IL232892D0 - Methods and systems for inspection of wafers and reticles using designer intent data - Google Patents

Methods and systems for inspection of wafers and reticles using designer intent data

Info

Publication number
IL232892D0
IL232892D0 IL232892A IL23289214A IL232892D0 IL 232892 D0 IL232892 D0 IL 232892D0 IL 232892 A IL232892 A IL 232892A IL 23289214 A IL23289214 A IL 23289214A IL 232892 D0 IL232892 D0 IL 232892D0
Authority
IL
Israel
Prior art keywords
reticles
wafers
inspection
systems
methods
Prior art date
Application number
IL232892A
Other languages
Hebrew (he)
Other versions
IL232892A (en
Original Assignee
Kla Tencor Technologies
Kla Tencor Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US48533803P priority Critical
Priority to US10/883,372 priority patent/US9002497B2/en
Priority to PCT/US2004/021459 priority patent/WO2005008747A2/en
Application filed by Kla Tencor Technologies, Kla Tencor Tech Corp filed Critical Kla Tencor Technologies
Publication of IL232892D0 publication Critical patent/IL232892D0/en
Publication of IL232892A publication Critical patent/IL232892A/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/0006Industrial image inspection using a design-rule based approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/70616Wafer pattern monitoring, i.e. measuring printed patterns or the aerial image at the wafer plane
    • G03F7/7065Defect inspection
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/0008Industrial image inspection checking presence/absence
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95676Masks, reticles, shadow masks
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer
IL232892A 2003-07-03 2014-05-29 Monitoring fabrication of integrated circuits on a semi-conductor wafer IL232892A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US48533803P true 2003-07-03 2003-07-03
US10/883,372 US9002497B2 (en) 2003-07-03 2004-07-01 Methods and systems for inspection of wafers and reticles using designer intent data
PCT/US2004/021459 WO2005008747A2 (en) 2003-07-03 2004-07-02 Methods and systems for inspection of wafers and reticles using designer intent data

Publications (2)

Publication Number Publication Date
IL232892D0 true IL232892D0 (en) 2014-07-31
IL232892A IL232892A (en) 2016-11-30

Family

ID=33555782

Family Applications (4)

Application Number Title Priority Date Filing Date
IL172941A IL172941A (en) 2003-07-03 2006-01-02 Methods for inspection of wafers and reticles using designer intent data
IL232892A IL232892A (en) 2003-07-03 2014-05-29 Monitoring fabrication of integrated circuits on a semi-conductor wafer
IL248278A IL248278A (en) 2003-07-03 2016-10-10 Monitoring fabrication of integrated circuits on semi-conductor wafer
IL253910A IL253910D0 (en) 2003-07-03 2017-08-08 Monitoring fabrication of integrated circuits on semi-conductor wafer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IL172941A IL172941A (en) 2003-07-03 2006-01-02 Methods for inspection of wafers and reticles using designer intent data

Family Applications After (2)

Application Number Title Priority Date Filing Date
IL248278A IL248278A (en) 2003-07-03 2016-10-10 Monitoring fabrication of integrated circuits on semi-conductor wafer
IL253910A IL253910D0 (en) 2003-07-03 2017-08-08 Monitoring fabrication of integrated circuits on semi-conductor wafer

Country Status (9)

Country Link
US (4) US9002497B2 (en)
EP (1) EP1646913B1 (en)
JP (7) JP4758343B2 (en)
KR (1) KR101089643B1 (en)
CN (3) CN1846170B (en)
AT (1) AT426835T (en)
DE (1) DE602004020230D1 (en)
IL (4) IL172941A (en)
WO (1) WO2005008747A2 (en)

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