JP2000212345A - Adhesive polymer composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an adhesive polymer composition excellent in molding processability and initial adhesive force to substrates and the heat resistance thereof as well. SOLUTION: This adhesive polymer composition comprises a total of 100 wt.% of (A) 30-98 wt.% of an ethylene-based polymer with a density of 0.850-0.950 g/cm3 and melt flow rate of 0.01-50 g/10 min, (B) 1-59 wt.% of a tackifier and (C) 1-59 wt.% of an aromatic vinyl compound-conjugated diene compound block copolymer or a hydrogenated product thereof, and (D) a polymer with a glass transition temperature of >=120 deg.C and solubility parameter of 8-14 at 0.01-5 wt.% times the aromatic vinyl compound unit derived from the component C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive polymer composition which is excellent in moldability and processability, and has excellent initial adhesive strength to a substrate and its heat resistance. The present invention relates to an adhesive polymer composition suitable for obtaining a resin laminate.

[0002]

2. Description of the Related Art Conventionally, various resins such as polyamide resin, polyester resin, saponified ethylene-vinyl acetate copolymer, polyolefin resin, polycarbonate resin, and polystyrene resin have been used as food packaging materials. Utilizing the properties of the above, it is used in various applications in the form of a laminate in which one of the resins is used as a base material and a different kind of resin is laminated thereon.

[0003] The laminating method includes a glue laminating method in which a base film or sheet and a different kind of resin film or sheet are adhered to each other with an adhesive to form a laminate, and an anchor coating agent is applied to the base film or sheet. Extrusion lamination method of extruding and laminating dissimilar resins to form a laminate, coextrusion lamination method of forming a laminate by coextruding and laminating an adhesive resin and dissimilar resin on a base film or sheet, and bonding to a base material There is an extrusion lamination method such as a co-extrusion method of co-extruding a conductive resin and a different resin to form a laminate,
The former glue lamination method is excellent in initial adhesive strength and its heat resistance, but has the problem of low productivity. On the other hand, the latter extrusion lamination method has the advantage of high productivity, but has the heat resistance of adhesive force. Inferior in durability, for example, as a material for food packaging, at the time of thermoforming into containers, etc., at the time of filling the contents at high temperature,
Or at the time of high temperature treatment such as boiling sterilization or retort treatment,
The problem of delamination often arises.

On the other hand, in order to improve the heat resistance of the adhesive force in the latter method, an ethylene polymer and / or an unsaturated carboxylic acid or a derivative thereof modified ethylene polymer, a tackifier, and an aromatic agent It has been proposed to use an adhesive resin composition comprising a vinyl compound and a conjugated diene compound block copolymer (JP-A-7-20708).
See No. 2 publication. ), However, has not yet been able to satisfy the heat resistance.

[0005]

SUMMARY OF THE INVENTION In view of the above-mentioned prior art, the present invention has been made to solve problems such as heat resistance and durability of adhesive strength in a laminate by an extrusion lamination method, particularly a co-extrusion method. Therefore, an object of the present invention is to provide an adhesive polymer composition which is excellent in moldability, and also has excellent initial adhesive strength to a substrate and excellent heat resistance.

[0006]

The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, a composition in which a specific polymer is further added to the above-mentioned composition in the prior art achieves the above object. The present invention has been found to be possible, that is, the present invention relates to the following components (A), (B) and (C) [provided that the weight% of each component is 100% by weight in total of these three components. Is for And (D)
The present invention provides an adhesive polymer composition containing a component. (A) Ethylene polymer having a density of 0.850 to 0.950 g / cm ³ and a melt flow rate of 0.01 to 50 g / 10 min: 30 to 98% by weight (B) tackifier: 1 to 59 (C) Aromatic vinyl compound-conjugated diene compound block copolymer or hydrogenated product thereof: 1 to 59% by weight (D) Polymer having a glass transition temperature of 120 ° C. or higher and a solubility parameter of 8 to 14: (C) 0.01 to 5 times the content weight of the aromatic vinyl compound unit derived from the component.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The ethylene polymer as the component (A) constituting the adhesive polymer composition of the present invention has a density of 0.8.
50~0.950g / cm ^3, conforming to JIS K7210 with a temperature 190 ° C., it is essential melt flow rate measured under a load 2.16kg is 0.01 to 50 g / 10 min, these ethylene-based Specific examples of the polymer include, for example, ethylene homopolymers such as low / medium / high density polyethylene (branched or linear), ethylene,
Vinyl acetate, acrylic acid, methacrylic acid, acrylates, copolymers with vinyl compounds such as methacrylates, and ethylene, propylene, 1-butene,
3-methyl-1-butene, 1-pentene, 4-methyl-
1-pentene, 4,4-dimethyl-1-pentene, 1-
Hexene, 4-methyl-1-hexene, 1-heptene,
Copolymers with α-olefins having 3 to 18 carbon atoms, such as 1-octene, 1-decene and 1-octadecene, are exemplified. Among them, ethylene, 1-hexene, and 4-methyl-1
-Α-olefin having 6 to 12 carbon atoms such as hexene, 1-heptene, 1-octene and 1-decene, having a density of 0.850 to 0.915 g / cm ³ and a melt flow rate of 0.01 to Ethylene-α at 5.0 g / 10 min
-Olefin copolymers are preferred.

Further, the ethylene-α-olefin copolymer is copolymerized in the presence of a metallocene catalyst, rather than in the presence of a conventionally widely used Ziegler-Natta catalyst. Preferably, it is

An ethylene-α-olefin copolymer using a metallocene catalyst is disclosed, for example, in JP-A-58-19309.
Nos. 59-95292, 60-35005, 60-35006, 60-35007, 60-
No. 35008, No. 60-35009, No. 61-130
No. 314, Japanese Patent Application Laid-Open No. H3-163088, European Patent Publication No. 420436, U.S. Pat.
No. 8, and a metallocene-based catalyst, particularly a metallocene-alumoxane-based catalyst, described in WO91 / 04257 and the like, or described in, for example, WO92 / 01723 and the like. Using a catalyst comprising a metallocene compound and a compound that reacts with the compound to form a stable anion, for example, a polymerization method such as a gas phase method, a slurry method, a solution method, and a high-pressure ionic polymerization method; It can be manufactured legally.

[0010] The adhesive polymer composition of the present invention may further comprise the above-mentioned (A) in order to further increase the heat resistance of the adhesive force.
As the component, it is preferable that the unsaturated carboxylic acid or its derivative-modified ethylene polymer is contained in an amount of 5% by weight or more, particularly 10 to 50% by weight based on the total amount of the component (A).

Here, the unsaturated carboxylic acid or its derivative-modified ethylene polymer is obtained by subjecting the ethylene polymer to a graft reaction condition using an unsaturated carboxylic acid or its derivative as a modifier. It was done.

As the unsaturated carboxylic acid or its derivative of the modifier, specifically, for example, acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid,
Unsaturated carboxylic acids such as fumaric acid, itaconic acid, citraconic acid, and tetrahydrophthalic acid, or anhydrides thereof, acid halides, amides, imides, esters and the like, and derivatives thereof, among which are unsaturated dicarboxylic acids or anhydrides thereof , Especially maleic acid or its anhydride, is preferred. Examples of the ethylene-based polymer to be modified include those similar to the above-mentioned component (A).

The conditions for the graft reaction include, for example, di-t-butyl peroxide, t-butyl cumyl peroxide, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butyl peroxide). Oxy) hexane, 2,
Dialkyl peroxides such as 5-dimethyl-2,5-di (t-butylperoxy) hexine-3, t-butylperoxyacetate, t-butylperoxybenzoate, t-butylperoxyisopropyl carbonate, 2, Peroxyesters such as 5-dimethyl-2,5-di (benzoylperoxy) hexane, 2,5-dimethyl-2,5-di (benzoylperoxy) hexyne-3, and diacyl peroxides such as benzoyl peroxide , Diisopropylbenzene hydroperoxide,
Organic peroxides such as hydroperoxides such as 2,5-dimethyl-2,5-di (hydroperoxy) hexane;
0.001 to 100 parts by weight of the ethylene polymer
A method of using about 10 to 10 parts by weight and reacting in a molten state or a solution state at a temperature of about 80 to 300 ° C. is employed.

In the present invention, the unsaturated carboxylic acid or its derivative-modified ethylene polymer has an unsaturated carboxylic acid or its derivative unit content of 0.01 to 20% by weight, particularly 0.1 to 10% by weight. Some are preferred. If the content of the unsaturated carboxylic acid or a derivative unit thereof is less than the above range, the initial compounding purpose for the adhesive polymer composition cannot be achieved, while if the content is more than the above range, gel or the like is contained in the modified ethylene polymer. Is generated, which becomes fish eyes or bumps in the adhesive polymer composition, resulting in a decrease in adhesive strength and surface appearance.

The tackifier (B) constituting the adhesive polymer composition of the present invention is generally used as a tackifier resin in the fields of pressure-sensitive adhesive tapes, hot-melt adhesives, and paints. A non-crystalline resin that is solid at room temperature, specifically, for example, aliphatic, aromatic, aliphatic-aromatic petroleum resins, and hydrogenated petroleum resins, natural rosins, and polymerization. Rosin resins such as rosin, and rosin resins obtained by hydrogenating them, polyterpene resins, terpene resins such as terpene phenol resins, and terpene resins obtained by hydrogenating them, and cumarone indene resins, and Coumarone indene-based resins obtained by hydrogenating them are exemplified.

The aromatic vinyl compound-conjugated diene compound block copolymer or the hydrogenated product thereof as the component (C) constituting the adhesive polymer composition of the present invention is a polymer mainly composed of an aromatic vinyl compound. A block copolymer having a molecular structure of linear, branched, radial, or a combination of these, consisting of a polymer block mainly composed of a united block and a conjugated diene compound. The double bonds of the latter polymer block of the polymer are hydrogenated. In the present invention, for example, these modified products by maleic anhydride or the like are also included.

Here, as the aromatic vinyl compound, styrene, α-methylstyrene, p-methylstyrene, dimethylstyrene, vinylnaphthalene, bromostyrene,
Examples thereof include divinylbenzene, among which styrene is preferable. As the conjugated diene compound, butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-
1,3-butadiene and the like, among which butadiene,
Isoprene or a combination of both is preferred.

In the present invention, the content of the aromatic vinyl compound unit in the aromatic vinyl compound-conjugated diene compound block copolymer is 10 to 50% by weight, particularly 20 to 40% by weight. Preferably, the hydrogenation rate of the double bond of the conjugated diene compound block of the hydrogenated block copolymer is 80% or more, particularly preferably 90% or more. The molecular weight of these block copolymers is 10,000 to 500,000 in number average molecular weight, especially 50,000 to 30000.
It is preferable that the number is 0,000.

The adhesive polymer composition of the present invention has a glass transition temperature of 120 ° C. or higher and a solubility parameter of 8 to 10 in addition to the components (A), (B) and (C). It is essential to contain the polymer (D) component No. 14; if the component (D) does not satisfy the above range of the glass transition temperature, the adhesive polymer composition has heat resistance of adhesive strength. And when the solubility parameter does not satisfy the above range, it becomes difficult to develop sufficient adhesiveness.

The solubility parameter (δ) of the component (D) in the present invention is, as generally known, δ =
(E / V) ^1/2 [where E is the molecular aggregation energy, V
Is the molecular volume and E / V is the cohesive energy density. ] Is calculated from the equation.

The component (D) of the present invention has a glass transition temperature of 120 ° C. or higher and a solubility parameter of 8 to
As the polymer of No. 14, typically, polyphenylene ether-based resin, polycarbonate-based resin, epoxy group,
Alternatively, a carboxylic acid or its anhydride group-containing styrene resin may be used.

Here, the polyphenylene ether resin is a homopolymer or a homopolymer obtained by an oxidative coupling reaction of 2,6-disubstituted phenols in the presence of an amine complex catalyst of a metal such as copper, manganese or cobalt. In a copolymer, as the substituent, for example, a primary or secondary alkyl group, an alkoxy group, an aminoalkyl group, a haloalkyl group, a haloalkoxy group, a phenyl group,
Examples thereof include a halogen atom, and specifically, for example, poly (2,6-dimethyl-1,4-phenylene) ether,
Poly (2,6-diethyl-1,4-phenylene) ether, poly (2-methyl-6-ethyl-1,4-phenylene) ether, poly (2-methyl-6-propyl-1,
4-phenylene) ether, poly (2-ethyl-6-propyl-1,4-phenylene) ether, poly (2,6
-Dipropyl-1,4-phenylene) ether, poly (2,6-dipropenyl-1,4-phenylene) ether, poly (2,6-dibutyl-1,4-phenylene) ether, poly (2,6-dilauryl) -1,4-phenylene) ether, poly (2,6-dimethoxy-1,4-phenylene) ether, poly (2,6-diethoxy-1,
4-phenylene) ether, poly (2-methoxy-6-)
Ethoxy-1,4-phenylene) ether, poly (2-
Ethyl-6-stearyloxy-1,4-phenylene)
Ether, poly (2-methyl-6-phenyl-1,4-
Phenylene) ether, poly (2,6-diphenyl-)
1,4-phenylene) ether, poly (2,6-dibenzyl-1,4-phenylene) ether, poly (2,6-
Dichloro-1,4-phenylene) ether, poly (2,
Homopolymers such as 6-dibromo-1,4-phenylene) ether, and 2,6-dimethylphenol and 2,3
Copolymer with 6-trimethylphenol, copolymer with 2,6-dimethylphenol and 2,3,5,6-tetramethylphenol, 2,6-diethylphenol and 2,
And copolymers with 3,6-trimethylphenol.

The polycarbonate resin may be a homopolymer or copolymer obtained by a phosgene method by reacting a dihydroxydiaryl compound with phosgene, or a transesterification method by reacting a dihydroxydiaryl compound with a carbonate such as diphenyl carbonate. The polymer is a dihydroxydiaryl compound, for example, bis (4-hydroxyphenyl) methane, 1,1
-Bis (4'-hydroxyphenyl) ethane, 2,2-
Bis (4'-hydroxyphenyl) propane, 2,2-
Bis (3'-methyl-4'-hydroxyphenyl) propane, 2,2-bis (4'-hydroxyphenyl) butane, 2,2-bis (4'-hydroxyphenyl) octane, bis (4-hydroxyphenyl) Bis (hydroxyaryl) alkanes such as phenylmethane, 1,1-bis (4′-hydroxyphenyl) cyclopentane, 1,
Bis (hydroxyaryl) cycloalkanes such as 1-bis (4′-hydroxyphenyl) cyclohexane,
4,4′-dihydroxydiphenyl ether, 3,3 ′
Dihydroxydiaryl ethers such as -dimethyl-4,4'-dihydroxydiphenyl ether, 4,4'-
Dihydroxydiphenyl ketone, 3,3'-dimethyl-
Dihydroxy diaryl ketones such as 4,4'-dihydroxy diphenyl ketone; dihydroxy diaryl sulfides such as 4,4'-dihydroxy diphenyl sulfide and 3,3'-dimethyl-4,4'-dihydroxy diphenyl sulfide; 4,4 ' Dihydroxydiarylsulfoxides such as dihydroxydiphenylsulfoxide, 3,3′-dimethyl-4,4′-dihydroxydiphenylsulfoxide, 4,4′-dihydroxydiphenylsulfone, 3,3′-dimethyl-4,4′-dihydroxydiphenyl And dihydroxydiaryl sulfones such as sulfone. Among them, 2,2-bis (4′-
(Hydroxyphenyl) propane is preferred, and a homopolymer thereof is particularly preferred.

Examples of the styrene resin containing an epoxy group or a carboxylic acid or its anhydride group include styrene-glycidyl methacrylate copolymer and styrene-
Methyl methacrylate-glycidyl methacrylate copolymer, styrene-maleic anhydride copolymer, styrene-
Examples thereof include acrylonitrile-maleic anhydride copolymer and the like, and among them, styrene-maleic anhydride copolymer is preferable.

The composition ratio in the adhesive polymer composition of the present invention is such that the ethylene polymer of the component (A) is 30 to 9%.
8% by weight, 1 to 59% by weight of the tackifier of the component (B), 1 to 5% of the aromatic vinyl compound-conjugated diene compound block copolymer or the hydrogenated product of the component (C).
It is essential that the content is 9% by weight, and the component (A) is 40 to
Preferably, 70% by weight, 1 to 30% by weight of the component (B) and 15 to 40% by weight of the component (C) [provided that the weight% of each component is based on the total of 100% by weight of these three components. is there. ].

When the component (A) is less than the above range and the components (B) and (C) are outside the above range, the moldability of the adhesive polymer composition is reduced and the composition is sticky. On the other hand, when the component (A) is more than the above range and the components (B) and (C) are less than the above range, sufficient adhesiveness as an adhesive polymer composition is exhibited. Becomes difficult.

The composition ratio of the component (D) is (C)
0.0% of the weight of the aromatic vinyl compound unit derived from the component
It is essential that the ratio be 1 to 5 times, and preferably 0.1 to 3 times. When the component (D) is less than the above range, it is difficult to provide the adhesive polymer composition with heat resistance of adhesive strength, while when the component is more than the above range, the adhesiveness itself is lowered.

The adhesive polymer composition of the present invention contains the ethylene polymer of the component (A), the tackifier of the component (B), and the tackifier, as long as the object of the present invention is not impaired. Component (C), an aromatic vinyl compound-conjugated diene compound block copolymer or a hydrogenated product thereof, and a glass transition temperature of component (D) of 120 ° C. or higher and a solubility parameter of 8 to
In addition to the polymer of No. 14, olefin-based resins such as propylene-based resins and other resins may be contained, and, if necessary, various commonly used additives such as antioxidants and light Stabilizers, ultraviolet absorbers, nucleating agents, neutralizing agents, lubricants, antiblocking agents, dispersants, flow improvers, mold release agents, flame retardants, colorants, fillers, and the like may be added.

[0029] The adhesive polymer composition of the present invention comprises an ethylene polymer as the component (A), a tackifier as the component (B), and an aromatic vinyl compound-conjugated diene compound as the component (C). The block copolymer or a hydrogenated product thereof, a polymer having a glass transition temperature of 120 ° C. or more and a solubility parameter of 8 to 14 of the component (D), and other materials and additives used as necessary, such as a resin. Tumbler blender, ribbon blender, V-type blender, Henschel mixer, etc., and then melt-kneading with a single-screw or twin-screw extruder, roll, Banbury mixer, kneader, Brabender or the like.

The adhesive polymer composition of the present invention can be prepared by a method known in the art, including a method of successively extruding a laminate, a sandwich extrusion laminate, and a co-extrusion laminate, with or without an anchor coat agent on a substrate, And a base material and an adhesive polymer composition, and a laminate formed by a method of coextruding a different resin or a similar resin, or the like, or further subjected to a stretching process to form a stretched product, and It is subjected to thermoforming such as molding, pressure molding, or the like, or is co-extrusion blow-molded and shaped into a container, and is suitable for producing a laminate by co-extrusion.

Examples of the laminated material such as a base material include a polyamide resin, a polyester resin, a saponified ethylene-vinyl acetate copolymer, a polyolefin resin, a polycarbonate resin, a polystyrene resin, and an acrylic resin. Unstretched or stretched film or sheet such as resin,
Alternatively, a resin film having a thickness of about 5 to 2000 μm, such as a printed film or sheet having a printed surface or the like, a metal foil such as aluminum, copper, iron, or the like having a thickness of 3 to 10 may be used.
For example, those made of metal having a size of about 00 μm are exemplified.

As described above, the adhesive polymer composition of the present invention is excellent not only in initial adhesive strength to the above-mentioned various substrates, but also in heat resistance thereof.
Even when the contents are filled at a high temperature of about 5 ° C., boil sterilization at about 80 to 90 ° C., or at the time of high temperature treatment such as retort treatment at about 120 to 140 ° C., the delamination does not occur.

[0033]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist of the invention. In addition, (A) an ethylene-based polymer of the adhesive polymer composition, (B) a tackifier,
The (C) aromatic vinyl compound-conjugated diene compound block copolymer or hydrogenated product thereof, and (D) the polymer having a glass transition temperature of 120 ° C. or more and a solubility parameter of 8 to 14 are as follows. Was.

(A) Ethylene polymer density 0.919 g / cm ³ , melt flow rate
0 g / 10 min, ethylene homopolymer by high pressure method. Density 0.902 g / cm ³ , melt flow rate 1.
0 g / 10 min, ethylene-1 with a metallocene catalyst
-Octene copolymer. 1. density 0.900 g / cm ³ , melt flow rate
Ethylene-1 over metallocene catalyst at 2 g / 10 min
-Hexene copolymer. Maleic anhydride unit content 0.7 wt%, melt flow rate 0.3 g / 10 min, density 0.923 g / cm ³
Maleic anhydride-modified ethylene-1-butene copolymer.

(B) Tackifier The hydrogenated aromatic petroleum resin (softening temperature 140 ° C.,
Specific gravity 0.999, number average molecular weight 860).

(C) Aromatic vinyl compound-conjugated diene formation
Compound block copolymer or hydrogenated product thereof Hydrogenated product of styrene-butadiene block copolymer (styrene content 20% by weight, number average molecular weight 7000
0, melt flow rate at a temperature of 200 ° C., a load of 5 kg, a melt flow rate of 0.3 g / 10 min, and a hydrogenation rate of 98% or more).

(D) Melting at a glass transition temperature of 120 ° C. or higher
Polymer glass transition temperature of 220 ° C. with solubility parameter of 8 to 14 , solubility parameter of 9.4
Polyphenylene ether-based resin ("Remalloy YPX100D", manufactured by Mitsubishi Engineering-Plastics Corporation, indicated as "PPE" in the table). Glass transition temperature 150 ° C, solubility parameter 9.0
Polycarbonate resin (“NOVAREX 7020” manufactured by Mitsubishi Engineering-Plastics Corporation;
C "). Glass transition temperature 160 ° C, solubility parameter 10.
No. 9 styrene-maleic anhydride copolymer (maleic anhydride unit content 15% by weight;
32 "and" SMA "in the table).

Examples 1 to 8, Comparative Examples 1 and 2 (A) Ethylene polymer, (B) tackifier, (C)
Aromatic vinyl compound-conjugated diene compound block copolymer or hydrogenated product thereof, and (D) glass transition temperature 12
As a polymer having a solubility parameter of 8 to 14 at 0 ° C. or higher, each of the polymers shown in Table 1 was mixed uniformly with a Henschel mixer, and then supplied to a twin-screw extruder having a diameter of 45 mm.
The pelletized adhesive polymer composition was produced by melt-kneading at 190 ° C., extruding into a strand, and cutting.

Each of the obtained adhesive polymer compositions was melt-kneaded with a 40 mm diameter single screw extruder for an intermediate layer, and a polycarbonate resin ("Iupilon E-20" manufactured by Mitsubishi Engineering-Plastics Corporation) was used for the inner and outer layers.
00)) were melt-kneaded in a single screw extruder having a diameter of 40 mm, were integrally laminated by a feed block set at 275 ° C., and were co-extruded from an annular die also set at 275 ° C., and a molding speed of 5 m / min. By inflation molding, the polycarbonate resin outer layer 100μ
m / 100 μm of the adhesive polymer composition layer / 100 μm of the inner layer of the polycarbonate resin, to prepare a laminate having a two-layer structure of three layers.

With respect to the obtained laminate, the adhesive strength was evaluated by the following method, and the results are shown in Table 1. Using a strip-shaped sample cut out to a width of 10 mm from the laminate obtained from the initial adhesion , the polycarbonate resin outer layer at one end and the adhesive polymer composition layer were previously peeled off at 23 ° C. in accordance with JIS K 6854. At a peeling speed of 50 mm /
The T-shaped peel test was performed in minutes, and the peel strength was measured.

Heat Resistance of Adhesive Force Using a strip sample cut out to a width of 10 mm from the obtained laminate, the same as described above under 80 ° C. atmosphere, 100 ° C. atmosphere, and 120 ° C. atmosphere. A T-peel test was performed by the method and the peel strength was measured. In this case, if the peel strength of 100 g / 10 mm or more is maintained at each temperature, it can be determined that the film is practical.

[0042]

[Table 1]

[0043]

According to the present invention, it is possible to provide an adhesive polymer composition which is excellent in molding processability, and is also excellent in initial adhesive strength to a substrate and heat resistance thereof.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 153/02 C09J 153/02 169/00 169/00 171/12 171/12 (72) Inventor Hiroyuki Nakayama 1 Toho-cho, Yokkaichi-shi, Mie F-term in Yokkaichi Office of Mitsubishi Chemical Corporation (reference) DN032 DN072 EC001 EC002 EE061 EE062 EL012 EL021 EL022 GA07 GA11 GA12 KA26 LA02 LA04 LA08 LA11 NA06

Claims (5)

[Claims] 1. The following components (A), (B) and (C)
Ingredients [However, the weight% of each ingredient is 100
% By weight. And an adhesive polymer composition comprising component (D). (A) Ethylene polymer having a density of 0.850 to 0.950 g / cm ³ and a melt flow rate of 0.01 to 50 g / 10 min: 30 to 98% by weight (B) tackifier: 1 to 59 (C) Aromatic vinyl compound-conjugated diene compound block copolymer or hydrogenated product thereof: 1 to 59% by weight (D) Polymer having a glass transition temperature of 120 ° C. or higher and a solubility parameter of 8 to 14: (C) 0.01 to 5 times the content weight of the aromatic vinyl compound unit derived from the component. 2. The adhesive polymer composition according to claim 1, wherein the ethylene polymer as the component (A) contains an unsaturated carboxylic acid or its derivative-modified ethylene polymer. 3. The adhesive polymer composition according to claim 1, wherein the polymer as the component (D) is a polyphenylene ether-based resin. 4. The adhesive polymer composition according to claim 1, wherein the polymer as the component (D) is a polycarbonate resin. 5. The adhesive polymer composition according to claim 1, wherein the polymer as the component (D) is a styrene resin containing an epoxy group or a carboxylic acid or its anhydride group.