HK1161609A1 - Aluminum chelate type latent hardener and process for producing same - Google Patents
Aluminum chelate type latent hardener and process for producing sameInfo
- Publication number
- HK1161609A1 HK1161609A1 HK12102095.6A HK12102095A HK1161609A1 HK 1161609 A1 HK1161609 A1 HK 1161609A1 HK 12102095 A HK12102095 A HK 12102095A HK 1161609 A1 HK1161609 A1 HK 1161609A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- producing same
- aluminum chelate
- type latent
- latent hardener
- chelate type
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1525—Four-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009011337A JP5321082B2 (ja) | 2009-01-21 | 2009-01-21 | アルミニウムキレート系潜在性硬化剤及びその製造方法 |
PCT/JP2010/050250 WO2010084804A1 (ja) | 2009-01-21 | 2010-01-13 | アルミニウムキレート系潜在性硬化剤及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1161609A1 true HK1161609A1 (en) | 2012-07-27 |
Family
ID=42355858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12102095.6A HK1161609A1 (en) | 2009-01-21 | 2012-02-29 | Aluminum chelate type latent hardener and process for producing same |
Country Status (6)
Country | Link |
---|---|
US (1) | US8198342B2 (ja) |
JP (1) | JP5321082B2 (ja) |
KR (1) | KR101246468B1 (ja) |
CN (1) | CN102292373B (ja) |
HK (1) | HK1161609A1 (ja) |
WO (1) | WO2010084804A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4381255B2 (ja) * | 2003-09-08 | 2009-12-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP5146645B2 (ja) * | 2007-08-28 | 2013-02-20 | デクセリアルズ株式会社 | マイクロカプセル型潜在性硬化剤 |
JP5707662B2 (ja) * | 2008-01-25 | 2015-04-30 | デクセリアルズ株式会社 | 熱硬化型エポキシ樹脂組成物 |
JP5481995B2 (ja) * | 2009-07-24 | 2014-04-23 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤及びそれらの製造方法 |
KR101659139B1 (ko) | 2014-01-29 | 2016-09-22 | 제일모직주식회사 | 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치 |
JP6323247B2 (ja) | 2014-08-11 | 2018-05-16 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤及びその製造方法 |
JP6489494B2 (ja) * | 2014-09-09 | 2019-03-27 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤、その製造方法及び熱硬化型エポキシ樹脂組成物 |
JP2017101164A (ja) * | 2015-12-03 | 2017-06-08 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤、その製造方法及び熱硬化型エポキシ樹脂組成物 |
US10626215B2 (en) | 2015-12-17 | 2020-04-21 | Dexerials Corporation | Process for producing aluminum-chelate-based latent curing agent, and thermosetting epoxy resin composition |
JP2017122144A (ja) * | 2016-01-05 | 2017-07-13 | デクセリアルズ株式会社 | 接着剤組成物 |
JP6670688B2 (ja) * | 2016-06-15 | 2020-03-25 | デクセリアルズ株式会社 | 潜在性硬化剤、及びその製造方法、並びに熱硬化型エポキシ樹脂組成物 |
CN114269760A (zh) * | 2019-08-26 | 2022-04-01 | 迪睿合株式会社 | 阳离子固化剂及其制造方法、以及阳离子固化性组合物 |
JP7520609B2 (ja) | 2019-08-26 | 2024-07-23 | デクセリアルズ株式会社 | カチオン硬化剤及びその製造方法、並びにカチオン硬化性組成物 |
JP7028280B2 (ja) * | 2020-06-09 | 2022-03-02 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002212537A (ja) | 2001-01-24 | 2002-07-31 | Sony Chem Corp | 接着剤及び電気装置 |
JP4381255B2 (ja) * | 2003-09-08 | 2009-12-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP4811555B2 (ja) * | 2005-01-12 | 2011-11-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP5057011B2 (ja) * | 2005-06-06 | 2012-10-24 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP5360348B2 (ja) | 2005-07-11 | 2013-12-04 | デクセリアルズ株式会社 | 熱硬化型エポキシ樹脂組成物 |
JP5267757B2 (ja) * | 2006-02-07 | 2013-08-21 | デクセリアルズ株式会社 | 潜在性硬化剤 |
JP5298431B2 (ja) * | 2007-01-24 | 2013-09-25 | デクセリアルズ株式会社 | 潜在性硬化剤 |
JP5212597B2 (ja) * | 2007-08-03 | 2013-06-19 | デクセリアルズ株式会社 | 潜在性硬化剤 |
JP5707662B2 (ja) * | 2008-01-25 | 2015-04-30 | デクセリアルズ株式会社 | 熱硬化型エポキシ樹脂組成物 |
JP5458596B2 (ja) | 2008-02-18 | 2014-04-02 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤、その製造方法及び熱硬化型エポキシ樹脂組成物 |
-
2009
- 2009-01-21 JP JP2009011337A patent/JP5321082B2/ja active Active
-
2010
- 2010-01-13 CN CN201080005068.9A patent/CN102292373B/zh active Active
- 2010-01-13 US US12/866,597 patent/US8198342B2/en active Active
- 2010-01-13 KR KR1020107025855A patent/KR101246468B1/ko active IP Right Grant
- 2010-01-13 WO PCT/JP2010/050250 patent/WO2010084804A1/ja active Application Filing
-
2012
- 2012-02-29 HK HK12102095.6A patent/HK1161609A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
CN102292373A (zh) | 2011-12-21 |
KR101246468B1 (ko) | 2013-03-21 |
JP5321082B2 (ja) | 2013-10-23 |
KR20110020775A (ko) | 2011-03-03 |
WO2010084804A1 (ja) | 2010-07-29 |
JP2010168449A (ja) | 2010-08-05 |
CN102292373B (zh) | 2014-07-16 |
US20100331435A1 (en) | 2010-12-30 |
US8198342B2 (en) | 2012-06-12 |
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