IT1051640B - Procedimento per la deposizione di un metallo su una superficie ferritica.particolarmente a scopo di connessione elettrica di due conduttori - Google Patents

Procedimento per la deposizione di un metallo su una superficie ferritica.particolarmente a scopo di connessione elettrica di due conduttori

Info

Publication number
IT1051640B
IT1051640B IT70128/75A IT7012875A IT1051640B IT 1051640 B IT1051640 B IT 1051640B IT 70128/75 A IT70128/75 A IT 70128/75A IT 7012875 A IT7012875 A IT 7012875A IT 1051640 B IT1051640 B IT 1051640B
Authority
IT
Italy
Prior art keywords
conductors
deposition
procedure
metal
electric connection
Prior art date
Application number
IT70128/75A
Other languages
English (en)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Application granted granted Critical
Publication of IT1051640B publication Critical patent/IT1051640B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT70128/75A 1974-12-20 1975-12-18 Procedimento per la deposizione di un metallo su una superficie ferritica.particolarmente a scopo di connessione elettrica di due conduttori IT1051640B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/534,920 US3960674A (en) 1974-12-20 1974-12-20 Method of depositing a metal on a surface comprising an electrically non-conductive ferrite

Publications (1)

Publication Number Publication Date
IT1051640B true IT1051640B (it) 1981-05-20

Family

ID=24132078

Family Applications (1)

Application Number Title Priority Date Filing Date
IT70128/75A IT1051640B (it) 1974-12-20 1975-12-18 Procedimento per la deposizione di un metallo su una superficie ferritica.particolarmente a scopo di connessione elettrica di due conduttori

Country Status (8)

Country Link
US (1) US3960674A (it)
JP (1) JPS5187786A (it)
BE (1) BE836788A (it)
CA (1) CA1059941A (it)
DE (1) DE2556686A1 (it)
FR (1) FR2295677A1 (it)
IT (1) IT1051640B (it)
NL (1) NL7514855A (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994154A (en) * 1990-02-06 1991-02-19 International Business Machines Corporation High frequency electrochemical repair of open circuits
DE69607130T2 (de) * 1995-12-29 2000-10-19 At & T Corp., New York Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen
WO2013114919A1 (ja) * 2012-01-30 2013-08-08 株式会社村田製作所 電子部品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2285553A (en) * 1942-06-09 Method and apparatus for electroplating magnetizable articles in bulk
US1275687A (en) * 1917-05-16 1918-08-13 Wilfred D Hodgson Electrical connection and art of making the same.
DE546465C (de) * 1929-05-15 1932-03-12 Waldberg Sa French Company Verfahren zum Galvanisieren von Massenartikeln
FR843625A (fr) 1937-09-21 1939-07-06 Procédé pour influencer les réactions électrochimiques
US3325379A (en) * 1962-05-22 1967-06-13 Hazeltine Research Inc Method of making metallic patterns having continuous interconnections
FR1469185A (fr) * 1965-12-30 1967-02-10 Csf Intégration d'éléments magnétiques câblés
BE758641A (fr) * 1969-11-07 1971-05-06 Philips Nv Support de tete de magnetophone a autoreglage
JPS519570B1 (it) * 1970-10-05 1976-03-27
US3639215A (en) * 1970-12-07 1972-02-01 Budd Co Method of joining parts by plating
US3729388A (en) * 1970-12-10 1973-04-24 Western Electric Co Method of preparing at least one conductive form
US3859180A (en) * 1971-01-06 1975-01-07 Texas Instruments Inc Method for encapsulating discrete semiconductor chips

Also Published As

Publication number Publication date
DE2556686A1 (de) 1976-07-01
JPS5187786A (it) 1976-07-31
FR2295677A1 (fr) 1976-07-16
CA1059941A (en) 1979-08-07
BE836788A (fr) 1976-04-16
NL7514855A (nl) 1976-06-22
US3960674A (en) 1976-06-01

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