HK1048454A1 - Brittle panel breaking method and its apparatus - Google Patents

Brittle panel breaking method and its apparatus

Info

Publication number
HK1048454A1
HK1048454A1 HK03100519.9A HK03100519A HK1048454A1 HK 1048454 A1 HK1048454 A1 HK 1048454A1 HK 03100519 A HK03100519 A HK 03100519A HK 1048454 A1 HK1048454 A1 HK 1048454A1
Authority
HK
Hong Kong
Prior art keywords
panel breaking
brittle
brittle panel
breaking
Prior art date
Application number
HK03100519.9A
Other languages
Chinese (zh)
Inventor
Haruo Wakayama
Original Assignee
Mitsuboshi Diamond Ind Co. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000385140A priority Critical patent/JP3792508B2/en
Application filed by Mitsuboshi Diamond Ind Co. Ltd. filed Critical Mitsuboshi Diamond Ind Co. Ltd.
Publication of HK1048454A1 publication Critical patent/HK1048454A1/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
HK03100519.9A 2000-12-19 2003-01-21 Brittle panel breaking method and its apparatus HK1048454A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000385140A JP3792508B2 (en) 2000-12-19 2000-12-19 Method for dividing bonded brittle substrates

Publications (1)

Publication Number Publication Date
HK1048454A1 true HK1048454A1 (en) 2003-04-04

Family

ID=18852460

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03100519.9A HK1048454A1 (en) 2000-12-19 2003-01-21 Brittle panel breaking method and its apparatus

Country Status (5)

Country Link
JP (1) JP3792508B2 (en)
KR (2) KR20020050116A (en)
CN (1) CN1231335C (en)
HK (1) HK1048454A1 (en)
TW (1) TW561134B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100657197B1 (en) * 2002-11-22 2006-12-14 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for dividing substrate and method for manufacturing substrate using such method
JP4373980B2 (en) * 2003-09-24 2009-11-25 三星ダイヤモンド工業株式会社 Substrate cutting system and substrate cutting method
CN101823215B (en) * 2004-02-18 2013-02-27 川崎重工业株式会社 Vertical machining production line of sheet material
JP2008195571A (en) * 2007-02-13 2008-08-28 Shiraitekku:Kk Apparatus for dividing substrate
KR100890764B1 (en) 2008-01-25 2009-03-26 삼성코닝정밀유리 주식회사 Apparatus for breaking glass panel unified with process table
JP5178814B2 (en) * 2008-02-29 2013-04-10 三星ダイヤモンド工業株式会社 Separation apparatus and separation method for mother substrate for flat display panel
JP2010023071A (en) 2008-07-18 2010-02-04 Mitsuboshi Diamond Industrial Co Ltd Method for machining terminal of laminated substrate
JP5284726B2 (en) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 Brittle material break device
JP5284725B2 (en) * 2008-08-29 2013-09-11 三星ダイヤモンド工業株式会社 Brittle material break device
JP5310278B2 (en) * 2009-06-05 2013-10-09 三星ダイヤモンド工業株式会社 Break bar
KR101146642B1 (en) * 2010-08-04 2012-05-16 (주)큐엠씨 Apparatus for Breaking Processed Object Using Curved Surface Close-adhesion
CN102219368B (en) * 2011-04-12 2012-12-19 深圳市晶向科技有限公司 System and method for controlling cutting wheel pressure of TFT-LCD (thin film transitor-liquid crystal display) glass cutting machine
JP5981791B2 (en) * 2012-07-18 2016-08-31 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate
KR102026822B1 (en) * 2012-07-23 2019-10-01 삼성디스플레이 주식회사 Cell cutting apparatus for display device and method for manufacturing display device
JP6287548B2 (en) * 2014-04-28 2018-03-07 三星ダイヤモンド工業株式会社 End material separating method and end material separating apparatus for brittle material substrate
JP6256178B2 (en) * 2014-04-28 2018-01-10 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate
JP6387695B2 (en) 2014-06-13 2018-09-12 三星ダイヤモンド工業株式会社 Breaking device for brittle material substrate
JP6413694B2 (en) * 2014-11-25 2018-10-31 三星ダイヤモンド工業株式会社 Method for dividing brittle substrate
JP6627326B2 (en) 2015-08-20 2020-01-08 三星ダイヤモンド工業株式会社 Break device
CN105538521A (en) * 2016-01-12 2016-05-04 田宇科技股份有限公司 Cutting method for hard and brittle material substrate
CN111836789A (en) * 2018-02-13 2020-10-27 康宁公司 Glass separation system and glass manufacturing apparatus including same

Also Published As

Publication number Publication date
KR20050118148A (en) 2005-12-15
KR20020050116A (en) 2002-06-26
KR100645499B1 (en) 2006-11-14
JP3792508B2 (en) 2006-07-05
TW561134B (en) 2003-11-11
CN1359784A (en) 2002-07-24
CN1231335C (en) 2005-12-14
JP2002187098A (en) 2002-07-02

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