HUE062888T2 - Forrasztóberendezés - Google Patents

Forrasztóberendezés

Info

Publication number
HUE062888T2
HUE062888T2 HUE21191626A HUE21191626A HUE062888T2 HU E062888 T2 HUE062888 T2 HU E062888T2 HU E21191626 A HUE21191626 A HU E21191626A HU E21191626 A HUE21191626 A HU E21191626A HU E062888 T2 HUE062888 T2 HU E062888T2
Authority
HU
Hungary
Prior art keywords
flow rate
uniform flow
blown gas
soldering apparatuses
soldering
Prior art date
Application number
HUE21191626A
Other languages
English (en)
Inventor
Kazunari Soma
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of HUE062888T2 publication Critical patent/HUE062888T2/hu

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
HUE21191626A 2020-09-08 2021-08-17 Forrasztóberendezés HUE062888T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020150298A JP6854436B1 (ja) 2020-09-08 2020-09-08 はんだ付け装置

Publications (1)

Publication Number Publication Date
HUE062888T2 true HUE062888T2 (hu) 2023-12-28

Family

ID=75267866

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE21191626A HUE062888T2 (hu) 2020-09-08 2021-08-17 Forrasztóberendezés

Country Status (7)

Country Link
US (1) US11311956B2 (hu)
EP (1) EP3964317B1 (hu)
JP (1) JP6854436B1 (hu)
KR (1) KR102322680B1 (hu)
CN (1) CN113695703B (hu)
HU (1) HUE062888T2 (hu)
MX (1) MX2021010459A (hu)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6854436B1 (ja) 2020-09-08 2021-04-07 千住金属工業株式会社 はんだ付け装置
CN117156713B (zh) * 2023-08-18 2024-08-23 宜宾卓邦科技有限公司 一种电路板焊锡设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268B2 (ja) * 1988-02-23 1994-01-05 エイティックテクトロン株式会社 リフロー半田付け方法及び装置
NL9202279A (nl) * 1992-07-29 1994-02-16 Soltec Bv Reflow-soldeermachine.
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
US5567151A (en) * 1994-10-21 1996-10-22 Senju Metal Industry Company Limited Reflow furnaces with hot air blow type heaters
US5911486A (en) * 1997-02-26 1999-06-15 Conceptronic, Inc. Combination product cooling and flux management apparatus
JPH1154903A (ja) * 1997-07-31 1999-02-26 Fujitsu Ltd リフローソルダリング方法及びリフロー炉
NL1009214C2 (nl) * 1998-05-19 1999-12-07 Soltec Bv Reflowoven.
JP3877477B2 (ja) * 1999-11-12 2007-02-07 日本電熱計器株式会社 リフローはんだ付け装置
JP2001170767A (ja) * 1999-12-10 2001-06-26 Hitachi Ltd はんだ付け装置
JP4537312B2 (ja) * 2001-02-23 2010-09-01 株式会社タムラ製作所 熱風噴射型加熱装置および加熱炉
JP3799278B2 (ja) * 2001-02-23 2006-07-19 株式会社タムラ製作所 熱風噴射装置、熱風噴射型加熱装置および加熱炉
JP5247137B2 (ja) * 2007-12-21 2013-07-24 株式会社タムラ製作所 リフロー装置
US9751146B2 (en) * 2009-09-24 2017-09-05 Senju Metal Industry Co., Ltd. Nozzle for heating device, heating device, and nozzle for cooling device
JP5801047B2 (ja) * 2010-01-19 2015-10-28 有限会社ヨコタテクニカ リフロー半田付け装置及び方法
JP5395940B2 (ja) 2012-10-01 2014-01-22 株式会社タムラ製作所 リフロー装置
JP5541354B1 (ja) * 2012-12-28 2014-07-09 千住金属工業株式会社 気体吹き出し孔の配列構造及びはんだ付け装置
JP6854436B1 (ja) 2020-09-08 2021-04-07 千住金属工業株式会社 はんだ付け装置

Also Published As

Publication number Publication date
US20220072641A1 (en) 2022-03-10
CN113695703A (zh) 2021-11-26
MX2021010459A (es) 2023-03-07
CN113695703B (zh) 2022-07-19
JP2022044912A (ja) 2022-03-18
US11311956B2 (en) 2022-04-26
EP3964317A1 (en) 2022-03-09
EP3964317B1 (en) 2023-06-14
KR102322680B1 (ko) 2021-11-04
JP6854436B1 (ja) 2021-04-07

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