IE903510A1 - Composite material having good thermal conductivity - Google Patents

Composite material having good thermal conductivity

Info

Publication number
IE903510A1
IE903510A1 IE351090A IE351090A IE903510A1 IE 903510 A1 IE903510 A1 IE 903510A1 IE 351090 A IE351090 A IE 351090A IE 351090 A IE351090 A IE 351090A IE 903510 A1 IE903510 A1 IE 903510A1
Authority
IE
Ireland
Prior art keywords
composite material
weight percent
thermal conductivity
heat
waxes
Prior art date
Application number
IE351090A
Original Assignee
Hoechst Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst Ag filed Critical Hoechst Ag
Publication of IE903510A1 publication Critical patent/IE903510A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A highly heat-resistant composite material which consists of a highly heat-resistant polymer and an electrically insulating mineral filler having high thermal conductivity is proposed for electrically insulating and readily heat-conducting parts in electric and electronic components. Composite material filled with, for example, 50 to 90 percent by weight of sintered ceramic can be injection moulded and extrudable and, owing to its high thermal conductivity of more than 1 W/mK, its dielectric strength of more than 3 kV/mm and its high heat distortion resistance of more than 180 DEG C, is very suitable for electrical components at 220 volt and operating temperatures of up to about 150 DEG .

Description

BACKGROUND OF THE INVENTION t Field of the Invention: ' The present invention relates to a highly heat-resistant composite material as well as to the use thereof.
Description of the Prior Art The increasing miniaturization of electronic components and the increase in the packing density of electronic circuits and assemblies that accompanies the miniaturization creates problems due to the stray heat arising during operation of the components. Increasingly-greater quantities of heat is also to be dissipated from the components due to the higher power density in order to protect the components against damage due to overheating.
Given closed envelopes or housings of components, the stray heat arising must be eliminated via the material of the envelope or, respectively, of the housing. Known envelopes of unfilled thermoplastics, in fact, have good electrical insulation that is likewise required, but have a thermal conductivity of approximately 0.2-0.4 W/mK that is often inadequate.
In order to increase this low thermal conductivity, plastics filled with correspondingly thermally-conductive particles are now employed. The European patent 167 000 proposed aluminum particles as a filler. The filler particles are thereby covered with a closed polyethylene layer in order to guarantee an adequate electrical insulation of the plastic filled therewith. Thermal conductivities of approximately 2-5 W/mK are, in fact, achieved; however, an adequate dielectric strength in order to meet all requirements for utilization given components in 220 volt operation is not achieved.
SUMMARY OF THE'INVENTION •Λ It is therefore an object of the present invention to provide a material that has a good conductivity of at least 1,5 W/mK. is thereby electrically insulating and has a puncture or breakdown voltage that allows utilization for components effectively operated with 220 volts.
The above object is achieved through a highly heat-resistant composite material composed of: -5 0 weight percent of a highly thermally-resistant thermoplastic polymer having a thermoforming stability greater than or equal to 180°C.: and 50-85 weight percent of a mineral, crystalline filler having a thermal conductivity greater than or equal 10 W/mK. whereby the extrudable and injectable composite material has a thermal conductivity of at least 1 W/mK. a thermoforming stability of greater than or equal to 180°C. and a dielectric strength of greater than or equal to 3 kV/mm.
According to a particular feature of the invention, the composite material is characterized in that it contains 20-35 weight percent of the polymer.
According to another feature of the invention, the composite material is particularly characterized in that the highly heat-resistant polymer is a thermoplastic and is selected from the group consisting of liquid crystal polymers (LCP), polyphenylenesulfide (PPS), polyetherimide (PEI), polyethersulfone (PES), polyetheretherketone (PEEK), polyethyleneterephthalate (PET), polysulfone (PSU), ' ’’T ? polyarvletherketone, polyamide/imide (PAI), polyimides (PI) and polyamide (PA). •Λ According to another feature of the invention, the composite material is characterized in that the filler is a sintered ceramic selected from the group consisting of aluminum nitride, aluminum oxide, boron nitride, silicon carbide, boron carbide and silicon nitride.
According to another feature of the invention, the composite material is characterized in that it is composed of 20—35 weight percent of a liquid crystal polymer and 65-- weight percent of a mineral filler having a thermal conductivity above 30 W/mK and an electrical volume resistance of greater than ohm cm.
According to another feature of the invention, the composite material mentioned immediately above is particularly characterized as having and at least subaromatic liquid crystal polymer that is selected from the group consisting of copolyester, polyester carbonate and polyester amide.
According to another feature of the invention, the composite material is characterized in that the filler has grain sizes smaller than 50 um.
According to another feature of the invention, the composite material is particularly characterized in that the filler is present in the form of short fibers.
According to another feature of the invention, the composite material is particularly characterized in that it contains further, standard additives selected from anti-statics, heat and light stabilizers, pigments, colorants, optical brightness, unmolding auxiliaries, flame-retardant agents and gliding agents and lubricants, particularly fatty alcohols, dicarboxylic acid ester, fatty acid ester, fatty acids, fatty acid soaps and fatty acid amides. f According to another feature of the invention, the composite material just mentioned is particularly characterized in that it contains 0.05--10 weight percent of one or more waxes which are selected from the group consisting of montanic acids (having 26--32 C atoms), synthetic dicarboxylic acids having more than 20 C, atoms, the esters and soaps thereof, paraffin waxes, polyethylene waxes and polypropylene waxes and their oxidates, and amide waxes.
According to another feature of the invention, the composite material just mentioned is particularly characterized in that 0.1--5 weight percent waxes are contained therein.
According to another feature of the invention, the composite material is used for electrically insulating and highly thermally conductive parts in electric and electronic components, particularly as covering, envelope or housing of material.
BRIEF DESCRIPTION OF THE DRAWING Other objects, features and advantages of the invention, its organization, construction and operation will be best understood from the following detailed description, taken in conjunction with the accompanying drawing, on which there is a single figure showing a cross sectional view of an electronic power component, such as for a motor vehicle, encapsulated for protection against environmental influences with a composite material manufactured in accordance with the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawing, an electronic power component (for example, for a motor vehicle) is illustrated that is encapsulated for protection against environmental influences. A power transistor 4 is illustrated along with a component 3 of an assembly arranged on a printed circuitboard 2. The overall assembly (2, 3, 4) is extrusion coated with the composite material of the present invention, so that the power component 1 is hermetically shielded from environmental influences, for example moisture, by the encapsulation 7. The electrical contact to the power supply can be produced via a plugtype connector 5.
The crux of the present invention is based on the advantageous and likewise surprising properties of the composite material manufactured in accordance with the invention. Mineral and hard fillers could previously be processed only with great difficulty since the hardness of the filler particles employed resulted in an increased abrasion of the apparatus employed and therefore made the processing uneconomical. Furthermore, a processing was heretofore possible only up to certain filler contents. Surprisingly, the composite material of the present invention exhibits a good extrudability and can be injected up to a maximum filler content of 85 weight percent. The thermal conductivities achieved in the recited range lie above 1.5 W/mK. whereby a dielectric strength of 3 kV.„/mm and above is simultaneously achieved.
This makes the composite material excellently suited for manufacturing envelopes, housing, etc, of electrical and electronic components wherein a high heat elimination and simultaneously good electrical insulation are required.
The high filler contents and the properties of the composite material therefore achieved become possible on the basis of the selection of the polymer employed. The required temperature stability and thermoforming stability is met, for example, by what is referred to as high-temperature thermoplastics that simultaneously I have other beneficial properties and are excellently suited to the composite material.
These polymers have highly-ordered structures and thus create adequate space for filler particles up to the mentioned high percentage of fillers. These polymers thereby exhibit a high flowability under the processing conditions, particular ly at high pressures and high processing temperatures, so that no significantly-higher forces must be exerted ► for processing the composite material, despite the high content of filler. The premature wear of the processing equipment and, thus, a shortening of their service life are thereby simultaneously prevented.
Highly heat-resistant thermoplastics that are also suitable for the composite material of the present invention are, in particular, liquid crystal polymers (LCP), polvphenylenesulfide (PES), polyetherimide (PEI), polyethersulfone (PES), polyetheretherketone (PEEK), polyethyleneterephthalate (PET), polybutyleneterephthalate (PBT), polysulfone (PSU), polyaryletherketone, polyamide/imide (PAI), polyimides (PI) and various polyamides (for example, PA 46, PA 11 and PA 12).
Liquid crystal polymers whose very name testifies to their highly-ordered structure, even in the fluid condition, are particularly suitable for the composite material of the present invention.
The highest degrees of filler are achieved with these polymers. Preferred liquid crystal polymers have at least aromatic sub-structures and are selected from copolyester, polyester carbonate and polyester amide.
Fillers that likewise have a high thermal conductivity and are thereby electrically insulating are required for a composite material having good thermal conductivity. These are particularly crystalline fillers wherein the thermal conduction arises due to lattice oscillations (phonons) buf-npt due to an electron contribution. The electrically-insulating properties of the filler and, therefore, of the composite material are thereby guaranteed. Λ It is not, however, the conductivity of the filler that is predominantly decisive for a high thermal conductivity of the composite material; rather, it is the volume portion of the filler in the composite material. The selection criterion for a good filler is therefore the compatibility thereof with the thermoplastic or, respectively, its capability of achieving a high degree of filler in combination with a suitable thermoplastic.
Suitable fillers are selected from the group consisting of oxides, nitrides, and carbides of elements of the third through sixth main group. Such components belonging to the group of sintered ceramics are, for example, aluminum nitride, aluminum oxide, boron nitride, silicon carbide, boron carbide and silicon nitride. Aluminum nitride is a filler with which especially good properties of the composite material can be achieved. As a consequence of its high costs, however, the utilization thereof on an industrial scale is not economical. Aluminum oxide is to be preferred from this point of view. Silicon carbide represents a good compromise with respect to economical feasibility and properties. A composite material filled therewith, however, has a somewhat lower dielectric strength since silicon carbide is a weak semiconductor.
The filler particles advantageously havegrainsizes below 50 nm. The shape of the particles is thereby arbitrary and is only dependent on the manufacturing method. Although a composite material that has extraordinarily-good thermal conductivity properties is obtained given the use of short fibers as the filler, the fibers have heretofore not been economically useable because of their high costs. Filler contents of, for example, 50 volume percent are achieved given a filler having approximately spherical particles, this, for example, corresponding to 70 weight percent ' if F ? dependent on the filler and on the polymer. Thermal conductivities of approximately 2 W/mK are thus achieved.
Given the recited thermoplastics and the recited fillers, composite materials are obtained within the mentioned ranges that can already be well processed in this form, i.e. are extrudable and injectable, and that are well-suited for the electrical or, respectively, electronic applications. However, further constituent materials can be contained in the composite material for special purposes. These can be additives which are standard for achieving defined properties and which, for example, are selected from antistatics, heat and light stabilizers, pigments, colorants, optical brighteners, unmolding auxiliaries, flame-retarding additives or glide agents and lubricants. As already mentioned, no additives are required for the composite materials. In particular, composite materials having LCP as the thermoplastic meet the requirements for the flame retardant class UL94 VO and are also particularly easy to process. Nonetheless, further advantages, particularly an easier workability, can be achieved by adding, in particular, gliding agents and lubricants. Advantageous additives are therefore fatty alcohols, dicarboxylicacidester, fatty acid ester, fatty acids, fatty acid soaps and fatty acid amines or compounds derived therefrom. For example, one or more waxes in a proportion of 0.05-10 weight percent can be contained in a composite material, particularly in a proportion of 0.1-5 weight percent. Such waxes, for example, are selected from montanic acids that have approximately 26-32 C atoms, synthetic dicarboxylic acid having more than 20 C. atoms, their esters and soaps, parafinepolyethylene wax and polypropylene waxes and their oxidates, as well as amide waxes.
The composite materials are to be worked like standard thermoplastics.
They are extrudable and injectable. A suitable apparatus for processing the component materials is disclosed, for example, in the European patent application 199 340. For producing the composite material, the corresponding thermoplastic is extruded as a granulate together with the filler. The material obtained in such a fashion can be converted into a granulate again and can be processed inlhis form into corresponding component parts in injection molding systems. In industrial-scale systems, it is also possible to work the filler into the polymers by kneading.
Three compositions for composite material according to the teachings of the present invention will be set forth below as exemplary embodiments, the illustration thereof being illustrated on the drawing.
Example #1 A mixture that is composed of 70 weight percent aluminum oxide (granulation 0-30 um and 30 weight percent of a liquid crystal polymer (for example, Vectra C 950, Hoechst/Celanese) is extruded in a double worm extruder as disclosed, for example, in the European patent application 199 340.
Standardized injection molded parts for calculating the electrical and physical parameters are manufactured from this extruded mixture. The composite materia] has a thermal conductivity of 2 W/mK. a specific volume resistance of above ., punchthrough ohm cm. voltage of more than 5kV.,f/mm and a continuous use temperature of more than 150°C, The flame-retardant specifications of UL 94 VO are met up to a thickness of 2 mm.
The composite material can be employed for eliminating stray heat in housings, or envelopes, or can be employed as a cooling member.
Example #2 Corresponding to the first example and first exemplary embodiment, a mixture of 60 weight percent silicon carbide (for example, Silcar N, Elektroschmelzwerk Kempten) and 40 weight percent LCP (for example, Vectra C 950) are extruded. Injection-molded parts manufactured therefrom have a thermal conductivity of 1.5 W/mK. a specific volume resistance of more than 1012 ohm cm. punch through voltage of 3kVeff/mm and a continuous use temperature of at least one 150°C. The flameretardant specification of UL 94 VO are met up to 2mm.
Example #3 Correspondingly, a mixture of 35 weight percent aluminum nitride (ESK Company) and 65 weight percent LCP are extruded. Injection-molded parts manufactured therefrom have apunchth voftige of more than 5 kV.^mm. a specific volume resistance of more than 1012 ohm cm and a continuous use temperature of at least 150cC, The flame-retardant specifications of UL 94 VO are likewise met up to 2 mm.
In a schematic cross-sectional view, the drawing illustrates an envelope for an electronic component manufactured from the composite material of the present invention.
Although we have described our invention by reference to particular illustrative embodiments thereof, many changes and modifications of the invention may become apparent to those skilled in the art without departing from the spirit and scope of the invention. We therefore intend to include within the patent warranted hereon all such changes and modifications as may reasonably and properly be included within the scope of our contribution to the art.

Claims (14)

1. WE CLAIM:
1. A high-heat resistant extrudable and injectable composite material comprising: 15—50 weight percent of a highly heat-resistant thermoplastic polymer having a thermoforming stability of > 180°C; and 50-85 weight percent of a mineral crystalline filler having a thermal conductivity of > 10 W/mK, whereby the material has a thermal conductivity of at least 1 W/mK, a thermoforming stability of > 180°C. and a dielectric strength > 3 kV/mm.
2. The composite material of claim 1, wherein said heat-resistant polymer is further defined as comprising: a thermoplastic material selected from the group consisting of liquid-crystal polymers, polyphenylenesulfide, polyetherimide, polyethersulfone, polyetheretherketone, polyethyleneterephthalate, polysulfone, polyaryletherketone, polyamide/imide, polyimides and polyamides.
3. The composite material of claim 2, wherein said filler comprises a sintered ceramic selected from the group consisting of aluminum nitride, aluminum oxide, boron nitride, silicon carbide, boron carbide and silicon nitride.
4. The composite material of claim 1, wherein: said filler comprises grain sizes smaller than 50 pm. *
5. The composite material of claim 1, wherein: said filler comprises short fibers.
6. The composite material of claim 1, and further comprising: additives selected from the group heat and light stabilizers, pigments, colorants, optical brighteners, unmolding auxiliaries, flame-retarding agents, and gliding agents and lubricants.
7. The composite material of claim 1, and further comprising: additives selected from the group consisting of fatty alcohols, dicarboxylic acid ester, fatty acid ester, fatty acids, fatty acid soaps and fatty acid amides.
8. The composite material of claim 6, and further comprising: 0.05—10 weight percent of at least one wax selected from the group consisting of montanic acids having 26—32 C atoms, synthetic dicarboxylic acids having more than 20 C atoms, the esters and soaps thereof, paraffin waxes, polyethylene waxes and polypropylene waxes and their oxidates, and amide waxes. ?. The composite material of claim·?, and further comprising: J 0.05—10 weight percent of at least one wax selected from the group consisting of montanic acids having 26—32 C atoms, synthetic dicarboxylic acids having more than 20 C atoms, the esters and soaps thereof, paraffin waxes, I polyethylene waxes and polypropylene waxes and their oxidates, and amide waxes.
9. 10. The composite material of claim 8, wherein: said wax is in the range of 0.1—5 weight percent.
10. 11. The composite material of claim 9, wherein: said wax is in the range of 0.1—5 weight percent.
11. 12. A highly-heat resistant extrudable and injectable composite material comprising: 20—35 weight percent of a highly heat-resistant thermoplastic polymer having a thermoforming stability of > 180° C; and 65 —80 weight percent of a mineral crystalline filler having a thermal conductivity of > 10 W/mK, whereby the composite material has a thermal conductivity of at least 1 W/mK, a thermoforming stability of > 180° C. and a dielectric strength of > 3kV/mm. ' . f '*
12. 13. A highly-heat resistant extrudable and injectable composite material comprising: 20—35 weight percent of a highly heat-resistant thermoplastic polymer having a * thermoforming stability of > 180°C; and 65—85 weight percent of a mineral crystalline filler having a thermal conductivity of > 30 W/mK,
13.
14. A high-heat resistant extrudable and injectable composite material according to claim 1 or 13, substantially as hereinbefore described with particular reference to and as illustrated in the accompanying drawings. Dated this the 1st day of October, 1990 F. R./KELLY & CO. BY XECUTIVE 27 Clyde Road, Ballsbridge, Dublin 4 AGENTS FOR THE APPLICANTS
IE351090A 1989-10-02 1990-10-01 Composite material having good thermal conductivity IE903510A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19893932882 DE3932882A1 (en) 1989-10-02 1989-10-02 WELL HEAT-CONDUCTING COMPOSITE

Publications (1)

Publication Number Publication Date
IE903510A1 true IE903510A1 (en) 1991-04-10

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IE351090A IE903510A1 (en) 1989-10-02 1990-10-01 Composite material having good thermal conductivity

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EP (1) EP0421193A1 (en)
JP (1) JPH03126765A (en)
CA (1) CA2026452A1 (en)
DE (1) DE3932882A1 (en)
IE (1) IE903510A1 (en)
PT (1) PT95472A (en)

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JPH03126765A (en) 1991-05-29
CA2026452A1 (en) 1991-04-03
EP0421193A1 (en) 1991-04-10
PT95472A (en) 1991-06-25
DE3932882A1 (en) 1991-04-11

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