IL144160D0 - A lead-free alloy for use as soldering material - Google Patents

A lead-free alloy for use as soldering material

Info

Publication number
IL144160D0
IL144160D0 IL14416001A IL14416001A IL144160D0 IL 144160 D0 IL144160 D0 IL 144160D0 IL 14416001 A IL14416001 A IL 14416001A IL 14416001 A IL14416001 A IL 14416001A IL 144160 D0 IL144160 D0 IL 144160D0
Authority
IL
Israel
Prior art keywords
soldering
lead
free alloy
alloy
free
Prior art date
Application number
IL14416001A
Original Assignee
Ika Ind Consulting Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ika Ind Consulting Ltd filed Critical Ika Ind Consulting Ltd
Priority to IL14416001A priority Critical patent/IL144160D0/en
Publication of IL144160D0 publication Critical patent/IL144160D0/en

Links

IL14416001A 2001-07-05 2001-07-05 A lead-free alloy for use as soldering material IL144160D0 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IL14416001A IL144160D0 (en) 2001-07-05 2001-07-05 A lead-free alloy for use as soldering material

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
IL14416001A IL144160D0 (en) 2001-07-05 2001-07-05 A lead-free alloy for use as soldering material
US10/482,826 US6936219B2 (en) 2001-07-05 2002-07-07 Lead-free alloy
AU2002317451A AU2002317451A1 (en) 2001-07-05 2002-07-07 Lead-free solder alloy
PCT/IL2002/000531 WO2003004713A2 (en) 2001-07-05 2002-07-07 Lead-free solder alloy

Publications (1)

Publication Number Publication Date
IL144160D0 true IL144160D0 (en) 2002-05-23

Family

ID=11075585

Family Applications (1)

Application Number Title Priority Date Filing Date
IL14416001A IL144160D0 (en) 2001-07-05 2001-07-05 A lead-free alloy for use as soldering material

Country Status (4)

Country Link
US (1) US6936219B2 (en)
AU (1) AU2002317451A1 (en)
IL (1) IL144160D0 (en)
WO (1) WO2003004713A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012503309A (en) 2008-09-16 2012-02-02 アギア システムズ インコーポレーテッド Pb-free solder bumps with improved mechanical properties
CN105189003A (en) * 2013-03-13 2015-12-23 日本斯倍利亚社股份有限公司 Solder alloy and joint thereof
JP6514883B2 (en) * 2014-12-04 2019-05-15 千住金属工業株式会社 Rail bond solder alloy
CN104668810B (en) * 2015-01-29 2016-09-07 苏州天兼新材料科技有限公司 A kind of novel lead-free welding material and the preparation method of scaling powder thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2252409A (en) * 1939-12-29 1941-08-12 Aluminum Co Of America Solder
DE19752329A1 (en) * 1997-11-26 1999-05-27 Stolberger Metallwerke Gmbh Process for the production of a metallic composite tape
JP3306007B2 (en) * 1998-06-30 2002-07-24 株式会社東芝 Solder material
JP3392778B2 (en) * 1999-03-31 2003-03-31 株式会社東芝 Method for forming lead-free joining member and circuit board
JP2001129682A (en) * 1999-10-29 2001-05-15 Topy Ind Ltd Sn BASED Pb-FREE SOLDER SUPERIOR IN HEAT CYCLE CHARACTERISTICS

Also Published As

Publication number Publication date
WO2003004713A3 (en) 2004-03-04
WO2003004713A2 (en) 2003-01-16
US20040208779A1 (en) 2004-10-21
US6936219B2 (en) 2005-08-30
AU2002317451A1 (en) 2003-01-21

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Legal Events

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