IL250588D0 - Metrology method, target and substrate - Google Patents

Metrology method, target and substrate

Info

Publication number
IL250588D0
IL250588D0 IL250588A IL25058817A IL250588D0 IL 250588 D0 IL250588 D0 IL 250588D0 IL 250588 A IL250588 A IL 250588A IL 25058817 A IL25058817 A IL 25058817A IL 250588 D0 IL250588 D0 IL 250588D0
Authority
IL
Israel
Prior art keywords
metrology
target
substrate
Prior art date
Application number
IL250588A
Other languages
Hebrew (he)
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP14182962 priority Critical
Priority to US201462090801P priority
Priority to US201562170008P priority
Priority to PCT/EP2015/069062 priority patent/WO2016030255A2/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of IL250588D0 publication Critical patent/IL250588D0/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/70633Overlay
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical means
    • G01B11/14Measuring arrangements characterised by the use of optical means for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70608Wafer resist monitoring, e.g. measuring thickness, reflectivity, effects of immersion liquid on resist
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/70683Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane using process control mark, i.e. specific mark designs
IL250588A 2014-08-29 2017-02-14 Metrology method, target and substrate IL250588D0 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP14182962 2014-08-29
US201462090801P true 2014-12-11 2014-12-11
US201562170008P true 2015-06-02 2015-06-02
PCT/EP2015/069062 WO2016030255A2 (en) 2014-08-29 2015-08-19 Metrology method, target and substrate

Publications (1)

Publication Number Publication Date
IL250588D0 true IL250588D0 (en) 2017-04-30

Family

ID=51422000

Family Applications (1)

Application Number Title Priority Date Filing Date
IL250588A IL250588D0 (en) 2014-08-29 2017-02-14 Metrology method, target and substrate

Country Status (7)

Country Link
US (2) US10386176B2 (en)
JP (2) JP6421237B2 (en)
KR (1) KR101986258B1 (en)
CN (2) CN107148597B (en)
IL (1) IL250588D0 (en)
TW (2) TWI645260B (en)
WO (1) WO2016030255A2 (en)

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KR20190029698A (en) 2016-07-15 2019-03-20 에이에스엠엘 네델란즈 비.브이. Apparatus and method for designing a metrology target field
EP3339959A1 (en) * 2016-12-23 2018-06-27 ASML Netherlands B.V. Method of determining a position of a feature
US20200064746A1 (en) * 2016-12-28 2020-02-27 Asml Holding N.V. Metrology tool and method of using the same
US20200089122A1 (en) * 2016-12-28 2020-03-19 Asml Netherlands B.V. Simulation-assisted alignment between metrology image and design
KR20190142376A (en) 2017-04-28 2019-12-26 에이에스엠엘 네델란즈 비.브이. Instrumentation methods and devices and associated computer programs
EP3404488A1 (en) * 2017-05-19 2018-11-21 ASML Netherlands B.V. Method of measuring a target, metrology apparatus, lithographic cell, and target
EP3422602A1 (en) 2017-06-27 2019-01-02 Xieon Networks S.à r.l. Data transmission method and transceiver facilitating the switching of frequency bands for optical channels
US10663633B2 (en) * 2017-06-29 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Aperture design and methods thereof
US20190064654A1 (en) * 2017-08-31 2019-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-function overlay marks for reducing noise and extracting focus and critical dimension information
US10204867B1 (en) * 2017-08-31 2019-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor metrology target and manufacturing method thereof
EP3457212A1 (en) * 2017-09-18 2019-03-20 ASML Netherlands B.V. Method of controlling a patterning process, device manufacturing method

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WO2014210381A1 (en) * 2013-06-27 2014-12-31 Kla-Tencor Corporation Polarization measurements of metrology targets and corresponding target designs
US9257351B2 (en) 2013-08-15 2016-02-09 Globalfoundries Inc. Metrology marks for bidirectional grating superposition patterning processes
NL2014071A (en) 2014-02-03 2015-08-06 Asml Netherlands Bv Metrology method and apparatus, substrate, lithographic system and device manufacturing method.
CN106030414B (en) * 2014-02-21 2018-10-09 Asml荷兰有限公司 The optimization of target arrangement and relevant target
JP6421237B2 (en) * 2014-08-29 2018-11-07 エーエスエムエル ネザーランズ ビー.ブイ. Metrology method, target and substrate
US10210606B2 (en) * 2014-10-14 2019-02-19 Kla-Tencor Corporation Signal response metrology for image based and scatterometry overlay measurements
CN110553602A (en) * 2014-11-26 2019-12-10 Asml荷兰有限公司 Metric method, computer product and system
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KR20180008704A (en) * 2015-05-15 2018-01-24 케이엘에이-텐코 코포레이션 System and method for determining focus using focus-sensitive overlay target
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NL2017466A (en) * 2015-09-30 2017-04-05 Asml Netherlands Bv Metrology method, target and substrate
JP6697560B2 (en) * 2015-12-23 2020-05-20 エーエスエムエル ネザーランズ ビー.ブイ. Metrology method and apparatus

Also Published As

Publication number Publication date
US20160061589A1 (en) 2016-03-03
CN107148597B (en) 2020-05-01
US20190346256A1 (en) 2019-11-14
WO2016030255A2 (en) 2016-03-03
TWI645260B (en) 2018-12-21
JP2017526973A (en) 2017-09-14
KR20170048489A (en) 2017-05-08
KR101986258B1 (en) 2019-06-07
JP6421237B2 (en) 2018-11-07
US10386176B2 (en) 2019-08-20
JP2019012291A (en) 2019-01-24
CN111338187A (en) 2020-06-26
WO2016030255A3 (en) 2016-04-21
TWI598699B (en) 2017-09-11
TW201809903A (en) 2018-03-16
CN107148597A (en) 2017-09-08
US10718604B2 (en) 2020-07-21
TW201614382A (en) 2016-04-16
JP6686097B2 (en) 2020-04-22

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