HK1078640A1 - A pump-free water-cooling system - Google Patents

A pump-free water-cooling system

Info

Publication number
HK1078640A1
HK1078640A1 HK05110395A HK05110395A HK1078640A1 HK 1078640 A1 HK1078640 A1 HK 1078640A1 HK 05110395 A HK05110395 A HK 05110395A HK 05110395 A HK05110395 A HK 05110395A HK 1078640 A1 HK1078640 A1 HK 1078640A1
Authority
HK
Hong Kong
Prior art keywords
pump
cooling system
free water
free
water
Prior art date
Application number
HK05110395A
Other languages
English (en)
Inventor
Ippoushi Shigetoshi
Uehara Nobuaki
Yamada Akira
Ogushi Tetsuro
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of HK1078640A1 publication Critical patent/HK1078640A1/xx

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK05110395A 2004-01-06 2005-11-18 A pump-free water-cooling system HK1078640A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004001030A JP2005195226A (ja) 2004-01-06 2004-01-06 ポンプレス水冷システム

Publications (1)

Publication Number Publication Date
HK1078640A1 true HK1078640A1 (en) 2006-03-17

Family

ID=34746967

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05110395A HK1078640A1 (en) 2004-01-06 2005-11-18 A pump-free water-cooling system

Country Status (4)

Country Link
US (2) US7380584B2 (xx)
JP (1) JP2005195226A (xx)
CN (1) CN1327183C (xx)
HK (1) HK1078640A1 (xx)

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WO2005055319A2 (en) * 2003-12-08 2005-06-16 Noise Limit Aps A cooling system with a bubble pump
JP2005195226A (ja) * 2004-01-06 2005-07-21 Mitsubishi Electric Corp ポンプレス水冷システム
US7705342B2 (en) * 2005-09-16 2010-04-27 University Of Cincinnati Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes
KR101098721B1 (ko) * 2006-03-31 2011-12-23 미쓰비시덴키 가부시키가이샤 전차용의 전력변환장치
US20090065182A1 (en) * 2006-03-31 2009-03-12 Mitsubishi Electric Corporation Cooling device
AU2007239597B9 (en) * 2006-04-13 2010-12-02 Mitsubishi Electric Corporation Cooling apparatus and power converter
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JP4899997B2 (ja) * 2007-03-30 2012-03-21 日本電気株式会社 サーマルサイフォン式沸騰冷却器
US20080283221A1 (en) * 2007-05-15 2008-11-20 Christian Blicher Terp Direct Air Contact Liquid Cooling System Heat Exchanger Assembly
DE102008027773A1 (de) * 2007-06-28 2009-02-26 Denso Corp., Kariya-shi Abgaswärme-Rückgewinnungseinrichtung
US8188595B2 (en) 2008-08-13 2012-05-29 Progressive Cooling Solutions, Inc. Two-phase cooling for light-emitting devices
US9297589B2 (en) 2008-11-18 2016-03-29 Nec Corporation Boiling heat transfer device
US20100132404A1 (en) * 2008-12-03 2010-06-03 Progressive Cooling Solutions, Inc. Bonds and method for forming bonds for a two-phase cooling apparatus
JP2010196568A (ja) * 2009-02-25 2010-09-09 Ts Heatronics Co Ltd 羽根車を利用した発電装置
JP4666084B2 (ja) * 2009-03-13 2011-04-06 三菱電機株式会社 電車用の電力変換装置
KR101036685B1 (ko) * 2009-03-31 2011-05-23 공상운 버블젯을 이용한 루프형 히트파이프
US8640765B2 (en) 2010-02-23 2014-02-04 Robert Jensen Twisted conduit for geothermal heating and cooling systems
US9109813B2 (en) * 2010-02-23 2015-08-18 Robert Jensen Twisted conduit for geothermal heating and cooling systems
US9909783B2 (en) 2010-02-23 2018-03-06 Robert Jensen Twisted conduit for geothermal heat exchange
WO2011122332A1 (ja) * 2010-03-29 2011-10-06 日本電気株式会社 相変化冷却器及びこれを備えた電子機器
WO2012026221A1 (ja) * 2010-08-24 2012-03-01 三菱電機株式会社 ループ型熱輸送機器
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US20130048254A1 (en) * 2011-08-31 2013-02-28 Troy W. Livingston Heat transfer bridge
FR2985808B1 (fr) * 2012-01-13 2018-06-15 Airbus Defence And Space Dispositif de refroidissement adapte a la regulation thermique d'une source de chaleur d'un satellite, procede de realisation du dispositif de refroidissement et satellite associes
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US8893513B2 (en) 2012-05-07 2014-11-25 Phononic Device, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
FR3007999B1 (fr) 2013-07-03 2015-07-17 10 Vins Procede et installation pour la preparation a la degustation de boisson, en particulier de vin
JP6561846B2 (ja) 2014-01-16 2019-08-21 日本電気株式会社 冷却装置及び電子装置
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
CN104634142A (zh) * 2014-08-02 2015-05-20 芜湖长启炉业有限公司 三腔联合超导换热器
US10634397B2 (en) * 2015-09-17 2020-04-28 Purdue Research Foundation Devices, systems, and methods for the rapid transient cooling of pulsed heat sources
US10988904B2 (en) * 2016-08-18 2021-04-27 Ian R. Cooke Snow and ice melting device, system and corresponding methods
CN108426477A (zh) * 2018-04-13 2018-08-21 中国科学院理化技术研究所 一种紧凑的抗重力回路热管
US11530529B2 (en) * 2019-01-29 2022-12-20 John Saavedra Heat transfer system utilizing dynamic fluid leveling
US11737240B1 (en) 2020-09-10 2023-08-22 Hamfop Technologies LLC Heat-activated multiphase fluid-operated pump for electronics waste heat removal

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Also Published As

Publication number Publication date
JP2005195226A (ja) 2005-07-21
US7841387B2 (en) 2010-11-30
CN1637377A (zh) 2005-07-13
US20050155744A1 (en) 2005-07-21
US7380584B2 (en) 2008-06-03
US20080223556A1 (en) 2008-09-18
CN1327183C (zh) 2007-07-18

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20131230