IL133453D0 - Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby - Google Patents

Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby

Info

Publication number
IL133453D0
IL133453D0 IL13345399A IL13345399A IL133453D0 IL 133453 D0 IL133453 D0 IL 133453D0 IL 13345399 A IL13345399 A IL 13345399A IL 13345399 A IL13345399 A IL 13345399A IL 133453 D0 IL133453 D0 IL 133453D0
Authority
IL
Israel
Prior art keywords
integrated circuit
circuit devices
packaged integrated
methods
producing
Prior art date
Application number
IL13345399A
Original Assignee
Shellcase Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shellcase Ltd filed Critical Shellcase Ltd
Priority to IL13345399A priority Critical patent/IL133453D0/en
Publication of IL133453D0 publication Critical patent/IL133453D0/en

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IL13345399A 1999-12-10 1999-12-10 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby IL133453D0 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IL13345399A IL133453D0 (en) 1999-12-10 1999-12-10 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
IL13345399A IL133453D0 (en) 1999-12-10 1999-12-10 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
CA 2394458 CA2394458A1 (en) 1999-12-10 2000-11-26 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
PCT/IL2000/000786 WO2001043181A1 (en) 1999-12-10 2000-11-26 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
CN 00816990 CN1222024C (en) 1999-12-10 2000-11-26 Method for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
AU17272/01A AU1727201A (en) 1999-12-10 2000-11-26 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
EP00979896.8A EP1247293B1 (en) 1999-12-10 2000-11-26 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
JP2001543771A JP5160710B2 (en) 1999-12-10 2000-11-26 Packaged integrated circuit device manufacturing method and packaged integrated circuit device manufactured by the manufacturing method
TW89125196A TW466722B (en) 1999-12-10 2000-11-28 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
US09/725,166 US6777767B2 (en) 1999-12-10 2000-11-29 Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
US09/922,770 US7144745B2 (en) 1999-12-10 2001-08-07 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced
US11/588,489 US7939918B2 (en) 1999-12-10 2006-10-26 Chip packages with covers

Publications (1)

Publication Number Publication Date
IL133453D0 true IL133453D0 (en) 2001-04-30

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ID=11073589

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13345399A IL133453D0 (en) 1999-12-10 1999-12-10 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby

Country Status (9)

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US (3) US6777767B2 (en)
EP (1) EP1247293B1 (en)
JP (1) JP5160710B2 (en)
CN (1) CN1222024C (en)
AU (1) AU1727201A (en)
CA (1) CA2394458A1 (en)
IL (1) IL133453D0 (en)
TW (1) TW466722B (en)
WO (1) WO2001043181A1 (en)

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* Cited by examiner, † Cited by third party
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