IL165931A - Dicopper (i) oxalate complexes as precursors in the process of metallic copper deposition - Google Patents
Dicopper (i) oxalate complexes as precursors in the process of metallic copper depositionInfo
- Publication number
- IL165931A IL165931A IL165931A IL16593104A IL165931A IL 165931 A IL165931 A IL 165931A IL 165931 A IL165931 A IL 165931A IL 16593104 A IL16593104 A IL 16593104A IL 165931 A IL165931 A IL 165931A
- Authority
- IL
- Israel
- Prior art keywords
- dicopper
- precursors
- metallic copper
- copper deposition
- oxalate complexes
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 239000010949 copper Substances 0.000 title abstract 2
- 230000008021 deposition Effects 0.000 title abstract 2
- 150000003891 oxalate salts Chemical class 0.000 title abstract 2
- 239000002243 precursor Substances 0.000 title abstract 2
- 239000002879 Lewis base Substances 0.000 abstract 2
- 150000007527 lewis bases Chemical class 0.000 abstract 2
- 239000003446 ligand Substances 0.000 abstract 2
- 230000007935 neutral effect Effects 0.000 abstract 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract 1
- 150000001336 alkenes Chemical class 0.000 abstract 1
- 150000001345 alkine derivatives Chemical class 0.000 abstract 1
- 125000004185 ester group Chemical group 0.000 abstract 1
- 150000002826 nitrites Chemical group 0.000 abstract 1
- 150000002829 nitrogen Chemical group 0.000 abstract 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 abstract 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 abstract 1
- 229920006395 saturated elastomer Chemical group 0.000 abstract 1
- 229910052717 sulfur Inorganic materials 0.000 abstract 1
- 239000011593 sulfur Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/08—Copper compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F19/00—Metal compounds according to more than one of main groups C07F1/00 - C07F17/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Chemically Coating (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
The invention relates to dicopper(I) oxalate complexes stabilised by neutral Lewis base components and to the use thereof as precursors for the deposition of metallic copper. The neutral Lewis bases used are alkynes or alkenes containing at least one silyl or ester group, or nitrites, saturated or unsaturated nitrogen ligands, phosphites, trialkyl-phosphines or oxygen- or sulfur-containing ligands.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10228050A DE10228050A1 (en) | 2002-06-24 | 2002-06-24 | Dikupfer (I) oxolate complexes as precursor substances for metallic copper deposition |
| PCT/EP2003/005897 WO2004000850A1 (en) | 2002-06-24 | 2003-06-05 | Dicopper(i)oxalate complexes for use as precursor substances in metallic copper deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL165931A0 IL165931A0 (en) | 2006-01-15 |
| IL165931A true IL165931A (en) | 2010-12-30 |
Family
ID=29723396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL165931A IL165931A (en) | 2002-06-24 | 2004-12-22 | Dicopper (i) oxalate complexes as precursors in the process of metallic copper deposition |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US7169947B2 (en) |
| EP (1) | EP1515976B1 (en) |
| JP (1) | JP4477490B2 (en) |
| KR (1) | KR100941529B1 (en) |
| CN (1) | CN1300149C (en) |
| AT (1) | ATE326472T1 (en) |
| BR (1) | BR0312047A (en) |
| CA (1) | CA2490773A1 (en) |
| DE (2) | DE10228050A1 (en) |
| IL (1) | IL165931A (en) |
| RU (1) | RU2322447C2 (en) |
| TW (1) | TWI316970B (en) |
| WO (1) | WO2004000850A1 (en) |
| ZA (1) | ZA200500581B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10319454A1 (en) * | 2003-04-29 | 2004-11-18 | Merck Patent Gmbh | Dikupfer (I) oxalate complexes as a precursor for metallic copper deposition |
| KR101791673B1 (en) * | 2015-02-17 | 2017-11-20 | 주식회사 엘지화학 | Metal complex, metal nano structure and catalyst composition comprising the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4387055A (en) * | 1981-07-13 | 1983-06-07 | Exxon Research And Engineering Co. | Copper oxalate complexes |
| US5441766A (en) * | 1994-08-25 | 1995-08-15 | Korea Institute Of Science And Technology | Method for the production of highly pure copper thin films by chemical vapor deposition |
| RU2149217C1 (en) * | 1998-07-17 | 2000-05-20 | Фокина Елена Леонидовна | Method of applying metal coating on the surface of powders and substrates |
| KR100289946B1 (en) * | 1998-09-21 | 2001-05-15 | 신현국 | Copper thin film precursor solution for chemical vapor deposition and its manufacturing method |
| US5994571A (en) * | 1998-11-10 | 1999-11-30 | Sharp Laboratories Of America, Inc. | Substituted ethylene precursor and synthesis method |
| KR100298125B1 (en) * | 1999-04-15 | 2001-09-13 | 정명식 | Organocuprous precursors for chemical deposition of copper |
| JP4102954B2 (en) * | 1999-10-08 | 2008-06-18 | 三菱マテリアル株式会社 | Organocopper compound for metalorganic chemical vapor deposition, solution raw material for forming copper thin film containing the same, and copper thin film made therefrom |
-
2002
- 2002-06-24 DE DE10228050A patent/DE10228050A1/en not_active Withdrawn
-
2003
- 2003-06-05 CN CNB038146916A patent/CN1300149C/en not_active Expired - Fee Related
- 2003-06-05 WO PCT/EP2003/005897 patent/WO2004000850A1/en not_active Ceased
- 2003-06-05 DE DE50303377T patent/DE50303377D1/en not_active Expired - Lifetime
- 2003-06-05 CA CA002490773A patent/CA2490773A1/en not_active Abandoned
- 2003-06-05 JP JP2004514666A patent/JP4477490B2/en not_active Expired - Fee Related
- 2003-06-05 RU RU2005101745/04A patent/RU2322447C2/en not_active IP Right Cessation
- 2003-06-05 US US10/519,163 patent/US7169947B2/en not_active Expired - Lifetime
- 2003-06-05 KR KR1020047021208A patent/KR100941529B1/en not_active Expired - Fee Related
- 2003-06-05 AT AT03732539T patent/ATE326472T1/en not_active IP Right Cessation
- 2003-06-05 BR BR0312047-3A patent/BR0312047A/en not_active IP Right Cessation
- 2003-06-05 EP EP03732539A patent/EP1515976B1/en not_active Expired - Lifetime
- 2003-06-18 TW TW092116561A patent/TWI316970B/en not_active IP Right Cessation
-
2004
- 2004-12-22 IL IL165931A patent/IL165931A/en active IP Right Grant
-
2005
- 2005-01-20 ZA ZA200500581A patent/ZA200500581B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| ZA200500581B (en) | 2005-07-20 |
| DE10228050A1 (en) | 2004-01-15 |
| US7169947B2 (en) | 2007-01-30 |
| EP1515976B1 (en) | 2006-05-17 |
| BR0312047A (en) | 2005-03-29 |
| TWI316970B (en) | 2009-11-11 |
| CA2490773A1 (en) | 2003-12-31 |
| KR20050014886A (en) | 2005-02-07 |
| AU2003238474A1 (en) | 2004-01-06 |
| WO2004000850A1 (en) | 2003-12-31 |
| RU2005101745A (en) | 2005-09-27 |
| US20050226997A1 (en) | 2005-10-13 |
| CN1662545A (en) | 2005-08-31 |
| CN1300149C (en) | 2007-02-14 |
| EP1515976A1 (en) | 2005-03-23 |
| JP2005530827A (en) | 2005-10-13 |
| JP4477490B2 (en) | 2010-06-09 |
| IL165931A0 (en) | 2006-01-15 |
| KR100941529B1 (en) | 2010-02-10 |
| DE50303377D1 (en) | 2006-06-22 |
| ATE326472T1 (en) | 2006-06-15 |
| RU2322447C2 (en) | 2008-04-20 |
| TW200403353A (en) | 2004-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |