IL244109D0 - Methods and apparatus for determining focus - Google Patents

Methods and apparatus for determining focus

Info

Publication number
IL244109D0
IL244109D0 IL244109A IL24410916A IL244109D0 IL 244109 D0 IL244109 D0 IL 244109D0 IL 244109 A IL244109 A IL 244109A IL 24410916 A IL24410916 A IL 24410916A IL 244109 D0 IL244109 D0 IL 244109D0
Authority
IL
Israel
Prior art keywords
methods
determining focus
focus
determining
Prior art date
Application number
IL244109A
Other languages
Hebrew (he)
Other versions
IL244109A (en
Original Assignee
Kla-Tencor Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201361864527P priority Critical
Priority to US14/451,320 priority patent/US9383661B2/en
Priority to PCT/US2014/050390 priority patent/WO2015023542A1/en
Application filed by Kla-Tencor Corporation filed Critical Kla-Tencor Corporation
Publication of IL244109D0 publication Critical patent/IL244109D0/en
Publication of IL244109A publication Critical patent/IL244109A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Exposure apparatus for microlithography
    • G03F7/70483—Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616—Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/70641—Focus
IL244109A 2013-08-10 2016-02-14 Methods and apparatus for determining focus IL244109A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US201361864527P true 2013-08-10 2013-08-10
US14/451,320 US9383661B2 (en) 2013-08-10 2014-08-04 Methods and apparatus for determining focus
PCT/US2014/050390 WO2015023542A1 (en) 2013-08-10 2014-08-08 Methods and apparatus for determining focus

Publications (2)

Publication Number Publication Date
IL244109D0 true IL244109D0 (en) 2016-07-31
IL244109A IL244109A (en) 2020-01-30

Family

ID=52448403

Family Applications (1)

Application Number Title Priority Date Filing Date
IL244109A IL244109A (en) 2013-08-10 2016-02-14 Methods and apparatus for determining focus

Country Status (8)

Country Link
US (2) US9383661B2 (en)
EP (1) EP3033764A4 (en)
KR (1) KR102102021B1 (en)
CN (1) CN105593973B (en)
IL (1) IL244109A (en)
SG (1) SG11201601027PA (en)
TW (1) TWI649627B (en)
WO (1) WO2015023542A1 (en)

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US10281263B2 (en) 2016-05-02 2019-05-07 Kla-Tencor Corporation Critical dimension measurements with gaseous adsorption
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US10458912B2 (en) 2016-08-31 2019-10-29 Kla-Tencor Corporation Model based optical measurements of semiconductor structures with anisotropic dielectric permittivity
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US10317198B2 (en) * 2016-09-30 2019-06-11 Kla-Tencor Corporation Three-dimensional mapping of a wafer
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US10690602B2 (en) 2017-02-17 2020-06-23 Kla-Tencor Corporation Methods and systems for measurement of thick films and high aspect ratio structures
US10732516B2 (en) 2017-03-01 2020-08-04 Kla Tencor Corporation Process robust overlay metrology based on optical scatterometry
US10474042B2 (en) * 2017-03-22 2019-11-12 Kla-Tencor Corporation Stochastically-aware metrology and fabrication
US10365211B2 (en) 2017-09-26 2019-07-30 Kla-Tencor Corporation Systems and methods for metrology beam stabilization
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Also Published As

Publication number Publication date
CN105593973B (en) 2019-04-26
WO2015023542A1 (en) 2015-02-19
US20150042984A1 (en) 2015-02-12
SG11201601027PA (en) 2016-03-30
US9383661B2 (en) 2016-07-05
KR102102021B1 (en) 2020-04-17
EP3033764A4 (en) 2017-03-22
US10101674B2 (en) 2018-10-16
CN105593973A (en) 2016-05-18
TW201514637A (en) 2015-04-16
EP3033764A1 (en) 2016-06-22
IL244109A (en) 2020-01-30
KR20160042989A (en) 2016-04-20
TWI649627B (en) 2019-02-01
US20160282731A1 (en) 2016-09-29

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