IT7923796A0 - Struttura dielettrica a piu' strati per il montaggio di circuiti integrati. - Google Patents

Struttura dielettrica a piu' strati per il montaggio di circuiti integrati.

Info

Publication number
IT7923796A0
IT7923796A0 IT7923796A IT2379679A IT7923796A0 IT 7923796 A0 IT7923796 A0 IT 7923796A0 IT 7923796 A IT7923796 A IT 7923796A IT 2379679 A IT2379679 A IT 2379679A IT 7923796 A0 IT7923796 A0 IT 7923796A0
Authority
IT
Italy
Prior art keywords
assembly
integrated circuits
dielectric structure
layer dielectric
layer
Prior art date
Application number
IT7923796A
Other languages
English (en)
Other versions
IT1162549B (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/918,214 external-priority patent/US4193082A/en
Priority claimed from US05/918,213 external-priority patent/US4202007A/en
Application filed by Ibm filed Critical Ibm
Publication of IT7923796A0 publication Critical patent/IT7923796A0/it
Application granted granted Critical
Publication of IT1162549B publication Critical patent/IT1162549B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
IT23796/79A 1978-06-23 1979-06-22 Struttura dielettrica a piu' strati per il montaggio di circuiti integrati IT1162549B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/918,214 US4193082A (en) 1978-06-23 1978-06-23 Multi-layer dielectric structure
US05/918,213 US4202007A (en) 1978-06-23 1978-06-23 Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers

Publications (2)

Publication Number Publication Date
IT7923796A0 true IT7923796A0 (it) 1979-06-22
IT1162549B IT1162549B (it) 1987-04-01

Family

ID=27129747

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23796/79A IT1162549B (it) 1978-06-23 1979-06-22 Struttura dielettrica a piu' strati per il montaggio di circuiti integrati

Country Status (3)

Country Link
EP (1) EP0006444B1 (it)
DE (1) DE2964342D1 (it)
IT (1) IT1162549B (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818951A (ja) * 1981-07-22 1983-02-03 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体チツプ装着用基板
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
US4535388A (en) * 1984-06-29 1985-08-13 International Business Machines Corporation High density wired module
GB2168857A (en) * 1984-11-14 1986-06-25 Int Standard Electric Corp Method and structure for interconnecting high frequency components
JP2592308B2 (ja) * 1988-09-30 1997-03-19 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
US5055973A (en) * 1990-01-17 1991-10-08 Aptix Corporation Custom tooled printed circuit board
KR101155557B1 (ko) * 2010-11-19 2012-06-19 한국철도기술연구원 내마모성이 개선된 절연재를 채용한 절연구분장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3456158A (en) * 1963-08-08 1969-07-15 Ibm Functional components
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
NL7003372A (it) * 1969-03-11 1970-09-15
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate
US4037047A (en) * 1974-12-31 1977-07-19 Martin Marietta Corporation Multilayer circuit board with integral flexible appendages
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
DE2742534C2 (de) * 1977-09-21 1985-01-24 Siemens AG, 1000 Berlin und 8000 München Verbindungselement für elektronische Schaltungen

Also Published As

Publication number Publication date
EP0006444B1 (de) 1982-12-22
EP0006444A1 (de) 1980-01-09
DE2964342D1 (en) 1983-01-27
IT1162549B (it) 1987-04-01

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