JP2000049259A - Sealing epoxy resin molding material and electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealing epoxy resin molding material excellent in reflow resistance, moisture resistance and reliability in which soldering can be carried out without requiring any preprocessing when mounted on a wiring board. SOLUTION: The sealing epoxy resin molding material essentially comprises (A) epoxy resin, (B) a bis-phenol compound having melting point of 160 deg.C or below, (C) an additive of third phosphine and quinone, and (D) an inorganic filler wherein the content of bis-phenol compound in the component (B) is 3-30 pts.wt. for 100 pts.wt. of epoxy resin in the component (A) and the content of inorganic filler in the component (D) is 60-80 vol.% of the entire molding material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding material particularly suitable for sealing a device of a surface mount type plastic package.
And an electronic component device including an element sealed with the sealing molding material.

[0002]

2. Description of the Related Art Epoxy resin molding materials have been widely used in the field of sealing electronic components such as transistors and ICs. The reason for this is that the epoxy resin is balanced in various properties such as electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to insert products. In particular, a combination of an ortho-cresol novolak epoxy resin and a phenol novolak curing agent has an excellent balance between them, and has become a mainstream as a base resin of a molding material for IC encapsulation.

[Problems to be solved by the invention]

In recent years, high-density mounting of electronic components on printed wiring boards has been progressing. Along with this trend, electronic component devices have become the mainstream from conventional pin insertion type packages to surface mount type packages. Surface mount ICs such as ICs and LSIs are packaged in a thin and small package in order to increase the mounting density and lower the mounting height. The occupied volume of the element in the package is large, and the thickness of the package is extremely large. It is getting thinner. Furthermore, these packages are different in mounting method from the conventional pin insertion type. That is, in the conventional pin insertion type package, since the pins are inserted into the wiring board and then soldered from the back surface of the wiring board, the package is not directly exposed to a high temperature. But,
The surface mount type IC is temporarily fixed to the surface of the wiring board, and is processed by a solder bath or a reflow device, so that it is directly exposed to a soldering temperature. As a result, if the IC package absorbs moisture, the moisture absorbs rapidly during soldering, causing the package to crack, and this phenomenon is a major problem related to the surface mount IC.

In addition, if the interface between the IC element and the sealing epoxy resin is peeled off even before the IC package is cracked in the soldering step, the moisture resistance of the IC is greatly reduced. This is because the moisture absorbed in the peeled part creates a water film, where ionic impurities are extracted from the sealing epoxy resin, and the wiring and bonding pads formed by aluminum deposition on the IC element are corroded. To do that. Generally, IC reliability tests include high-temperature and high-humidity tests, bias-type high-temperature and high-humidity tests, and PCT (Pressure Cooker Tes).
t), HAST (Highly Accelerated Humidity and Str)
ess test), etc., and most of the failure modes generated in these moisture resistance tests are disconnections due to corrosion of aluminum wiring formed on the elements of the IC. Of these, as for the high-temperature and high-humidity test and the unattended moisture resistance test such as PCT, the occurrence of failures has been reduced by controlling the purity of the epoxy resin molding material for sealing and improving the adhesiveness. In a moisture resistance test under voltage application such as HAST or HAST, corrosion of aluminum wiring is likely to occur.

[0005] In the case of an IC package sealed with the current base resin composition, these problems are unavoidable.
Are used after being sufficiently dried. However, these methods are laborious and costly.

The present invention has been made in view of such circumstances, and can be soldered without specific pretreatment when mounted on a wiring board, and has reliability such as reflow resistance and moisture resistance. It is an object of the present invention to provide an epoxy resin molding material for sealing which is excellent in sealing performance.

[Means for Solving the Problems]

As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the above objects can be achieved by blending an epoxy resin, a specific bisphenol compound, and an adduct of a tertiary phosphine with a quinone. They have found what can be achieved and have completed the present invention.

That is, the present invention provides (1) (A) an epoxy resin, (B) a bisphenol compound having a melting point of 160 ° C. or less, (C) an adduct of a tertiary phosphine and a quinone,
(D) An inorganic filler is an essential component, and the content of the bisphenol compound of the component (B) is 3 to 30 parts by weight based on 100 parts by weight of the epoxy resin of the component (A). 60-80% by volume of the entire molding material
Epoxy resin molding material for sealing, characterized by being
(2) The epoxy resin molding material for sealing according to the above (1), wherein the bisphenol compound of the component (B) is bisphenol A, (3) the component (C) is an adduct of a tertiary phosphine and p-benzoquinone, and / or Tertiary phosphine and 1,4
The epoxy resin molding material for sealing according to the above (1) or (2), which is an adduct with naphthoquinone; and (4) an anion exchanger (E). 3) The epoxy resin molding compound for sealing according to any one of the above, (5) the epoxy for sealing according to the above (4), wherein the anion exchanger (E) is a hydrotalcite represented by the following formula (I): Resin molding materials,

[Image Omitted] Mg _1-X Al _X (OH) ₂ (CO ₃ ) _{X / 2} · mH ₂ O (I) (0 <X ≦ 0.5, m is a positive number) (6) Anion exchange The sealing epoxy resin molding material according to the above (4), wherein the body (E) is a hydrated oxide of at least one element selected from magnesium, aluminum, titanium, zirconium, and bismuth;
(6) An electronic component device obtained by sealing an element with the sealing epoxy resin molding material according to any one of the above (6).

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin (A) of the present invention comprises:
There is no particular limitation, and an epoxy resin generally used for an epoxy resin molding material for sealing can be used. For example, phenols such as phenol novolak type epoxy resin and orthocresol novolak type epoxy resin, phenols such as cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F and / or α-naphthol and β-naphthol Epoxidized novolak resin obtained by condensing or co-condensing naphthols such as dihydroxynaphthalene and aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde under an acidic catalyst, bisphenol A, bisphenol B , Bisphenol F, bisphenol S, diglycidyl ethers such as alkyl-substituted or unsubstituted biphenol, phenol-aralkyl resin , Epoxidized adducts or polyadducts of phenols with dicyclopentadiene or terpenes, glycidyl ester-type epoxy resins obtained by the reaction of epichlorohydrin with polybasic acids such as phthalic acid and dimer acid, diaminodiphenylmethane Glycidylamine-type epoxy resins obtained by the reaction of polyamines such as isocyanuric acid and epichlorohydrin, linear aliphatic epoxy resins obtained by oxidizing olefin bonds with a peracid such as peracetic acid, and alicyclic epoxy resins. Any number of these can be used in combination.

[0010] The purity of the epoxy resin (A),
In particular, the amount of hydrolyzable chlorine is preferably small because it is related to the corrosion of aluminum wiring on elements such as ICs.
It is preferably at most ppm. Here, the amount of hydrolyzable chlorine means that 1 g of a sample epoxy resin is 30 m in dioxane.
, 1 ml of 1N-KOH methanol solution, 5 minutes of reflux, and the value obtained by potentiometric titration was used as a scale.

The melting point of the component (B) in the present invention is 160
The bisphenol compound having a temperature of not more than ° C is a curing agent for the epoxy resin, and is not particularly limited. Examples thereof include bisphenol A, bisphenol AD, bisphenol F, and alkyl substituted products thereof. Of these, bisphenol A and its alkyl-substituted product are preferred from the viewpoints of cost, moldability, reflow resistance and the like.

The amount of the bisphenol compound (B) should be 3 to 30 parts by weight based on 100 parts by weight of the epoxy resin (A). If the amount is less than 3 parts by weight, the effect of the present invention on the reflow resistance is small, and if it exceeds 30 parts by weight, voids and pinholes are generated during molding.

In the present invention, in addition to the bisphenol compound as the component (B), a curing agent for an epoxy resin generally used in an epoxy resin molding material for sealing can be used in combination. For example, phenols such as phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F and aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde and salicylaldehyde are subjected to a condensation reaction under an acidic catalyst. Two or more phenolic hydroxyl groups in one molecule of the resulting novolak phenolic resin, adducts or polyadducts of phenols with dicyclopentadiene or terpenes, polyparavinylphenol resin, phenol-aralkyl resin, etc. Phenolic compounds which may be used alone or in combination of two or more.

When these phenol compounds are used in combination, the amount of the bisphenol compound of the component (B) is determined based on the total amount of the phenol compound combined with the component (B) from the viewpoint of fluidity. It is preferably at least 3% by weight, more preferably at least 5% by weight. 1
The range of 0 to 60% by weight is more preferable.

In the present invention, the mixing ratio of the total amount of the epoxy resin of the component (A) to the total amount of the phenol compound containing the component (B) is determined based on the equivalent of the total epoxy resin from the viewpoint of heat resistance and curability. If the equivalent ratio of the compound is 0.
It is preferably set in the range of 6 to 1.4, and 0.8
The range of -1.2 is more preferable.

The adduct of the tertiary phosphine and the quinone as the component (C) used in the present invention is a curing accelerator for accelerating the curing reaction between the epoxy resin and the compound having a phenolic hydroxyl group. A) an epoxy resin, a bisphenol compound as a curing agent (B),
When used in a molding material containing 65% by volume or more of a filler, excellent reflow resistance, moisture resistance and moldability are exhibited.

The tertiary phosphine used for the component (C) is not particularly limited, but may be dibutylphenylphosphine, butyldiphenylphosphine, ethyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, tris ( Tertiary phosphines having an aryl group such as 4-methoxyphenyl) phosphine are preferred. Examples of the quinones used for the component (C) include o-benzoquinone, p-benzoquinone, diphenoquinone, 1,4-naphthoquinone, and anthraquinone. Among them, p-benzoquinone,
1,4-Naphthoquinone is preferred from the viewpoints of moisture resistance, moldability, and storage stability.

The method for producing the adduct of the component (C) includes:
A method in which tertiary phosphine as a raw material and a quinone are both mixed and stirred in a solvent in which both are dissolved is exemplified. The production conditions in this case are as follows: in the range of room temperature to 80 ° C. in a solvent such as ketones such as methyl isobutyl ketone, methyl ethyl ketone, and acetone having a high solubility of the raw material and a low solubility of the formed adduct for 1 hour to 12 hours. It is preferable to carry out addition reaction by stirring for an hour.

The component (C), which is a main object of the present invention and has excellent reflow resistance and moisture resistance, and has good curability and storage stability, is an adduct of n-butyldiphenylphosphine and p-benzoquinone, adduct of n-butyldiphenylphosphine with 1,4-naphthoquinone, adduct of triphenylphosphine with p-benzoquinone, adduct of triphenylphosphine with 1,4-naphthoquinone, tris (4
Adduct of -methylphenyl) phosphine with p-benzoquinone, adduct of tris (4-methylphenyl) phosphine with 1,4-naphthoquinone, adduct of tris (4-methoxyphenyl) phosphine with p-benzoquinone, Tris (4-methoxyphenyl) phosphine and 1,
Adducts with 4-naphthoquinone; adducts of tris (2,6-methoxyphenyl) phosphine with p-benzoquinone; and adducts of tris (2,6-methoxyphenyl) phosphine and 1,4-naphthoquinone. These may be used alone or in combination of two or more.

In addition to the component (C), the molding material of the present invention may be used in combination with one or more compounds generally used as a curing accelerator for accelerating the curing reaction between an epoxy resin and a compound having a phenolic hydroxyl group. be able to. Examples of these curing accelerators include diazabicycloalkenes such as 1,8-diazabicyclo (5,4,0) undecene-7 and 1,6-diazabicyclo (4,3,0) nonene-5 and derivatives thereof. Tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, 2-methylimidazole,
Imidazoles such as phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole, tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, triphenylphosphine triphenylboron complex Or a complex of an organic phosphine and an organic boron, such as tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / ethyltriphenylborate, tetrabutylphosphonium / tetrabutylborate, etc. , 2-ethyl-4
-Methylimidazole / tetraphenylborate, N-
And tetraphenylboron salts such as methylmorpholine / tetraphenylborate.

When these curing accelerators are used in combination,
The amount of the component (C) is preferably at least 60% by weight, more preferably at least 80% by weight, based on the total amount of the curing accelerator. In the molding material using the epoxy resin (A) and the bisphenol compound (B), the tertiary amines have poor moisture resistance and storage stability as compared with the case using the component (C). The organic phosphines have a drawback that they are susceptible to the deterioration of the curability due to oxidation, and the use of the above-mentioned tetraphenylboron salt tends to give rise to a drawback in adhesiveness. If so, the effect of the present invention is reduced.

The total amount of the curing accelerator containing the component (C) is not particularly limited as long as the curing acceleration effect is achieved.
2% by weight is preferred, more preferably 0.01 to 0.5%.
% By weight.

The inorganic filler of the component (D) of the present invention is blended in a molding material for absorbing moisture, reducing the coefficient of linear expansion, improving thermal conductivity, and improving strength. Powder of glass, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite, titania, etc. Beads or the like can be used, and one or more kinds can be used. further,
Examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, and zinc borate. These may be used alone or in combination. Among the above inorganic fillers, from the viewpoint of reducing the linear expansion coefficient, fused silica,
Alumina is preferred from the viewpoint of high thermal conductivity.

The compounding amount of the inorganic filler (D) must be 65 to 85% by volume of the whole molding material. If the amount is less than 65% by volume, the effect of reducing the hygroscopicity and improving the strength is not sufficiently exhibited, so that the reflow resistance is reduced. If the amount exceeds 85% by volume, the fluidity during molding is hindered.

From the viewpoint of fluidity, it is preferred that 70% by weight or more of the inorganic filler as the component (D) is spherical particles. Further, the average particle size of the entire inorganic filler is 10 to 30 μm.
m, a component of 100 μm or more, 0.5% by weight or less of the whole inorganic filler;
The content is preferably 40% by weight, and more preferably the component having a particle size of 1 μm or less is 8 to 15% by weight, more preferably 10 to 15% by weight of the whole inorganic filler.

From the viewpoint of improving the moisture resistance of the IC, it is preferable to add an anion exchanger (E) to the sealing epoxy resin molding material of the present invention. The moisture resistance to be considered here refers to the reliability of the moisture resistance of the IC. In particular, the bias type high temperature and high humidity test, HAST (Highly Accelerated Humidit)
y and Stress Test). Most of the failure modes generated in these moisture resistance tests are disconnections due to corrosion of aluminum wiring formed on IC elements. However, the epoxy resin of component (A) and the bisphenol compound of component (B) of the present invention are used. Good moisture resistance reliability can be obtained by using a sealing epoxy resin molding material comprising a combination of a curing accelerator of the component (C) and a specific amount of the inorganic filler of the component (D). However, the addition of an anion exchanger is effective for obtaining more excellent voltage application type moisture resistance. In the case of the voltage application type moisture resistance test, the aluminum wiring on the anode side is particularly susceptible to corrosion, and the following phenomena can be considered as the cause. When water is present, the wiring or bonding pad on the anode side is subjected to anodic oxidation by oxygen generated by the electrolysis of water, and a stable aluminum oxide film is formed on the surface, so that aluminum corrosion should not proceed. However, the presence of a small amount of halogen ions such as chlorine solubilizes the aluminum oxide film, resulting in pitting corrosion in which the underlying aluminum is dissolved. Since the pitting corrosion on the anode side progresses faster than the grain boundary corrosion on the cathode side, in the voltage application type moisture resistance test, the corrosion of the aluminum wiring on the anode side proceeds first and becomes defective. Therefore, in order to prevent corrosion on the anode side, it is effective to add an anion exchanger capable of capturing a trace amount of halogen ions.

(E) which can be used in the present invention
Examples of the component anion exchanger include hydrotalcites represented by the following formula (I),

[Image Omitted] Mg _1-X Al _X (OH) ₂ (CO ₃ ) _{X / 2} · mH ₂ O (I) (0 <X ≦ 0.5, m is a positive number) Magnesium, aluminum, titanium, zirconium,
A hydrated oxide of an element selected from bismuth is preferable, and these may be used alone or in combination.

Hydrotalcites are trapped by replacing an anion such as a halogen ion with CO ₃ in the structure, and the halogen ion incorporated in the crystal structure is about 3
It is a compound that has the property of not desorbing at 50 ° C. or higher until the crystal structure is broken. An example of hydrotalcites having such properties is Mg ₆ A produced as a natural product.
l ₂ (OH) ₁₆ CO ₃ · 4H ₂ O or Mg _4.3 A as a synthetic product
l ₂ (OH) _12.6 CO ₃ · mH ₂ O. Also,
The epoxy resin molding material for encapsulation of the present invention has a pH value of 3 due to the effect of the phenolic compound and the extract of the cured product using pure water.
~ 5 and acidic. Therefore, although the environment is susceptible to corrosion for aluminum, which is an amphoteric metal, hydrotalcites also have the effect of adsorbing acids, and therefore have the effect of bringing the extract closer to neutrality. It can be inferred that the addition of sites is a factor that works effectively to prevent aluminum corrosion.

Hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium, bismuth, and antimony can also be captured by replacing halogen ions with hydroxide ions, and these ion exchangers are excellent on the acidic side. Shows ion exchange capacity. As for the sealing epoxy resin molding material of the present invention, since the extract is on the acidic side as described above, these hydrated oxides are also particularly effective in preventing aluminum corrosion. For example, MgO · n
H ₂ O, Al ₂ O ₃ .nH ₂ O, TiO ₂ .nH ₂ O, ZrO
Examples include hydrated oxides such as ₂ · nH ₂ O, Bi ₂ O ₃ · nH ₂ O, and Sb ₂ O ₅ · nH ₂ O.

The amount of the component (E) anion exchanger is as follows:
The amount is not particularly limited as long as it is a sufficient amount capable of capturing anions such as halogen ions, but is preferably 0.002 to 3% by weight, more preferably 0.005 to 1% by weight based on the whole molding material. is there.

The molding materials of the present invention include higher fatty acids, higher fatty acid metal salts, ester waxes, release agents such as low molecular weight polyethylene, dyes, colorants such as carbon black, epoxy silane, amino silane, ureido silane, Surface treatment agents such as coupling agents such as vinyl silane, alkyl silane, organic titanate, and aluminum alcoholate;
A flame retardant such as a brominated resin, a nitrogen-containing compound such as antimony oxide, phosphate ester, and melamine, and a stress relieving agent such as silicone oil and silicone rubber powder can be added as necessary.

The molding material in the present invention can be prepared by any method as long as the various raw materials can be uniformly dispersed and mixed. As a general method, the raw materials having a predetermined compounding amount are sufficiently mixed by a mixer or the like. After mixing, melt-kneading with a mixing roll, extruder, etc., cooling,
A pulverizing method can be used. It is easy to use if it is tableted with dimensions and weight that match the molding conditions.

As an electronic component device obtained by sealing an element with the epoxy resin molding material for sealing obtained by the present invention, a semiconductor element is fixed on a lead frame, and a terminal portion (such as a bonding pad) of the element is formed. A general resin-sealed IC is used in which the lead portions are connected by wire bonding, bumps, or the like, and then sealed by transfer molding or the like using an epoxy resin molding material for electronic component sealing. For example, DIP (Dual Inline Packag)
e), PLCC (Plastic Leaded Chip Carrier), QF
P (Quad Flat Package), SOP (Small Outline Pac)
kage), SOJ (Small Outline J-lead package), T
SOP (Thin Small Outline Package), TQFP (Th
In particular, when applied to an electronic component device mounted on a wiring board by a surface mounting method, excellent reliability can be exhibited. In particular, the molding material for sealing of the present invention is effective for a thin surface-mounted resin-sealed semiconductor device.

In the case of the above-described resin-sealed package having leads (external connection terminals), not only semiconductor elements such as transistors, thyristors, and ICs but also resistors, Switches such as resistor arrays, capacitors, and poly switches are also targeted, and they can provide excellent reliability for these elements, as well as sealing the whole after mounting various elements and electronic components on a ceramic substrate. Also, excellent reliability can be obtained for the hybrid IC. Furthermore, after mounting the element on the surface of the organic substrate with terminals for wiring board connection formed on the back surface, connecting the element and the wiring formed on the organic substrate by bump or wire bonding, epoxy resin for electronic component sealing The element is sealed using a molding material,
BGA (BallGrid Array) and CSP (Chip Size Packag)
Excellent reliability can also be obtained for electronic component devices such as e).

As a method for sealing an electronic component device using the molding material obtained in the present invention, a low pressure transfer molding method is the most common, but an injection molding method, a compression molding method or the like may be used. .

[0036]

EXAMPLES Next, examples of the present invention will be described, but the scope of the present invention is not limited to these examples.

Examples 1 to 10, Comparative Examples 1 to 6 Epoxy equivalent: 200, o-cresol novolak type epoxy resin having a softening point of 67 ° C., hydroxyl equivalent: 106, softening point: 8
Phenol novolak resin at 1 ° C, bisphenol A with a melting point of 150 ° C, adduct of triphenylphosphine with p-benzoquinone (promoter-1), adduct of triphenylphosphine and 1,4-naphthoquinone (promoter-2) ),
Triphenylphosphine (promoter-3), Mg _4.3 Al ₂ (OH) _12.6 CO ₃ · mH as hydrotalcite
₂ O, as hydrous oxides of Toagosei Chemical Industry Co. IXE50
0 (hydrated oxide-1), IX600 (hydrated oxide-
2) A brominated bisphenol A type epoxy resin having a bromine ratio of 50% by weight and an epoxy equivalent of 375, antimony trioxide, carnauba wax, carbon black, γ-glycidoxypropyltrimethoxysilane as a silane coupling agent, and fused silica. , Blended at the ratios shown in Tables 1 and 2, using a 10-inch diameter heating roll, at a kneading temperature of 80 to 90 ° C. and a kneading time of 7 to 10 minutes. 6 was prepared. In addition, the unit of the compounding amount shown in Table 1 and Table 2 is% by volume for fused silica, and the other parts are parts by weight.

[0038]

[Table 1]

[0039]

[Table 2]

With respect to the obtained epoxy resin molding material,
Various characteristics tests (1) to (4) shown below were performed. The results are shown in Tables 3 and 4. (1) Spiral flow Using a spiral flow mold conforming to ASTM D3123, the flow length was measured at 180 ° C. and 6.9 Mpa. (2) Wire sweep An 80-pin, 42-alloy lead frame with aluminum wiring on a silicon substrate, 8 × 10 × 0.
After connecting a test element of 4 (mm) and bonding a lead portion and a bonding pad on the element with a gold wire of 25 μm, transfer molding is performed at 180 ° C. and 6.9 Mp.
a, An epoxy resin molding material was molded under the conditions of 90 seconds to obtain a QFP for evaluation having an outer dimension of 14 × 20 × 2 (mm). The deformation amount (wire sweep amount) of the gold wire of the obtained evaluation QFP was determined by soft X-ray observation. Observe the wire sweep amount from the direction perpendicular to the lead frame surface,
The value obtained by dividing the maximum amount of deformation from a straight line connecting the first bonding portion and the second bonding portion by the length of the straight line is represented by 100%. (3) Reflow resistance A QFP having the same specifications as those used in the above (2) Wire sweep evaluation was prepared, humidified at 85 ° C. and 85% RH for a predetermined time, and then VPS (Vapor Phase Solderin) at 215 ° C.
In g), a reflow treatment was performed for 90 seconds, and the presence or absence of a package crack was evaluated by microscopic observation. (4) PCBT The IC used for the moisture resistance evaluation was a 350 mil, 42 alloy, 28-pin SOP, mounted with a 5 × 10 × 0.4 (mm) test element provided with a 10 μm width aluminum wiring.
After wire bonding using a 25 μm gold wire, an epoxy resin molding material was molded by transfer molding under the conditions of 180 ° C., 6.9 Mpa, 90 seconds, and the SOP for evaluation was used.
Obtained. The obtained SOP for evaluation was prepared at 85 ° C. and 85% RH for 7 hours.
After humidification for 2 hours and reflow treatment at 215 ° C. VPS for 90 seconds, 2 atm, 121 ° C., 100% RH, DC20
Humidification was performed for a predetermined time under the condition of V applied voltage, and disconnection failure due to corrosion of aluminum wiring was examined.

[0041]

[Table 3]

[0042]

[Table 4]

As shown in Examples 1 to 10 in Tables 3 and 4, by using the epoxy resin molding material for sealing of the present invention, excellent reflow crack resistance was obtained without impairing fluidity during molding. And moisture resistance can be obtained. In particular, the effect of improving the moisture resistance by applying the ion supplement is remarkable.

[0044]

The epoxy resin molding material for encapsulation obtained according to the present invention enables high filling of the filler without impairing the fluidity, and thus has the highest resistance to surface mount electronic components. The reflow cracking property and the moisture resistance after reflow can be significantly improved as compared with the conventional one. With regard to reflow crack resistance, which is particularly strictly required, the use of the encapsulating epoxy resin molding material of the present invention makes it possible to ship most electronic components without moisture-proof packing and has a large industrial value. .

 ──────────────────────────────────────────────────続 き Continued on front page F term (reference) 4J036 AD08 AD21 AE05 AF15 AF19 AF27 AG04 AG07 AH04 AH07 AJ07 AJ08 AJ09 DB06 DB28 DC05 DC10 DC12 DC41 DC46 DD07 FA01 FA03 FA05 FB07 FB08 JA07 4M109 AA01 EA02 EB02 EB04 EC05 EC05

Claims (7)

[Claims] (A) an epoxy resin, (B) a melting point of 160
An epoxy resin having (B) a bisphenol compound having a content of (B) a bisphenol compound having a content of (A) as an essential component, and a bisphenol compound having a content of (B) as an essential component. 3 to 3 for 100 parts by weight
An epoxy resin molding material for encapsulation, wherein the content of the inorganic filler (D) is 60 to 80% by volume based on 0 parts by weight. 2. The epoxy resin molding material for sealing according to claim 1, wherein the bisphenol compound (B) is bisphenol A. (3) Component (C) is an adduct of tertiary phosphine and p-benzoquinone and / or tertiary phosphine and 1,4-
3. The composition according to claim 1, which is an adduct with naphthoquinone.
The epoxy resin molding material for sealing according to the above. 4. The epoxy resin molding material for sealing according to claim 1, further comprising an anion exchanger (E). 5. The epoxy resin molding material for sealing according to claim 4, wherein the anion exchanger (E) is a hydrotalcite represented by the following formula (I). [Image Omitted] Mg _1-X Al _X (OH) ₂ (CO ₃ ) _{X / 2} · mH ₂ O (I) (0 <X ≦ 0.5, m is a positive number) 6. The anion exchanger (E) is a hydrated oxide of at least one element selected from magnesium, aluminum, titanium, zirconium and bismuth.
The epoxy resin molding material for sealing according to the above. 7. An electronic component device comprising an element sealed with the sealing epoxy resin molding material according to any one of claims 1 to 6.