GB9725173D0 - Manufacture of interface circuits - Google Patents

Manufacture of interface circuits

Info

Publication number
GB9725173D0
GB9725173D0 GBGB9725173.0A GB9725173A GB9725173D0 GB 9725173 D0 GB9725173 D0 GB 9725173D0 GB 9725173 A GB9725173 A GB 9725173A GB 9725173 D0 GB9725173 D0 GB 9725173D0
Authority
GB
United Kingdom
Prior art keywords
manufacture
interface circuits
circuits
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9725173.0A
Other versions
GB2331840A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EI Technology Ltd
Original Assignee
EI Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to IE970827 priority Critical patent/IES78835B2/en
Application filed by EI Technology Ltd filed Critical EI Technology Ltd
Priority to GB9725173A priority patent/GB2331840A/en
Publication of GB9725173D0 publication Critical patent/GB9725173D0/en
Publication of GB2331840A publication Critical patent/GB2331840A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
GB9725173A 1997-11-25 1997-11-27 Manufacture of interface boards Withdrawn GB2331840A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IE970827 IES78835B2 (en) 1997-11-25 1997-11-25 Manufacture of interface circuits
GB9725173A GB2331840A (en) 1997-11-25 1997-11-27 Manufacture of interface boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IE970827 IES78835B2 (en) 1997-11-25 1997-11-25 Manufacture of interface circuits
GB9725173A GB2331840A (en) 1997-11-25 1997-11-27 Manufacture of interface boards

Publications (2)

Publication Number Publication Date
GB9725173D0 true GB9725173D0 (en) 1998-01-28
GB2331840A GB2331840A (en) 1999-06-02

Family

ID=26312677

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9725173A Withdrawn GB2331840A (en) 1997-11-25 1997-11-27 Manufacture of interface boards

Country Status (2)

Country Link
GB (1) GB2331840A (en)
IE (1) IES78835B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2347021B (en) * 1998-12-01 2003-07-09 Dovatron Res & Dev Ltd A circuit board manufacturing apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667403A (en) * 1984-05-16 1987-05-26 Siemens Aktiengesellschaft Method for manufacturing electronic card modules
GB2284368B (en) * 1993-12-02 1996-01-03 Calmwaters Limited A circuit board production process

Also Published As

Publication number Publication date
IES970827A2 (en) 1998-02-25
GB2331840A (en) 1999-06-02
IES78835B2 (en) 1998-02-25

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)