HK1219570A1 - 移動圖像傳感器封裝件 - Google Patents
移動圖像傳感器封裝件Info
- Publication number
- HK1219570A1 HK1219570A1 HK16107540.2A HK16107540A HK1219570A1 HK 1219570 A1 HK1219570 A1 HK 1219570A1 HK 16107540 A HK16107540 A HK 16107540A HK 1219570 A1 HK1219570 A1 HK 1219570A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- image sensor
- moving image
- sensor package
- package
- moving
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462003421P | 2014-05-27 | 2014-05-27 | |
US14/692,662 US9578217B2 (en) | 2014-05-27 | 2015-04-21 | Moving image sensor package |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1219570A1 true HK1219570A1 (zh) | 2017-04-07 |
Family
ID=54703259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16107540.2A HK1219570A1 (zh) | 2014-05-27 | 2016-06-28 | 移動圖像傳感器封裝件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9578217B2 (zh) |
CN (1) | CN105428375B (zh) |
HK (1) | HK1219570A1 (zh) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6316000B2 (ja) * | 2014-01-20 | 2018-04-25 | キヤノン株式会社 | 撮像素子ユニット、及び光学機器 |
KR102390760B1 (ko) * | 2015-02-13 | 2022-04-26 | 삼성전자주식회사 | 카메라 장치 및 이를 구비한 전자 장치 |
US9591215B1 (en) * | 2015-09-11 | 2017-03-07 | Apple Inc. | Thermally conductive camera enclosure |
US9874742B2 (en) * | 2015-09-25 | 2018-01-23 | Intel Corporation | MEMS reinforcement |
US9813602B2 (en) * | 2015-12-22 | 2017-11-07 | Faez Ba-Tis | Autofocus camera using MEMS actuation of image sensor |
SG11201807830UA (en) | 2016-03-11 | 2018-10-30 | Apple Inc | Optical image stabilization with voice coil motor for moving image sensor |
US11956544B2 (en) | 2016-03-11 | 2024-04-09 | Apple Inc. | Optical image stabilization with voice coil motor for moving image sensor |
US10437023B2 (en) | 2016-03-28 | 2019-10-08 | Apple Inc. | Folded lens system with three refractive lenses |
CN105789233B (zh) * | 2016-04-15 | 2019-12-17 | 格科微电子(上海)有限公司 | Cmos图像传感器模组的感光元件移动式光学防抖方法 |
KR102348365B1 (ko) | 2016-05-03 | 2022-01-10 | 삼성전자주식회사 | 카메라 모듈을 포함하는 전자 장치 |
CN106161979B (zh) | 2016-07-29 | 2017-08-25 | 广东欧珀移动通信有限公司 | 高动态范围图像拍摄方法、装置和终端设备 |
CN106254768B (zh) * | 2016-07-29 | 2018-05-22 | 广东欧珀移动通信有限公司 | 微距拍摄处理方法、装置和终端设备 |
CN106254773B (zh) * | 2016-07-29 | 2018-01-23 | 广东欧珀移动通信有限公司 | 光学图像稳定系统、成像装置及电子装置 |
WO2018049147A1 (en) * | 2016-09-12 | 2018-03-15 | Mems Drive, Inc. | Mems actuation systems and methods |
US11407634B2 (en) | 2016-09-12 | 2022-08-09 | MEMS Drive (Nanjing) Co., Ltd. | MEMS actuation systems and methods |
KR102507615B1 (ko) | 2016-12-16 | 2023-03-09 | 허친슨 테크놀로지 인코포레이티드 | 광학 이미지 안정화 서스펜션에서의 센서 이동 구조 |
CN110199119B (zh) * | 2016-12-16 | 2022-11-18 | 哈钦森技术股份有限公司 | 一种悬架组件 |
CN108234832B (zh) * | 2016-12-22 | 2023-09-05 | 宁波舜宇光电信息有限公司 | 改善平整度的摄像模组和感光组件及其制造方法 |
CN108234831B (zh) * | 2016-12-22 | 2023-09-05 | 宁波舜宇光电信息有限公司 | 改善平整度的摄像模组和感光组件及其制造方法 |
US10122924B2 (en) * | 2017-01-23 | 2018-11-06 | Faez Ba-Tis | Camera modules using MEMS micro electrostatic pistontube actuators for autofocus (AF) and optical image stabilization (OIS) |
CN106686292B (zh) * | 2017-02-14 | 2018-09-04 | 维沃移动通信有限公司 | 一种摄像头模组及移动终端 |
KR102384532B1 (ko) * | 2017-03-15 | 2022-04-08 | 삼성전자주식회사 | 카메라 방열 구조를 가지는 전자 장치 |
US10890734B1 (en) | 2017-03-29 | 2021-01-12 | Apple Inc. | Camera actuator for lens and sensor shifting |
US11049898B2 (en) * | 2017-04-01 | 2021-06-29 | Ningbo Sunny Opotech Co., Ltd. | Systems and methods for manufacturing semiconductor modules |
US11094727B2 (en) | 2017-04-12 | 2021-08-17 | Ningbo Sunny Opotech Co., Ltd. | Camera module, molding photosensitive assembly thereof, manufacturing method thereof and electronic device |
US10863094B2 (en) | 2017-07-17 | 2020-12-08 | Apple Inc. | Camera with image sensor shifting |
US10893200B2 (en) * | 2018-06-01 | 2021-01-12 | Faez Ba-Tis | Autofocus and optical image stabilizer system |
CN112262567A (zh) * | 2018-07-17 | 2021-01-22 | 韦斯特尔电子工业和贸易有限责任公司 | 具有恰好两个相机的设备以及使用该设备生成两个图像的方法 |
WO2020034826A1 (zh) * | 2018-08-15 | 2020-02-20 | 宁波舜宇光电信息有限公司 | 防抖摄像模组和防抖感光组件及其制造方法以及电子设备 |
CN110839119A (zh) * | 2018-08-15 | 2020-02-25 | 宁波舜宇光电信息有限公司 | 防抖摄像模组和防抖感光组件及其制造方法以及电子设备 |
CN109343293A (zh) * | 2018-08-27 | 2019-02-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | 静电驱动装置及光学装置 |
US11122205B1 (en) | 2018-09-14 | 2021-09-14 | Apple Inc. | Camera actuator assembly with sensor shift flexure arrangement |
CN111225130B (zh) * | 2018-11-23 | 2021-02-26 | 华为机器有限公司 | 一种成像装置及终端设备 |
US10582100B1 (en) | 2019-01-04 | 2020-03-03 | Faez Ba-Tis | Five degrees of freedom MEMS actuator for autofocus, optical image stabilization, and super resolution imaging in miniature cameras |
US11595582B2 (en) | 2019-09-25 | 2023-02-28 | Apple Inc. | Dynamic flex circuit for camera with moveable image sensor |
US11223765B2 (en) * | 2019-09-25 | 2022-01-11 | Apple Inc. | Dynamic flex circuit for camera with moveable image sensor |
US11223756B1 (en) | 2019-12-03 | 2022-01-11 | Waymo Llc | Position sensor and hybrid substrate for camera focus management |
US11647287B1 (en) | 2019-12-03 | 2023-05-09 | Waymo Llc | Autofocus actuator |
EP4303643A3 (en) | 2020-01-22 | 2024-05-29 | Tdk Taiwan Corp. | Optical system |
US20220019128A1 (en) * | 2020-07-17 | 2022-01-20 | MEMS Drive (Nanjing) Co., Ltd. | MEMS Assembly Process Flow |
CN114200739A (zh) | 2020-09-02 | 2022-03-18 | 哈钦森技术股份有限公司 | 引导式自动对焦组件 |
US11194115B1 (en) | 2020-09-02 | 2021-12-07 | Hutchinson Technology Incorporated | Guided autofocus assembly |
US11575835B2 (en) | 2020-09-24 | 2023-02-07 | Apple Inc. | Multi-axis image sensor shifting system |
CN114553985B (zh) * | 2020-11-25 | 2023-09-12 | 华为技术有限公司 | 摄像模组及应用其的电子装置 |
US10965848B1 (en) | 2020-12-01 | 2021-03-30 | Sheba Microsystems Inc. | MEMS electrostatic actuator for super resolution and autofocus in cameras |
US11680786B2 (en) | 2021-11-05 | 2023-06-20 | Waymo Llc | Capacitive position sensing for camera focus management |
JP2023089794A (ja) * | 2021-12-16 | 2023-06-28 | パナソニックIpマネジメント株式会社 | 撮像装置 |
CN117355480A (zh) * | 2021-12-17 | 2024-01-05 | 麦斯卓微电子(南京)有限公司 | Mems间隔组件 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008533441A (ja) * | 2005-02-08 | 2008-08-21 | ナノネクサス インク | Icパッケージおよび相互接続アゼンブリのための高密度の相互接続システム |
US8768157B2 (en) * | 2011-09-28 | 2014-07-01 | DigitalOptics Corporation MEMS | Multiple degree of freedom actuator |
US7812418B2 (en) * | 2008-07-29 | 2010-10-12 | Fortemedia, Inc | Chip-scaled MEMS microphone package |
KR101940227B1 (ko) * | 2011-12-19 | 2019-01-21 | 엘지이노텍 주식회사 | 멤스 소자 및 흔들림 보정 장치 |
JP6029283B2 (ja) * | 2012-02-08 | 2016-11-24 | 株式会社アドバンテスト | 波長変換装置、光源装置、および波長変換方法 |
TWI557439B (zh) * | 2012-05-28 | 2016-11-11 | 鴻海精密工業股份有限公司 | 紅外截止濾光片及鏡頭模組 |
-
2015
- 2015-04-21 US US14/692,662 patent/US9578217B2/en active Active - Reinstated
- 2015-05-27 CN CN201510276359.6A patent/CN105428375B/zh active Active
-
2016
- 2016-06-28 HK HK16107540.2A patent/HK1219570A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN105428375B (zh) | 2019-03-01 |
US9578217B2 (en) | 2017-02-21 |
CN105428375A (zh) | 2016-03-23 |
US20150350500A1 (en) | 2015-12-03 |
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