IN2014CN02789A - - Google Patents

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Publication number
IN2014CN02789A
IN2014CN02789A IN2789CHN2014A IN2014CN02789A IN 2014CN02789 A IN2014CN02789 A IN 2014CN02789A IN 2789CHN2014 A IN2789CHN2014 A IN 2789CHN2014A IN 2014CN02789 A IN2014CN02789 A IN 2014CN02789A
Authority
IN
India
Application number
Inventor
Regine Mallwitz
Original Assignee
Sma Solar Technology Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sma Solar Technology Ag filed Critical Sma Solar Technology Ag
Publication of IN2014CN02789A publication Critical patent/IN2014CN02789A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structure Of Printed Boards (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
IN2789CHN2014 2011-09-16 2014-04-11 IN2014CN02789A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011053680A DE102011053680A1 (en) 2011-09-16 2011-09-16 Circuit arrangement for reducing oscillation tendency
PCT/EP2012/068191 WO2013037989A1 (en) 2011-09-16 2012-09-17 Circuitry arrangement for reducing a tendency towards oscillations

Publications (1)

Publication Number Publication Date
IN2014CN02789A true IN2014CN02789A (en) 2015-07-03

Family

ID=47040660

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2789CHN2014 IN2014CN02789A (en) 2011-09-16 2014-04-11

Country Status (7)

Country Link
US (1) US8964400B2 (en)
EP (1) EP2756741A1 (en)
JP (1) JP2014528167A (en)
CN (1) CN103828490A (en)
DE (1) DE102011053680A1 (en)
IN (1) IN2014CN02789A (en)
WO (1) WO2013037989A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6106127B2 (en) 2014-05-29 2017-03-29 株式会社ソニー・インタラクティブエンタテインメント Switching converter and electronic device using the same
JP6908012B2 (en) * 2018-10-01 2021-07-21 株式会社デンソー Semiconductor module
JP7136023B2 (en) * 2019-07-01 2022-09-13 株式会社豊田自動織機 Circuit boards and circuit board modules
TWI693682B (en) * 2019-08-28 2020-05-11 財團法人工業技術研究院 Electronic device package structure

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6353540B1 (en) * 1995-01-10 2002-03-05 Hitachi, Ltd. Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.
US6166933A (en) * 1999-10-01 2000-12-26 Pillar Industries, Inc. Snubber circuit for an inverter having inductively coupled resistance
DE10123232A1 (en) 2001-05-12 2002-11-21 Infineon Technologies Ag Semiconductor module used as a MOSFET, JFET or thyristor has a damping material having electromagnetically damping properties provided in a sealing composition arranged within a housing
JP4587603B2 (en) * 2001-06-11 2010-11-24 株式会社日本自動車部品総合研究所 Electronic equipment
JP3798959B2 (en) 2001-09-27 2006-07-19 京セラ株式会社 Multilayer wiring board
DE10159851B4 (en) 2001-12-06 2006-05-24 Infineon Technologies Ag Semiconductor device arrangement with reduced oscillation tendency
DE10162637C1 (en) 2001-12-20 2003-08-21 Eupec Gmbh & Co Kg Circuit arrangement with electronic components on an insulating carrier substrate
CN1148864C (en) * 2002-05-09 2004-05-05 艾默生网络能源有限公司 Method and device for compensating ripple amplitude modulation
JP2004022735A (en) * 2002-06-14 2004-01-22 Matsushita Electric Ind Co Ltd Part-mounting board
DE10333806A1 (en) * 2003-07-24 2005-02-17 Siemens Ag Printed circuit board e.g. for mobile telephone components comprising screen for at least one component against electromagnetic radiation
US20050068751A1 (en) * 2003-09-30 2005-03-31 Hyunjun Kim Floating trace on signal layer
KR100771146B1 (en) 2006-11-30 2007-10-29 한국과학기술원 System in package using single layer capacitor
JP4343254B1 (en) * 2008-06-02 2009-10-14 株式会社東芝 Multilayer printed circuit board
JP2010087024A (en) * 2008-09-29 2010-04-15 Nec Corp Circuit board, manufacturing method for circuit board, and electronic equipment
DE102009026479B4 (en) * 2009-05-26 2016-12-29 Infineon Technologies Ag Power semiconductor module with reduced oscillation tendency

Also Published As

Publication number Publication date
JP2014528167A (en) 2014-10-23
WO2013037989A1 (en) 2013-03-21
CN103828490A (en) 2014-05-28
US20140192487A1 (en) 2014-07-10
EP2756741A1 (en) 2014-07-23
DE102011053680A1 (en) 2013-03-21
US8964400B2 (en) 2015-02-24

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