HK1084918A1 - Wood-cement board manufactured by extrusion-molding - Google Patents

Wood-cement board manufactured by extrusion-molding

Info

Publication number
HK1084918A1
HK1084918A1 HK06105089.5A HK06105089A HK1084918A1 HK 1084918 A1 HK1084918 A1 HK 1084918A1 HK 06105089 A HK06105089 A HK 06105089A HK 1084918 A1 HK1084918 A1 HK 1084918A1
Authority
HK
Hong Kong
Prior art keywords
wood
extrusion
molding
cement board
board manufactured
Prior art date
Application number
HK06105089.5A
Inventor
Kazuhiko Sakai
Junya Ito
Hideki Kimura
Original Assignee
Nichiha Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiha Kk filed Critical Nichiha Kk
Publication of HK1084918A1 publication Critical patent/HK1084918A1/en

Links

HK06105089.5A 2003-03-13 2006-04-28 Wood-cement board manufactured by extrusion-molding HK1084918A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003068142A JP2004276315A (en) 2003-03-13 2003-03-13 Extrusion-molded woody cement panel

Publications (1)

Publication Number Publication Date
HK1084918A1 true HK1084918A1 (en) 2006-08-11

Family

ID=33285561

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06105089.5A HK1084918A1 (en) 2003-03-13 2006-04-28 Wood-cement board manufactured by extrusion-molding

Country Status (3)

Country Link
JP (1) JP2004276315A (en)
CN (1) CN1693050B (en)
HK (1) HK1084918A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITCO20080002A1 (en) * 2008-02-08 2009-08-09 Hera Spa PROCEDURE FOR TREATMENT OF HYDRAULIC MIXTURES CURLED TO PRODUCE NON-POLLUTING ARTICLES AND MANUFACTURED PRODUCTS WITH ITS PRODUCTS
ITCO20080003A1 (en) * 2008-02-08 2009-08-09 Pescale Spa PROCESS OF TREATMENT OF HYDRAULIC MIXTURES CATALIZED CONTAINING INDUSTRIAL AND INERT SCORES TO PRODUCE NON-POLLUTING ARTICLES AND MANUFACTURED PRODUCTS WITH ITS PRODUCTS
JP5548340B2 (en) * 2008-03-31 2014-07-16 ニチハ株式会社 Manufacturing method of wood cement board
JP5347950B2 (en) * 2009-12-24 2013-11-20 株式会社デンソー Manufacturing method of ceramic substrate
CN106242424B (en) * 2016-07-21 2018-08-17 中如建工集团有限公司 A kind of fire-retardant compound fetal membrane of light thermal-insulation and preparation method thereof
WO2019008626A1 (en) * 2017-07-03 2019-01-10 サイアミーズ エコライト カンパニー リミテッド Lightweight concrete panel extrusion molding device, and lightweight concrete panel manufactured by said extrusion molding device
JP7088658B2 (en) * 2017-10-26 2022-06-21 ケイミュー株式会社 Substrate manufacturing method
CN108714957A (en) * 2018-08-13 2018-10-30 沈阳建筑大学 Band rib laminated floor slab prefabricated panel structure, making apparatus and production method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512375B2 (en) * 1971-12-18 1980-04-01
JP2601781B2 (en) * 1992-02-05 1997-04-16 ニチハ株式会社 Cement fiberboard
JPH05329823A (en) * 1992-06-04 1993-12-14 Sekisui Chem Co Ltd Production of hydraulic inorganic molded object
CN1024342C (en) * 1992-06-12 1994-04-27 山东建筑材料工业学院 Manufacturing method of composite annual fiber cement panel
CN1104702A (en) * 1993-12-31 1995-07-05 徐铜文 Lightweight decorative board for construction
JPH1015922A (en) * 1996-07-05 1998-01-20 Mitsubishi Chem Corp Manufacture of sheet material for construction
CN2302112Y (en) * 1997-04-14 1998-12-30 包赟元 Plastic extrusion forming die with pattern ripple-making device
JPH11300721A (en) * 1998-04-17 1999-11-02 Taiheiyo Cement Corp Cement-based extrusion-molding composition
JPH11343161A (en) * 1998-05-28 1999-12-14 Taiheiyo Cement Corp Cement-based extrusion composition

Also Published As

Publication number Publication date
CN1693050B (en) 2010-04-28
JP2004276315A (en) 2004-10-07
CN1693045A (en) 2005-11-09

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150312