IL166342D0 - Method and apparatus for producing uniform processing rates - Google Patents

Method and apparatus for producing uniform processing rates

Info

Publication number
IL166342D0
IL166342D0 IL16634205A IL16634205A IL166342D0 IL 166342 D0 IL166342 D0 IL 166342D0 IL 16634205 A IL16634205 A IL 16634205A IL 16634205 A IL16634205 A IL 16634205A IL 166342 D0 IL166342 D0 IL 166342D0
Authority
IL
Israel
Prior art keywords
uniform processing
processing rates
producing uniform
producing
rates
Prior art date
Application number
IL16634205A
Other versions
IL166342A (en
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US10/200,833 priority Critical patent/US6842147B2/en
Priority to PCT/US2003/022206 priority patent/WO2004010457A1/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of IL166342D0 publication Critical patent/IL166342D0/en
Publication of IL166342A publication Critical patent/IL166342A/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32917Plasma diagnostics
    • H01J37/3299Feedback systems
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/29Combinations of different interacting antenna units for giving a desired directional characteristic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
IL166342A 2002-07-22 2005-01-17 Method and apparatus for producing uniform processing rates IL166342A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/200,833 US6842147B2 (en) 2002-07-22 2002-07-22 Method and apparatus for producing uniform processing rates
PCT/US2003/022206 WO2004010457A1 (en) 2002-07-22 2003-07-17 Method and apparatus for producing uniform processing rates

Publications (2)

Publication Number Publication Date
IL166342D0 true IL166342D0 (en) 2006-01-16
IL166342A IL166342A (en) 2009-08-03

Family

ID=30769568

Family Applications (1)

Application Number Title Priority Date Filing Date
IL166342A IL166342A (en) 2002-07-22 2005-01-17 Method and apparatus for producing uniform processing rates

Country Status (9)

Country Link
US (1) US6842147B2 (en)
EP (1) EP1540694B1 (en)
JP (2) JP4928077B2 (en)
KR (1) KR100974844B1 (en)
CN (3) CN1689132B (en)
AU (1) AU2003256565A1 (en)
IL (1) IL166342A (en)
TW (1) TWI327875B (en)
WO (1) WO2004010457A1 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200253559Y1 (en) * 2001-07-30 2001-11-22 주식회사 플라즈마트 Antenna Structure of Inductively Coupled Plasma Generating Device
JP2003323997A (en) * 2002-04-30 2003-11-14 Lam Research Kk Plasma stabilizing method and plasma device
KR100486724B1 (en) * 2002-10-15 2005-05-03 삼성전자주식회사 Inductively coupled plasma generating apparatus with serpentine coil antenna
US20050205211A1 (en) * 2004-03-22 2005-09-22 Vikram Singh Plasma immersion ion implantion apparatus and method
KR100968132B1 (en) * 2008-02-29 2010-07-06 (주)얼라이드 테크 파인더즈 Rotational antenna and semiconductor device including the same
US8298949B2 (en) * 2009-01-07 2012-10-30 Lam Research Corporation Profile and CD uniformity control by plasma oxidation treatment
CA2752183C (en) * 2009-02-10 2018-12-11 Helyssen Sarl Apparatus for large area plasma processing
US9337004B2 (en) * 2009-04-06 2016-05-10 Lam Research Corporation Grounded confinement ring having large surface area
JP5851681B2 (en) * 2009-10-27 2016-02-03 東京エレクトロン株式会社 Plasma processing equipment
JP5592098B2 (en) * 2009-10-27 2014-09-17 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
KR101757922B1 (en) 2009-10-27 2017-07-14 도쿄엘렉트론가부시키가이샤 Plamsa processing apparatus
KR101757921B1 (en) * 2009-10-27 2017-07-14 도쿄엘렉트론가부시키가이샤 Plasma processing apparatus and plasma processing method
KR101757920B1 (en) * 2009-10-27 2017-07-14 도쿄엘렉트론가부시키가이샤 Plasma processing apparatus and plasma processing method
JP5451324B2 (en) * 2009-11-10 2014-03-26 株式会社日立ハイテクノロジーズ Plasma processing equipment
JP5723130B2 (en) * 2010-09-28 2015-05-27 東京エレクトロン株式会社 Plasma processing equipment
JP5916044B2 (en) * 2010-09-28 2016-05-11 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
JP5639866B2 (en) * 2010-12-03 2014-12-10 株式会社日立ハイテクノロジーズ Plasma processing equipment
JP5781349B2 (en) 2011-03-30 2015-09-24 東京エレクトロン株式会社 Plasma processing equipment
US10271416B2 (en) * 2011-10-28 2019-04-23 Applied Materials, Inc. High efficiency triple-coil inductively coupled plasma source with phase control
US20130256271A1 (en) * 2012-04-03 2013-10-03 Theodoros Panagopoulos Methods and apparatuses for controlling plasma in a plasma processing chamber
JP6248562B2 (en) * 2013-11-14 2017-12-20 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
CN104684235B (en) * 2013-11-28 2017-07-07 中微半导体设备(上海)有限公司 A kind of inductance coil group and inductance coupling plasma processing device
CN105719928A (en) * 2014-12-03 2016-06-29 中微半导体设备(上海)有限公司 Device and method for compensating non-uniformity of etching rate in ICP etching
JP6603999B2 (en) * 2015-02-13 2019-11-13 日新電機株式会社 Plasma processing equipment
US10297457B2 (en) 2015-03-19 2019-05-21 Mattson Technology, Inc. Controlling azimuthal uniformity of etch process in plasma processing chamber
JP6053881B2 (en) * 2015-07-15 2016-12-27 東京エレクトロン株式会社 Plasma processing equipment
US10128083B2 (en) * 2016-06-01 2018-11-13 Vebco Instruments Inc. Ion sources and methods for generating ion beams with controllable ion current density distributions over large treatment areas
CN108271309B (en) * 2016-12-30 2020-05-01 中微半导体设备(上海)股份有限公司 Inductively coupled plasma processing device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401350A (en) 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
US5731565A (en) 1995-07-27 1998-03-24 Lam Research Corporation Segmented coil for generating plasma in plasma processing equipment
US5907221A (en) * 1995-08-16 1999-05-25 Applied Materials, Inc. Inductively coupled plasma reactor with an inductive coil antenna having independent loops
US5759280A (en) 1996-06-10 1998-06-02 Lam Research Corporation Inductively coupled source for deriving substantially uniform plasma flux
US5897712A (en) 1996-07-16 1999-04-27 Applied Materials, Inc. Plasma uniformity control for an inductive plasma source
TW434723B (en) * 1997-03-17 2001-05-16 Matsushita Electric Ind Co Ltd Method and apparatus for plasma processing
US6237526B1 (en) * 1999-03-26 2001-05-29 Tokyo Electron Limited Process apparatus and method for improving plasma distribution and performance in an inductively coupled plasma
US6310577B1 (en) * 1999-08-24 2001-10-30 Bethel Material Research Plasma processing system with a new inductive antenna and hybrid coupling of electronagnetic power
US6320320B1 (en) 1999-11-15 2001-11-20 Lam Research Corporation Method and apparatus for producing uniform process rates
US6341574B1 (en) * 1999-11-15 2002-01-29 Lam Research Corporation Plasma processing systems
US6508198B1 (en) 2000-05-11 2003-01-21 Applied Materials Inc. Automatic tuning in a tapped RF transformer inductive source of a plasma reactor for processing a semiconductor wafer
US6414648B1 (en) * 2000-07-06 2002-07-02 Applied Materials, Inc. Plasma reactor having a symmetric parallel conductor coil antenna
JP2003234338A (en) * 2002-02-08 2003-08-22 Tokyo Electron Ltd Inductively coupled plasma treatment apparatus

Also Published As

Publication number Publication date
CN1689132A (en) 2005-10-26
US20040085246A1 (en) 2004-05-06
IL166342A (en) 2009-08-03
AU2003256565A1 (en) 2004-02-09
EP1540694A1 (en) 2005-06-15
CN1689132B (en) 2010-06-16
TW200405768A (en) 2004-04-01
CN102573265A (en) 2012-07-11
KR20050025975A (en) 2005-03-14
JP2012104496A (en) 2012-05-31
TWI327875B (en) 2010-07-21
JP2005534150A (en) 2005-11-10
CN102573265B (en) 2016-01-20
CN101460002B (en) 2012-07-04
KR100974844B1 (en) 2010-08-11
JP4928077B2 (en) 2012-05-09
US6842147B2 (en) 2005-01-11
EP1540694B1 (en) 2015-11-11
WO2004010457A1 (en) 2004-01-29
CN101460002A (en) 2009-06-17

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Legal Events

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KB Patent renewed
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MM9K Patent not in force due to non-payment of renewal fees