HK174996A - Surface structures of ceramics substrate and method of manufacturing the same - Google Patents
Surface structures of ceramics substrate and method of manufacturing the sameInfo
- Publication number
- HK174996A HK174996A HK174996A HK174996A HK174996A HK 174996 A HK174996 A HK 174996A HK 174996 A HK174996 A HK 174996A HK 174996 A HK174996 A HK 174996A HK 174996 A HK174996 A HK 174996A
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- same
- surface structures
- ceramics substrate
- ceramics
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12889—Au-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1318250A JP2760107B2 (ja) | 1989-12-07 | 1989-12-07 | セラミックス基板の表面構造およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK174996A true HK174996A (en) | 1996-09-27 |
Family
ID=18097111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK174996A HK174996A (en) | 1989-12-07 | 1996-09-19 | Surface structures of ceramics substrate and method of manufacturing the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US5134461A (de) |
EP (1) | EP0431606B1 (de) |
JP (1) | JP2760107B2 (de) |
CA (1) | CA2031459C (de) |
DE (1) | DE69023745T2 (de) |
HK (1) | HK174996A (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5190601A (en) * | 1989-12-07 | 1993-03-02 | Sumitomo Electric Industries, Ltd. | Surface structure of ceramics substrate and method of manufacturing the same |
US5317190A (en) * | 1991-10-25 | 1994-05-31 | International Business Machines Corporation | Oxygen assisted ohmic contact formation to N-type gallium arsenide |
JP3575068B2 (ja) * | 1994-08-02 | 2004-10-06 | 住友電気工業株式会社 | 平滑なめっき層を有するセラミックスメタライズ基板およびその製造方法 |
JP3000877B2 (ja) * | 1995-02-20 | 2000-01-17 | 松下電器産業株式会社 | 金メッキ電極の形成方法、基板及びワイヤボンディング方法 |
US5744752A (en) * | 1995-06-05 | 1998-04-28 | International Business Machines Corporation | Hermetic thin film metallized sealband for SCM and MCM-D modules |
JP3022765B2 (ja) * | 1996-03-27 | 2000-03-21 | 日本電気株式会社 | 半導体装置及び半導体素子の実装方法 |
JP3239231B2 (ja) * | 1996-04-11 | 2001-12-17 | 日本特殊陶業株式会社 | パッドを備えるセラミック基板、端子部材を備えるセラミック基板およびそれらの製造方法 |
US6225569B1 (en) | 1996-11-15 | 2001-05-01 | Ngk Spark Plug Co., Ltd. | Wiring substrate and method of manufacturing the same |
CA2313438C (en) | 2000-07-06 | 2003-03-11 | B-Con Engineering Inc. | High quality optical surface and method of producing same |
DE10311031B4 (de) * | 2003-03-13 | 2005-04-21 | Siemens Ag | Elektrochemischer Sensor und Verfahren zu dessen Herstellung |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1027525A (de) * | 1962-03-02 | |||
JPS5032020A (de) * | 1973-07-24 | 1975-03-28 | ||
JPS531858A (en) * | 1976-06-29 | 1978-01-10 | Kokusai Electric Co Ltd | Method of forming thin film circuit |
JPS59114846A (ja) * | 1982-12-21 | 1984-07-03 | Narumi China Corp | 半導体塔載用セラミツクパツケ−ジ |
JPS6056073A (ja) * | 1983-09-05 | 1985-04-01 | Hitachi Ltd | セラミツク基板への部分厚付け金被覆方法 |
JP2579315B2 (ja) * | 1987-06-17 | 1997-02-05 | 新光電気工業株式会社 | セラミツクパツケ−ジ |
JP2529294B2 (ja) * | 1987-09-25 | 1996-08-28 | 株式会社日立製作所 | 多層めつき方法 |
KR920005459B1 (ko) * | 1988-08-30 | 1992-07-04 | 가부시기가이샤 히다찌세이사꾸쇼 | 금속의 균질화방법 및 회로기판 |
-
1989
- 1989-12-07 JP JP1318250A patent/JP2760107B2/ja not_active Expired - Lifetime
-
1990
- 1990-12-04 CA CA002031459A patent/CA2031459C/en not_active Expired - Fee Related
- 1990-12-05 DE DE69023745T patent/DE69023745T2/de not_active Expired - Fee Related
- 1990-12-05 EP EP90123357A patent/EP0431606B1/de not_active Expired - Lifetime
- 1990-12-06 US US07/623,204 patent/US5134461A/en not_active Expired - Fee Related
-
1996
- 1996-09-19 HK HK174996A patent/HK174996A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5134461A (en) | 1992-07-28 |
DE69023745D1 (de) | 1996-01-04 |
EP0431606B1 (de) | 1995-11-22 |
EP0431606A3 (en) | 1993-01-27 |
JP2760107B2 (ja) | 1998-05-28 |
JPH03179793A (ja) | 1991-08-05 |
CA2031459C (en) | 1996-01-23 |
CA2031459A1 (en) | 1991-06-08 |
EP0431606A2 (de) | 1991-06-12 |
DE69023745T2 (de) | 1996-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |