IN2013CH04103AIN4103CH2013AIN2013CH04103AIN 2013CH04103 AIN2013CH04103 AIN 2013CH04103AIN 4103CH2013 AIN4103CH2013 AIN 4103CH2013AIN 2013CH04103 AIN2013CH04103 AIN 2013CH04103A
Authority
IN
India
Prior art keywords
ceria
lanthanum
abrasive
wafers
particle
Prior art date
Application number
Inventor
Venkata Sesha Praveen Bulusu
Manivannan Ramachandran
Dwarakanathan Umashankar Trilicane
Cho Byoung-Jun
Goo Park Jin
Ramanathan Srinivasan
Original Assignee
Indian Inst Technology Madras
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Filing date
Publication date
Application filed by Indian Inst Technology MadrasfiledCriticalIndian Inst Technology Madras
Priority to IN4103CH2013priorityCriticalpatent/IN2013CH04103A/en
Publication of IN2013CH04103ApublicationCriticalpatent/IN2013CH04103A/en
This invention relates to a method of chemical mechanical planarization for silicon abrasive pads are fixed on wafers, which contains ceria and lanthanum and/or polishing slurry of 7 PH having abrasive which is ceria and containing lanthanum and further the ceria may be of nano particle, or micro particle.
Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, cmp polishing pad and process for preparing said composition