the are. この突起4は、圧接を行ったときにフレキシブル配線基板2の第1の電極1a間にはまり込むという役目を果たす。 The projections 4 serve as fits between the first electrode 1a of the flexible wiring board 2 when subjected to pressure. 従って、圧接時の熱によりフレキシブル配線基板2 Therefore, the flexible wiring board 2 by the heat at the time of pressure
が熱収縮を起こしても接続の際のズレを最小限に抑えることができるという効果が得られる。 There effect is obtained that it is possible to minimize the deviation of the time of connection even cause thermal shrinkage.

【0016】 [0016]

【実施例】次に、図面を参照して、本発明の実施例について説明する。 EXAMPLES Next, with reference to the accompanying drawings, a description will be given of an embodiment of the present invention.

【0017】まず、図1,図2を参照して、本発明のプリント配線基板構造の第1の実施例について説明する。 Firstly, with reference to FIGS. 1 and 2, a description will be given of a first embodiment of a printed circuit board structure of the present invention.
図1は、プリント配線基板の圧接前の構造を示す断面図であり、図2は、プリント配線基板の圧接後の構造を示す断面図である。 Figure 1 is a sectional view showing the structure before welding of the printed wiring board, FIG. 2 is a cross-sectional view showing the structure after welding of the printed wiring board.

【0018】本発明のプリント配線基板構造は、プリント配線基板5とフレキシブル配線基板2との間には両者の電極間を電気的に接続するための異方性導電膜3が設けられている。 The printed circuit board structure of the present invention, the anisotropic conductive film 3 for electrically connecting the both electrodes is provided between the printed wiring board 5 and the flexible wiring board 2. そして、本実施例では、プリント配線基板5の圧接を行う第2の電極1b間にはソルダーレジスト等を使用して突起4が設けられている。 In the present embodiment, the projections 4 by using the solder resist or the like is provided between the second electrode 1b performing welding of the printed circuit board 5. この突起4の高さはプリント配線基板5の第2の電極1b高さより高い必要があり、且つ、プリント配線基板5の第2の電極1b高さと、フレキシブル配線基板2の第1の電極1a The height of the projection 4 is higher needs than the second electrode 1b height of the printed wiring board 5, and a second electrode 1b height of the printed wiring board 5, the first electrode 1a of the flexible wiring board 2
高さとを足した高さ(和)より低くする必要がある。 It is necessary to lower than the height plus the height (sum). 従って、圧接を行ったときにこのプリント配線基板5の第2の電極1b間の突起4がフレキシブル配線基板2の第1の電極1a間に食い込むため、圧接を行うときの位置合わせズレおよび圧接時の熱によりフレキシブル配線基板2が収縮することによるズレを抑えるという効果がもたらされる。 Therefore, since the projection 4 between the second electrode 1b of the printed wiring board 5 when subjected to pressure bites between the first electrode 1a of the flexible wiring board 2, when misalignment and pressure when performing the press the flexible wiring board 2 is brought about an effect of suppressing deviation due to shrinkage by heat.

【0019】上述したことを、図1および図2を用いてさらに詳細に説明する。 [0019] that described above, will be described in more detail with reference to FIGS. 本発明によるプリント配線基板5の圧接電極(第2の電極)1b間の突起4の存在により、圧接部位置決めの容易性という点において格段に向上していることが分かる。 The presence of the projections 4 between pressure electrodes of the printed wiring board 5 according to the present invention (second electrode) 1b, it can be seen that remarkably improved in terms of ease of the press-contact portion positioned. しかも、本実施例では、プリント配線基板5に設けた突起4が圧接後にフレキシブル配線基板2の圧接電極(第1の電極)1a間に食い込む構造となっているので、圧接時の熱によりポリイミド等を材料とするフレキシブル配線基板2が熱収縮を起こしても圧接ズレを最小限に抑えることが可能であるという効果が得られる。 Moreover, in this embodiment, since the projections 4 provided on the printed circuit board 5 has a structure that bites between the flexible wiring substrate 2 pressure electrode (first electrode) 1a after pressing, polyimide or the like by heat during pressing effect that the flexible wiring board 2, the material it is possible to minimize the even pressure deviation undergo thermal shrinkage.

【0020】ここで、上記実施例において、異方性導電膜3は、はんだ等の導電材料としてもよい。 [0020] Here, in the above embodiment, the anisotropic conductive film 3 may be a conductive material such as solder.

【0021】次に、本発明のプリント配線基板構造の第2の実施例について説明する。 Next, a description will be given of a second embodiment of a printed circuit board structure of the present invention.

【0022】図3は、本発明の第2の実施例の構造を示す断面図である。 FIG. 3 is a sectional view showing the structure of a second embodiment of the present invention. 前述した第1の実施例では、本発明の突起4をプリント配線基板5に適応したが、フレキシブル配線基板2についても適応することができる。 In the first embodiment described above, but adapted to the projections 4 of the present invention the printed circuit board 5 can be adapted also flexible wiring board 2. その構成を図3に示している。 It shows the arrangement in Figure 3. 本図において、フレキシブル配線基板2の圧接を行う第1の電極1a間には、ポリイミド製等のカバーレイを使用して突起6が設けられている。 In the figure, between the first electrode 1a performing pressure of the flexible wiring board 2, the protrusions 6 are provided using the coverlay polyimide or the like. この突起6の高さは、フレキシブル配線基板2の第1の電極1a高さより高い必要があり、且つ、プリント配線基板5の第2の電極1b高さと、フレキシブル配線基板2の第1の電極1a高さとを足した高さより低い必要がある。 The height of the projection 6, must be greater than the first electrode 1a height of the flexible wiring board 2, and, the height the second electrode 1b of the printed wiring board 5, the first electrode 1a of the flexible wiring board 2 there is a need lower than the height plus the height. 従って、圧接を行ったときにこのフレキシブル配線基板2の第1の電極1a間の突起6が、プリント配線基板5の第2の電極1b間に食い込むため、圧接を行うときの位置合わせが容易に行えるという効果が得られる。 Therefore, the projection 6 between the first electrode 1a of the flexible circuit board 2 when subjected to pressure contact, since the bite between the second electrode 1b of the printed wiring board 5, it is easily aligned when performing the press an effect that can be performed is obtained.

【0023】しかも、本実施例によるフレキシブル配線基板2の圧接部電極(第1の電極)1a間の突起6が、 [0023] Moreover, the projection 6 between the pressure contact portion electrode of the flexible wiring board 2 according to the present embodiment (the first electrode) 1a is,
圧接後にプリント配線基板5の圧接電極(第2の電極) Pressure electrodes of the printed circuit board 5 after the pressing (second electrode)
1b間に食い込む構造となっているので、圧接時の熱によりポリイミド等を材料とするフレキシブル配線基板2 Since a structure of biting between 1b, the flexible wiring board 2 to the polyimide as a material by heat during pressing
が熱収縮を起こしても圧接ズレを最小限に抑えることが可能という効果も得られる。 There there is also an effect that can be minimized even if the pressure deviation undergo thermal shrinkage.

【0024】本発明の関する圧接では、プリント配線基板5の第2の電極1bとフレキシブル配線基板2の第1 [0024] In pressure-related the present invention, the first second electrode 1b and the flexible wiring board 2 of the printed wiring board 5
の電極1a間の圧接ズレを抑えることが重要な要素の一つとなっている。 Be suppressed pressure deviation between the electrodes 1a has become one of the important factors.

【0025】 [0025]

【発明の効果】以上説明したように、本発明によれば、 As described in the foregoing, according to the present invention,
プリント配線基板またはフレキシブル配線基板に設けた突起が、圧接後にフレキシブル配線基板の圧接電極間に食い込む構造となっているので、圧接時の熱によりポリイミド等を材料とするフレキシブル配線基板2が熱収縮を起こしても圧接ズレを最小限に抑えることが可能であるという効果を奏する。 Projection provided on the printed wiring board or a flexible wiring board, since a structure in which bite between pressure electrodes of the flexible printed circuit board after pressing, the flexible wiring board 2 to the polyimide as a material by heat during pressing is the thermal shrinkage It causes an effect that it is possible to minimize also the pressure deviation by.

【0026】また、上記突起により、圧接位置決めのスピードアップを図ることができるという効果を奏する。 Further, by the projections, there is an effect that it is possible to speed up the pressure positioning.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の第1の実施例(圧接前)を示す断面図である。 [1] first embodiment (before pressing) of the present invention is a cross-sectional view showing a.

【図2】本発明の第1の実施例(圧接後)を示す断面図である。 2 is a sectional view showing a first embodiment (after pressing) of the present invention.

【図3】本発明の第2の実施例(圧接前)を示す断面図である。 [Figure 3] a second embodiment (before pressing) of the present invention is a cross-sectional view showing a.

【図4】本発明の第2の実施例(圧接後)を示す断面図である。 4 is a sectional view showing a second embodiment (after pressing) of the present invention.

【図5】従来例(圧接前)を示す断面図である。 5 is a sectional view showing a conventional example (prior pressure).

【図6】従来例(圧接後)を示す断面図である。 6 is a sectional view showing a conventional example (after pressing).

【符号の説明】 DESCRIPTION OF SYMBOLS

1 電極 1a フレキシブル配線基板側の電極(第1の電極) 1b プリント配線基板側の電極(第2の電極) 2 フレキシブル配線基板 3 異方性導電膜 4 突起(第1の実施例) 5 プリント配線基板 6 突起(第2の実施例) 1 electrode 1a flexible wiring board side of the electrode (first electrode) 1b printed wiring board side of the electrode (second electrode) 2 flexible wiring board 3 anisotropic conductive film 4 protrusions (first embodiment) 5 printed circuit substrate 6 projections (second embodiment)

Claims (7)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】複数の第1の電極を有するフレキシブル配線基板と、複数の第2の電極を有するプリント配線基板とが、前記複数の第1および第2の電極が対向するように異方性導電膜で圧接接続されているプリント配線基板構造において、 前記複数の第1の電極間、または前記複数の第2の電極間に複数の突起を設け、前記圧接接続時の熱により前記フレキシブル配線基板が熱収縮を起こしても接続のズレを最小限に抑えることができることを特徴とするプリント配線基板構造。 1. A flexible wiring board having a plurality of first electrodes, a printed wiring board having a plurality of second electrodes, anisotropy such that the plurality of first and second electrodes are opposed in the printed wiring board structure that is connected by crimping a conductive film, wherein between a plurality of first electrodes, or a plurality of projections between the plurality of second electrodes provided, the flexible wiring board by heat during the insulation displacement connection printed circuit board structure but characterized in that it is possible to minimize the deviation of the connection also undergo thermal shrinkage.
  2. 【請求項2】前記複数の突起は、前記複数の第2の電極間に設けられ、前記圧接接続を行ったときに前記複数の第1の電極間にはまり込むことを特徴とする、請求項1 Wherein said plurality of projections are provided between the plurality of second electrodes, characterized in that the fit between the plurality of first electrode when performing the insulation displacement connection, claim 1
    に記載のプリント配線基板構造。 Printed circuit board structure according to.
  3. 【請求項3】前記複数の突起の高さは、前記複数の第2 3. A height of the plurality of protrusions, said plurality of second
    の電極高さより高く、かつ、前記複数の第2の電極高さと前記複数の第1の電極高さとの和より低くしたことを特徴とする、請求項2に記載のプリント配線基板構造。 Higher than the electrode height, and is characterized in that lower than the sum of the first electrode height plurality of second electrode height and the plurality, the printed wiring board structure as claimed in claim 2.
  4. 【請求項4】前記複数の突起は、前記複数の第1の電極間に設けられ、前記圧接接続を行ったときに前記複数の第2の電極間にはまり込むことを特徴とする、請求項1 Wherein said plurality of projections are provided between the plurality of first electrodes, wherein the fit between the plurality of second electrodes when performing the press-contact connection, claim 1
    に記載のプリント配線基板構造。 Printed circuit board structure according to.
  5. 【請求項5】前記複数の突起の高さは、前記複数の第1 5. The height of the plurality of protrusions, the plurality of first
    の電極高さより高く、かつ、前記複数の第1の電極高さと前記複数の第2の電極高さとの和より低くしたことを特徴とする、請求項4に記載のプリント配線基板構造。 Higher than the electrode height, and is characterized in that lower than the sum of the second electrode height plurality of first electrode height and the plurality, the printed wiring board structure as claimed in claim 4.
  6. 【請求項6】前記複数の突起は、ソルダーレジストを使用して設けたことを特徴とする、請求項1〜5のいずれかに記載のプリント配線基板構造。 Wherein said plurality of projections are characterized by comprising using a solder resist, printed circuit board structure according to claim 1.
  7. 【請求項7】前記異方性導電膜は、はんだ等の導電材料であることを特徴とする、請求項1〜6のいずれかに記載のプリント配線基板構造。 Wherein said anisotropic conductive film is characterized in that it is a conductive material such as solder, a printed circuit board structure according to any one of claims 1 to 6.
JP3702099A 1999-02-16 1999-02-16 Printed wiring board structure Pending JP2000236153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3702099A JP2000236153A (en) 1999-02-16 1999-02-16 Printed wiring board structure

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006012992A (en) * 2004-06-23 2006-01-12 Sharp Corp Electrode connection structure of circuit board
JP2011029460A (en) * 2009-07-27 2011-02-10 Sumitomo Electric Ind Ltd Printed wiring board, connection structure of the same, and method of manufacturing the printed wiring board and the connection structure
WO2012056995A1 (en) * 2010-10-27 2012-05-03 シャープ株式会社 Circuit module, circuit board, circuit device and method for manufacturing circuit module
JP2012200364A (en) * 2011-03-24 2012-10-22 Toshiba Corp Ultrasonic probe and method for manufacturing ultrasonic probe

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006012992A (en) * 2004-06-23 2006-01-12 Sharp Corp Electrode connection structure of circuit board
JP2011029460A (en) * 2009-07-27 2011-02-10 Sumitomo Electric Ind Ltd Printed wiring board, connection structure of the same, and method of manufacturing the printed wiring board and the connection structure
WO2012056995A1 (en) * 2010-10-27 2012-05-03 シャープ株式会社 Circuit module, circuit board, circuit device and method for manufacturing circuit module
JP2012200364A (en) * 2011-03-24 2012-10-22 Toshiba Corp Ultrasonic probe and method for manufacturing ultrasonic probe

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