IL183311D0 - Heat sink with microchannel cooling for power devices - Google Patents

Heat sink with microchannel cooling for power devices

Info

Publication number
IL183311D0
IL183311D0 IL18331107A IL18331107A IL183311D0 IL 183311 D0 IL183311 D0 IL 183311D0 IL 18331107 A IL18331107 A IL 18331107A IL 18331107 A IL18331107 A IL 18331107A IL 183311 D0 IL183311 D0 IL 183311D0
Authority
IL
Israel
Prior art keywords
heat sink
power devices
microchannel cooling
microchannel
cooling
Prior art date
Application number
IL18331107A
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US10/998,707 priority Critical patent/US7353859B2/en
Priority to PCT/US2005/041087 priority patent/WO2007001456A1/en
Application filed by Gen Electric filed Critical Gen Electric
Publication of IL183311D0 publication Critical patent/IL183311D0/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
IL18331107A 2004-11-24 2007-05-20 Heat sink with microchannel cooling for power devices IL183311D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/998,707 US7353859B2 (en) 2004-11-24 2004-11-24 Heat sink with microchannel cooling for power devices
PCT/US2005/041087 WO2007001456A1 (en) 2004-11-24 2005-11-14 Heat sink with microchannel cooling for power devices

Publications (1)

Publication Number Publication Date
IL183311D0 true IL183311D0 (en) 2007-09-20

Family

ID=36459885

Family Applications (1)

Application Number Title Priority Date Filing Date
IL18331107A IL183311D0 (en) 2004-11-24 2007-05-20 Heat sink with microchannel cooling for power devices

Country Status (8)

Country Link
US (2) US7353859B2 (en)
EP (1) EP1825730B1 (en)
JP (1) JP5052350B2 (en)
CN (1) CN100559926C (en)
CA (1) CA2589183C (en)
DE (1) DE602005025923D1 (en)
IL (1) IL183311D0 (en)
WO (1) WO2007001456A1 (en)

Families Citing this family (132)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7327024B2 (en) * 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
US7190581B1 (en) * 2005-01-11 2007-03-13 Midwest Research Institute Low thermal resistance power module assembly
CN100555613C (en) * 2005-03-22 2009-10-28 布哈拉特强电有限公司 Selectively grooved cold plate for electronics cooling
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US7515415B2 (en) * 2006-02-02 2009-04-07 Sun Microsystems, Inc. Embedded microchannel cooling package for a central processor unit
US20070259523A1 (en) * 2006-05-04 2007-11-08 Yechuri Sitaramarao S Method of fabricating high speed integrated circuits
KR100737162B1 (en) * 2006-08-11 2007-07-02 동부일렉트로닉스 주식회사 Semiconductor device and fabricating method thereof
US7762314B2 (en) * 2007-04-24 2010-07-27 International Business Machines Corporation Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
US8479806B2 (en) * 2007-11-30 2013-07-09 University Of Hawaii Two-phase cross-connected micro-channel heat sink
US20090151893A1 (en) * 2007-12-13 2009-06-18 International Business Machines Corporation High performance compliant thermal interface cooling structures
EP2291599A4 (en) * 2008-04-29 2014-05-14 Carrier Corp Modular heat exchanger
US8302671B2 (en) 2008-04-29 2012-11-06 Raytheon Company Scaleable parallel flow micro-channel heat exchanger and method for manufacturing same
US8472193B2 (en) * 2008-07-04 2013-06-25 Kabushiki Kaisha Toyota Jidoshokki Semiconductor device
WO2010036442A1 (en) * 2008-07-21 2010-04-01 The Regents Of The University Of California Titanium-based thermal ground plane
US8120915B2 (en) * 2008-08-18 2012-02-21 General Electric Company Integral heat sink with spiral manifolds
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
US8929071B2 (en) * 2008-12-22 2015-01-06 General Electric Company Low cost manufacturing of micro-channel heatsink
US20100175857A1 (en) * 2009-01-15 2010-07-15 General Electric Company Millichannel heat sink, and stack and apparatus using the same
KR20110125231A (en) 2009-02-04 2011-11-18 퍼듀 리서치 파운데이션 Finned heat exchangers for metal hydride storage systems
US8778063B2 (en) 2009-02-04 2014-07-15 Purdue Research Foundation Coiled and microchannel heat exchangers for metal hydride storage systems
DE102009010256A1 (en) * 2009-02-24 2010-08-26 Jungheinrich Aktiengesellschaft Printed circuit board with heat sink
US7898807B2 (en) * 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US8358000B2 (en) * 2009-03-13 2013-01-22 General Electric Company Double side cooled power module with power overlay
US7929306B2 (en) * 2009-03-31 2011-04-19 Alcatel-Lucent Usa Inc. Circuit pack cooling solution
US8899776B2 (en) 2012-05-07 2014-12-02 Lighting Science Group Corporation Low-angle thoroughfare surface lighting device
US20100302734A1 (en) * 2009-05-29 2010-12-02 General Electric Company Heatsink and method of fabricating same
US8582298B2 (en) * 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
CN101599471B (en) 2009-06-29 2012-05-23 浙江工业大学 Cooling structure of power device and manufacturing method thereof
US8345720B2 (en) 2009-07-28 2013-01-01 Northrop Grumman Systems Corp. Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance
US20110024150A1 (en) * 2009-07-31 2011-02-03 General Electric Company Cooling system and method for current carrying conductor
US9157581B2 (en) 2009-10-05 2015-10-13 Lighting Science Group Corporation Low profile luminaire with light guide and associated systems and methods
US9581756B2 (en) 2009-10-05 2017-02-28 Lighting Science Group Corporation Light guide for low profile luminaire
US8522569B2 (en) * 2009-10-27 2013-09-03 Industrial Idea Partners, Inc. Utilization of data center waste heat for heat driven engine
CN102076203B (en) * 2009-11-24 2015-11-25 通用电气公司 For the radiator of press pack and cooling and packaging laminate
US9596785B2 (en) * 2010-03-22 2017-03-14 Pratt & Whitney Canada Corp. Heat exchanger
EP2395549B1 (en) * 2010-06-10 2014-06-25 Imec Device for cooling integrated circuits
US8218320B2 (en) 2010-06-29 2012-07-10 General Electric Company Heat sinks with C-shaped manifolds and millichannel cooling
US9532423B2 (en) 2010-07-23 2016-12-27 Lighting Science Group Corporation System and methods for operating a lighting device
US9827439B2 (en) 2010-07-23 2017-11-28 Biological Illumination, Llc System for dynamically adjusting circadian rhythm responsive to scheduled events and associated methods
US9174067B2 (en) 2012-10-15 2015-11-03 Biological Illumination, Llc System for treating light treatable conditions and associated methods
US8743023B2 (en) 2010-07-23 2014-06-03 Biological Illumination, Llc System for generating non-homogenous biologically-adjusted light and associated methods
US9252069B2 (en) * 2010-08-31 2016-02-02 Teledyne Scientific & Imaging, Llc High power module cooling system
US8514901B2 (en) * 2010-11-02 2013-08-20 Gerald Ho Kim Silicon-based cooling package for laser gain medium
US8401231B2 (en) 2010-11-09 2013-03-19 Biological Illumination, Llc Sustainable outdoor lighting system for use in environmentally photo-sensitive area
US8384984B2 (en) 2011-03-28 2013-02-26 Lighting Science Group Corporation MEMS wavelength converting lighting device and associated methods
US9360202B2 (en) 2011-05-13 2016-06-07 Lighting Science Group Corporation System for actively cooling an LED filament and associated methods
US9151482B2 (en) 2011-05-13 2015-10-06 Lighting Science Group Corporation Sealed electrical device with cooling system
US8608348B2 (en) 2011-05-13 2013-12-17 Lighting Science Group Corporation Sealed electrical device with cooling system and associated methods
US8754832B2 (en) 2011-05-15 2014-06-17 Lighting Science Group Corporation Lighting system for accenting regions of a layer and associated methods
US9173269B2 (en) 2011-05-15 2015-10-27 Lighting Science Group Corporation Lighting system for accentuating regions of a layer and associated methods
US8760370B2 (en) 2011-05-15 2014-06-24 Lighting Science Group Corporation System for generating non-homogenous light and associated methods
US8982558B2 (en) * 2011-06-24 2015-03-17 General Electric Company Cooling device for a power module, and a related method thereof
KR101255935B1 (en) * 2011-07-08 2013-04-23 삼성전기주식회사 Power Module Package and Method for Manufacturing the same
US8897010B2 (en) * 2011-08-22 2014-11-25 General Electric Company High performance liquid cooled heatsink for IGBT modules
US20130056176A1 (en) * 2011-08-26 2013-03-07 Mikros Manufacturing, Inc. Heat Exchanger with Controlled Coefficient of Thermal Expansion
US8465167B2 (en) 2011-09-16 2013-06-18 Lighting Science Group Corporation Color conversion occlusion and associated methods
US8408725B1 (en) 2011-09-16 2013-04-02 Lighting Science Group Corporation Remote light wavelength conversion device and associated methods
US9220202B2 (en) 2011-12-05 2015-12-29 Biological Illumination, Llc Lighting system to control the circadian rhythm of agricultural products and associated methods
US9913341B2 (en) 2011-12-05 2018-03-06 Biological Illumination, Llc LED lamp for producing biologically-adjusted light including a cyan LED
US8963450B2 (en) 2011-12-05 2015-02-24 Biological Illumination, Llc Adaptable biologically-adjusted indirect lighting device and associated methods
US9289574B2 (en) 2011-12-05 2016-03-22 Biological Illumination, Llc Three-channel tuned LED lamp for producing biologically-adjusted light
US8686641B2 (en) 2011-12-05 2014-04-01 Biological Illumination, Llc Tunable LED lamp for producing biologically-adjusted light
US9024536B2 (en) 2011-12-05 2015-05-05 Biological Illumination, Llc Tunable LED lamp for producing biologically-adjusted light and associated methods
US8866414B2 (en) 2011-12-05 2014-10-21 Biological Illumination, Llc Tunable LED lamp for producing biologically-adjusted light
US8841864B2 (en) 2011-12-05 2014-09-23 Biological Illumination, Llc Tunable LED lamp for producing biologically-adjusted light
US8545034B2 (en) 2012-01-24 2013-10-01 Lighting Science Group Corporation Dual characteristic color conversion enclosure and associated methods
CN102548367B (en) * 2012-02-07 2014-07-02 山东大学 Small passageway liquid cooling base board of power electronic integration module with double-trapezoid cross section fins
US8901850B2 (en) 2012-05-06 2014-12-02 Lighting Science Group Corporation Adaptive anti-glare light system and associated methods
US9681522B2 (en) 2012-05-06 2017-06-13 Lighting Science Group Corporation Adaptive light system and associated methods
US9006987B2 (en) 2012-05-07 2015-04-14 Lighting Science Group, Inc. Wall-mountable luminaire and associated systems and methods
US8680457B2 (en) 2012-05-07 2014-03-25 Lighting Science Group Corporation Motion detection system and associated methods having at least one LED of second set of LEDs to vary its voltage
US9402294B2 (en) 2012-05-08 2016-07-26 Lighting Science Group Corporation Self-calibrating multi-directional security luminaire and associated methods
JP5924106B2 (en) * 2012-05-08 2016-05-25 富士電機株式会社 Power converter
US8937976B2 (en) 2012-08-15 2015-01-20 Northrop Grumman Systems Corp. Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier
US9127818B2 (en) 2012-10-03 2015-09-08 Lighting Science Group Corporation Elongated LED luminaire and associated methods
US9322516B2 (en) 2012-11-07 2016-04-26 Lighting Science Group Corporation Luminaire having vented optical chamber and associated methods
CN103809708A (en) * 2012-11-07 2014-05-21 辉达公司 Panel electronic device, auxiliary heat dissipating device of panel electronic device and assembly of panel electronic device and auxiliary heat dissipating device
US9347655B2 (en) 2013-03-11 2016-05-24 Lighting Science Group Corporation Rotatable lighting device
US9459397B2 (en) 2013-03-12 2016-10-04 Lighting Science Group Corporation Edge lit lighting device
US10270220B1 (en) * 2013-03-13 2019-04-23 Science Research Laboratory, Inc. Methods and systems for heat flux heat removal
US9255670B2 (en) 2013-03-15 2016-02-09 Lighting Science Group Corporation Street lighting device for communicating with observers and associated methods
CN105122466B (en) * 2013-03-15 2019-06-04 Mtpv动力公司 Microchannel heat sink for microgap thermophotovoltaic device
US8899775B2 (en) 2013-03-15 2014-12-02 Lighting Science Group Corporation Low-angle thoroughfare surface lighting device
US20140268731A1 (en) 2013-03-15 2014-09-18 Lighting Science Group Corpporation Low bay lighting system and associated methods
JP6416219B2 (en) 2013-05-02 2018-10-31 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. Cooling device for cooling laser device and laser system equipped with cooling device
US9510478B2 (en) 2013-06-20 2016-11-29 Honeywell International Inc. Cooling device including etched lateral microchannels
US20150034280A1 (en) * 2013-08-01 2015-02-05 Hamilton Sundstrand Corporation Header for electronic cooler
US9041193B2 (en) * 2013-09-17 2015-05-26 Hamilton Sundstrand Corporation Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel
US9429294B2 (en) 2013-11-11 2016-08-30 Lighting Science Group Corporation System for directional control of light and associated methods
TWI489741B (en) * 2013-12-20 2015-06-21 Ind Tech Res Inst Motor controller with cooling function and cooling method thereof
US20150195951A1 (en) * 2014-01-06 2015-07-09 Ge Aviation Systems Llc Cooled electronic assembly and cooling device
KR101695708B1 (en) 2014-01-09 2017-01-13 한국전자통신연구원 Semiconductor device and method of fabricating the same
JP6279950B2 (en) * 2014-03-25 2018-02-14 京セラ株式会社 Heat exchange member
US9437523B2 (en) * 2014-05-30 2016-09-06 Toyota Motor Engineering & Manufacturing North America, Inc. Two-sided jet impingement assemblies and power electronics modules comprising the same
JP6156283B2 (en) * 2014-08-07 2017-07-05 株式会社デンソー Power converter
WO2016044246A1 (en) * 2014-09-15 2016-03-24 D Onofrio Nicholas Michael Liquid cooled metal core printed circuit board
KR20160051407A (en) * 2014-11-03 2016-05-11 현대모비스 주식회사 Cooling flow channel module for power changing device and power changing device having the same
US20160150678A1 (en) * 2014-11-22 2016-05-26 Gerald Ho Kim Silicon Cooling Plate With An Integrated PCB
US20170303431A1 (en) * 2014-11-22 2017-10-19 Gerald Ho Kim Silicon Cooling Plate With An Integrated PCB
EP3227624A4 (en) * 2014-12-03 2018-10-31 GE Intelligent Platforms, Inc. Combined energy dissipation apparatus and method
US9762018B2 (en) 2014-12-09 2017-09-12 Raytheon Company System and method for cooling a laser gain medium using an ultra-thin liquid thermal optical interface
US9445526B2 (en) 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
FI127831B (en) * 2015-01-15 2019-03-29 Lappeenrannan Teknillinen Yliopisto A method for fabricating a semiconductor module
US9693487B2 (en) 2015-02-06 2017-06-27 Caterpillar Inc. Heat management and removal assemblies for semiconductor devices
KR20160107397A (en) 2015-03-03 2016-09-19 한국전자통신연구원 Semiconductor device
CN104768356B (en) * 2015-04-27 2017-06-06 中国电子科技集团公司第三十八研究所 A kind of water cooling hardened structure of application 3D printing technique
CN104852257A (en) * 2015-05-18 2015-08-19 大连理工大学 Large-diameter laser liquid cooling mirror structure
US9443786B1 (en) * 2015-08-19 2016-09-13 Ac Propulsion, Inc. Packaging and cooling method and apparatus for power semiconductor devices
US9980415B2 (en) 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
WO2017059382A1 (en) 2015-09-30 2017-04-06 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US9865988B2 (en) 2015-11-25 2018-01-09 Raytheon Company High-power planar waveguide (PWG) pumphead with modular components for high-power laser system
US10056731B2 (en) 2015-11-25 2018-08-21 Raytheon Company Planar waveguide (PWG) amplifier-based laser system with adaptive optic wavefront correction in low-power beam path
US10211590B2 (en) 2015-11-25 2019-02-19 Raytheon Company Dual-function optical bench and cooling manifold for high-power laser system
US10297968B2 (en) 2015-11-25 2019-05-21 Raytheon Company High-gain single planar waveguide (PWG) amplifier laser system
US10069270B2 (en) 2016-02-11 2018-09-04 Raytheon Company Planar waveguides with enhanced support and/or cooling features for high-power laser systems
US9917413B2 (en) * 2016-02-11 2018-03-13 Coherent, Inc. Cooling apparatus for diode-laser bars
CN105576113A (en) * 2016-02-16 2016-05-11 广东富信科技股份有限公司 Semiconductor refrigeration component
US9484284B1 (en) 2016-03-16 2016-11-01 Northrop Grumman Systems Corporation Microfluidic impingement jet cooled embedded diamond GaN HEMT
US10411435B2 (en) 2016-06-06 2019-09-10 Raytheon Company Dual-axis adaptive optic (AO) system for high-power lasers
US10492343B2 (en) * 2016-08-23 2019-11-26 Ford Global Technologies, Llc Vehicle power module assembly with cooling
CN107634037A (en) * 2017-03-02 2018-01-26 天津开发区天地信息技术有限公司 High heat conduction package substrate
CN108966583A (en) * 2017-05-17 2018-12-07 华为技术有限公司 Radiator and communication equipment
CN108011008A (en) * 2017-11-28 2018-05-08 西安科锐盛创新科技有限公司 LED encapsulation structure
CN108006566A (en) * 2017-11-28 2018-05-08 西安科锐盛创新科技有限公司 Solar street light
CN108011007B (en) * 2017-11-28 2019-11-08 刘琼 LED encapsulation structure
CN108011019B (en) * 2017-11-28 2019-12-17 廊坊源驰科技有限公司 LED packaging method
CN108006490A (en) * 2017-11-28 2018-05-08 西安科锐盛创新科技有限公司 Led tunnel lamp
CN108006491A (en) * 2017-11-28 2018-05-08 西安科锐盛创新科技有限公司 Led tunnel lamp
CN108006488A (en) * 2017-11-28 2018-05-08 西安科锐盛创新科技有限公司 A kind of New LED wall lamp
US10511135B2 (en) 2017-12-19 2019-12-17 Raytheon Company Laser system with mechanically-robust monolithic fused planar waveguide (PWG) structure
DE102018112000A1 (en) * 2018-05-18 2019-11-21 Rogers Germany Gmbh A system for cooling a metal-ceramic substrate, a metal-ceramic substrate, and method of manufacturing the system

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4758926A (en) * 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package
US4759403A (en) * 1986-04-30 1988-07-26 International Business Machines Corp. Hydraulic manifold for water cooling of multi-chip electric modules
US5345107A (en) * 1989-09-25 1994-09-06 Hitachi, Ltd. Cooling apparatus for electronic device
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
JPH07114250B2 (en) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション The heat transfer system
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JPH06326226A (en) * 1993-03-15 1994-11-25 Toshiba Corp Cooling unit
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5892279A (en) * 1995-12-11 1999-04-06 Northrop Grumman Corporation Packaging for electronic power devices and applications using the packaging
GB2309827B (en) 1996-01-30 1998-04-22 Samsung Electronics Co Ltd Surface complemental heat dissipation device
US5692558A (en) * 1996-07-22 1997-12-02 Northrop Grumman Corporation Microchannel cooling using aviation fuels for airborne electronics
US5801442A (en) * 1996-07-22 1998-09-01 Northrop Grumman Corporation Microchannel cooling of high power semiconductor devices
DE19710783C2 (en) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Coolers for use as a heat sink for electrical components or circuits
JP4048579B2 (en) * 1997-08-28 2008-02-20 住友電気工業株式会社 Heat dissipating body including refrigerant flow path and manufacturing method thereof
US6188575B1 (en) * 1998-06-30 2001-02-13 Intersil Corporation Heat exchanging chassis and method
SE511809C2 (en) * 1998-11-25 1999-11-29 Trulstech Innovation Kb Feed Horn, designed specifically for two-way satellite communication
FR2786656B1 (en) * 1998-11-27 2001-01-26 Alstom Technology power electronic component having cooling means
US6237682B1 (en) 1999-04-30 2001-05-29 Motorola, Inc. Cooling module including a pressure relief mechanism
US6131650A (en) * 1999-07-20 2000-10-17 Thermal Corp. Fluid cooled single phase heat sink
US6678182B2 (en) * 2000-11-07 2004-01-13 United Defense Lp Electrical bus with associated porous metal heat sink and method of manufacturing same
US6529394B1 (en) * 2000-11-07 2003-03-04 United Defense Lp Inverter for an electric motor
JP2003051689A (en) * 2001-08-06 2003-02-21 Toshiba Corp Heating element cooling unit
WO2003016075A1 (en) * 2001-08-15 2003-02-27 Florida State University Method of manufacturing and design of microreactors, including microanalytical and separation devices
DE10145780B4 (en) * 2001-09-17 2012-10-04 Merck Patent Gmbh Fluorinated cyclopenta [a] naphthalenes and their use in liquid crystal mixtures and displays
US7278474B2 (en) * 2001-10-09 2007-10-09 Mikros Manufacturing, Inc. Heat exchanger
US6449158B1 (en) * 2001-12-20 2002-09-10 Motorola, Inc. Method and apparatus for securing an electronic power device to a heat spreader
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7032651B2 (en) * 2003-06-23 2006-04-25 Raytheon Company Heat exchanger
JP2005059508A (en) * 2003-08-19 2005-03-10 Funai Electric Co Ltd Photo-printer
US20060113063A1 (en) * 2004-10-15 2006-06-01 Lalit Chordia Thin-plate microchannel structure

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US20060108098A1 (en) 2006-05-25
US7353859B2 (en) 2008-04-08
EP1825730A1 (en) 2007-08-29
CN100559926C (en) 2009-11-11
JP2008522406A (en) 2008-06-26
CA2589183C (en) 2013-11-12
DE602005025923D1 (en) 2011-02-24
WO2007001456A1 (en) 2007-01-04
US20070215325A1 (en) 2007-09-20
CA2589183A1 (en) 2007-01-04
EP1825730B1 (en) 2011-01-12
JP5052350B2 (en) 2012-10-17
CN101103659A (en) 2008-01-09

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