IL144160D0 - A lead-free alloy for use as soldering material - Google Patents
A lead-free alloy for use as soldering materialInfo
- Publication number
- IL144160D0 IL144160D0 IL14416001A IL14416001A IL144160D0 IL 144160 D0 IL144160 D0 IL 144160D0 IL 14416001 A IL14416001 A IL 14416001A IL 14416001 A IL14416001 A IL 14416001A IL 144160 D0 IL144160 D0 IL 144160D0
- Authority
- IL
- Israel
- Prior art keywords
- soldering
- lead
- free alloy
- alloy
- free
- Prior art date
Links
- 239000000956 alloys Substances 0.000 title 1
- 229910045601 alloys Inorganic materials 0.000 title 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 title 1
- 239000000463 materials Substances 0.000 title 1
- 238000005476 soldering Methods 0.000 title 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL14416001A IL144160D0 (en) | 2001-07-05 | 2001-07-05 | A lead-free alloy for use as soldering material |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL14416001A IL144160D0 (en) | 2001-07-05 | 2001-07-05 | A lead-free alloy for use as soldering material |
| US10/482,826 US6936219B2 (en) | 2001-07-05 | 2002-07-07 | Lead-free alloy |
| AU2002317451A AU2002317451A1 (en) | 2001-07-05 | 2002-07-07 | Lead-free solder alloy |
| PCT/IL2002/000531 WO2003004713A2 (en) | 2001-07-05 | 2002-07-07 | Lead-free solder alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL144160D0 true IL144160D0 (en) | 2002-05-23 |
Family
ID=11075585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL14416001A IL144160D0 (en) | 2001-07-05 | 2001-07-05 | A lead-free alloy for use as soldering material |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6936219B2 (en) |
| AU (1) | AU2002317451A1 (en) |
| IL (1) | IL144160D0 (en) |
| WO (1) | WO2003004713A2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012503309A (en) | 2008-09-16 | 2012-02-02 | アギア システムズ インコーポレーテッド | Pb-free solder bumps with improved mechanical properties |
| CN105189003A (en) * | 2013-03-13 | 2015-12-23 | 日本斯倍利亚社股份有限公司 | Solder alloy and joint thereof |
| JP6514883B2 (en) * | 2014-12-04 | 2019-05-15 | 千住金属工業株式会社 | Rail bond solder alloy |
| CN104668810B (en) * | 2015-01-29 | 2016-09-07 | 苏州天兼新材料科技有限公司 | A kind of novel lead-free welding material and the preparation method of scaling powder thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2252409A (en) * | 1939-12-29 | 1941-08-12 | Aluminum Co Of America | Solder |
| DE19752329A1 (en) * | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Process for the production of a metallic composite tape |
| JP3306007B2 (en) * | 1998-06-30 | 2002-07-24 | 株式会社東芝 | Solder material |
| JP3392778B2 (en) * | 1999-03-31 | 2003-03-31 | 株式会社東芝 | Method for forming lead-free joining member and circuit board |
| JP2001129682A (en) * | 1999-10-29 | 2001-05-15 | Topy Ind Ltd | Sn BASED Pb-FREE SOLDER SUPERIOR IN HEAT CYCLE CHARACTERISTICS |
-
2001
- 2001-07-05 IL IL14416001A patent/IL144160D0/en not_active IP Right Cessation
-
2002
- 2002-07-07 US US10/482,826 patent/US6936219B2/en active Active - Reinstated
- 2002-07-07 AU AU2002317451A patent/AU2002317451A1/en not_active Abandoned
- 2002-07-07 WO PCT/IL2002/000531 patent/WO2003004713A2/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003004713A3 (en) | 2004-03-04 |
| WO2003004713A2 (en) | 2003-01-16 |
| US20040208779A1 (en) | 2004-10-21 |
| US6936219B2 (en) | 2005-08-30 |
| AU2002317451A1 (en) | 2003-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed | ||
| MM9K | Patent not in force due to non-payment of renewal fees |