ITMI940172A1 - Configurazione per sottrarre calore ai componenti di potenza montati su piastre a circuito stampato - Google Patents

Configurazione per sottrarre calore ai componenti di potenza montati su piastre a circuito stampato

Info

Publication number
ITMI940172A1
ITMI940172A1 ITMI940172A ITMI940172A1 IT MI940172 A1 ITMI940172 A1 IT MI940172A1 IT MI940172 A ITMI940172 A IT MI940172A IT MI940172 A1 ITMI940172 A1 IT MI940172A1
Authority
IT
Italy
Prior art keywords
configuration
printed circuit
circuit boards
components mounted
power components
Prior art date
Application number
Other languages
English (en)
Inventor
Reinhard Fassel
Herbert Klinger
Hartmut Zoebl
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19934302917 priority Critical patent/DE4302917C1/de
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI940172D0 publication Critical patent/ITMI940172D0/it
Publication of ITMI940172A1 publication Critical patent/ITMI940172A1/it
Application granted granted Critical
Publication of IT1269708B publication Critical patent/IT1269708B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205Thermal paths through the printed circuit board [PCB]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
ITMI940172 1993-02-03 1994-02-01 Configurazione per sottrarre calore ai componenti di potenza montati su piastre a circuito stampato IT1269708B (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19934302917 DE4302917C1 (de) 1993-02-03 1993-02-03 Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen

Publications (3)

Publication Number Publication Date
ITMI940172D0 ITMI940172D0 (it) 1994-02-01
ITMI940172A1 true ITMI940172A1 (it) 1994-08-04
IT1269708B IT1269708B (it) 1997-04-15

Family

ID=6479459

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI940172 IT1269708B (it) 1993-02-03 1994-02-01 Configurazione per sottrarre calore ai componenti di potenza montati su piastre a circuito stampato

Country Status (5)

Country Link
US (1) US5394301A (it)
JP (1) JPH06244574A (it)
DE (1) DE4302917C1 (it)
FR (1) FR2701190A1 (it)
IT (1) IT1269708B (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699231A (en) * 1995-11-24 1997-12-16 Xerox Corporation Method of packaging high voltage components with low voltage components in a small space
US5831826A (en) * 1996-09-20 1998-11-03 Motorola, Inc. Heat transfer apparatus suitable for use in a circuit board assembly
DE19654606C2 (de) * 1996-12-20 1998-10-22 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
DE10035170B4 (de) * 2000-07-19 2005-11-24 Siemens Ag Keramikkörper mit Temperiervorrichtung, Verfahren zum Herstellen und Verwendung des Keramikkörpers
US6797889B1 (en) * 2002-05-30 2004-09-28 Johnson Controls Automotive Electronics Assembly of power circuits and numerical data printed on a multilayer board
DE10250697A1 (de) * 2002-10-31 2004-05-13 Hella Kg Hueck & Co. Leiterplatte
US7561430B2 (en) * 2007-04-30 2009-07-14 Watlow Electric Manufacturing Company Heat management system for a power switching device
ITRN20130032A1 (it) * 2013-08-10 2015-02-11 Rebernig Supervisioni Srl Dispositivo elettrico e/o elettronico comprendente almeno un circuito stampato.
CN107734839A (zh) * 2017-11-21 2018-02-23 生益电子股份有限公司 一种pcb
CN107896422A (zh) * 2017-11-21 2018-04-10 生益电子股份有限公司 一种快速散热的pcb

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE330167C (de) * 1919-02-25 1922-02-17 Landw Lichen Bedarf G M B H Ge Verfahren zur Herstellung eines Duengemittels
DE2743647C3 (it) * 1977-09-28 1980-04-10 Siemens Ag, 1000 Berlin Und 8000 Muenchen
DE8114325U1 (de) * 1981-05-14 1982-09-30 Siemens Ag Wärmeableitungsvorrichtung
US4628407A (en) * 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
FR2620587B1 (fr) * 1987-09-16 1993-07-02 Telemecanique Electrique Circuit imprime equipe d'un drain thermique
JPH01161888A (en) * 1987-12-18 1989-06-26 Cmk Corp Printed wiring board
DE3813364A1 (de) * 1988-04-21 1989-11-02 Bodenseewerk Geraetetech Vorrichtung zur waermeabfuhr von bauelementen auf einer leiterplatte
CA1307355C (en) * 1988-05-26 1992-09-08 David C. Degree Soft-faced semiconductor component backing
US4941067A (en) * 1989-04-07 1990-07-10 Motorola Inc. Thermal shunt for electronic circuits
US4965699A (en) * 1989-04-18 1990-10-23 Magnavox Government And Industrial Electronics Company Circuit card assembly cold plate
DE4107312A1 (de) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh Montageanordnung von halbleiterbauelementen auf einer leiterplatte
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same

Also Published As

Publication number Publication date
JPH06244574A (ja) 1994-09-02
DE4302917C1 (de) 1994-07-07
US5394301A (en) 1995-02-28
IT1269708B (it) 1997-04-15
FR2701190A1 (fr) 1994-08-05
ITMI940172D0 (it) 1994-02-01

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Legal Events

Date Code Title Description
0001 Granted