HK10395A - Magnetron sputter ion plating - Google Patents

Magnetron sputter ion plating

Info

Publication number
HK10395A
HK10395A HK10395A HK10395A HK10395A HK 10395 A HK10395 A HK 10395A HK 10395 A HK10395 A HK 10395A HK 10395 A HK10395 A HK 10395A HK 10395 A HK10395 A HK 10395A
Authority
HK
Hong Kong
Prior art keywords
magnetrons
ion plating
magnetron sputter
sputter ion
substrates
Prior art date
Application number
HK10395A
Other languages
English (en)
Inventor
Dennis Gerald Teer
Original Assignee
Teer Coatings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10672810&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK10395(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Teer Coatings Ltd filed Critical Teer Coatings Ltd
Publication of HK10395A publication Critical patent/HK10395A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Glass Compositions (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Chemically Coating (AREA)
HK10395A 1990-03-17 1995-01-26 Magnetron sputter ion plating HK10395A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB909006073A GB9006073D0 (en) 1990-03-17 1990-03-17 Magnetron sputter ion plating
PCT/GB1991/000417 WO1991014797A1 (en) 1990-03-17 1991-03-18 Magnetron sputter ion plating

Publications (1)

Publication Number Publication Date
HK10395A true HK10395A (en) 1995-02-03

Family

ID=10672810

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10395A HK10395A (en) 1990-03-17 1995-01-26 Magnetron sputter ion plating

Country Status (9)

Country Link
US (1) US5556519A (xx)
EP (1) EP0521045B1 (xx)
JP (1) JP3397786B2 (xx)
AT (1) ATE160180T1 (xx)
AU (1) AU7481091A (xx)
DE (1) DE69128195T2 (xx)
GB (2) GB9006073D0 (xx)
HK (1) HK10395A (xx)
WO (1) WO1991014797A1 (xx)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9405442D0 (en) * 1994-03-19 1994-05-04 Applied Vision Ltd Apparatus for coating substrates
US6423419B1 (en) 1995-07-19 2002-07-23 Teer Coatings Limited Molybdenum-sulphur coatings
GB9514773D0 (en) * 1995-07-19 1995-09-20 Teer Coatings Ltd Methods for improving the sputter deposition of metal-sulphur coatings e.g.molybdenum disulphide(MoS2) coatings
US5714044A (en) * 1995-08-07 1998-02-03 Hmt Technology Corporation Method for forming a thin carbon overcoat in a magnetic recording medium
GB2306510B (en) * 1995-11-02 1999-06-23 Univ Surrey Modification of metal surfaces
WO1998013532A1 (en) * 1996-09-24 1998-04-02 Deposition Sciences, Inc. A multiple target arrangement for decreasing the intensity and severity of arcing in dc sputtering
US6726993B2 (en) * 1997-12-02 2004-04-27 Teer Coatings Limited Carbon coatings, method and apparatus for applying them, and articles bearing such coatings
GB2332087A (en) * 1997-12-02 1999-06-09 Superion Ltd Apparatus and method relating to ion beams and gaseous plasma
GB2340845B (en) * 1998-08-19 2001-01-31 Kobe Steel Ltd Magnetron sputtering apparatus
DE19860474A1 (de) * 1998-12-28 2000-07-06 Fraunhofer Ges Forschung Verfahren und Einrichtung zum Beschichten von Substraten mittels bipolarer Puls-Magnetron-Zerstäubung
US6224725B1 (en) * 1999-02-09 2001-05-01 Isoflux, Inc. Unbalanced magnetron sputtering with auxiliary cathode
US6290825B1 (en) 1999-02-12 2001-09-18 Applied Materials, Inc. High-density plasma source for ionized metal deposition
US6306265B1 (en) 1999-02-12 2001-10-23 Applied Materials, Inc. High-density plasma for ionized metal deposition capable of exciting a plasma wave
US6497802B2 (en) 1999-02-12 2002-12-24 Applied Materials, Inc. Self ionized plasma sputtering
US6328856B1 (en) 1999-08-04 2001-12-11 Seagate Technology Llc Method and apparatus for multilayer film deposition utilizing rotating multiple magnetron cathode device
US6864007B1 (en) 1999-10-08 2005-03-08 Hybrid Power Generation Systems, Llc Corrosion resistant coated fuel cell plate with graphite protective barrier and method of making the same
US6649031B1 (en) 1999-10-08 2003-11-18 Hybrid Power Generation Systems, Llc Corrosion resistant coated fuel cell bipolar plate with filled-in fine scale porosities and method of making the same
US7250196B1 (en) 1999-10-26 2007-07-31 Basic Resources, Inc. System and method for plasma plating
US6267851B1 (en) * 1999-10-28 2001-07-31 Applied Komatsu Technology, Inc. Tilted sputtering target with shield to block contaminants
GB0005411D0 (en) * 2000-03-08 2000-04-26 Univ Ulster Magnetron sputter ion plating system
DE10018143C5 (de) * 2000-04-12 2012-09-06 Oerlikon Trading Ag, Trübbach DLC-Schichtsystem sowie Verfahren und Vorrichtung zur Herstellung eines derartigen Schichtsystems
US6521104B1 (en) 2000-05-22 2003-02-18 Basic Resources, Inc. Configurable vacuum system and method
US6503379B1 (en) 2000-05-22 2003-01-07 Basic Research, Inc. Mobile plating system and method
US6497803B2 (en) 2000-05-31 2002-12-24 Isoflux, Inc. Unbalanced plasma generating apparatus having cylindrical symmetry
US6352629B1 (en) * 2000-07-10 2002-03-05 Applied Materials, Inc. Coaxial electromagnet in a magnetron sputtering reactor
WO2002043466A2 (en) * 2000-11-30 2002-06-06 North Carolina State University Non-thermionic sputter material transport device, methods of use, and materials produced thereby
WO2002044443A1 (en) 2000-11-30 2002-06-06 North Carolina State University Methods and apparatus for producing m'n based materials
US6663754B2 (en) * 2001-04-13 2003-12-16 Applied Materials, Inc. Tubular magnet as center pole in unbalanced sputtering magnetron
WO2002092873A2 (en) * 2001-04-30 2002-11-21 Isoflux, Inc. Relationship to other applications and patents
GB0202855D0 (en) * 2002-02-07 2002-03-27 Teer Coatings Ltd A method for depositing very hard and smooth metal alloy nitride or multi layernitride coatings with excellent adhesion
US20030180450A1 (en) * 2002-03-22 2003-09-25 Kidd Jerry D. System and method for preventing breaker failure
US20040149575A1 (en) * 2002-04-29 2004-08-05 Isoflux, Inc. System for unbalanced magnetron sputtering with AC power
GB0222331D0 (en) 2002-09-26 2002-10-30 Teer Coatings Ltd A method for depositing multilayer coatings with controlled thickness
US6991219B2 (en) * 2003-01-07 2006-01-31 Ionbond, Llc Article having a hard lubricious coating
US20050126497A1 (en) * 2003-09-30 2005-06-16 Kidd Jerry D. Platform assembly and method
SG143940A1 (en) * 2003-12-19 2008-07-29 Agency Science Tech & Res Process for depositing composite coating on a surface
CN100564584C (zh) * 2004-03-31 2009-12-02 倍耐力轮胎股份公司 涂敷有金属合金层的金属丝的制造方法和设备
GB0410729D0 (en) * 2004-05-14 2004-06-16 Teer Coatings Ltd Coating with hard wear and non-stick characteristics
WO2006006637A1 (ja) * 2004-07-09 2006-01-19 National Institute For Materials Science 磁束配置（バランス型／アンバランス型）を切換可能としたマグネトロンスパッタリング装置とこの装置を用いた無機質薄膜体材料の成膜方法、及びデﾕアル形式のマグネトロンスパッタリング装置とこの装置による低温成膜を可能とした無機質薄膜体材料の成膜方法
JP4873681B2 (ja) * 2004-08-09 2012-02-08 独立行政法人物質・材料研究機構 デュアルマグネトロンスパッタリング装置及び薄膜体製造方法
KR101255375B1 (ko) * 2004-12-28 2013-04-17 가부시키가이샤 알박 스퍼터원, 스퍼터 장치, 박막의 제조 방법
US8597479B2 (en) * 2005-02-08 2013-12-03 Tohoku Seiki Industries, Ltd. Sputtering system
GB0503401D0 (en) * 2005-02-18 2005-03-30 Applied Multilayers Ltd Apparatus and method for the application of material layer to display devices
GB2425401A (en) 2005-04-21 2006-10-25 Stuart Philip Speakman Manufacture of microstructures using peelable mask
JP4607687B2 (ja) * 2005-07-04 2011-01-05 株式会社神戸製鋼所 非晶質炭素膜の成膜方法
DE102005033769B4 (de) 2005-07-15 2009-10-22 Systec System- Und Anlagentechnik Gmbh & Co.Kg Verfahren und Vorrichtung zur Mehrkathoden-PVD-Beschichtung und Substrat mit PVD-Beschichtung
EP1999292B1 (en) 2006-03-28 2014-01-22 Sulzer Metaplas GmbH Sputtering apparatus
DE602006002264D1 (de) * 2006-06-01 2008-09-25 Varian Spa Magnetanordnung für eine Sputter-Ionenpumpe
WO2008013469A1 (fr) 2006-07-26 2008-01-31 Dmitry Davidovich Spivakov Procédé d'application à plasma d'ions de revêtements de film à composants multiples et installation correspondante
JP5174825B2 (ja) * 2006-10-26 2013-04-03 ハウザー テクノ−コーティング ベー．フェー． デュアルマグネトロンスパッタリング電源およびマグネトロンスパッタリング装置
DE102006058078A1 (de) * 2006-12-07 2008-06-19 Systec System- Und Anlagentechnik Gmbh & Co. Kg Vakuumbeschichtungsanlage zur homogenen PVD-Beschichtung
WO2009052874A1 (en) * 2007-10-26 2009-04-30 Hauzer Techno Coating Bv Dual magnetron sputtering power supply and magnetron sputtering apparatus
CN201614406U (zh) * 2008-08-27 2010-10-27 梯尔涂层有限公司 沉积材料形成镀层的设备
DE102008050499B4 (de) 2008-10-07 2014-02-06 Systec System- Und Anlagentechnik Gmbh & Co. Kg PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substrate
GB2465597A (en) * 2008-11-24 2010-05-26 Merck Patent Gmbh Magnetron sputter ion plating
US8647486B2 (en) * 2009-01-05 2014-02-11 Applied Materials, Inc. Magnet bar support system
US20100230274A1 (en) * 2009-03-12 2010-09-16 Applied Materials, Inc. Minimizing magnetron substrate interaction in large area sputter coating equipment
US20120152726A1 (en) * 2010-12-17 2012-06-21 Harkness Iv Samuel D Method and apparatus to produce high density overcoats
UA101678C2 (uk) * 2011-04-08 2013-04-25 Национальный Научный Центр "Харьковский Физико-Технический Институт" Вакуумно-дуговий випарник для генерування катодної плазми
US10224189B2 (en) 2011-09-30 2019-03-05 Teer Coatings Limited Apparatus and a method for deposition of material to form a coating
CN103122450A (zh) * 2011-11-21 2013-05-29 鸿富锦精密工业（深圳）有限公司 离化装置及应用离化装置的镀膜装置
JP6009220B2 (ja) * 2012-05-21 2016-10-19 住友重機械工業株式会社 成膜装置
CN102719799A (zh) * 2012-06-08 2012-10-10 深圳市华星光电技术有限公司 旋转磁控溅射靶及相应的磁控溅射装置
GB2504923A (en) * 2012-06-18 2014-02-19 Teer Coatings Ltd Printing plate having a metal nitride protective layer
WO2014005617A1 (en) * 2012-07-02 2014-01-09 Applied Materials, Inc. Apparatus for coating a layer of sputtered material on a substrate and deposition system
CN104603324B (zh) 2012-07-05 2017-03-08 因特瓦克公司 制造用于透明衬底的高度透明的氢化的碳保护涂层的方法
PL2811507T3 (pl) 2013-06-07 2020-09-07 Soleras Advanced Coatings Bvba Konfiguracja magnesów dla systemu magnetronowego do napylania jonowego
CN105200383B (zh) * 2015-10-27 2019-03-01 中国科学院兰州化学物理研究所 一种磁控溅射制备超硬超光滑四面体碳薄膜的装置与方法
CN105200385B (zh) * 2015-10-27 2019-02-01 中国科学院兰州化学物理研究所 箍缩磁场辅助磁控溅射镀膜装置
US10580627B2 (en) 2018-04-26 2020-03-03 Keihin Ramtech Co., Ltd. Sputtering cathode, sputtering cathode assembly, and sputtering apparatus
JP6498819B1 (ja) * 2018-05-10 2019-04-10 京浜ラムテック株式会社 スパッタリングカソード集合体およびスパッタリング装置
EP3960896B1 (en) 2020-04-20 2023-12-06 Joint-Stock Company "TVEL" Method of ion-plasma application of corrosion-resistant film coatings on articles made from zirconium alloys
CN114214596B (zh) * 2021-11-09 2023-09-29 维达力实业(深圳)有限公司 磁控溅射镀膜腔室、镀膜机以及镀膜方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176073A (ja) * 1985-01-29 1986-08-07 Matsushita Electric Ind Co Ltd ボタン型アルカリ電池の製造法
JPS61179864A (ja) * 1985-02-06 1986-08-12 Hitachi Ltd スパツタ装置
JPS61238958A (ja) * 1985-04-15 1986-10-24 Hitachi Ltd 複合薄膜形成法及び装置
GB8512455D0 (en) * 1985-05-16 1985-06-19 Atomic Energy Authority Uk Coating apparatus
US4767516A (en) * 1985-05-20 1988-08-30 Sanyo Electric Co., Ltd. Method for making magnetic recording media
JPS6277460A (ja) * 1985-09-30 1987-04-09 Tokuda Seisakusho Ltd 放電電極
DE3611492A1 (de) * 1986-04-05 1987-10-22 Leybold Heraeus Gmbh & Co Kg Verfahren und vorrichtung zum beschichten von werkzeugen fuer die zerspanungs- und umformtechnik mit hartstoffschichten
US4756810A (en) * 1986-12-04 1988-07-12 Machine Technology, Inc. Deposition and planarizing methods and apparatus
JP2643149B2 (ja) * 1987-06-03 1997-08-20 株式会社ブリヂストン 表面処理方法
JPH01298154A (ja) * 1988-05-26 1989-12-01 Kikuo Tominaga 対向ターゲット式プレーナーマグネトロンスパッタリング装置
DE4038497C1 (xx) * 1990-12-03 1992-02-20 Leybold Ag, 6450 Hanau, De
JP3733991B2 (ja) * 1996-07-10 2006-01-11 株式会社ブリヂストン 軟質ポリウレタンフォームの製造方法
JPH10179864A (ja) * 1996-12-25 1998-07-07 Ace Denken:Kk 遊技機

Also Published As

Publication number Publication date
ATE160180T1 (de) 1997-11-15
EP0521045B1 (en) 1997-11-12
GB9218562D0 (en) 1992-11-11
DE69128195D1 (de) 1997-12-18
DE69128195T2 (de) 1998-03-12
EP0521045A1 (en) 1993-01-07
GB2258343B (en) 1994-04-06
GB9006073D0 (en) 1990-05-16
US5556519A (en) 1996-09-17
JPH05505215A (ja) 1993-08-05
GB2258343A (en) 1993-02-03
AU7481091A (en) 1991-10-21
JP3397786B2 (ja) 2003-04-21
WO1991014797A1 (en) 1991-10-03

Similar Documents

Publication Publication Date Title
GB2258343B (en) Magnetron sputter ion plating
AU4388293A (en) Improved planar magnetron sputtering magnet assembly
KR100396456B1 (ko) 절단된 코니칼 스퍼터링 타겟용 고 타겟 이용 자기 장치
ATE90475T1 (de) Zerstaeubungskatode nach dem magnetronprinzip.
EP0818803A3 (en) Electrically floating shield in a plasma reactor
EP0144572A3 (en) Magnetron-cathodes for the sputtering of ferromagnetic targets
JPS575871A (en) Cathode part of magnetron type sputtering apparatus
WO1996024947A3 (en) Magnetron sputtering cathode apparatus
US6432285B1 (en) Planar magnetron sputtering apparatus
GB2462890A (en) Magnetron sputter ion plating system and method for deposition of a coating
US5889371A (en) Ion source with pole rings having differing inner diameters
WO2003023814A3 (en) Flat magnetron sputter apparatus
GB1154237A (en) Electron Beam Vapourisation Furnace
YU6588A (en) Multi phase self-expanding switch with chamber for arc putting out, armoured by pole
US4131753A (en) Multiple electron-beam vapor source assembly
JPS57194255A (en) Sputtering device
US5061360A (en) Apparatus for depositing a thin film of a sputtered material on a member
GB2209769A (en) Sputter coating
JPS58141387A (ja) スパツタ装置
FR2833452B1 (fr) Source d'electrons
CZ154293A3 (en) Process and apparatus for magnetron sputtering
JPS56149755A (en) 3-beam inline type electron gun
JPS5779170A (en) Target for magnetron sputtering
JPS5543758A (en) Cathode ray tube electron gun
JPS57194256A (en) Sputtering device

Legal Events

Date Code Title Description
PF Patent in force
CHPA Change of a particular in the register (except of change of ownership)
PE Patent expired

Effective date: 20110317