HK1201989A1 - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- HK1201989A1 HK1201989A1 HK15102428.1A HK15102428A HK1201989A1 HK 1201989 A1 HK1201989 A1 HK 1201989A1 HK 15102428 A HK15102428 A HK 15102428A HK 1201989 A1 HK1201989 A1 HK 1201989A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16196—Cap forming a cavity, e.g. being a curved metal foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2013096477A JP6199601B2 (ja) | 2013-05-01 | 2013-05-01 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
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HK1201989A1 true HK1201989A1 (en) | 2015-09-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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HK15102428.1A HK1201989A1 (en) | 2013-05-01 | 2015-03-10 | Semiconductor device |
Country Status (4)
Country | Link |
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US (1) | US9460938B2 (ja) |
JP (1) | JP6199601B2 (ja) |
CN (1) | CN104134651B (ja) |
HK (1) | HK1201989A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPWO2016203967A1 (ja) | 2015-06-15 | 2018-03-29 | ソニー株式会社 | 半導体装置、電子機器、並びに製造方法 |
JP6591234B2 (ja) * | 2015-08-21 | 2019-10-16 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2017112241A (ja) * | 2015-12-17 | 2017-06-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2017123446A (ja) * | 2016-01-08 | 2017-07-13 | 株式会社日立製作所 | 半導体装置および半導体パッケージ装置 |
US10796976B2 (en) | 2018-10-31 | 2020-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of forming the same |
KR20210022911A (ko) * | 2019-08-21 | 2021-03-04 | 삼성전기주식회사 | 반도체 패키지 |
JP7526642B2 (ja) * | 2020-11-20 | 2024-08-01 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US11748545B2 (en) * | 2021-08-04 | 2023-09-05 | I-Shou University | Method and electronic device for configuring signal pads between three-dimensional stacked chips |
CN114210597B (zh) * | 2022-02-22 | 2022-04-26 | 深圳市正和兴电子有限公司 | 一种半导体器件的导电胶推荐方法、系统和可读存储介质 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP3417608B2 (ja) | 1993-08-03 | 2003-06-16 | 日本特殊陶業株式会社 | 半導体パッケージ用のセラミック製リッド基板 |
JPH0851167A (ja) | 1994-05-31 | 1996-02-20 | Sumitomo Kinzoku Ceramics:Kk | 半導体パッケージ封止用リッドとそのリッドを用いた半導体パッケージおよびそのリッドのα線遮蔽層形成方法 |
JP2861981B2 (ja) * | 1997-04-11 | 1999-02-24 | 日本電気株式会社 | 半導体装置の冷却構造 |
JP3462979B2 (ja) * | 1997-12-01 | 2003-11-05 | 株式会社東芝 | 半導体装置 |
JP3097644B2 (ja) * | 1998-01-06 | 2000-10-10 | 日本電気株式会社 | 半導体装置接続構造及び接続方法 |
US6281573B1 (en) * | 1998-03-31 | 2001-08-28 | International Business Machines Corporation | Thermal enhancement approach using solder compositions in the liquid state |
JP3676091B2 (ja) * | 1998-08-10 | 2005-07-27 | 富士通株式会社 | 半導体装置 |
JP3768761B2 (ja) * | 2000-01-31 | 2006-04-19 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
US7247932B1 (en) * | 2000-05-19 | 2007-07-24 | Megica Corporation | Chip package with capacitor |
JP4254669B2 (ja) * | 2004-09-07 | 2009-04-15 | 豊田合成株式会社 | 発光装置 |
US7524701B2 (en) * | 2005-04-20 | 2009-04-28 | International Rectifier Corporation | Chip-scale package |
JP4768314B2 (ja) * | 2005-05-16 | 2011-09-07 | 株式会社東芝 | 半導体装置 |
JP2007042719A (ja) | 2005-08-01 | 2007-02-15 | Nec Electronics Corp | 半導体装置 |
JP2007234988A (ja) * | 2006-03-02 | 2007-09-13 | Epson Toyocom Corp | 半導体素子の実装基板及び実装方法 |
US20090057884A1 (en) * | 2007-08-29 | 2009-03-05 | Seah Sun Too | Multi-Chip Package |
KR101500791B1 (ko) * | 2007-12-14 | 2015-03-09 | 데쿠세리아루즈 가부시키가이샤 | 광 반도체 패키지 밀봉 수지 재료 |
JP2010092977A (ja) * | 2008-10-06 | 2010-04-22 | Panasonic Corp | 半導体装置及びその製造方法 |
JP5425461B2 (ja) * | 2008-12-26 | 2014-02-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2011249398A (ja) * | 2010-05-24 | 2011-12-08 | Sanyo Electric Co Ltd | 回路装置 |
JP2013012720A (ja) * | 2011-05-28 | 2013-01-17 | Kyocera Corp | 電子装置 |
JP2012054597A (ja) | 2011-11-07 | 2012-03-15 | Renesas Electronics Corp | 半導体装置 |
US20130258610A1 (en) * | 2012-03-29 | 2013-10-03 | Jianguo Li | Semiconductor chip device with vented lid |
JP6150375B2 (ja) * | 2012-12-06 | 2017-06-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2013
- 2013-05-01 JP JP2013096477A patent/JP6199601B2/ja active Active
-
2014
- 2014-04-16 US US14/254,805 patent/US9460938B2/en active Active
- 2014-04-30 CN CN201410182740.1A patent/CN104134651B/zh active Active
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2015
- 2015-03-10 HK HK15102428.1A patent/HK1201989A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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JP6199601B2 (ja) | 2017-09-20 |
US9460938B2 (en) | 2016-10-04 |
CN104134651B (zh) | 2018-06-26 |
JP2014220278A (ja) | 2014-11-20 |
US20140327138A1 (en) | 2014-11-06 |
CN104134651A (zh) | 2014-11-05 |
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